Natural heat dissipation charging pile module

Abstract

The utility model provides a natural heat dissipation charging pile module. The natural heat dissipation charging pile module comprises an input filter, a power factor correction circuit, a direct current conversion circuit and an output filter which are arranged on a printed circuit board, the LED lamp further comprises a radiator, the radiator is formed by stamping a whole piece of aluminum alloy and comprises a heat absorption face making contact with the printed circuit board, and the back face of the heat absorption face is a heat dissipation face provided with heat dissipation teeth. A heat absorption plane connected with a heat dissipation plane of the high-power semiconductor device and a heat absorption groove filled with heat conduction liquid are arranged on the heat absorption surface, and the winding coil device is soaked in the heat conduction liquid. According to the utility model, heating coils such as an inductor and a transformer are subjected to heat conduction by adopting surrounding heat conduction liquid, and high-power semiconductor devices such as an MOS (Metal Oxide Semiconductor) tube are subjected to contact heat conduction by adopting a high-heat-conductivity material, so that the heat dissipation effect is better.

Description

Technical Field

[0001] The utility model relates to a natural heat dissipation electric pile module. Background Art

[0002] The charging pile module, also known as the charging pile power module, is used in DC charging piles to convert AC power from the AC grid into DC power for charging the power battery. It is the core component of DC charging piles that enables charging of power batteries. The core component of the charging pile module is the power converter, which converts AC power (mains electricity) into DC power to charge the vehicle's power battery. Traditional charging pile modules mainly include four parts: input filter, power factor correction circuit, DC conversion circuit, and output filter.

[0003] Because of its high power, the charging module used to charge a car requires a radiator to function properly. Patent document CN107994757 A discloses a new charging pile power module. This module houses a power converter within a sealed housing filled with thermal oil, completely immersing the converter. External radiators are mounted on both sides of the sealed housing. A circulating pump draws the thermal oil from the sealed housing, cools it in the external radiator, and then re-injects it into the sealed housing, maintaining a relatively low temperature for the entire converter. This fully sealed design ensures heat dissipation for the power module, ensuring its normal and reliable operation and preventing the impact of external environmental factors on the module. It is particularly suitable for use in complex and changing outdoor environments, offering safety, reliability, and a long service life.

[0004] We know that in the charging pile module, the main heat sources are some high-power devices, such as high-power semiconductor switching tubes (MOS tubes) and coils (including inductor coils and transformer coils). These are the main heat sources and are the key heat dissipation components in the charging pile module. The coil uses thermal oil, which has a significantly better heat conduction effect than in the air. However, due to its small size, the heat exchange rate between the thermal oil surrounding it and the contact surface of the semiconductor device is limited, which may cause the local temperature of the device, such as the MOS tube, to rise or even burn out due to the high temperature. Since the entire module is in a sealed shell, maintenance is inconvenient. Utility Model Content

[0005] The present invention aims to solve the problem that in the current heat dissipation mode of charging pile modules, all circuit boards of the charging pile modules are encapsulated in a sealed shell and surrounded by thermal oil. The main heat source components in the charging module, such as high-power semiconductor devices, such as MOS tubes, have limited heat exchange speed with the thermal oil, which may cause the local temperature of the middle part of the device, such as the MOS tube, to rise or even burn out due to the high temperature. Since the entire module is in a sealed shell, maintenance is inconvenient. The present invention provides a charging pile module with natural heat dissipation. In the charging pile module, heating coils such as inductors and transformers are heat-dissipated by being surrounded by thermal fluid, while high-power semiconductor devices such as MOS tubes are heat-dissipated by contact with high-thermal-conductivity materials.

[0006] The technical solution adopted by the present invention to achieve its technical purpose is: a natural heat dissipation charging pile module, including an input filter, a power factor correction circuit, a DC conversion circuit and an output filter arranged on a printed circuit board; the electronic components constituting the input filter, the power factor correction circuit, the DC conversion circuit and the output filter include high-power semiconductor devices and winding coil devices; it also includes a radiator, which is stamped from a whole piece of aluminum alloy, including a heat-absorbing surface in contact with the printed circuit board, and a heat-dissipating surface with heat-dissipating teeth on the back of the heat-absorbing surface; a heat-absorbing plane connected to the heat-dissipating plane of the high-power semiconductor device and a heat-absorbing groove filled with heat-conducting liquid are provided on the heat-absorbing surface, and the winding coil device is immersed in the heat-conducting liquid.

[0007] Furthermore, in the above-mentioned winding coil device: the winding coil device includes an inductor and a transformer, and the high-power semiconductor device includes a MOS tube.

[0008] Furthermore, in the above-mentioned winding coil device: the printed circuit board includes an inductor sub-board on which all inductors are soldered, a transformer sub-board on which all transformers are soldered, and a main printed circuit board on which other components are soldered.

[0009] Furthermore, in the above-mentioned winding coil device: the heat absorption tank includes an inductor heat absorption tank and a transformer heat absorption tank; all the inductor coils are immersed in the heat-conducting liquid in the inductor heat absorption tank, and the inductor sub-plate is sealed and covers the notch of the inductor heat absorption tank; all the transformer coils are immersed in the heat-conducting liquid in the transformer heat absorption tank, and the transformer sub-plate is sealed and covers the notch of the transformer heat absorption tank.

[0010] Furthermore, in the above-mentioned winding coil device: the main printed circuit board is supported on the heat absorbing surface by a metal rod, the MOS transistor is fixed to the heat absorbing surface by bolts, the heat dissipation plane of the MOS transistor is close to the heat absorbing plane on the heat absorbing surface, and the pins of the MOS transistor are welded to the main printed circuit board.

[0011] In the present invention, the heating coils such as inductors and transformers are heat-conducted by being filled with heat-conducting fluid, while high-power semiconductor devices such as MOS tubes are heat-conducted by contact with high-thermal-conductivity materials, thereby achieving better heat dissipation effects.

[0012] Furthermore, in the present invention, the transformer and the inductor are integrated onto the transformer circuit board and the inductor circuit board, which are then connected to corresponding positions on the main circuit board with wires. At the same time, the pins of the MOS tube are soldered to the main PCB, and the heat dissipation surface on the package body of the packaged MOS tube is closely attached to the heat dissipation plane of the radiator. Targeted heat dissipation structures are adopted for different heating devices, resulting in better heat dissipation effect.

[0013] The present invention will be described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Attachment Figure 1 This is a three-dimensional diagram of a charging pile module according to an embodiment of the present utility model;

[0015] Attachment Figure 2 This is a three-dimensional diagram of the radiator in the charging pile module according to an embodiment of the present utility model;

[0016] Attachment Figure 3 This is an exploded view of the charging pile module according to an embodiment of the present utility model. DETAILED DESCRIPTION

[0017] Example 1, as Figure 1 、 2As shown in Figure 3, this embodiment is a natural heat dissipation charging pile module, including an input filter, a power factor correction circuit, a DC conversion circuit, and an output filter arranged on a printed circuit board 1; the printed circuit board 1 is abbreviated as PCB in English, and will be referred to as a PCB board, an electronic circuit board, etc. in the future. Like all charging pile modules, the charging pile module in this embodiment is composed of an input filter, a power factor correction circuit, a DC conversion circuit, and an output filter in order to convert AC power into DC power to charge the power battery. The input filter filters the input mains power and removes some clutter. Then, the PFC circuit, also known as the power factor correction circuit, converts the input 220VAC mains power into a 400VDC output, improving the power factor while rectifying it. Compared with a simple rectifier circuit, its power factor will be improved. At this time, the two parts are commonly used in power supply circuits and are very mature technologies. These two parts mainly include some capacitors, rectifier tubes, etc. The DC conversion circuit primarily consists of an inverter bridge circuit, including switches and transformers. The output filter, like the input filter, also filters out noise to stabilize the output DC power. It primarily consists of components such as inductors, transformers, and diodes. The input filter, power factor correction circuit, DC conversion circuit, and output filter are all highly mature technologies in power supply circuits, and various power supply modules incorporate these circuits. This embodiment categorizes the specific components used in these circuit modules, primarily into semiconductor devices that generate high heat, such as MOS transistors 111 (used as switches, rectifiers, etc.). These transistors can also replace some diodes. Another component that generates high heat is the coil. The wire used in the coil itself has a certain resistivity. If the wire in the coil winding is long enough, its resistance will also be high. Due to the high current flowing through it, the heat generated is considerable. Therefore, heat dissipation is a key concern. The coil winding primarily consists of two components: the inductor 121 and the transformer 122. Both components generate high heat, especially in high-power power supplies like charging piles. Therefore, heat dissipation of the transformer 122 and inductor 121 is a key concern.

[0018] In this embodiment, in order to achieve heat dissipation of the charging pile module, a special radiator 2 is designed, such as Figure 2 The heat sink 2 shown is stamped from a single piece of aluminum alloy and includes a heat absorbing surface 210 that contacts the printed circuit board 1. Behind the heat absorbing surface 210 is a heat dissipation surface 220 provided with heat dissipation teeth 221. Heat generated by the power devices on the PCB is absorbed by the heat absorbing surface 210 and then conducted to the heat dissipation surface 220 on the opposite side by the high thermal conductivity of the aluminum alloy. On the heat dissipation surface 220, the heat dissipation teeth 221 are used to increase the heat dissipation area, allowing the heat to be quickly dissipated into the air.

[0019] In this embodiment, heat absorbing surface 210 includes a heat absorbing surface 211 connected to the heat dissipation surface of the high-power semiconductor device and a heat absorbing groove 212 filled with a heat-conducting liquid. The winding coil device is immersed in the heat-conducting liquid. The winding coil device includes an inductor 121 and a transformer 122, and the high-power semiconductor device includes a MOS transistor 111.

[0020] In this embodiment, the printed circuit board 1 includes an inductor sub-board 130 to which an inductor 121 is soldered, a transformer sub-board 140 to which a transformer 122 is soldered, and a main printed circuit board 150 to which other components are soldered. In this embodiment, the coil winding components, such as the transformer 122 and the inductor 121, on the PCB are collectively immersed in a thermal fluid. Currently, thermal fluid, also known as thermal oil or thermal adhesive, is commercially available and can be used by those skilled in the art. The thermal fluid is filled around the coil windings to promptly dissipate heat generated by the coil windings. This provides a better heat dissipation effect than exposing the coil windings to air in the past, as the thermal fluid itself is a good conductor of heat compared to air and can more quickly absorb the heat generated by the coil windings. High-power semiconductor devices are packaged and have a metal surface for heat dissipation. For example, some MOS transistors have a metal housing in addition to three pins, providing a heat dissipation surface.

[0021] In this embodiment, the heat absorption tank 212 includes an inductor heat absorption tank 212-1 and a transformer heat absorption tank 212-2; the coil of the inductor 121 is immersed in the heat-conducting liquid in the inductor heat absorption tank 212-1, and the inductor sub-board 130 is sealed and covered in the notch of the inductor heat absorption tank 212-1; the coil of the transformer 122 is immersed in the heat-conducting liquid in the transformer heat absorption tank 212-2, and the transformer sub-board 140 is sealed and covered in the notch of the transformer heat absorption tank 212-2. The main printed circuit board 150 is supported on the heat absorption surface 210 by a metal rod 151, and the MOS tube 111 is fixed to the heat absorption surface 210 by a bolt 152. The heat dissipation plane of the MOS tube 111 is close to the heat absorption plane 211 on the heat absorption surface 210, and the pins of the MOS tube 111 are welded to the main printed circuit board 150. Figure 3As shown, these MOS transistors 111 are fixed to the heat dissipation surface 210 of the heat sink 2 by bolts. In this embodiment, the heat absorption surface 210 of the heat sink 2 has two heat absorption structures. One is the heat dissipation plane 211, which is mainly used to dissipate heat from high-power semiconductor devices such as the MOS transistor 111. As we know, high-power devices such as the MOS transistor 111 generally require packaging, such as general integrated circuits and MOS transistors. These devices have a heat dissipation plane on the package. This heat dissipation plane is basically a metal surface that dissipates heat within the package. Therefore, the heat dissipation surface of this device is closely attached to the heat absorption plane 211 on the heat absorption surface 210 allocated for dissipating heat from the MOS transistor. The heat absorption plane 211 quickly absorbs the heat from the heat dissipation surface of the MOS transistor 111 and conducts it to the heat dissipation teeth 221 on the opposite heat dissipation surface 220 to dissipate it into the air.

[0022] In this embodiment, the heat dissipation characteristics of coil windings and high-power semiconductor devices such as MOS tubes are combined. Winding-type devices such as inductors and transformers are cooled by filling the surrounding heat-conducting liquid, while high-power semiconductor devices such as MOS tubes are cooled by closely contacting the heat dissipation surface with the heat absorption surface. The advantages of each are fully utilized to increase the heat dissipation. At the same time, natural heat dissipation is achieved by means of natural air flow, resulting in good heat dissipation effect.

Claims

1. A natural heat dissipation charging pile module, comprising an input filter, a power factor correction circuit, a DC conversion circuit and an output filter arranged on a printed circuit board (1); the electronic components constituting the input filter, the power factor correction circuit, the DC conversion circuit and the output filter include high-power semiconductor devices and winding coil devices; characterized in that: The device further comprises a heat sink (2), the heat sink (2) being formed by stamping a whole piece of aluminum alloy and comprising a heat absorbing surface (210) in contact with the printed circuit board (1), a heat dissipation surface (220) provided with heat dissipation teeth (221) on the back side of the heat absorbing surface (210); a heat absorbing plane (211) in contact with the heat dissipation plane of the high-power semiconductor device and a heat absorbing groove (212) filled with heat-conducting liquid are provided on the heat absorbing surface (210), and the winding coil device is immersed in the heat-conducting liquid.

2. The natural heat dissipation charging pile module according to claim 1, characterized in that: The winding coil device includes an inductor (121) and a transformer (122), and the high-power semiconductor device includes a MOS tube (111).

3. The natural heat dissipation charging pile module according to claim 2, characterized in that: The printed circuit board (1) includes an inductor sub-board (130) on which all inductors (121) are welded, a transformer sub-board (140) on which all transformers (122) are welded, and a main printed circuit board (150) on which components other than the inductors (121) and transformers (122) are welded.

4. The natural heat dissipation charging pile module according to claim 3, characterized in that: The heat absorption groove (212) includes an inductor heat absorption groove (212-1) and a transformer heat absorption groove (212-2); all the inductor (121) coils are immersed in the heat-conducting liquid in the inductor heat absorption groove (212-1), and the inductor sub-plate (130) is sealed and covered on the groove opening of the inductor heat absorption groove (212-1); all the transformer (122) coils are immersed in the heat-conducting liquid in the transformer heat absorption groove (212-2), and the transformer sub-plate (140) is sealed and covered on the groove opening of the transformer heat absorption groove (212-2).

5. The natural heat dissipation charging pile module according to claim 3, characterized in that: The main printed circuit board (150) is supported on the heat absorbing surface (210) by a metal rod (151); the MOS tube (111) is fixed on the heat absorbing surface (210) by a bolt (152); the heat dissipation plane of the MOS tube (111) is close to the heat absorbing plane (211) on the heat absorbing surface (210); and the pins of the MOS tube (111) are welded on the main printed circuit board (150).

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