High-temperature industrial instrument shell structure with cooling fins

Abstract

The utility model relates to the technical field of shell heat dissipation, in particular to a high-temperature industrial instrument shell structure with radiating fins, which comprises a shell main body and the radiating fins. And a first heat dissipation mechanism and a second heat dissipation mechanism are arranged in the heat dissipation fins. The shell body is provided with a ventilation opening, the second heat dissipation mechanism is composed of a heat dissipation substrate arranged on one side wall of the heat dissipation piece, and the heat dissipation substrate is arranged corresponding to the first ventilation opening and connected with the heat conduction piece through a heat conduction column. The first heat dissipation mechanism comprises a plurality of heat conduction fins fixedly connected to the other end of the heat conduction piece, heat dissipation holes are formed in the fins, and the heat dissipation area is further increased. In addition, fans are arranged on the inner side walls of the cooling fins and correspond to the two sides of the heat conduction fins, and dust covers are arranged on one sides of the fans, so that air flow is ensured, and dust is prevented from entering the cooling fins. According to the utility model, the working stability and the service life of the industrial instrument in a high-temperature environment are effectively improved, and the industrial instrument has good heat dissipation effect and protection performance.

Description

Technical Field

[0001] The utility model relates to the technical field of shell heat dissipation, in particular to a high-temperature industrial instrument shell structure with a heat sink. Background Art

[0002] In modern industrial production, high-temperature environments pose a severe challenge to the performance and lifespan of industrial instruments. Industrial instruments are widely used in high-temperature environments such as metallurgy, chemical engineering, and electric power, where temperatures often exceed the operating range of conventional electronic equipment. To ensure stable operation of industrial instruments in high-temperature conditions, heat dissipation design becomes a key factor.

[0003] Traditional industrial instrument housings typically utilize simple metal shells. While these provide basic physical protection, they suffer from numerous deficiencies in heat dissipation. First, existing heat sink designs often have limited heat dissipation areas, failing to effectively increase the heat conduction surface area, making it difficult for heat to be quickly transferred to the outside air. Second, the layout and shape of the heat sinks are often less than optimal, resulting in poor air circulation and poor natural convection heat dissipation. Furthermore, many existing designs fail to fully utilize forced convection heat dissipation, meaning they are not equipped with fans or other auxiliary heat dissipation devices to enhance air flow, further reducing heat dissipation efficiency. In some high-temperature applications, if the heat generated by internal electronic components cannot be dissipated in a timely manner, the temperature can rise sharply, affecting measurement accuracy and reliability. Long-term exposure to high temperatures can also damage electronic components due to overheating, shortening the instrument's service life. Utility Model Content

[0004] The purpose of the utility model is to provide a high-temperature industrial instrument housing structure with a heat sink to solve the problems of low heat dissipation efficiency of existing high-temperature industrial instrument housings under extreme temperature conditions and easy overheating and damage of internal electronic components.

[0005] To achieve the above-mentioned purpose, a high-temperature industrial instrument housing structure with a heat sink is provided, comprising a housing body, heat sinks symmetrically provided on both side walls of the interior of the housing body, a first heat sink mechanism provided on both sides of the interior of the heat sink, a second heat sink mechanism provided between the two first heat sink mechanisms, and first ventilation openings symmetrically provided on both sides of the housing body at corresponding positions of the two heat sinks.

[0006] As a further improvement of the present technical solution, the second heat dissipation mechanism includes a heat dissipation substrate arranged on one side wall of the heat dissipation fin, the heat dissipation substrate is arranged corresponding to the first vent, and the other end of the heat dissipation substrate is fixedly connected to a plurality of heat-conducting columns, and the other end of the heat-conducting columns is fixedly connected to a heat-conducting fin.

[0007] As a further improvement of the present technical solution, the first heat dissipation mechanism includes a plurality of heat-conducting fins fixedly connected to the other end of the heat-conducting sheet, and a plurality of heat-dissipating holes are provided on the heat-conducting fins.

[0008] As a further improvement of the present technical solution, fans are provided on the inner wall of the heat sink at positions corresponding to both sides of the heat conducting fins, and dust covers are provided on one side of the fan at the wall openings on both sides of the heat sink.

[0009] As a further improvement of the present technical solution, a circuit board is provided inside the heat sink on the side opposite to the thermal conductive plate.

[0010] As a further improvement of the present technical solution, a display screen is provided on the outer surface of one side of the shell body.

[0011] As a further improvement of this technical solution, a handle is provided at the upper end of the shell body.

[0012] As a further improvement of the present technical solution, a second vent is provided on the side of the housing body opposite to the display screen.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The housing structure of this high-temperature industrial instrument with a heat sink significantly increases the heat dissipation surface area by providing a first heat dissipation mechanism on both sides of the interior of the heat sink, and a second heat dissipation mechanism between the two first heat dissipation mechanisms. The combined design of the heat sink substrate, heat-conducting columns, and heat-conducting plates more effectively transfers heat from the heat source to the heat sink, and quickly dissipates it to the external environment through heat dissipation holes and fan-assisted forced convection. This multi-layered heat dissipation structure design not only improves heat conduction efficiency but also enhances air circulation, thereby significantly improving overall heat dissipation performance. Especially in high-temperature environments, this design can effectively prevent the internal temperature of the instrument from overheating, ensure the stable operation of electronic components, and extend the service life of the instrument.

[0015] 2. The housing structure of this high-temperature industrial instrument with heat sink features fans installed on the inner wall of the heat sink, corresponding to the thermal fins on both sides. A dust cover is installed on one side of the fan. This design not only enhances air flow and improves heat dissipation efficiency, but also effectively blocks dust and foreign matter from entering the instrument, protecting sensitive electronic components from contamination and damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the utility model;

[0017] Figure 2 It is a partially cutaway structural schematic diagram of the present utility model;

[0018] Figure 3 It is a partial structural diagram of the utility model.

[0019] The meaning of each number in the figure is:

[0020] Among them: 1. Shell body; 2. Display screen; 3. First vent; 4. Handle; 5. Second vent; 6. Heat sink; 7. Dust cover; 8. First heat dissipation mechanism; 9. Second heat dissipation mechanism; 10. Fan; 11. Thermal fins; 12. Heat dissipation holes; 13. Thermal pad; 14. Thermal column; 15. Heat dissipation substrate; 16. Circuit board. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0023] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0024] See also Figure 1-Figure 3As shown, the purpose of this embodiment is to provide a high-temperature industrial instrument housing structure with a heat sink, including a housing body 1. The housing body 1 is made of high-temperature resistant material to ensure that the structural stability and protective performance can be maintained under extreme temperature conditions. Heat sinks 6 are symmetrically provided on both side walls of the interior of the housing body 1. These heat sinks 6 not only increase the surface area, but also further improve the heat dissipation efficiency through the first heat dissipation mechanism 8 and the second heat dissipation mechanism 9 inside. The first heat dissipation mechanism 8 includes a plurality of heat-conducting fins 11 fixedly connected to the other end of the heat-conducting fin 13. These heat-conducting fins 11 are provided with a plurality of heat dissipation holes 12, which effectively increase the heat dissipation area and promote air flow. The second heat dissipation mechanism 9 is composed of a heat dissipation substrate 15 provided on one side wall of the heat sink 6. The heat dissipation substrate 15 is arranged corresponding to the first vent 3 and is connected to the heat-conducting fin 13 through a heat-conducting column 14, forming an efficient heat conduction path.

[0025] To further enhance heat dissipation, fans 10 are installed on the inner wall of the heat sink 6, corresponding to the heat-conducting fins 11. These fans 10 force airflow, accelerating heat dissipation. Dust covers 7 are located on either side of the fan 10, preventing dust and foreign matter from entering the instrument and protecting the electronic components from contamination. This design not only enhances heat dissipation but also increases the reliability and service life of the instrument.

[0026] A circuit board 16 is located inside the heat sink 6, on the side opposite the thermally conductive sheet 13, ensuring that the electronic components operate in a favorable heat dissipation environment. A display screen 2 is located on one side of the outer surface of the housing body 1, allowing operators to monitor instrument data in real time. A handle 4 is located at the top of the housing body 1, facilitating transport and installation, enhancing ease of use. Furthermore, a second vent 5 is located on the side of the housing body 1 opposite the display screen 2, forming an effective airflow channel with the first vent 3, further enhancing overall heat dissipation performance.

[0027] A multi-layered heat dissipation design, combining natural and forced convection, significantly improves heat dissipation efficiency, ensuring stable operation of the instrument in high-temperature environments. The heat sink 6, thermal fins 11, heat dissipation holes 12, and fan 10 work together to form an efficient heat dissipation system, rapidly transferring heat from the heat source to the external air and preventing damage to electronic components caused by excessive internal temperatures.

[0028] The dust cover 7 and seal design effectively prevent the intrusion of dust and moisture, extending the service life of electronic components. The dust cover 7 not only blocks dust but also reduces maintenance frequency and costs. Furthermore, the seal design ensures the instrument operates normally in harsh environments such as dusty and humid environments, improving overall protection.

[0029] Display 2 provides an intuitive data display, while handle 4 facilitates transport and installation. The design of display 2 allows operators to easily read instrument data and keep abreast of device status. The presence of handle 4 further facilitates transport and installation, significantly improving work efficiency in applications requiring frequent movement or repositioning.

[0030] The optimized ventilation opening layout and fan 10 assist in heat dissipation, allowing the instrument to maintain good operating conditions even in harsh environments such as dust and high humidity. The rational layout of the first and second ventilation openings 3 and 5, combined with the forced convection of fan 10, ensures that heat inside the instrument can be effectively dissipated even in dusty and high-humidity environments, thereby ensuring the long-term stable operation of the instrument.

[0031] In summary, this embodiment provides an efficient and reliable high-temperature industrial instrument housing structure, solves the problem of insufficient heat dissipation in existing designs, and provides a more stable and durable solution for industrial production.

[0032] Working Principle: This high-temperature industrial instrument housing structure ensures efficient heat dissipation even under extreme temperature conditions through an optimized heat dissipation design and air circulation mechanism. When heat is generated within the instrument, it is first transferred to the heat conducting plate 13 via the circuit board 16, and then conducted to the heat sink substrate 15 via the heat conducting pillars 14. The heat sink substrate 15 corresponds to the first vent 3, promoting natural convection heat dissipation. Simultaneously, a fan 10 forces air flow, accelerating the dissipation of heat from the heat conducting fins 11 and heat dissipation holes 12 on the heat sink 6 to the external environment. A dust cover 7 prevents the ingress of dust and foreign matter, protecting the internal electronic components. The display 2 provides real-time data monitoring, while the handle 4 facilitates transportation and installation. The second vent 5 and the first vent 3 form an effective airflow channel, further enhancing the overall heat dissipation effect. Through this multi-layered heat dissipation design and optimized air circulation path, the structure significantly improves heat dissipation efficiency, ensuring stable operation of the instrument in harsh environments such as high temperatures and dust.

[0033] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely preferred examples of the present invention and are not intended to limit the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention. The scope of protection claimed in the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-temperature industrial instrument housing structure with a heat sink, comprising a housing body (1), characterized in that: The inner side walls of the shell body (1) are symmetrically provided with heat dissipation fins (6), the inner sides of the heat dissipation fins (6) are both provided with first heat dissipation mechanisms (8), a second heat dissipation mechanism (9) is provided between the two first heat dissipation mechanisms (8), and first ventilation openings (3) are symmetrically provided on both sides of the shell body (1) at positions corresponding to the two heat dissipation fins (6).

2. The high-temperature industrial instrument housing structure with heat sink according to claim 1, characterized in that: The second heat dissipation mechanism (9) comprises a heat dissipation substrate (15) provided on a side wall of the heat dissipation fin (6), the heat dissipation substrate (15) being provided corresponding to the first vent (3), the other end of the heat dissipation substrate (15) being fixedly connected to a plurality of heat conducting columns (14), and the other end of the heat conducting columns (14) being fixedly connected to a heat conducting fin (13).

3. The high-temperature industrial instrument housing structure with heat sink according to claim 2, characterized in that: The first heat dissipation mechanism (8) comprises a plurality of heat-conducting fins (11) fixedly connected to the other end of the heat-conducting sheet (13), and each of the heat-conducting fins (11) is provided with a plurality of heat dissipation holes (12).

4. The high-temperature industrial instrument housing structure with heat sink according to claim 3, characterized in that: The inner wall of the heat sink (6) is provided with a fan (10) at positions corresponding to both sides of the heat conducting fins (11), and one side of the fan (10) is provided with a dust cover (7) at both side wall openings of the heat sink (6).

5. The high-temperature industrial instrument housing structure with heat sink according to claim 2, characterized in that: A circuit board (16) is provided inside the heat sink (6) on a side opposite to the heat conducting plate (13).

6. The high-temperature industrial instrument housing structure with heat sink according to claim 1, characterized in that: A display screen (2) is provided on the outer surface of one side of the housing body (1).

7. The high-temperature industrial instrument housing structure with heat sink according to claim 1, characterized in that: A handle (4) is provided at the upper end of the shell body (1).

8. The high-temperature industrial instrument housing structure with heat sink according to claim 6, characterized in that: The housing body (1) is provided with a second ventilation opening (5) on a side opposite to the display screen (2).

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