Organic light-emitting display module

Abstract

The embodiment of the utility model provides an organic light-emitting display module. The organic light-emitting display module comprises a thin film transistor array substrate, a light-emitting device, a thin film packaging layer, an optical transparent bonding layer, a glass cover plate and a polaroid, the thin film transistor array substrate comprises a glass substrate; the light-emitting device is arranged on the thin film transistor array substrate; the thin film packaging layer is arranged on the light-emitting device and the thin film transistor array substrate and wraps the light-emitting device; the optical transparent bonding layer is arranged on the thin film packaging layer; the glass cover plate is arranged on the optical transparent bonding layer; and the polaroid is arranged on the glass cover plate. According to the organic light-emitting display module provided by the embodiment of the invention, a narrow frame design can be realized, and a good display effect is obtained.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to an organic light-emitting display module. Background Art

[0002] Currently, there are three main structural types of organic light-emitting display modules:

[0003] The first structure includes a heat dissipation film, a thin-film transistor array substrate, light-emitting devices, encapsulant, encapsulating glass, and a polarizer. The thin-film transistor array substrate is mounted on the heat dissipation film, the light-emitting devices are mounted on the thin-film transistor array substrate, the encapsulating adhesive is mounted on the thin-film transistor array substrate and surrounds the light-emitting devices, the encapsulating glass is mounted on the light-emitting devices and encapsulating adhesive, and the polarizer is mounted on the encapsulating glass. This structure has the advantage of a simple manufacturing process, but due to the limitations of the encapsulating adhesive process, the bezel width is generally greater than 5 mm, making a narrow bezel design difficult to achieve.

[0004] The second structure includes a heat dissipation film, a thin-film transistor array substrate, a light-emitting device, a thin-film encapsulation layer, a polarizer, and a cover glass. The thin-film transistor array substrate is disposed on the heat dissipation film, the light-emitting device is disposed on the thin-film transistor array substrate, the thin-film encapsulation layer is disposed on the light-emitting device and the thin-film transistor array substrate and covers the light-emitting device, the polarizer is disposed on the thin-film encapsulation layer, and the cover glass is disposed on the polarizer. This structure reduces module thickness by thinning the thin-film transistor array substrate and achieves higher surface hardness. However, the polarizer is disposed between the thin-film encapsulation layer and the cover glass, resulting in poor optical performance.

[0005] The third structure includes a heat dissipation film, a flexible substrate, a light-emitting device, a thin-film encapsulation layer, a polarizer, and a cover glass. The flexible substrate is positioned on the heat dissipation film, the light-emitting device is positioned on the flexible substrate, the thin-film encapsulation layer is positioned over and covers the light-emitting device and the flexible substrate, the polarizer is positioned on the thin-film encapsulation layer, and the cover glass is positioned on the polarizer. This structure uses a laser lift-off process to remove the glass substrate from the thin-film transistor array substrate, reducing module thickness and achieving higher surface hardness. However, the manufacturing process is complex and the optical quality is poor.

[0006] Therefore, it is difficult for existing organic light-emitting display modules to achieve both a narrow frame design and a good display effect. Utility Model Content

[0007] The purpose of the present application is to provide an organic light-emitting display module that can achieve a narrow frame design and obtain good display effects.

[0008] An embodiment of the present application provides an organic light-emitting display module, comprising: a thin film transistor array substrate, a light-emitting device, a thin film encapsulation layer, an optically transparent adhesive layer, a glass cover and a polarizer; the thin film transistor array substrate comprises a glass substrate; the light-emitting device is arranged on the thin film transistor array substrate; the thin film encapsulation layer is arranged on the light-emitting device and the thin film transistor array substrate, and covers the light-emitting device; the optically transparent adhesive layer is arranged on the thin film encapsulation layer; the glass cover is arranged on the optically transparent adhesive layer; and the polarizer is arranged on the glass cover.

[0009] In the above organic light emitting display module, the thickness of the glass substrate is 0.1 mm to 0.5 mm.

[0010] In the above organic light emitting display module, the thickness of the glass substrate is 0.2 mm to 0.4 mm.

[0011] In the above organic light-emitting display module, the thickness of the glass cover plate is 0.1 mm to 0.5 mm.

[0012] In the above organic light-emitting display module, the thickness of the glass cover plate is 0.2 mm to 0.4 mm.

[0013] In the above organic light emitting display module, in a top view of the organic light emitting display module, the coverage of the optically transparent adhesive layer is located within the coverage of the thin film transistor array substrate.

[0014] In the above organic light emitting display module, a distance between an edge of the optically transparent adhesive layer and an edge of the thin film transistor array substrate is 0.2 mm to 0.5 mm.

[0015] In the above organic light emitting display module, the organic light emitting display module further includes a sealant, which is arranged between the edge of the optically transparent adhesive layer and the edge of the thin film transistor array substrate, and is located between the thin film encapsulation layer and the glass cover.

[0016] In the above organic light emitting display module, the outer edge of the sealant is flush with the edge of the thin film transistor array substrate.

[0017] In the above organic light emitting display module, the inner edge of the sealant is connected to the optically transparent adhesive layer.

[0018] The organic light-emitting display module provided by the embodiment of the present application sets an optically transparent adhesive layer between the thin film encapsulation layer and the glass cover plate, and sets a polarizer on the glass cover plate, so that after the light is emitted from the light-emitting device, it only needs to pass through the thin film encapsulation layer, the optically transparent adhesive layer, the glass cover plate and the polarizer in sequence to reach the light-emitting surface of the display module. The light propagation path is short, which reduces light loss and improves the light transmittance of the display module, thereby obtaining a good display effect. At the same time, since the thin film encapsulation layer is used instead of the encapsulation glue, the process limitations of the encapsulation glue are broken through, and a narrow frame design can be achieved. In addition, the organic light-emitting display module provided by the embodiment of the present application uses a glass substrate instead of a flexible substrate, which improves the stability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a block diagram of an organic light-emitting display module provided in an embodiment of the present application.

[0020] Figure 2 is a cross-sectional view of an organic light-emitting display module provided in an embodiment of the present application.

[0021] Figure 3 4 is a top view of an organic light emitting display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0022] The specific implementation methods of this application are described in detail below with reference to the accompanying drawings.

[0023] The terms "first", "second" and similar words do not indicate any order, quantity or importance, but are only used to distinguish different technical features. The term "plurality" and similar words mean two or more, unless otherwise expressly limited.

[0024] The embodiments of the present application may be combined with each other.

[0025] like Figure 1 and Figure 2 As shown, the organic light-emitting display module 10 provided in the embodiment of the present application includes a source driving circuit, a gate driving circuit, a timing controller, a light-emitting controller, a power management chip, a glass substrate, a data line DATA, a scan line SCAN, a power line (VDD, VSS), a light-emitting control signal line EM, a pixel array, an encapsulation layer, an optically transparent adhesive layer 105, a glass cover 106, a polarizer 107, a color filter, etc.

[0026] The pixel array is composed of a plurality of pixel units PX arranged in rows and columns, and each pixel unit PX includes a light-emitting device and a pixel driving circuit. The light-emitting device is electrically connected to the pixel driving circuit, and the pixel driving circuit is used to control the brightness of each light-emitting device. The light-emitting device includes a light-emitting layer, an electron transport layer, a hole transport layer, a cathode and an anode, etc. The encapsulation layer includes an organic / inorganic alternating multilayer structure. Each level of the gate driving unit in the gate driving circuit controls a row of pixel units PX. The source driving circuit is used to provide data signals to the pixel units PX. The timing controller is used to receive external input image data and synchronization signals, and generate signals required by the gate driving circuit and the source driving circuit. The power management chip is used to provide the required operating voltage for each component of the organic light-emitting display module 10. In addition, the organic light-emitting display module 10 of the present application can also integrate an embedded touch circuit, and the touch circuit is used to realize the touch function.

[0027] like Figure 2 and Figure 3 As shown, an embodiment of the present application provides an organic light-emitting display module 10, including a heat dissipation film 101, a thin film transistor array substrate 102, a light-emitting device 103, a thin film encapsulation layer 104, an optically transparent adhesive layer 105, a glass cover 106 and a polarizer 107.

[0028] The thin film transistor array substrate 102 includes a glass substrate, which is disposed on the heat dissipation film 101 .

[0029] The light emitting device 103 is disposed on the thin film transistor array substrate 102 .

[0030] The thin film encapsulation layer 104 is disposed on the light emitting device 103 and the thin film transistor array substrate 102 , and covers the light emitting device 103 .

[0031] The optically transparent adhesive layer 105 is disposed on the thin film encapsulation layer 104 .

[0032] A glass cover 106 is disposed on the optically transparent adhesive layer 105 .

[0033] The polarizer 107 is disposed on the glass cover 106 .

[0034] In this embodiment, the thin-film transistor array substrate 102 further includes a plurality of thin-film transistors, a plurality of gate lines, and a plurality of data lines disposed on a glass substrate. The light-emitting device 103 includes an anode, an organic light-emitting layer, and a cathode. The anode is disposed on the thin-film transistor array substrate 102 and is electrically connected to the thin-film transistors. The organic light-emitting layer is disposed on the anode, and the cathode is disposed on the organic light-emitting layer. The thin-film encapsulation layer 104 is composed of alternating inorganic and organic layers. The inorganic layer is used to block the infiltration of moisture and oxygen, and the organic layer is used for planarization. The optically transparent adhesive layer 105 is made of optically transparent adhesive. The difference in refractive index between the optically transparent adhesive and the glass cover plate 106 is no more than 0.1 to reduce interfacial reflections.

[0035] In this embodiment, the glass substrate and the glass cover 106 may be made of soda-lime glass or aluminosilicate glass.

[0036] The thickness of the glass substrate is 0.1 mm to 0.5 mm. By controlling the thickness of the glass substrate within the range of 0.1 mm to 0.5 mm, the thickness of the organic light-emitting display module 10 can be effectively reduced. Specifically, the glass substrate can be thinned to the desired thickness by chemical etching, mechanical grinding, or laser lift-off.

[0037] Preferably, the thickness of the glass substrate is 0.2 mm to 0.4 mm. Within this range, the glass substrate has an optimal balance between mechanical properties and optical effects.

[0038] A compressive stress layer is formed on the surface of the glass substrate facing away from the glass substrate. The compressive stress layer has a depth of 15 to 25 microns, corresponding to a compressive stress of 350 MPa to 450 MPa. This compressive stress layer is formed by immersing the surface of the glass substrate facing away from the glass substrate in a molten salt containing potassium ions for ion exchange.

[0039] The thickness of the glass cover plate 106 is 0.1 mm to 0.5 mm. This thickness range allows the glass cover plate 106 to have sufficient strength to protect internal components while significantly reducing the overall thickness of the organic light emitting display module 10 .

[0040] The thickness of the glass cover plate 106 is 0.2 mm to 0.4 mm. Within this range, the glass cover plate 106 has an optimal balance between mechanical properties and optical effects.

[0041] The thickness of the glass substrate and the glass cover 106 may be, for example, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, 0.26 mm, 0.27 mm, 0.28 mm. , 0.29 mm, 0.3 mm, 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.37 mm, 0.38 mm, 0.39 mm, 0.4 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.47 mm, 0.48 mm, 0.49 mm, 0.5 mm.

[0042] In the top view of the organic light-emitting display module 10, the coverage of the optically transparent adhesive layer 105 is located within the coverage of the thin-film transistor array substrate 102. Specifically, the optically transparent adhesive layer 105 covers the light-emitting area and part of the non-light-emitting area of ​​the light-emitting device 103. This technical solution prevents the optically transparent adhesive layer 105 from overflowing the edge of the thin-film transistor array substrate 102. Through this technical solution, it is possible to prevent the optically transparent adhesive layer 105 from being located at the cutting line of the large plate (the optically transparent adhesive layer 105 exceeds the edge of the organic light-emitting display module 10) during the process of cutting a large plate to form multiple organic light-emitting display modules 10, thereby affecting the cutting effect. It is also possible to prevent the optically transparent adhesive layer 105 from adhering to the side edges of the cut organic light-emitting display module 10.

[0043] In this embodiment, the orthographic projection of the optically transparent adhesive layer 105 on the thin film transistor array substrate 102 is completely located within the range of the thin film transistor array substrate 102. Specifically, the optically transparent adhesive layer 105 covers the light-emitting area of ​​the light-emitting device 103 and the non-light-emitting area of ​​2 mm to 3 mm around the light-emitting area. A gate drive circuit is provided on the non-light-emitting area. The gate drive circuit includes a plurality of thin film transistors and a plurality of signal lines, which are also covered by the optically transparent adhesive layer 105. Contact pads for connecting to an external circuit are also provided on the periphery of the non-light-emitting area. These contact pads are located outside the coverage of the optically transparent adhesive layer 105 to facilitate electrical connection. The edge shape of the optically transparent adhesive layer 105 is similar to that of the thin film transistor array substrate 102, and is kept proportionally reduced to ensure the uniformity of the retracted distance.

[0044] The distance between the edge of the optically transparent adhesive layer 105 and the edge of the thin film transistor array substrate 102 is 0.2 mm to 0.5 mm. For example, the distance is 0.2 mm, 0.21 mm, 0.22 mm, 0.23 mm, 0.24 mm, 0.25 mm, 0.26 mm, 0.27 mm, 0.28 mm, 0.29 mm, 0.3 mm, 0.31 mm, 0.32 mm, 0.33 mm, 0.34 mm, 0.35 mm, 0.36 mm, 0.37 mm, 0.38 mm, 0.39 mm, 0.4 mm, 0.41 mm, 0.42 mm, 0.43 mm, 0.44 mm, 0.45 mm, 0.46 mm, 0.47 mm, 0.48 mm, 0.49 mm, and 0.5 mm. This technical solution ensures that the optically transparent adhesive layer 105 will not be cut during the process of cutting a large plate to form multiple organic light-emitting display modules 10, thereby preventing the optically transparent adhesive layer 105 from adhering to the side of the cut organic light-emitting display module 10.

[0045] In this embodiment, the distance between the edge of the optically transparent adhesive layer 105 and the edge of the thin-film transistor array substrate 102 remains consistent throughout the entire perimeter. This ensures that the cutting tool does not contact the optically transparent adhesive layer 105 during the cutting process, preventing adhesive contamination of the cutting tool. The four corners of the optically transparent adhesive layer 105 are rounded with a radius of 0.5 mm to avoid stress concentration.

[0046] The thickness of the optically clear adhesive layer 105 is 50 microns.

[0047] The organic light-emitting display module 10 also includes a sealant, which is disposed between the edge of the optically transparent adhesive layer 105 and the edge of the thin-film transistor array substrate 102, and between the thin-film encapsulation layer 104 and the glass cover 106. The outer edge of the sealant is flush with the edge of the thin-film transistor array substrate 102. The inner edge of the sealant is connected to the optically transparent adhesive layer.

[0048] Through this technical solution, the inner edge of the sealant can be in close contact with the edge of the optically transparent adhesive layer 105 to form a complete sealing structure, preventing foreign matter from entering the gap between the thin film encapsulation layer 104 and the glass cover plate 106 and stretching the thin film encapsulation layer 104 and the glass cover plate 106, thereby preventing the organic light-emitting display module 10 from being damaged.

[0049] In this embodiment, the sealant is made of epoxy resin material, and a moisture absorbent is added to the epoxy resin material to absorb moisture that may penetrate. The thickness of the sealant is the same as that of the optically transparent adhesive layer 105, so that the glass cover 106 can be kept level.

[0050] The organic light-emitting display module 10 provided in this embodiment includes: a heat dissipation film 101, a thin-film transistor array substrate 102, a light-emitting device 103, a thin-film encapsulation layer 104, an optically transparent adhesive layer 105, a glass cover 106, and a polarizer 107. The glass substrate of the thin-film transistor array substrate 102 is thinned and disposed on the heat dissipation film 101, the light-emitting device 103 is disposed on the thin-film transistor array substrate 102, the thin-film encapsulation layer 104 is disposed on the light-emitting device 103 and the thin-film transistor array substrate 102 and covers the light-emitting device 103, the optically transparent adhesive layer 105 is disposed on the thin-film encapsulation layer 104, the glass cover 106 is thinned and disposed on the optically transparent adhesive layer 105, and the polarizer 107 is disposed on the glass cover 106.

[0051] In this embodiment, the optically transparent adhesive layer 105 is retracted by 0.2-0.5 mm relative to the edge of the organic light-emitting display module 10. If the retracted distance of the optically transparent adhesive layer 105 is too large, the thin film encapsulation layer 104 will not be adequately protected, and water accumulation may occur during the washing process. If the retracted distance of the optically transparent adhesive layer 105 is too small, the optically transparent adhesive layer 105 may be difficult to cut when cutting a large panel into small panels.

[0052] The manufacturing process of this embodiment includes:

[0053] First, a plurality of optically transparent adhesive layers 105 are disposed at intervals on the release film, and each optically transparent adhesive layer 105 corresponds to the middle area of ​​a small plate (organic light-emitting display module 10 ) to be cut.

[0054] Then, the release film is attached to the thin film encapsulation layer 104 of the large board (including a plurality of small boards to be cut).

[0055] Next, a glass cover 106 is attached to the optically transparent adhesive layer 105 .

[0056] Next, the large glass cover plate 106 and the glass substrate of the thin-film transistor array substrate 102 are thinned. During the thinning process of the glass substrate and glass cover plate 106 of the organic light-emitting display module 10, mechanical grinding is first used to coarse-grind the glass substrate and glass cover plate 106 to a thickness of 0.1 mm above the target thickness. Then, chemical etching is used to finely thin the glass substrate and glass cover plate 106 to the target thickness, while simultaneously removing the stress generated by the mechanical grinding. Chemical etching is performed using a hydrofluoric acid solution, the etching temperature is controlled between 25°C and 35°C, and the etching time is determined according to the thickness to be etched. After etching is completed, the glass substrate and glass cover plate 106 are neutralized and cleaned, and then surface treated to improve their surface flatness.

[0057] Next, a heat dissipation film 101 is disposed on the surface of the large glass substrate facing away from the glass cover 106 , and a polarizer 107 is disposed on the surface of the large glass cover 106 .

[0058] Finally, the large board is cut into multiple smaller boards.

[0059] In this embodiment, to ensure the yield of glass thinning, a width of at least 15 mm is reserved around the perimeter of the large plate for use in fixtures used in the thinning process. Furthermore, the optically clear adhesive layer 105 does not cover the binding area of ​​the large plate corresponding to the small plate, ensuring a smooth cutting process.

[0060] The organic light-emitting display module 10 provided in the embodiment of the present application sets an optically transparent adhesive layer 105 between the thin film encapsulation layer 104 and the glass cover plate 106, and sets a polarizer 107 on the glass cover plate 106, so that after the light is emitted from the light-emitting device 103, it only needs to pass through the thin film encapsulation layer 104, the optically transparent adhesive layer 105, the glass cover plate 106 and the polarizer 107 in sequence to reach the light-emitting surface of the display module. The light propagation path is short, which reduces light loss and improves the light transmittance of the display module, thereby obtaining a good display effect. At the same time, since the thin film encapsulation layer 104 is used to replace the encapsulation glue, the process limitations of the encapsulation glue are broken through, and a narrow frame design can be achieved. In addition, the organic light-emitting display module provided in the embodiment of the present application uses a glass substrate instead of a flexible substrate, which improves the stability of the structure.

[0061] The above is a detailed introduction to the embodiments of the present application. The contents of this specification should not be understood as limiting the scope of protection of the present application.

Claims

1. An organic light emitting display module, characterized in that: include: Thin film transistor array substrate, light emitting device, thin film encapsulation layer, optically transparent adhesive layer, glass cover and polarizer; The thin film transistor array substrate includes a glass substrate; The light emitting device is arranged on the thin film transistor array substrate; The thin film encapsulation layer is provided on the light emitting device and the thin film transistor array substrate, and covers the light emitting device; The optically transparent adhesive layer is disposed on the thin film encapsulation layer; The glass cover is disposed on the optically transparent adhesive layer; The polarizer is arranged on the glass cover.

2. The organic light emitting display module according to claim 1, wherein: The thickness of the glass substrate is 0.1 mm to 0.5 mm.

3. The organic light emitting display module according to claim 2, wherein: The thickness of the glass substrate is 0.2 mm to 0.4 mm.

4. The organic light emitting display module according to claim 1, wherein: The thickness of the glass cover plate is 0.1 mm to 0.5 mm.

5. The organic light emitting display module according to claim 4, wherein: The thickness of the glass cover plate is 0.2 mm to 0.4 mm.

6. The organic light emitting display module according to claim 1, wherein: In a top view of the organic light emitting display module, the coverage of the optically transparent adhesive layer is within the coverage of the thin film transistor array substrate.

7. The organic light emitting display module according to claim 6, wherein: A distance between an edge of the optically transparent adhesive layer and an edge of the thin film transistor array substrate is 0.2 mm to 0.5 mm.

8. The organic light emitting display module according to claim 6, wherein: The organic light emitting display module further includes a sealant, which is disposed between an edge of the optically transparent adhesive layer and an edge of the thin film transistor array substrate, and is located between the thin film encapsulation layer and the glass cover.

9. The organic light emitting display module according to claim 8, wherein: The outer edge of the sealant is flush with the edge of the thin film transistor array substrate.

10. The organic light emitting display module according to claim 8, wherein: An inner edge of the sealant is connected to the optically clear adhesive layer.

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