Chip feeding equipment for integrated circuit packaging

Abstract

The utility model relates to the technical field of chip feeding, and discloses chip feeding equipment for integrated circuit packaging, which comprises a bottom box, a material conveying mechanism is arranged in the bottom box, a feeding mechanism is arranged at the top of the material conveying mechanism, a chip main body is arranged in the top of the feeding mechanism, and the chip main body is arranged in the bottom box. The material conveying mechanism comprises a suction assembly, a material conveying assembly and a connecting assembly, the suction assembly is arranged in the left side of the bottom box, the material conveying assembly is arranged at the top of the bottom box, and the connecting assembly is arranged in the material conveying assembly. According to the chip feeding equipment for integrated circuit packaging, a follow-up structure does not need to be controlled by software programming to do complex movement, meanwhile, reverse material conveying treatment on the same side of a chip body can be completed through rotation of the material conveying rotary disc, the chip body can be transferred and fed reversely, a packaging production line of the chip body can be placed in a folded-back mode, and the production efficiency is improved. The total occupied length of a chip main body packaging equipment production line is reduced, the requirement for the occupied area is lowered, and use is convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of chip loading, in particular to chip loading equipment for integrated circuit packaging. Background Art

[0002] The role of the chip loading conveyor belt in integrated circuit manufacturing is to efficiently transport chips to improve production efficiency. At the same time, its structure includes a conveyor belt, an adjustment mechanism, a sensor and a control system. By monitoring the position and direction of the chip and adjusting the movement of the conveyor belt, it ensures the accurate positioning and orientation of the chip, thereby achieving high-quality automated production.

[0003] According to the "Chip Loading Equipment for Integrated Circuit Packaging (Publication Number: CN 221478658 U; Application Number: 202323063752.6)" published on the Patent Network, the above application optimizes the problem that "differences in the operating level and skills of the staff can easily lead to inaccurate chip positioning, which in turn affects the accurate positioning of the conveyor belt and subsequent packaging equipment. This instability may lead to packaging errors and waste of circuit chips during the production process." However, the loading equipment in the above application can only complete the same-direction transport and loading of chips when in use, which limits the length and floor space of the chip packaging production line, making it inconvenient to place the production line and inconvenient to use. Utility Model Content

[0004] The purpose of the present invention is to provide a chip loading device for integrated circuit packaging to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip loading device for integrated circuit packaging, comprising a bottom box, a material transfer mechanism is provided in the bottom box, a material feeding mechanism is provided on the top of the material transfer mechanism, and a chip body is provided on the top of the material feeding mechanism.

[0006] The material transfer mechanism includes a suction component, a material transfer component and a connecting component. The suction component is arranged in the left side of the bottom box, the material transfer component is arranged on the top of the bottom box, and the connecting component is arranged in the material transfer component.

[0007] The feeding mechanism includes a feeding component and a driving component. The feeding component is arranged above the material transfer component, and the driving component is arranged in the bottom box.

[0008] Preferably, the suction assembly includes a fixed box, which is fixedly connected to the bottom left side of the bottom box. An exhaust fan is provided in the fixed box, and air mesh plates are fixedly connected to the exhaust fan positions on the left and right sides of the fixed box.

[0009] Preferably, the material transfer assembly includes an annular air extraction groove, which is fixedly connected to the top of the bottom box. The top of the annular air extraction groove is rotatably connected to a feed turntable. A discharge positioning rod is provided on the right side of the feed turntable, and the discharge positioning rod is fixedly connected to the right side of the bottom box.

[0010] Preferably, the right end of the annular air extraction groove is arranged at the right position of the top of the bottom box, and the front side of the annular air extraction groove is arranged at the left position in front of the top of the bottom box.

[0011] Preferably, the connecting component includes a chip embedding groove, the chip embedding groove is opened in the top of the feed turntable with corresponding dimensions, a vent hole is opened in the bottom of the chip embedding groove, and a perforated plate is fixedly connected to the position of the vent hole at the bottom of the chip embedding groove.

[0012] Preferably, the feed assembly includes a feed slide, which is arranged in the front position above the feed turntable, and a frame rod is fixedly connected to the left side of the feed slide, and a limit block is fixedly connected to the left side of the frame rod.

[0013] Preferably, the feed slide is sleeved on the outside of the chip body, and the left opening of the feed slide is aligned with the chip embedding groove just in front of the top of the feed turntable.

[0014] Preferably, the drive assembly includes a drive motor, which is fixedly connected to the bottom box, a rotating shaft is fixedly connected to the top of the drive motor, the rotating shaft is rotatably connected to the top of the bottom box, a drive gear is fixedly connected to the top of the rotating shaft, the outer ring of the drive gear is engaged with a transmission gear ring, and the transmission gear ring is fixedly connected to the inner ring of the feed turntable.

[0015] Compared with the prior art, the present invention provides a chip loading device for integrated circuit packaging, which has the following beneficial effects:

[0016] 1. The chip loading equipment for integrated circuit packaging, through the provided material transfer mechanism, the exhaust fan is started to adsorb and fix the chip body entering the chip embedding groove through the cooperation of the annular exhaust groove, the orifice plate and the vent hole, so that when the feed turntable rotates to transfer and load the chip body, the chip body can be just stuck in the chip embedding groove under the action of airflow adsorption, thereby ensuring the stability of the chip body during the transfer and loading process. At the same time, the chip body is stuck in the chip embedding groove, so that the subsequent material transfer robot arm and other structures can effectively pick up the chip body and other processing, without the need for software programming to control the subsequent structure to perform complex movements. At the same time, the rotation of the feed turntable can complete the material transfer processing on the same side of the chip body, so that the chip body can complete the transfer and loading in the reverse direction, so that the chip body packaging production line can be folded back and placed, reducing the total length of the chip body packaging equipment production line, reducing the floor space requirement, and facilitating use.

[0017] 2. The chip loading equipment for integrated circuit packaging has a feeding mechanism. The staff only needs to start the drive motor to drive the feed turntable to rotate to complete the transfer and loading of the chip body. The limit block is fixed to the left side of the feed slide through a rack to limit and block the sliding chip body, so that the chip body will not fall to the top of the feed turntable and correspond to the chip embedding groove after sliding out of the feed slide, which is convenient for the subsequent chip embedding groove to absorb the chip body. The operation is simple and convenient for the staff to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without inventive work.

[0019] Figure 1 This is a front view of the utility model;

[0020] Figure 2 This is an explosion diagram of the utility model;

[0021] Figure 3 This is a cross-sectional exploded view of the utility model;

[0022] Figure 4 It is a side sectional view of the feed turntable structure;

[0023] Figure 5 It is a cross-sectional view of the structure of the connection component;

[0024] Figure 6 It is a schematic diagram of the partial structure of the feed component.

[0025] In the figure: 1. Material transmission mechanism; 11. Suction assembly; 1101. Fixed box; 1102. Exhaust fan; 1103. Air mesh plate; 12. Material transmission assembly; 1201. Annular exhaust trough; 1202. Feed turntable; 1203. Discharge positioning rod; 13. Connecting assembly; 1301. Chip embedding groove; 1302. Orifice plate; 1303. Vent; 2. Feeding mechanism; 21. Feeding assembly; 2101. Feeding slide; 2102. Rack rod; 2103. Limiting block; 22. Driving assembly; 2201. Driving motor; 2202. Rotating shaft; 2203. Driving gear; 2204. Transmission gear ring; 3. Bottom box; 4. Chip body. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium, internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0028] The utility model provides a technical solution: Example 1

[0029] Combine Figures 1 to 6 A chip loading device for integrated circuit packaging includes a bottom box 3, a material transfer mechanism 1 is arranged in the bottom box 3, a material feeding mechanism 2 is arranged on the top of the material transfer mechanism 1, and a chip body 4 is arranged on the top of the material feeding mechanism 2.

[0030] The material transfer mechanism 1 includes a suction component 11, a material transfer component 12 and a connecting component 13. The suction component 11 is arranged in the left side of the bottom box 3, the material transfer component 12 is arranged on the top of the bottom box 3, and the connecting component 13 is arranged in the material transfer component 12.

[0031] The suction assembly 11 includes a fixed box 1101, which is fixedly connected to the bottom of the left side of the bottom box 3. An exhaust fan 1102 is provided in the fixed box 1101. The left and right sides of the fixed box 1101 are fixedly connected to the positions of the exhaust fans 1102. The air-transmitting assembly 12 includes an annular air-extraction groove 1201, which is fixedly connected to the top of the bottom box 3. The top of the annular air-extraction groove 1201 is rotatably connected to a feed turntable 1202. A discharge positioning rod 12 is provided on the right side of the feed turntable 1202. 03, the discharge positioning rod 1203 is fixedly connected to the right side of the bottom box 3, the right end of the annular exhaust groove 1201 is set at the right position of the top of the bottom box 3, and the front side of the annular exhaust groove 1201 is set at the left position of the top of the bottom box 3. The connecting component 13 includes a chip embedding groove 1301, and the chip embedding groove 1301 is opened in the top of the feed turntable 1202 with a corresponding size. A vent hole 1303 is opened at the bottom of the chip embedding groove 1301, and a perforated plate 1302 is fixedly connected to the position of the vent hole 1303 at the bottom of the chip embedding groove 1301.

[0032] Furthermore: when the exhaust fan 1102 is started, the chip body 4 entering the chip embedding groove 1301 is adsorbed and fixed through the annular exhaust groove 1201, the orifice plate 1302 and the air vent 1303, so that when the feed turntable 1202 rotates to transfer and load the chip body 4, the chip body 4 can be just stuck in the chip embedding groove 1301 under the action of airflow adsorption, ensuring the stability of the chip body 4 during the transfer and loading process. At the same time, the chip body 4 is stuck in the chip embedding groove 1301, so that subsequent material transfer robotic arms and other structures can effectively pick up the chip body 4 and other processing, without the need for software programming to control subsequent structures to perform complex movements. At the same time, the rotation of the feed turntable 1202 can complete the material transfer processing on the same side of the chip body 4, so that the chip body 4 can complete the transfer and loading in reverse, so that the packaging production line of the chip body 4 can be folded back, reducing the total length of the chip body 4 packaging equipment production line, reducing the floor space requirements, and facilitating use. Example 2

[0033] See Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 and Figure 6 , and on the basis of Example 1, it is further obtained that the feeding mechanism 2 includes a feeding component 21 and a driving component 22, the feeding component 21 is arranged above the material transfer component 12, and the driving component 22 is arranged in the bottom box 3.

[0034] The feeding assembly 21 includes a feeding slide 2101, which is arranged in the front position above the feed turntable 1202. The left side of the feeding slide 2101 is fixedly connected to a frame rod 2102, and the left side of the frame rod 2102 is fixedly connected to a limit block 2103. The feeding slide 2101 is sleeved on the outside of the chip body 4, and the left opening of the feeding slide 2101 is aligned with the chip embedding groove 1301 in front of the top of the feed turntable 1202. The driving assembly 22 includes a driving motor 2201, which is fixedly connected to the bottom box 3. The top of the driving motor 2201 is fixedly connected to a rotating shaft 2202, and the rotating shaft 2202 is rotatably connected to the top of the bottom box 3. The top of the rotating shaft 2202 is fixedly connected to a driving gear 2203, and the outer ring of the driving gear 2203 is engaged with a transmission gear ring 2204, and the transmission gear ring 2204 is fixedly connected to the inner ring of the feed turntable 1202.

[0035] Furthermore: the staff only needs to start the driving motor 2201 to drive the feed turntable 1202 to rotate and complete the transfer and loading processing of the chip body 4. The limit block 2103 is fixed to the left side of the feed slide 2101 through the frame rod 2102 to limit and block the sliding chip body 4, so that the chip body 4 will not fall to the top of the feed turntable 1202 and correspond to the chip embedding groove 1301 after sliding out of the feed slide 2101, which is convenient for the subsequent chip embedding groove 1301 to adsorb the chip body 4 into. The operation is simple and convenient for the staff to use.

[0036] During actual operation, when this device is used, the staff starts the exhaust fan 1102 and the drive motor 2201. The exhaust fan 1102 starts to pump the air in the bottom box 3 outward, so that negative pressure is formed in the bottom box 3. The external air is sucked through the annular exhaust groove 1201, the orifice plate 1302 and the vent 1303 through the chip embedding groove 1301 to supplement the air pressure in the bottom box 3. The drive motor 2201 starts to drive the transmission gear ring 2204 to rotate through the rotating shaft 2202 and the driving gear 2203. The rotation of the transmission gear ring 2204 drives the feeding turntable 1202 to rotate. The rotation of the feeding turntable 1202 drives the chip embedding groove 1301 to follow the rotation through the annular exhaust groove 1201 to control whether the device adsorbs and positions the chip body 4 in the chip embedding groove 1301.

[0037] When the device is in use, the chip body 4 slides to the left in the feed slide 2101 and falls to the top of the feed turntable 1202, which is located above the chip embedding groove 1301. Then, the chip embedding groove 1301 and the chip body 4 follow the feed turntable 1202 to rotate into the position above the annular exhaust groove 1201. At this time, the chip embedding groove 1301 generates suction to adsorb the chip body 4 into the chip embedding groove 1301, completing the alignment of the chip embedding groove 1301. Then, the feed turntable 1202 continues to rotate to drive the chip body 4 to move to the right. At this time, the chip body 4 and the corresponding chip embedding groove 1301 are separated from the position above the annular exhaust groove 1201. At this time, the chip embedding groove 1301 releases the adsorption of the chip body 4, and then the chip body 4 can be transferred by structures such as a robotic arm.

[0038] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

Claims

1. A chip loading device for integrated circuit packaging, comprising a bottom box (3), characterized in that: A material transfer mechanism (1) is provided in the bottom box (3), a material feeding mechanism (2) is provided on the top of the material transfer mechanism (1), and a chip body (4) is provided in the top of the material feeding mechanism (2); The material transfer mechanism (1) comprises a suction component (11), a material transfer component (12) and a connecting component (13), wherein the suction component (11) is arranged in the left side of the bottom box (3), the material transfer component (12) is arranged on the top of the bottom box (3), and the connecting component (13) is arranged in the material transfer component (12); The feeding mechanism (2) comprises a feeding assembly (21) and a driving assembly (22); the feeding assembly (21) is arranged above the material transfer assembly (12); and the driving assembly (22) is arranged in the bottom box (3).

2. The chip loading equipment for integrated circuit packaging according to claim 1, characterized in that: The suction assembly (11) comprises a fixed box (1101), the fixed box (1101) being fixedly connected to the bottom of the left side of the bottom box (3), an exhaust fan (1102) being provided in the fixed box (1101), and air-permeable mesh plates (1103) being fixedly connected to the positions of the exhaust fan (1102) on the left and right sides of the fixed box (1101).

3. The chip loading equipment for integrated circuit packaging according to claim 1, characterized in that: The material transfer assembly (12) comprises an annular air extraction groove (1201), the annular air extraction groove (1201) is fixedly connected to the top of the bottom box (3), the top of the annular air extraction groove (1201) is rotatably connected to a feed turntable (1202), a discharge positioning rod (1203) is provided on the right side of the feed turntable (1202), and the discharge positioning rod (1203) is fixedly connected to the right side of the bottom box (3).

4. The chip loading equipment for integrated circuit packaging according to claim 3, characterized in that: The right end of the annular air extraction groove (1201) is arranged at the right position of the top of the bottom box (3), and the front side of the annular air extraction groove (1201) is arranged at the left position of the top of the bottom box (3).

5. The chip loading equipment for integrated circuit packaging according to claim 1, characterized in that: The connecting component (13) includes a chip embedding groove (1301), the chip embedding groove (1301) is opened in the top of the feed turntable (1202) with corresponding dimensions, a vent hole (1303) is opened in the bottom of the chip embedding groove (1301), and a perforated plate (1302) is fixedly connected to the position of the vent hole (1303) in the bottom of the chip embedding groove (1301).

6. The chip loading equipment for integrated circuit packaging according to claim 1, characterized in that: The feeding assembly (21) comprises a feeding slide (2101), the feeding slide (2101) being arranged in front of the feed turntable (1202), the feeding slide (2101) being fixedly connected to a frame rod (2102) on the left side, and the frame rod (2102) being fixedly connected to a limit stopper (2103) on the left side.

7. The chip loading equipment for integrated circuit packaging according to claim 6, characterized in that: The feed slide (2101) is sleeved on the outside of the chip body (4), and the left opening of the feed slide (2101) is aligned with the chip embedding groove (1301) directly in front of the top of the feed turntable (1202).

8. The chip loading equipment for integrated circuit packaging according to claim 1, characterized in that: The driving assembly (22) comprises a driving motor (2201), the driving motor (2201) being fixedly connected to the bottom box (3), the top of the driving motor (2201) being fixedly connected to a rotating shaft (2202), the rotating shaft (2202) being rotatably connected to the top of the bottom box (3), the top of the rotating shaft (2202) being fixedly connected to a driving gear (2203), the outer ring of the driving gear (2203) being meshed with a transmission gear ring (2204), and the transmission gear ring (2204) being fixedly connected to the inner ring of the feed turntable (1202).

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