PCB (Printed Circuit Board) copper-clad plate structure with efficient heat dissipation

Abstract

The utility model discloses an efficient heat dissipation PCB copper-clad plate structure, which comprises a core layer, a connecting layer arranged at the bottom of the core layer, a bottom plate arranged at the bottom of the connecting layer, a protective layer arranged at the top of the core layer, a panel arranged at the top of the protective layer, the bottom plate and the connecting layer are bonded with each other, the bottom plate is a copper foil layer, and the connecting layer is a copper foil layer. The connecting layer and the core layer are bonded with each other, and the connecting layer is glass fiber cloth, and the device is provided with the bottom plate, the connecting layer, the core layer, the protective layer and the panel, so that the function of good heat dissipation effect is realized, the problem of poor heat dissipation effect is solved, the problem of overheating damage caused by poor heat dissipation effect is further solved, and the service life of the device is prolonged. Therefore, the service life is effectively prolonged, and the working requirements of people are met.

Description

Technical Field

[0001] The utility model belongs to the technical direction of PCB copper clad plates, and specifically relates to a PCB copper clad plate structure with high efficiency in heat dissipation. Background Art

[0002] Copper-clad laminate is a plate-like material made by impregnating electronic fiberglass cloth or other reinforcing materials with resin, covering one or both sides with copper foil and hot pressing. It is referred to as copper-clad laminate for short. With the increasing maturity of 4G and 5G technologies, the use of various thin plates of high-end copper-clad laminate products is increasing, resulting in the rapid development of copper-clad laminate.

[0003] Existing copper clad laminates have poor heat dissipation during use, which can easily lead to overheating, which in turn can easily lead to damage and shorten the service life. This phenomenon has become a problem that needs to be urgently solved by those skilled in the art. Summary of the Invention

[0004] The purpose of the present invention is to provide a PCB copper clad plate structure with high efficiency in heat dissipation in view of the existing technology, so as to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: a PCB copper-clad plate structure with high efficiency in heat dissipation, comprising a core layer, a connecting layer is provided at the bottom of the core layer, a bottom plate is provided at the bottom of the connecting layer, a protective layer is provided at the top of the core layer, and a panel is provided at the top of the protective layer. By providing the bottom plate, the connecting layer, the core layer, the protective layer and the panel, a good heat dissipation effect is achieved, thereby solving the problem of poor heat dissipation effect, and further solving the problem of overheating damage caused by poor heat dissipation effect, thereby effectively extending the service life and meeting people's work needs.

[0006] Furthermore, the bottom plate and the connection layer are bonded to each other, and the bottom plate is a copper foil layer.

[0007] Furthermore, the connecting layer and the core layer are bonded to each other, and the connecting layer is glass fiber cloth.

[0008] Furthermore, the core layer and the protective layer are bonded to each other, and the protective layer is a nano-scale glass bead sheet, and the core layer is a PTFE film, which facilitates the thermal insulation work.

[0009] Furthermore, the protective layer and the panel are bonded to each other, and the panel is a graphene sheet, which facilitates heat dissipation.

[0010] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0011] (1) By providing a base plate, a connection layer, a core layer, a protective layer and a panel, a good heat dissipation effect is achieved, thereby solving the problem of poor heat dissipation effect, and further solving the problem of overheating damage caused by poor heat dissipation effect, thereby effectively extending the service life and meeting people's work needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0013] Figure 1 It is an explosion diagram of the utility model;

[0014] Figure 2 It is a schematic diagram of the composition of the present utility model.

[0015] In the figure: 1. Base plate; 2. Connecting layer; 3. Core layer; 4. Protective layer; 5. Panel. DETAILED DESCRIPTION

[0016] The following is a non-limiting detailed description of the technical solution of the present invention in conjunction with preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention.

[0017] See also Figure 1-2 The utility model provides a technical solution: a PCB copper clad plate structure with high efficiency in heat dissipation, comprising a core layer 3, a connecting layer 2 is provided at the bottom of the core layer 3, a bottom plate 1 is provided at the bottom of the connecting layer 2, a protective layer 4 is provided on the top of the core layer 3, and a panel 5 is provided on the top of the protective layer 4. By providing the bottom plate 1, the connecting layer 2, the core layer 3, the protective layer 4 and the panel 5, a good heat dissipation effect is achieved, thereby solving the problem of poor heat dissipation effect, and further solving the problem of overheating damage caused by poor heat dissipation effect, thereby effectively extending the service life and meeting people's work needs.

[0018] Furthermore, the bottom plate 1 and the connection layer 2 are bonded to each other, and the bottom plate 1 is a copper foil layer.

[0019] Furthermore, the connecting layer 2 and the core layer 3 are bonded to each other, and the connecting layer 2 is glass fiber cloth.

[0020] Furthermore, the core layer 3 and the protective layer 4 are bonded to each other, and the protective layer 4 is a nano-scale glass bead sheet, and the core layer 3 is a PTFE film, which facilitates the thermal insulation work.

[0021] Furthermore, the protective layer 4 and the panel 5 are bonded to each other, and the panel 5 is a graphene sheet, which facilitates heat dissipation.

[0022] The bonding described above is achieved by using epoxy curing glue on the copper clad laminate.

[0023] First, the bottom plate 1 is bonded to the connecting layer 2, and then the connecting layer 2 is bonded to the core layer 3, and then the core layer 3 is bonded to the protective layer 4, and then the protective layer 4 is bonded to the panel 5. Finally, the entire copper clad plate structure is pressed through a pressing device to complete a series of assembly work. After the assembly is completed, the protective layer 4 is set as a nano-scale glass bead sheet, which can effectively insulate the heat generated by the panel 5, thereby preventing high temperature from damaging the core layer 3, and the panel 5 is set as a graphene sheet, which can effectively accelerate the heat dissipation effect, solve the damage caused by poor heat dissipation, and effectively extend the service life.

[0024] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only used to facilitate the description of the present invention, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0025] Finally, it should be pointed out that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that modifications may be made to the technical solutions described in the above embodiments, or that some of the technical features may be replaced with equivalents. Such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A PCB copper-clad plate structure with high heat dissipation efficiency, comprising a core layer (3), characterized in that: A connecting layer (2) is provided at the bottom of the core layer (3), a bottom plate (1) is provided at the bottom of the connecting layer (2), a protective layer (4) is provided at the top of the core layer (3), and a panel (5) is provided at the top of the protective layer (4).

2. The PCB copper-clad plate structure with high heat dissipation efficiency according to claim 1, characterized in that: The bottom plate (1) and the connecting layer (2) are bonded to each other, and the bottom plate (1) is a copper foil layer.

3. The PCB copper-clad plate structure with high heat dissipation efficiency according to claim 1, characterized in that: The connecting layer (2) and the core layer (3) are bonded to each other, and the connecting layer (2) is glass fiber cloth.

4. The PCB copper-clad plate structure with high heat dissipation efficiency according to claim 1, characterized in that: The core layer (3) and the protective layer (4) are bonded to each other, the protective layer (4) is a nano-scale glass microbead sheet, and the core layer (3) is a PTFE membrane.

5. The PCB copper-clad plate structure with high heat dissipation efficiency according to claim 1, characterized in that: The protective layer (4) and the panel (5) are bonded to each other, and the panel (5) is a graphene sheet.

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