Multi-stage adjustable heat dissipation mechanism for power battery

Abstract

The utility model discloses a multi-stage adjustable heat dissipation mechanism for a power battery, which comprises a support plate, one side of the support plate is communicated with a circulating inlet pipe, the other end of the circulating inlet pipe is communicated with a circulating pipe, the opposite side of the circulating pipe is communicated with a plurality of connecting pipes, the opposite ends of the connecting pipes are communicated with a heat conducting plate, and the heat conducting plate is communicated with the heat conducting pipe. A hollow heat dissipation piece is fixedly installed in the heat conduction plate, a supporting frame is fixedly installed at the top of the supporting plate, a plurality of heat dissipation plates are fixedly installed on the inner side of the supporting frame, and a plurality of heat dissipation holes are formed in the heat dissipation plates; through the through design of the heat dissipation plate, the contact surface between the heat dissipation plate and cooling working medium liquid can be increased, and the heat conduction efficiency of the heat dissipation plate is improved, so that the heat dissipation efficiency is indirectly improved, various heat dissipation and heat conduction efficiencies are realized, and the heat dissipation efficiency is improved by matching with concave table type internal spaces in the support plate and the support frame. Furthermore, an evaporation space and a contact surface are provided for heat dissipation of the cooling working medium liquid, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation mechanisms for power batteries, in particular to a heat dissipation mechanism for power batteries that can be adjusted in multiple stages. Background Art

[0002] Power batteries are the power source for tools, primarily those used in electric vehicles, electric trains, electric bicycles, and golf carts. They feature exceptionally long life, safety, high-current 2C fast charge and discharge, high-temperature resistance, high capacity, no memory effect, compact size, and lightweight. They primarily include lead-acid batteries, nickel-metal hydride batteries, and lithium-ion batteries. These batteries differ significantly from starting batteries used for automotive engines and are typically valve-sealed lead-acid batteries, open-type tubular lead-acid batteries, and lithium iron phosphate batteries.

[0003] In small new energy vehicles and mobile tools that use power batteries, during the operation of the power batteries, the violent chemical reactions inside them will generate a large amount of heat, causing the battery temperature to change sharply. The change in battery temperature directly affects the battery's safety, cycle life, discharge capacity, and charge and discharge efficiency. In order to ensure the temperature and service life during use, a heat dissipation mechanism will be built into the power battery's mounting structure. However, the heat dissipation efficiency of traditional heat dissipation mechanisms is not ideal. It has a single heat dissipation path and does not have multi-level temperature adjustment. It cannot respond to different usage conditions according to the adjustment. Based on this, a heat dissipation mechanism for power batteries with multi-level adjustment is proposed. Utility Model Content

[0004] The purpose of the present invention is to provide a multi-stage adjustable heat dissipation mechanism for a power battery to solve the problems raised in the above background technology.

[0005] The heat dissipation device is connected with the bridge to the upper end of the heat dissipation device, and the bridge has two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the end of the heat dissipation device and the mounting plate, so that the heat dissipation device can be connected along the bridge to the mounting plate, the bridge having two opposite ends, and one of the ends is disconnected from the mounting plate to form a cutout between the bridge and the mounting plate.

[0006] Preferably, the circulation pipe is in a rectangular ring shape, the number of the circulation pipe is at least one group, and the end of the circulation outlet pipe away from the circulation pump is fixedly passed through the support plate and connected to one end of the circulation pipe.

[0007] Preferably, the connecting pipes are linearly and evenly distributed on opposite sides of the circulation pipe, the heat conducting plate is an internal hollow structure, and the hollow heat dissipating element is a copper structure.

[0008] Preferably, the support plate and the support frame are both internally hollow structures, and the bottom of the support frame is connected to the interior of the support plate.

[0009] Preferably, both ends and the bottom of the heat dissipation plate are fixedly penetrated and extend to the bottom of the support frame and the support plate respectively, the copper connecting pipe is fixedly penetrated and connected to both sides of the support frame, and the copper hollow tube is fixedly penetrated and connected to the inner side of the support frame and the bottom of the support plate.

[0010] Preferably, the first semiconductor refrigerator and the second semiconductor refrigerator are symmetrically arranged opposite to each other, and the interiors of the support plate, support frame, circulation pipe and heat conducting plate are filled with cooling fluid.

[0011] Compared with the prior art, the beneficial effects of the present invention are as follows: when the mechanism is working, the power battery is installed on the opposite side of the heat conducting plate. When the power battery generates heat for dissipation, the circulating pump first circulates to pump out the cooling fluid inside the support plate, enters the inside of the circulation pipe through the circulation outlet pipe, circulates to the inside of the heat conducting plate through the circulation pipe and the connecting pipe, and contacts the outside of the hollow heat dissipation element. At this time, the heat generated by the power battery is taken away by the heat conduction effect of the heat conducting plate and the hollow heat dissipation element. At this time, the heat is circulated to the inside of the support plate through the circulation inlet pipe. At this time, due to the heat absorption of the cooling fluid, a certain amount of evaporation occurs. At this time, the evaporated gas fills the top space of the support plate and the support frame, and is in contact with the outside of the hollow heat dissipation element. Internal contact of the heat sink, at this time, as the airflow passes through the copper connecting tube and the heat dissipation holes and the inside of the copper hollow tube, the heat sink is prompted to conduct heat dissipation. Then, when the demand for heat dissipation increases, the heat dissipation fan is started to increase the airflow in contact with the heat sink, thereby improving the heat dissipation efficiency. When the heat dissipation demand further increases, the first semiconductor refrigerator with the cold end facing the inside of the support plate is started to cool the refrigerant liquid inside the support plate to achieve the maximum heat dissipation efficiency, thereby realizing the transition from unpowered heat dissipation to heat dissipation with increased airflow, and finally to heat dissipation requiring refrigeration, thereby gradually improving the heat dissipation efficiency and achieving the purpose of multi-stage regulation, thereby realizing diverse heat dissipation and improving the overall heat dissipation efficiency and use effect;

[0012] The utility model adopts the through-type design of the heat dissipation plate, which can increase the contact area between the heat dissipation plate and the cooling working fluid, and increase the thermal conductivity of the heat dissipation plate, thereby indirectly improving the heat dissipation efficiency, thereby achieving diverse heat dissipation and thermal conductivity efficiencies, and cooperates with the concave table-like internal space inside the support plate and the support frame to further provide evaporation space and contact surface for the heat dissipation of the cooling working fluid, thereby improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the front three-dimensional appearance structure of the utility model.

[0014] Figure 2 This is a schematic diagram of the three-dimensional appearance structure of the utility model when viewed from the rear or upward direction.

[0015] Figure 3 It is a schematic diagram of the right side sectional structure of the utility model.

[0016] Figure 4 It is a front sectional structural schematic diagram of the utility model.

[0017] In the figure: 1. Support plate; 2. Support frame; 3. Copper connecting pipe; 4. Heat dissipation plate; 5. Circulation outlet pipe; 6. Circulation inlet pipe; 7. Circulation pipe; 8. Connecting pipe; 9. Heat conduction plate; 10. Copper hollow pipe; 11. First semiconductor refrigerator; 12. Hollow heat dissipation element; 13. Heat dissipation hole; 14. Circulation pump; 15. Second semiconductor refrigerator; 16. Heat dissipation fan. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] See also Figures 1-4The utility model provides a technical solution: a multi-stage adjustable heat dissipation mechanism for a power battery, comprising a support plate 1, one side of the support plate 1 is connected to a circulation inlet pipe 6, the other end of the circulation inlet pipe 6 is connected to a circulation pipe 7, the opposite side of the circulation pipe 7 is connected to a plurality of connecting pipes 8, the opposite ends of the connecting pipes 8 are connected to a heat conducting plate 9, a hollow heat dissipation member 12 is fixedly installed inside the heat conducting plate 9, a support frame 2 is fixedly installed on the top of the support plate 1, a plurality of heat dissipation plates 4 are fixedly installed on the inner side of the support frame 2, a plurality of heat dissipation holes 13 are opened inside the heat dissipation plate 4, two copper connecting pipes 3 are fixedly sleeved inside the support frame 2, a copper hollow pipe 10 is fixedly sleeved inside the support plate 1, a heat dissipation fan 16 is movably installed inside the copper hollow pipe 10, a first semiconductor refrigerator 11 is fixedly installed inside the bottom end of the support plate 1, a second semiconductor refrigerator 15 is fixedly installed inside the bottom end of the support plate 1, a circulation pump 14 is fixedly installed at the bottom of the inner cavity of the support plate 1, and the output end of the circulation pump 14 is connected to the circulation outlet pipe 5.

[0020] The working principle of the above technical solution is as follows: during operation, the power battery is installed on the opposite side of the heat conducting plate 9. When the power battery generates heat for dissipation, the circulating pump 14 first circulates to pump out the cooling fluid inside the support plate 1, enters the inside of the circulation pipe 7 through the circulation outlet pipe 5, circulates to the inside of the heat conducting plate 9 through the circulation pipe 7 and the connecting pipe 8, and contacts the outside of the hollow heat sink 12. At this time, the heat generated by the power battery is taken away by the heat conduction effect of the heat conducting plate 9 and the hollow heat sink 12. At this time, the heat is circulated to the inside of the support plate 1 through the circulation inlet pipe 6. At this time, due to the absorption of heat by the cooling fluid, a certain amount of evaporation occurs. At this time, the evaporated gas fills the top space of the support plate 1 and the support frame 2, and contacts the heat sink 12. 4, at this time, as the air flow passes through the copper connecting tube 3 and the heat dissipation hole 13 and the inside of the copper hollow tube 10, the heat dissipation plate 4 is prompted to conduct heat dissipation, and then when the heat dissipation demand increases, the heat dissipation fan 16 is started to increase the air flow in contact with the heat dissipation plate 4, thereby improving the heat dissipation efficiency. When the heat dissipation demand further increases, the first semiconductor refrigerator 11 with the cold end facing the inside of the support plate 1 is started to cool the cooling fluid inside the support plate 1 so as to achieve the maximum heat dissipation efficiency, thereby realizing the transition from unpowered heat dissipation to increased airflow heat dissipation and finally to heat dissipation requiring refrigeration, thereby gradually improving the heat dissipation efficiency and achieving the purpose of multi-stage regulation, thereby realizing diverse heat dissipation and improving the heat dissipation efficiency and use effect as a whole.

[0021] In another embodiment, Figures 1-4 As shown, the circulation pipe 7 is in a rectangular ring shape, and the number of the circulation pipe 7 is at least one group. The end of the circulation outlet pipe 5 away from the circulation pump 14 is fixedly passed through the support plate 1 and connected to one end of the circulation pipe 7.

[0022] The circulation pipe 7 provides a channel for the circulation of the coolant, and a slightly larger battery can be equipped with multiple groups of circulation pipes 7 and heat conduction plates 9 to facilitate different usage requirements. One group of circulation pipes 7 is convenient for meeting the installation needs of small batteries, facilitates circulation, and increases the overall usage effect.

[0023] In another embodiment, Figures 1-4 As shown, the connecting pipes 8 are linearly and evenly distributed on the opposite sides of the circulation pipe 7, the heat conducting plate 9 is an internal hollow structure, and the hollow heat dissipating element 12 is a copper structure.

[0024] The connecting pipe 8 guides the circulating coolant into the interior of the heat conducting plate 9 and promotes the coolant to contact with the hollow heat dissipating member 12, thereby increasing the heat conduction efficiency of the coolant and facilitating improving the efficiency of the coolant in removing heat from the battery.

[0025] In another embodiment, Figures 1-4 As shown, the support plate 1 and the support frame 2 are both hollow structures, and the bottom of the support frame 2 is connected to the interior of the support plate 1.

[0026] The support plate 1 and the support frame 2 are internally connected, and a concave space is formed inside, thereby increasing the flow space of the coolant. The support plate 1 provides space for the liquid coolant, and when part of the coolant evaporates, the space of the support frame 2 provides space for the evaporated coolant, which facilitates increasing the contact area with the heat sink 4 and improving the heat dissipation efficiency.

[0027] In another embodiment, Figures 1-4 As shown, both ends and the bottom of the heat dissipation plate 4 are fixed through and extend to the bottom of the support frame 2 and the support plate 1 respectively, the copper connecting pipe 3 is fixed through the support frame 2 and connected on both sides of the support frame 2, and the copper hollow tube 10 is fixed through the support plate 1 and connected to the inner side of the support frame 2 and the bottom of the support plate 1.

[0028] The copper hollow tube 10 and the copper connecting tube 3 provide a position for airflow and seal the space, thereby adding an additional heat dissipation channel, which facilitates the passage of airflow and further improves the heat dissipation efficiency. This solution uses a through-type design of the heat dissipation plate 4 to increase the contact area between the heat dissipation plate 4 and the cooling fluid, and increase the thermal conductivity of the heat dissipation plate 4, thereby indirectly improving the heat dissipation efficiency, thereby achieving a variety of heat dissipation and thermal conductivity efficiencies, and cooperates with the concave internal space inside the support plate 1 and the support frame 2 to further provide evaporation space and contact surface for the heat dissipation of the cooling fluid, thereby improving the heat dissipation efficiency.

[0029] In another embodiment, Figures 1-4 As shown, the first semiconductor refrigerator 11 and the second semiconductor refrigerator 15 are symmetrically arranged opposite to each other, and the interiors of the support plate 1, the support frame 2, the circulation pipe 7 and the heat conducting plate 9 are filled with cooling fluid.

[0030] The cooling end and the heat dissipation end of the first semiconductor refrigerator 11 and the second semiconductor refrigerator 15 are opposite. The cooling end of the first semiconductor refrigerator 11 faces the inside of the support plate 1, and the heat dissipation end of the second semiconductor refrigerator 15 faces the inside of the support plate 1. This is convenient for cooling or heating the inside of the support plate 1 as needed, thereby further increasing the multi-stage adjustment capability. The overall structure is simple and the heat dissipation efficiency is high. The cooling working fluid includes but is not limited to water and ethylene glycol solution, silicone oil or fluorinated liquid.

[0031] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-stage adjustable heat dissipation mechanism for a power battery, comprising a support plate (1), characterized in that: One side of the support plate (1) is connected to a circulation inlet pipe (6), the other end of the circulation inlet pipe (6) is connected to a circulation pipe (7), the opposite side of the circulation pipe (7) is connected to a plurality of connecting pipes (8), the opposite ends of the connecting pipes (8) are connected to a heat conducting plate (9), a hollow heat dissipating member (12) is fixedly installed inside the heat conducting plate (9), a support frame (2) is fixedly installed on the top of the support plate (1), a plurality of heat dissipating plates (4) are fixedly installed on the inner side of the support frame (2), a plurality of heat dissipating holes (13) are opened inside the heat dissipating plate (4), and the heat dissipating plate (4) is provided with a plurality of heat dissipating holes (13). Two copper connecting pipes (3) are fixedly sleeved inside the support frame (2), a copper hollow pipe (10) is fixedly sleeved inside the support plate (1), a heat dissipation fan (16) is movably installed inside the copper hollow pipe (10), a first semiconductor refrigerator (11) is fixedly installed inside the bottom end of the support plate (1), a second semiconductor refrigerator (15) is fixedly installed inside the bottom end of the support plate (1), a circulation pump (14) is fixedly installed at the bottom of the inner cavity of the support plate (1), and the output end of the circulation pump (14) is connected to the circulation outlet pipe (5).

2. The multi-stage adjustable heat dissipation mechanism for a power battery according to claim 1, characterized in that: The circulation pipe (7) is in a rectangular ring shape, and the number of the circulation pipes (7) is at least one group. The end of the circulation outlet pipe (5) away from the circulation pump (14) is fixedly passed through the support plate (1) and connected to one end of the circulation pipe (7).

3. The multi-stage adjustable heat dissipation mechanism for a power battery according to claim 1, characterized in that: The connecting pipes (8) are linearly and evenly distributed on opposite sides of the circulation pipe (7); the heat conducting plate (9) is an internal hollow structure; and the hollow heat dissipating element (12) is a copper structure.

4. The multi-stage adjustable heat dissipation mechanism for a power battery according to claim 1, characterized in that: The support plate (1) and the support frame (2) are both internally hollow structures, and the bottom of the support frame (2) is connected to the interior of the support plate (1).

5. The multi-stage adjustable heat dissipation mechanism for a power battery according to claim 1, characterized in that: Both ends and the bottom of the heat dissipation plate (4) are fixedly passed through and extend to the bottom of the support frame (2) and the support plate (1), respectively; the copper connecting pipe (3) is fixedly passed through the support frame (2) and is connected to both sides of the support frame (2); and the copper hollow pipe (10) is fixedly passed through the support plate (1) and is connected to the inner side of the support frame (2) and the bottom of the support plate (1).

6. The multi-stage adjustable heat dissipation mechanism for a power battery according to claim 1, characterized in that: The first semiconductor refrigerator (11) and the second semiconductor refrigerator (15) are symmetrically arranged opposite to each other, and the interiors of the support plate (1), support frame (2), circulation pipe (7) and heat conduction plate (9) are filled with cooling fluid.

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