3D imaging system and detection system of chip product
The multi-angle rotation and multi-light source illumination design of the 3D imaging system solves the problems of existing equipment's difficulty in detecting 3D information and the existence of blind spots, achieving efficient and damage-free chip detection and improving detection accuracy and speed.
Patent Information
- Application Number
- CN202422588808.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-25
- Publication Date
- 2025-09-23
- Estimated Expiration
- 2034-10-25
AI Technical Summary
Existing chip product inspection equipment has difficulty in effectively detecting 3D information and is prone to damaging the chip or having blind spots in inspection.
A 3D imaging system, including a camera, a mirror group, a rotating device, a light source array and a reflector, is used to achieve all-round imaging and detection of chip products through multi-angle rotation and multi-light source illumination.
It achieves efficient detection without blind spots, improves detection efficiency and imaging quality, avoids chip damage, and can measure 2D and 3D information simultaneously.
Smart Images
Figure CN223377227U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of optical testing, in particular to a 3D imaging system for chip products and a detection system for chip products. Background Art
[0002] During semiconductor chip production, some chips require inspection for side defects, such as solder height, wire height, PIN height, chip height, and other cosmetic defects, to ensure they meet production specifications. Currently, existing inspection methods include contact shape sensors, laser displacement sensors using triangulation, and 2D vision systems.
[0003] Among them, because semiconductor chips are relatively fragile, the use of contact sensors can easily damage the product; the laser displacement detection using the triangular reflection method is difficult to apply to chip products whose surfaces are made of materials with high absorption and reflectivity, and shadows are prone to appear, resulting in detection blind spots; the 2D vision system can only measure surface appearance defects and has difficulty measuring 3D information.
[0004] The above content is only used to assist in understanding the technical solution of the present invention and does not constitute an admission that the above content is prior art. Utility Model Content
[0005] The utility model provides a 3D imaging system for chip products and a detection system for chip products, aiming to achieve efficient and high-quality 3D imaging of chip products.
[0006] To achieve the above-mentioned object, the present invention proposes a 3D imaging system for chip products, comprising: a camera, a lens assembly, a rotating device, a light source array, and a right-angle reflector arranged from top to bottom above the product placement position, with the central axis aligned with the product placement position;
[0007] The camera is connected to the rotating device through a lens assembly, and a first light source is also provided on the side of the lens assembly; there is a gap between the right-angle reflector and the light source array and the product placement position. The right-angle reflector has two back-to-back reflective surfaces with an angle of 90°, each reflecting surface forming an angle of 45° with the horizontal plane. Reflectors are symmetrically arranged on both sides of the two reflecting surfaces, and the angle between the reflectors and the horizontal plane ranges from [45° to 90°]; the incident angle range of the light path from the product placement position to the reflector is (0° to 90°);
[0008] A second light source is provided outside the area formed by the right-angle reflector and the reflector; a hollow third light source is provided between the plane where the reflector is located and the plane where the product is placed;
[0009] The light source array, the second light source, the third light source, the right-angle reflector and the reflector are all linked to the rotating device.
[0010] Optionally, the rotation center of the rotating device is the center of the 3D imaging system.
[0011] Optionally, the rotating device is driven by a built-in rotating motor.
[0012] The present invention further proposes a chip product detection system, comprising a computer and a 3D imaging system, wherein a communication connection is established between the computer and the 3D imaging system; the 3D imaging system is the 3D imaging system for chip products as described above.
[0013] The beneficial effects of this utility model's technical solution are: using visual inspection to avoid damaging the chip product being tested, while achieving multi-angle scanning and capturing information from all sides of the chip product. Furthermore, the arrangement of multiple light sources ensures sufficient illumination of all parts of the chip product. The design of the reflector and light source helps reduce shadows, enhancing the ability to inspect the surface and sides of the chip product and improving imaging quality. Therefore, through reasonable configuration and operation, the rotatable, blind-spot-free 3D imaging system of this embodiment can achieve efficient detection of chip product defects, thereby improving inspection efficiency and quality control. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the overall architecture of the 3D imaging system of the chip product of the utility model;
[0015] Figure 2 This is a schematic diagram of the optical path of the light source array of the 3D imaging system of the chip product of the utility model;
[0016] Figure 3 This is a schematic diagram of the optical path of the second light source of the 3D imaging system of the chip product of the utility model;
[0017] Figure 4 This is a schematic diagram of the optical path of the third light source of the 3D imaging system of the chip product of the utility model;
[0018] Figure 5 This is a schematic structural diagram of the rotating device of the 3D imaging system of the chip product of the present invention.
[0019] Description of reference numerals:
[0020] 1. Camera; 2. Lens group; 3. First light source; 4. Light source array; 5. Second light source; 6. Third light source; 7. Right-angle reflector; 8. Reflector; 9. Rotating device.
[0021] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the schemes in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0023] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0024] It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element.
[0025] In addition, if the descriptions of "first", "second", etc. are involved in the present invention, they are only used for descriptive purposes (such as to distinguish the same or similar elements) and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.
[0026] The utility model proposes a 3D imaging system for chip products, referring to Figure 1 The 3D imaging system of the chip product includes a camera 1, a lens group 2, a rotating device 9, a light source array 4 and a right-angle reflector 7, which are arranged from top to bottom above the product placement position and whose central axis is aligned with the product placement position;
[0027] The camera 1 is connected to the rotating device 9 via the lens assembly 2. A first light source 3 is also provided on the side of the lens assembly 2. There is a gap between the right-angle reflector 7, the light source array 4, and the product placement position. The right-angle reflector 7 has two back-to-back reflective surfaces with an angle of 90°. Reflectors are symmetrically arranged on both sides of the two reflective surfaces. The angle between the reflector 8 and the horizontal plane ranges from [45° to 90°]. The incident angle range of the light path from the product placement position to the reflector 8 is (0° to 90°).
[0028] A second light source 5 is provided on the periphery of the position area formed by the right-angle reflector 7 and the reflector 8; a hollow third light source 6 is provided between the plane where the reflector 8 is located and the plane where the product is placed;
[0029] The light source array 4 , the second light source 5 , the third light source 6 , the right-angle reflector 7 and the reflector 8 are all linked to the rotating device 9 .
[0030] In this embodiment, the product placement position provides a stable surface to ensure that the chip product maintains a fixed position during the inspection process, thereby reducing measurement errors caused by position movement.
[0031] Camera 1 and lens assembly 2 are located above the product placement area and aligned with its central axis. They capture the image data of the chip. Lens assembly 2 adjusts the light path so that it effectively reaches the chip and optimizes the optical path to improve image quality. Lens assembly 2 can also be used to magnify the image or change the viewing angle.
[0032] Below the camera 1, a rotating device 9 is connected via a lens group 2. The front end of the lens group 2 is connected to the rotating device 9, and the rear end of the lens group 2 is connected to the camera 1. One or more functional lenses can be set in the lens group 2 according to the needs of the situation.
[0033] A light source array 4 is provided below the rotating device 9. The light provided by the light source array 4 can evenly illuminate the surface of the chip.
[0034] Below the light source array 4, a right-angle reflector 7 is provided at a certain distance. At the same time, the right-angle reflector 7 also maintains a certain distance from the product placement position located thereunder.
[0035] Among them, the right-angle reflector 7 is provided with two back-to-back reflective surfaces, and the angle between the planes where the two reflective surfaces are located is 90°, and the angle between each reflective surface and the horizontal plane is 45°; reflectors 8 are symmetrically arranged on both sides of the two reflective surfaces; the angle between each reflector 8 and the horizontal plane is in the range of [45°, 90°), preferably 45°; the incident angle range of the light path from the product placement position to the reflector 8 is (0°, 90°], preferably [45°, 90°].
[0036] Optionally, the right-angle reflector 7 is preferably a right-angle triangular prism, so that the two sides of the right-angle reflector 7 that form a right angle are reflective surfaces, and the angle between them is 90°. Among them, the right-angle triangular prism has at least two reflective surfaces and one non-reflective surface. The non-reflective side of the right-angle reflector 7 faces the product placement position, and reflectors 8 are symmetrically arranged on both sides of the other two reflective surfaces of the right-angle reflector 7; the reflector 8 is tilted toward the side of the product placement position, and the reflector 8 also maintains a certain distance from one of the other two sides of the right-angle reflector 7 on the same side. In this way, the light reflected from the front and side of the product placement position to the reflector 8 can be reflected to the right-angle reflector 7, and then reflected to the lens group 2 and the camera 1 through the right-angle reflector 7.
[0037] A first light source 3 is also provided on the side of the lens assembly 2 to provide a side light source for the lens assembly 2. In some optional embodiments, a reflector can be provided in the lens assembly 2 at a position that does not affect the camera 1 to reflect the light provided by the first light source 3 toward the product placement position.
[0038] A second light source 5 is provided at the periphery of the position area formed by the right-angle reflector 7 and the reflector 8 and is tilted toward the product placement position.
[0039] A hollow third light source 6 is provided between the plane where the reflector 8 is located and the plane where the product is placed (the hollow setting can avoid blocking the light reflected back from the product placement position), and the light path of the third light source 6 can illuminate the side of the product placement position (optionally irradiate the front of the product placement position at the same time); the third light source 6 can maintain a certain distance from the plane where the reflector 8 is located and the plane where the product is placed in the upper and lower directions.
[0040] The light source array 4, the second light source 5, the third light source 6, the right-angle reflector 7 and the reflector 8 are all linked to the rotating device 9. These devices can adopt a specific connection mechanism (such as a bracket or a fixed frame) and the rotating device 9, and are driven to rotate by the rotating device 9.
[0041] When using the 3D imaging system for chip products, place the chip product on the product placement position. Camera 1 and lens group 2 are responsible for collecting the light reflected from the product placement position, converting the optical signal into an electrical signal and transmitting it to the computer as an image.
[0042] Lighting is provided by the light source array 4, the first light source 3, the second light source 5 and the third light source 6. By setting four light sources at different angles, the lighting requirements of different chip products or different features can be met, thus enriching the lighting environment.
[0043] Right-angle reflectors 7 and 8 are responsible for reflecting light reflected from the chip product back into lens assembly 2. There are two reflectors 8, symmetrically positioned. Light is directed to the sides of the chip product by light array 4, first light source 3, second light source 5, and third light source 6. The light reflected from the chip product is then reflected back into lens assembly 2 by reflectors 8 and right-angle reflectors 7, where it is captured by camera 1.
[0044] Reference Figure 2 The light path of the light source array 4 can reach the front and side of the chip product at the same time. The light reflected by the front and side of the chip product reaches the reflector 8, and then is reflected by the reflector 8 to the right-angle reflector 7, and finally the right-angle reflector 7 reflects the light into the mirror group 2.
[0045] Similarly, refer to Figure 3 The light provided by the second light source 5 is reflected by the chip product to the reflector 8, and then reflected by the reflector 8 to the right-angle reflector 7, and finally reflected by the right-angle reflector 7 into the mirror assembly 2.
[0046] Similarly, refer to Figure 4 The light provided by the third light source 6 is reflected by the chip product to the reflector 8, and then reflected by the reflector 8 to the right-angle reflector 7, and finally reflected by the right-angle reflector 7 into the mirror assembly 2.
[0047] Optionally, the rotation center of the rotating device 9 is the center of the 3D imaging system (which may correspond to the central axis of the product placement position).
[0048] The rotating device 9 can drive the light source array 4, the second light source 5, the third light source 6, the right-angle reflector 7 and the reflector 8 to rotate along the central axis, thereby realizing 360° imaging, and the features, defects, etc. of the surface of the chip product placed on the product placement position can be observed from various angles; as the rotating device 9 rotates, the camera 1 can capture images from different angles; the collected images can then be transmitted to a computer for processing, so as to measure height information and other defect information.
[0049] In one embodiment, visual inspection is employed to avoid damaging the chip being tested while enabling multi-angle scanning and capturing information from all sides of the chip. Furthermore, the arrangement of multiple light sources ensures adequate illumination of all parts of the chip (especially when detecting side defects). The design of the reflector 8 and light source helps reduce shadows, enhancing the ability to inspect the surface and sides of the chip and improving imaging quality. Therefore, through proper configuration and operation, the rotatable, blind-spot-free 3D imaging system of this embodiment can achieve efficient detection of chip defects, thereby improving inspection efficiency and quality control.
[0050] Because the 3D imaging system of the chip product of this embodiment has the characteristics of high precision, stability and reliability, compact structure, etc., it has a controllable observation angle, no blind spots in the field of view, and can simultaneously image both sides of the chip product through one field of view, reducing the number of images; it can simultaneously observe both sides of the object and perform 2D and 3D imaging at the same time, that is, it can simultaneously measure the 2D information and 3D information of the chip product.
[0051] Compared to existing solutions, the 3D imaging system of this embodiment offers faster inspection speeds and lower costs, significantly improving both efficiency and quality in surface defect inspection of chip products. This 3D imaging system significantly improves both the speed and quality of chip product inspections. Through its efficient inspection process and comprehensive imaging capabilities, it helps promptly identify and resolve defects in production, thereby enhancing quality control and production efficiency.
[0052] In one embodiment, based on the above embodiment, referring to Figure 2 Part of the light path of the light source array 4 illuminates the front of the product placement position, and another part of the light path illuminates the side of the product placement position.
[0053] In this embodiment, the light source array 4 is positioned beneath the rotating device 9, providing multiple light sources to fully illuminate the chip product. The placement and angle of the light source array 4 are key to ensuring uniform illumination of all parts of the chip product. Through precise optical design, the light source array 4 splits its light into two parts: one illuminates the front of the product placement area, and the other illuminates the sides of the product placement area.
[0054] The light source array 4 effectively splits the light into two parts, illuminating the front and side of the chip product respectively. This design not only ensures all-round illumination but also improves imaging quality, allowing every part of the chip product to be clearly captured, thereby optimizing the detection effect of the 3D imaging system.
[0055] In one embodiment, based on the above embodiment, the substrate of the light source array 4 is circular, and a plurality of lamp beads arranged in an array are provided on the substrate.
[0056] In this embodiment, by designing a circular substrate and multiple arrayed LEDs, light source array 4 can achieve a more uniform and controllable lighting effect. This configuration not only enhances the imaging quality of chip products, but also increases the system's flexibility and adaptability, enabling it to provide excellent performance under various inspection conditions. This will further improve the efficiency and accuracy of 3D imaging systems in chip product defect detection.
[0057] In one embodiment, based on the above embodiment, referring to Figure 3, the second light source 5 includes two arc-shaped light sources.
[0058] In this embodiment, by designing two arc-shaped light sources as the second light source 5, the illumination effect on the side surfaces of the chip product can be effectively improved. This design provides uniform side illumination, reduces detection blind spots caused by light inhomogeneity, and enhances the imaging system's ability to detect side defects. Overall, the introduction of arc-shaped light sources not only optimizes light distribution but also improves the detection accuracy and efficiency of the 3D imaging system.
[0059] In one embodiment, based on the above embodiment, the diameter of the front port of the lens assembly 2 is larger than the diameter of the rear port, and the rear end of the lens assembly 2 is connected to the camera 1 .
[0060] In this embodiment, by designing the front end of lens assembly 2 to have a larger diameter than the rear end and connecting the rear end of lens assembly 2 to camera 1, more efficient light reception and focusing are achieved, thereby improving the overall performance of the imaging system. The larger front end helps capture more light, increasing brightness; the smaller rear end helps precisely guide light to the camera 1 sensor, enhancing image clarity. This overall design optimizes light transmission, reduces light loss, and improves the system's imaging quality and stability.
[0061] In one embodiment, based on the above embodiment, referring to Figure 5 , the rotating device 9 is driven by a built-in rotating motor.
[0062] The present utility model further proposes a chip product detection system, which includes a computer and a 3D imaging system for the chip product. The specific structure of the 3D imaging system for the chip product refers to the above-mentioned embodiment. Since the chip product detection system adopts all the technical solutions of all the above-mentioned embodiments, it has at least all the technical effects brought about by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.
[0063] Among them, a communication connection is established between the computer and the 3D imaging system of the chip product to realize data transmission, processing and analysis.
[0064] The computer receives the optical signal corresponding to the chip product captured by the camera 1 of the 3D imaging system, performs 2D and / or 3D imaging, and performs height detection, surface defect detection, etc. on the chip product based on the imaging results.
[0065] The above description is only part or preferred embodiments of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural transformations made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.
Claims
1. A 3D imaging system for a chip product, characterized in that: include: Above the product placement, a camera, a lens assembly, a rotating device, a light source array, and a right-angle reflector are arranged from top to bottom with the central axis aligned with the product placement; The camera is connected to the rotating device via a lens assembly, and a first light source is also provided on the side of the lens assembly. There is a gap between the right-angle reflector and the light source array and the product placement position. The right-angle reflector has two back-to-back reflective surfaces with a 90° angle, each with a 45° angle to the horizontal plane. Reflectors are symmetrically arranged on either side of the two reflective surfaces, and the angles between the reflectors and the horizontal plane range from (45° to 90°). The incident angle range of the light path from the product placement position to the reflector is (0° to 90°). A second light source is provided outside the area formed by the right-angle reflector and the reflector; a hollow third light source is provided between the plane where the reflector is located and the plane where the product is placed; The light source array, the second light source, the third light source, the right-angle reflector and the reflector are all linked to the rotating device.
2. The 3D imaging system of the chip product according to claim 1, wherein: The rotation center of the rotating device is the center of the 3D imaging system.
3. The 3D imaging system of the chip product according to claim 1 or 2, characterized in that: The rotating device is driven by a built-in rotating motor.
4. A chip product detection system, characterized in that: It comprises a computer and a 3D imaging system, wherein a communication connection is established between the computer and the 3D imaging system; the 3D imaging system is a 3D imaging system of the chip product according to any one of claims 1 to 3.