Wafer vacuum packaging round box

Abstract

The utility model provides a wafer vacuum packaging round box which comprises a box body, a box cover is hinged to one side of the top end of the box body, an inserting hole is formed in the top end of the box cover, an inserting cover is movably embedded in the inserting hole, a protruding block is fixedly connected to the bottom end of the box cover, a through pipe is embedded in the protruding block, and a groove is formed in the middle of the box body. The bottom of the groove is fixedly connected with a plurality of vertical nails, the tops of the plurality of vertical nails are covered with a solid film, the top of the solid film is provided with a wafer, the middle of the bottom end of the box body is provided with a through hole, a rubber plug is movably embedded in the through hole, the bottom end of the rubber plug is fixedly connected with a pull rope, and the bottom end of the pull rope is fixedly connected with a clamping plate. According to the utility model, a series of structures are arranged, so that the probability that the wafer shakes in the round box is reduced, the wafer can be adsorbed and fixed in the round box, the dependence on vacuum equipment is reduced, the operation difficulty during the release of the wafer is reduced, and the wafer can be quickly taken out from the round packaging box.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer packaging, in particular to a wafer vacuum packaging round box. Background Art

[0002] After the production of optical components such as wafers is completed, they usually need to be packaged and transported in vacuum adsorption plastic boxes. Since the vacuum adsorption plastic box itself uses the adsorption effect of solid glue to make the bottom of the wafer thin film close to the thin film on the surface of the solid glue to achieve wafer adsorption and fixation, the existing wafer vacuum packaging boxes usually do not apply slight pressure to the surface of the wafer after the wafer is placed, so that the bottom of the wafer cannot fit tightly with the solid glue in the box body, resulting in the wafer in the round box being more prone to shaking, which is not conducive to the adsorption and fixation of the wafer in the round box; in addition, when taking the wafer out of the round box, it is usually necessary to place the bottom of the box body on a vacuum equipment, vacuum the bottom surface of the solid glue, make the bottom of the solid glue concave, and reduce the contact area between the bottom of the wafer and the solid glue to achieve the release of the wafer from the packaging round box. This method requires reliance on vacuum equipment, and the operation is also more troublesome and time-consuming, which is not conducive to the rapid removal of the wafer from the packaging round box. Utility Model Content

[0003] The purpose of the utility model is to provide a wafer vacuum packaging round box to solve the above technical problems existing in the prior art.

[0004] The technical solution adopted by the present invention to solve the above technical problems is:

[0005] A round box for vacuum packaging of wafers comprises a box body, a box cover hingedly connected to one side of the top of the box body, a socket opened at the top of the box cover, a plug cover movably embedded in the inside of the socket, a protrusion fixedly connected to the bottom end of the box cover, a through tube embedded in the inside of the protrusion, a groove opened in the middle of the box body, a number of vertical nails fixedly connected to the bottom of the groove, a solid film is provided on the top cover of the number of vertical nails, a wafer is placed on the top of the solid film, a through hole is opened in the middle of the bottom end of the box body, a rubber plug movably embedded in the inside of the through hole, a draw rope fixedly connected to the bottom end of the rubber plug, and a clamping plate fixedly connected to the bottom end of the draw rope.

[0006] Preferably, a first clamping block is fixedly connected to one side of the top end of the box cover, and a second clamping block is fixedly connected to one side of the top end of the box body.

[0007] Preferably, a clip is movably inserted into the middle of the second clamping block, the clip is movably inserted into and connected with the first clamping block, and the box cover is fixedly connected to the box body through the clip.

[0008] Preferably, a connecting belt is fixedly connected to one side wall of the plug-in cover, and the plug-in cover is movably connected to the box cover via the connecting belt.

[0009] Preferably, the interior of the insertion hole is communicated with the interior of the through pipe.

[0010] Preferably, the pull rope is movably connected to the through hole through a rubber plug.

[0011] Preferably, a card slot is provided at the bottom end of the box body, and the card plate is movably embedded in the box body through the card slot.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] 1. The wafer vacuum packaging round box of the present application, through the setting of the protrusion, makes it possible for the protrusion to press against the top surface of the wafer after the round box is closed, and exert slight pressure on the entire wafer, so that the bottom of the wafer can be tightly attached to the film on the top of the solid glue, and then through the through tube and the plug hole, when the box cover is tightly closed to the box body, the excess air inside can be squeezed out, and the plug cover seals the plug hole, so that the round box remains in a sealed state, thereby reducing the probability of the wafer shaking in the round box and facilitating the adsorption and fixation of the wafer in the round box.

[0014] 2. The wafer vacuum packaging round box of the present application pinches the card plate and pulls the pull rope downward to make the rubber plug slide down from the through hole, and the air at the bottom of the solid film is sucked into the through hole, so that a vacuum appears at the bottom of the solid film. It can also make the solid film concave, so that the wafer can be released, reducing dependence on vacuum equipment and reducing the difficulty of operation when releasing the wafer, thereby facilitating the rapid removal of the wafer from the packaging round box. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the plug-in cover and through-tube structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the bump and through-hole structure of the utility model;

[0018] Figure 4 This is a schematic diagram of the pull rope and card plate structure of the utility model.

[0019] In the figure: 1. Box cover; 2. Insert cover; 3. First clamping block; 4. Second clamping block; 5. Clip; 6. Box body; 7. Insert hole; 8. Through tube; 9. Wafer; 10. Solid film; 11. Vertical nail; 12. Rubber plug; 13. Through hole; 14. Drawstring; 15. Card plate; 16. Groove; 17. Bump; 18. Card slot. DETAILED DESCRIPTION

[0020] The technical solution of the present invention will be described clearly and completely below with reference to the accompanying drawings.

[0021] like Figures 1 to 4 As shown, a wafer vacuum packaging round box includes a box body 6, which is made of hard plastic and is round. A box cover 1 is hinged on one side of the top of the box body 6. The box cover 1 is also made of hard plastic, and the diameter of the box cover 1 is the same as that of the box body 6. After closing, almost no gap can be seen; a plug hole 7 is opened on the top of the box cover 1, and the bottom of the plug hole 7 is inside the through pipe 8, so that the gas in the through pipe 8 can be discharged through the plug hole 7. The plug cover 2 is movably embedded in the plug hole 7, and the cross section of the plug cover 2 is "T-shaped", so that the plug hole 7 can be opened. After the cover 2 is inserted into the insertion hole 7, the sealing inside the insertion hole 7 can be maintained; the bottom end of the box cover 1 is fixedly connected with a protrusion 17, which is thicker than the box cover 1 and is made of ceramic material. When it contacts the surface of the wafer 9, it is not easy to scratch the surface of the wafer 9. The bottom surface of the protrusion 17 can be smoothly attached to the surface of the wafer 9, so that the top of the wafer 9 can be subjected to a slight pressure as a whole, thereby pressing the wafer 9 against the thin film on the top of the solid film 10, which is conducive to the wafer 9 being adsorbed and fixed by the solid film 10;

[0022] A through-tube 8 is embedded in the interior of the protrusion 17, and the interior of the through-tube 8 is communicated with the interior of the box body 6, so that when the box cover 1 is closed with the box body 6, excess air in the box body 6 can be discharged from the insertion hole 7 along the through-tube 8, so that the box body 6 remains in a relatively closed state; a groove 16 is provided in the middle of the box body 6, and the groove 16 can be used to hold the wafer 9 so that the protrusion 17 can be pressed against the surface of the wafer 9, and a plurality of vertical nails 11 are fixedly connected to the bottom of the groove 16. The heights of the plurality of vertical nails 11 are the same, which can prop up the bottom of the solid film 10, so that an overhead layer is formed between the solid film 10 and the bottom of the groove 16, and the formed overhead layer is communicated with the through-hole 13 at the bottom of the groove 16; after pulling the rubber plug 12 in the through-hole 13, the overhead layer can be vacuumed, thereby realizing the depression of the solid film 10, which is beneficial to the wafer 9 Release from the solid film 10; the top cover of several vertical nails 11 is provided with a solid film 10, and a wafer 9 is placed on the top of the solid film 10. A through hole 13 is opened in the middle of the bottom end of the box body 6, and the inner diameter of the through hole 13 is adapted to the outer diameter of the top of the plug-in cover 2. When the round boxes are stacked, the top of the plug-in cover 2 can be inserted into the bottom of the through hole 13 for limiting, thereby increasing the stability of the packaged round boxes when stacked for transportation, and a rubber plug 12 is movably embedded in the through hole 13. The outer diameter of the rubber plug 12 is adapted to the inner diameter of the through hole 13, so that the through hole 13 can be sealed by the rubber plug 12, thereby maintaining the sealing inside the box body 6; the bottom end of the rubber plug 12 is fixedly connected to a pull rope 14, which is a steel wire with good flexibility and not easy to break and deform. The bottom end of the pull rope 14 is fixedly connected to a card plate 15, which is a round silicone plate, which is convenient for the operator to hold.

[0023] Specifically, a first card block 3 is fixedly connected to one side of the top of the box cover 1, and a second card block 4 is fixedly connected to one side of the top of the box body 6. Openings are provided on both sides of the first card block 3 and the second card block 4, so that the clip 5 can smoothly pass through the first card block 3 and the second card block 4 at the same time and fix them, thereby achieving the closure of the box cover 1 and the box body 6.

[0024] Furthermore, a clip 5 is movably inserted into the middle of the second card block 4, and the clip 5 is movably inserted into the first card block 3. The box cover 1 is fixedly connected to the box body 6 through the clip 5. The clip 5 is made of an elastic metal strip, similar to the steel clip on the hair, which can clamp the first card block 3 and the second card block 4, thereby keeping the box cover 1 and the box body 6 airtight.

[0025] Furthermore, a connecting belt is fixedly connected to one side wall of the plug cover 2, and the plug cover 2 is movably connected to the box cover 1 through the connecting belt. The connecting belt is made of flexible material and can be squeezed and deformed. After the plug cover 2 is pulled out from the socket 7, it can still remain connected to the box cover 1 through the connecting belt, thereby avoiding the loss of the plug cover 2.

[0026] Furthermore, the interior of the socket 7 is connected to the interior of the through-tube 8, and the air in the through-tube 8 can be discharged from the socket 7, so that after the box cover 1 is closed with the box body 6, the air in the cavity formed between the box cover 1 and the box body 6 can be reduced as much as possible, thereby facilitating the storage of the wafer 9 in the box body 6.

[0027] Furthermore, the pull rope 14 is movably connected to the through hole 13 through the rubber plug 12, so that the pull rope 14 can pull the rubber plug 12, so that the air between the solid film 10 and the bottom of the groove 16 is sucked into the through hole 13, thereby achieving the solid film 10 being adsorbed into the depression.

[0028] Furthermore, a card slot 18 is opened at the bottom end of the box body 6, and the card plate 15 is movably embedded in the box body 6 through the card slot 18. The initial state of the card plate 15 is stationary in the card slot 18, so that the bottom of the entire packaging round box is relatively flat, which is more conducive to the transportation of the packaging round box.

[0029] The method of using this embodiment is as follows: after the wafer 9 is placed on the solid film 10 in the groove 16 of the box body 6, the box cover 1 can be pressed against the box body 6. When the box cover 1 and the box body 6 are closed, the first card block 3 will fit with the second card block 4, and then the clip 5 on the second card block 4 is inserted into the first card block 3, so that the box cover 1 and the box body 6 are tightly closed. At this time, the protrusion 17 at the bottom end of the box cover 1 will fit the surface of the wafer 9 and apply slight pressure to the surface of the wafer 9, so that the bottom surface of the wafer 9 is more closely attached to the top of the solid film 10. At the same time, the excess air in the cavity formed between the box cover 1 and the box body 6 will flow into the insertion hole 7 through the through tube 8 passing through the protrusion 17, and then be discharged out of the box body 6 through the insertion hole 7, and then the insertion hole 7 is closed. The cover 2 is inserted into the socket 7 to keep the box cover 1 airtight; when the wafer 9 in the box body 6 needs to be taken out, the cover 2 is first opened to allow air to enter the groove 16, and the wafer 9 is in a normal pressure state. Then the card plate 15 is taken out from the card slot 18 through the pull rope 14, and then the card plate 15 is pulled downward to drive the pull rope 14 to pull the rubber plug 12 at the top of the through hole 13 to the bottom, so that the air in the overhead layer at the bottom of the solid film 10 enters the through hole 13. At this time, the solid film 10 will be concave downward under the action of the vertical nail 11, so that the contact area between the wafer 9 and the solid film 10 becomes smaller, weakening the adsorption effect of the solid film 10 on the wafer 9. Finally, the box cover 1 can be opened to take the wafer 9 out of the groove 16.

[0030] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art may modify or substitute equivalents for the technical solutions described in the aforementioned embodiments. Any modifications, equivalents, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer vacuum packaging round box, comprising a box body (6), characterized in that: A box cover (1) is hingedly connected to one side of the top of the box body (6), a socket (7) is provided at the top of the box cover (1), a plug cover (2) is movably embedded in the socket (7), a protrusion (17) is fixedly connected to the bottom of the box cover (1), a through tube (8) is embedded in the inside of the protrusion (17), a groove (16) is provided in the middle of the box body (6), a plurality of vertical nails (11) are fixedly connected to the bottom of the groove (16), a solid film (10) is provided on the top of the plurality of vertical nails (11), a wafer (9) is placed on the top of the solid film (10), a through hole (13) is provided in the middle of the bottom of the box body (6), a rubber plug (12) is movably embedded in the inside of the through hole (13), a pull rope (14) is fixedly connected to the bottom of the rubber plug (12), and a card plate (15) is fixedly connected to the bottom of the pull rope (14).

2. The wafer vacuum packaging round box according to claim 1, characterized in that: A first clamping block (3) is fixedly connected to one side of the top end of the box cover (1), and a second clamping block (4) is fixedly connected to one side of the top end of the box body (6).

3. The wafer vacuum packaging round box according to claim 2, characterized in that: A clip (5) is movably inserted into the middle of the second clamping block (4), the clip (5) is movably inserted into and connected with the first clamping block (3), and the box cover (1) is fixedly connected to the box body (6) via the clip (5).

4. The wafer vacuum packaging round box according to claim 1, characterized in that: A connecting belt is fixedly connected to one side wall of the plug cover (2), and the plug cover (2) is movably connected to the box cover (1) via the connecting belt.

5. The wafer vacuum packaging round box according to claim 1, characterized in that: The interior of the insertion hole (7) is connected to the interior of the through pipe (8).

6. The wafer vacuum packaging round box according to claim 1, characterized in that: The drawstring (14) is movably connected to the through hole (13) through the rubber plug (12).

7. The wafer vacuum packaging round box according to claim 1, characterized in that: A card slot (18) is provided at the bottom end of the box body (6), and the card plate (15) is movably embedded and connected to the box body (6) through the card slot (18).

Images