Optical imaging processing device and wire-drawing die laser-beam drilling machine

Abstract

The utility model discloses an optical imaging processing device and a wire-drawing die laser drilling machine, and relates to the technical field of laser processing. The optical imaging processing device comprises an imaging light path and a laser light path partially overlapped with the imaging light path, and a transflective mirror, a scanning galvanometer and a focusing field lens are sequentially arranged at the overlapped part of the imaging light path and the laser light path; a workpiece imager located on one side of the transflective mirror is arranged on the non-overlapping part of the imaging light path and the laser light path, and the transflective mirror is used for transmitting imaging light; a laser emitter located on one side of the transflective mirror is arranged on the non-coincident portion of the laser light path and the imaging light path, and the transflective mirror is used for reflecting laser. According to the optical imaging processing device provided by the embodiment of the invention, the laser light path and the imaging light path are coaxial and cofocal, so that the imaging magnification and definition are improved, accurate positioning in the laser processing process is realized, the laser processing efficiency of a workpiece is improved, meanwhile, the consistency of batch processing is ensured, and the technical requirements on operators are also reduced.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to an optical imaging processing device and a wire drawing die laser punching machine. Background Art

[0002] A wire drawing die is typically a die used to draw metal wire. It features a central hole in a circular, square, octagonal, or other specialized shape. During use, metal is drawn through the hole to form a wire. Therefore, the quality of the die's hole directly impacts the quality of the wire being formed.

[0003] With the development of industrial manufacturing technology, the demand for precision machining is growing. In the field of diamond wire drawing die processing, traditional mechanical processing methods can no longer meet the processing requirements of high precision and complex shapes. Laser processing technology, with its advantages such as high precision and non-contact processing, has been widely used in the field of precision machining, and can achieve more refined processing effects.

[0004] Although laser processing technology has made certain progress, there are still problems of low processing efficiency and poor consistency when processing wire drawing dies with special-shaped die holes, especially when the wire drawing dies are made of hard materials such as diamond. Utility Model Content

[0005] The purpose of this application is to provide an optical imaging processing device and a wire drawing die laser punching machine to solve the problems of low processing efficiency and poor consistency in the existing laser processing technology when processing wire drawing dies with special-shaped die holes.

[0006] The technical solution adopted by this application to solve its technical problems is:

[0007] In a first aspect, an optical imaging processing device is provided, comprising an imaging optical path and a laser optical path partially overlapping with the imaging optical path, wherein a transflective mirror, a scanning galvanometer mirror, and a focusing field lens are sequentially arranged in the overlapping portion of the optical path;

[0008] A workpiece imager located on one side of the transflective mirror is provided on the non-overlapping portion of the imaging optical path and the laser optical path, and the transflective mirror is used to transmit imaging light;

[0009] A laser emitter located on one side of the transflective mirror is provided on the non-overlapping portion of the laser light path and the imaging light path, and the transflective mirror is used to reflect laser light.

[0010] Furthermore, the workpiece imager includes a CCD camera and an imaging mirror arranged between the CCD camera and the transflective mirror.

[0011] Furthermore, the laser emitter includes a laser collimator.

[0012] Furthermore, the laser in the laser collimator is a solid laser, a gas laser or a fiber laser.

[0013] Furthermore, the scanning galvanometer is a two-dimensional scanning galvanometer.

[0014] Furthermore, the transflective mirror is arranged on an adjustment frame.

[0015] Furthermore, the transflective mirror is a 45° transflective mirror.

[0016] Furthermore, it also includes a mounting seat, and the imaging optical path and the laser optical path are both arranged on the mounting seat.

[0017] Furthermore, it also includes a Z-axis motion mechanism, and the mounting seat is arranged on the Z-axis motion mechanism.

[0018] In a second aspect, a wire drawing die laser punching machine is provided, comprising a frame, a Z-axis motion table arranged on the frame, and a punching device arranged on the Z-axis motion table, wherein the punching device is the optical imaging processing device.

[0019] Beneficial effects of this application:

[0020] The optical imaging processing device provided in the embodiment of the present application, by setting a reflective mirror, a scanning galvanometer and a focusing field lens that are shared by the imaging light path and the laser light path, makes the focusing field lens serve as both a laser focusing lens and an imaging objective lens, thereby achieving coaxial and cofocusing of the laser light path and the imaging light path, improving the imaging magnification and clarity, and realizing precise positioning during the laser processing process; especially when processing drawing dies with special-shaped die holes, it is more conducive to improving the laser processing efficiency of the workpiece, while ensuring the consistency of batch processing, and reducing the technical requirements for operators. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 Schematic diagram of the structure of the optical imaging processing device provided in an embodiment of the present application;

[0023] Figure 2 This is a schematic diagram of the optical design principle of the optical imaging processing device provided in an embodiment of the present application;

[0024] Figure 3 This is the schematic diagram of the laser light path;

[0025] Figure 4 This is a schematic diagram of the imaging light path;

[0026] Figure 5 It is a structural schematic diagram of the wire drawing die laser punching machine provided in an embodiment of the present application.

[0027] Reference numerals:

[0028] 1- rack;

[0029] 2-Z-axis motion stage;

[0030] 3- Punching device;

[0031] 4-X axis motion stage;

[0032] 5-Y axis motion stage;

[0033] 6- Material clamping tooling;

[0034] 7-Display screen;

[0035] 10- imaging optical path;

[0036] 11-Laser optical path;

[0037] 12-transmissive mirror;

[0038] 13- Scanning galvanometer;

[0039] 131-Y-axis galvanometer;

[0040] 132-X axis galvanometer;

[0041] 14-focusing field lens;

[0042] 15-workpiece imager;

[0043] 151-CCD camera;

[0044] 152-imaging mirror;

[0045] 16-Laser transmitter;

[0046] 17-mounting seat;

[0047] 18-Z-axis motion mechanism;

[0048] 19-Adjustment frame;

[0049] 20-Workpiece. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0051] In the description of this application, the terms "upper," "lower," "left," "right," "front," "back," "inner," and "outer" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. These terms are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Unless otherwise specified, the above-mentioned orientational descriptions may be flexibly set in actual application, provided that the relative positional relationships shown in the accompanying drawings are met.

[0052] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0053] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The optical imaging processing device provided by the embodiment of the present application includes an imaging optical path 10 and a laser optical path 11 that partially overlaps with the imaging optical path 10, and a reflective mirror 12, a scanning galvanometer 13 and a focusing field lens 14 are sequentially arranged in the overlapping part of the two; a workpiece imager 15 is provided on the side of the reflective mirror 12 on the non-overlapping part of the imaging optical path 10 and the laser optical path 11, and the reflective mirror 12 is used to transmit imaging light; a laser emitter 16 is provided on the side of the reflective mirror 12 on the non-overlapping part of the laser optical path 11 and the imaging optical path 10, and the reflective mirror 12 is used to reflect laser light.

[0054] The imaging optical path 10 is the path that light takes from a workpiece, through reflection and / or refraction by a series of optical components, to ultimately form an image. By precisely calculating and adjusting the imaging optical path 10, efficient and accurate imaging of the workpiece can be achieved, meeting the needs of various application scenarios.

[0055] Laser optical path 11 refers to the path that laser light takes from the laser source, through reflection and / or refraction through a series of optical components, and ultimately to the workpiece. By precisely calculating and adjusting laser optical path 11, a high-energy laser beam can be precisely directed to the workpiece processing area to meet diverse processing requirements.

[0056] On the imaging optical path 10, a focusing field lens 14, a scanning galvanometer 13, a transflective mirror 12 and a workpiece imager 15 are sequentially arranged along the light transmission direction. Figure 4 The dotted line in the figure is the imaging optical path 10. The focusing field lens 14 is used as an imaging objective lens to collect and focus light from the workpiece 20. The scanning galvanometer 13 is used to control the deflection and positioning of the light and reflect the light to the transflective mirror 12. The transflective mirror 12 is used to transmit the light to the workpiece imager 15 for imaging.

[0057] On the laser optical path 11, a laser emitter 16, a reflective mirror 12, a scanning galvanometer 13 and a focusing field lens 14 are sequentially arranged along the laser transmission direction. Figure 3 The dotted line in the figure is the laser optical path 11. The laser emitter 16 is used to emit a high-energy laser beam. The transflective mirror 12 is used to reflect the laser beam to the scanning galvanometer 13. The scanning galvanometer 13 is used to control the deflection and positioning of the laser beam and reflect the laser beam to the focusing field lens 14. The focusing field lens 14 is used to converge the laser beam into a focal point.

[0058] In some embodiments, see Figure 1 、 Figure 2 、 Figure 4 The workpiece imager 15 includes a CCD camera 151 and an imaging mirror 152 disposed between the CCD camera 151 and the transflective mirror 12. The imaging mirror 152 is used to focus light on the photosensitive element of the CCD camera 151 to form a clear image; by adjusting the distance between the imaging mirror 152 and the CCD camera 151, clear imaging of workpieces at different distances can be achieved.

[0059] In some embodiments, see Figure 1 、 Figure 2 、 Figure 3 The laser emitter 16 includes a laser collimator. The laser collimator primarily comprises an emission system using a laser as a light source and a calibration system for calibrating the laser beam. The laser is used to emit the laser beam, and the calibration system maintains parallelism during transmission to reduce energy loss and laser beam diffusion, ensuring the accuracy and stability of the laser beam and guaranteeing its quality. The laser in the laser collimator can be a solid-state laser, a gas laser, or a fiber laser.

[0060] In some embodiments, see Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The scanning galvanometer 13 is a two-dimensional scanning galvanometer, and the transflective mirror 12 is set on the adjustment frame 19. The transflective mirror 12 is a 45° transflective mirror.

[0061] Specifically, an X-axis galvanometer 132 and a Y-axis galvanometer 131 are provided in the two-dimensional scanning galvanometer. The X-axis drives the X-axis galvanometer 132, and the Y-axis drives the Y-axis galvanometer 131, and any two-dimensional coordinate within a certain range of travel can be scanned. The adjustment frame 19 can adjust the position of the reflective mirror 12 to achieve precise adjustment of the laser beam pointing. The optical axis of the laser collimator is perpendicular to the optical axis of the CCD camera 151. The angle between the optical axis of the laser collimator and the reflective mirror 12 is 45°, and the angle between the optical axis of the CCD camera 151 and the reflective mirror 12 is 45°. The reflective mirror 12 has reflection and transmission functions. The reflective mirror 12 reflects the laser and transmits the imaging light.

[0062] In some embodiments, see Figure 1 The optical imaging processing device also includes a mounting base 17, on which the imaging optical path 10 and the laser optical path 11 are both disposed. Specifically, the focusing field lens 14, the scanning galvanometer 13, the transflective mirror 12, the workpiece imager 15, the laser emitter 16, and the adjustment frame 19 are all disposed.

[0063] In some embodiments, the optical imaging processing device further includes a Z-axis motion mechanism 18, and the mounting base 17 is disposed on the Z-axis motion mechanism 18. The Z-axis motion mechanism 18 can drive the imaging optical path 10 and the laser optical path 11 to move up and down, forming a 2.5D three-dimensional processing system.

[0064] See also Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 The process of processing the workpiece 20 using the optical imaging processing device provided in the embodiment of the present application is as follows:

[0065] The workpiece 20 is placed on the workbench below the focusing field lens 14. The laser emitter 16 emits a laser beam downward. The laser beam is incident on the transflective mirror 12, and after being reflected by the transflective mirror 12, it is incident horizontally to the left on the scanning galvanometer mirror 13. Inside the scanning galvanometer mirror 13, the X-axis galvanometer mirror 132 and the Y-axis galvanometer mirror 131 complete the two-dimensional laser pattern scanning. At the same time, the laser beam is reflected by the scanning galvanometer mirror 13 and then vertically downwards into the focusing field lens 14. After being output by the focusing field lens 14, it is focused on the surface of the workpiece 20 to achieve laser pattern processing on the workpiece 20. The focusing field lens 14 also serves as an imaging objective lens. The image of the surface of the workpiece 20 is reflected by the scanning galvanometer mirror 13, transmitted by the transflective mirror 12, and then transmitted to the imaging mirror 152. The imaging mirror 152 focuses the image on the CCD camera 151 to achieve the imaging function.

[0066] The optical imaging processing device provided in the embodiment of the present application is provided with a reflective mirror 12, a scanning galvanometer 13 and a focusing field lens 14 shared by the imaging optical path 10 and the laser optical path 11, so that the focusing field lens 14 serves as both a laser focusing lens and an imaging objective lens, thereby achieving coaxial and cofocusing of the laser optical path 11 and the imaging optical path 10, improving the imaging magnification and clarity, and realizing precise positioning during the laser processing process; especially when processing drawing dies for special-shaped die holes, it is more conducive to improving the laser processing efficiency of the workpiece, while ensuring the consistency of batch processing, and reducing the technical requirements for operators.

[0067] See also Figure 5 The embodiment of the present application also provides a wire drawing die laser punching machine, including a frame 1, a Z-axis motion table 2 arranged on the frame 1, and a punching device 3 arranged on the Z-axis motion table 2, and the punching device 3 is an optical imaging processing device.

[0068] Specifically, a frame 1 is mounted on a foundation. An X-axis motion stage 4 and a Z-axis motion stage 2 are mounted on top of the frame 1. A Y-axis motion stage 5 is mounted on the X-axis motion stage 4, and a material clamping fixture 6 is mounted on the Y-axis motion stage 5. The frame 1 is also mounted with an industrial computer and a display screen 7. The Z-axis motion stage 2, X-axis motion stage 4, Y-axis motion stage 5, display screen 7, CCD camera 151, and laser transmitter 16 are all electrically connected to the industrial computer.

[0069] See also Figure 5 The process of processing the wire drawing die workpiece 20 with a special-shaped die hole using the wire drawing die laser punching machine provided in the embodiment of the present application is as follows:

[0070] Fix the workpiece 20 on the clamping fixture 6, start the industrial computer, and adjust the position of the workpiece 20 through the X-axis motion table 4 and the Y-axis motion table 5; start the punching device 3, and adjust the focal plane of the CCD camera 151 to be consistent with the focal length of the imaging mirror 152 through the coaxial imaging of the CCD camera 151. The clear surface of the CCD camera 151 is the focal position of the focusing field lens 14, and the workpiece 20 can be positioned and processed; the image after imaging is displayed on the display screen 7; input the workpiece 20 data on the display screen 7 and edit and set the processing file. The edited processing data is formed into a three-dimensional multi-layer data after the process parameters are set; use the laser to complete one layer of data processing on the workpiece 20, and the Z-axis motion table 2 drives the punching device 3 to move downward to set the value to complete the next layer of data processing. And so on, complete the processing of a whole set of three-dimensional data on the workpiece 20, and finally process all the layers to form three-dimensional data subtractive processing, and obtain the set special-shaped holes on the material.

[0071] The material of the workpiece 20 may include common wire drawing die raw materials such as natural diamond, ruby, sapphire, silicon nitride, ceramics, artificial single crystal, polycrystalline, high crystal, diamond, etc.

[0072] The wire drawing die laser punching machine provided in the embodiment of the present application uses laser for non-contact processing, is not picky about materials, has high precision, high efficiency, a small heat-affected zone, and low loss of equipment and processing materials, and can complete subtractive processing of any three-dimensional model data; the laser optical path and the imaging optical path are coaxial and cofocusing, which improves the imaging magnification and clarity, avoids the image from being skewed on the display screen, is beneficial to image shape judgment and distance measurement, and realizes precise positioning during laser processing; especially when processing wire drawing dies for special-shaped die holes, it is more conducive to improving the laser processing efficiency of the workpiece, while ensuring the consistency of batch processing, and reducing the technical requirements for operators.

[0073] The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in this application should be covered by the scope of protection of the present application.

Claims

1. An optical imaging processing device, characterized in that: It comprises an imaging optical path (10) and a laser optical path (11) partially overlapping with the imaging optical path (10), and a transflective mirror (12), a scanning galvanometer (13) and a focusing field lens (14) are sequentially arranged in the overlapping portion of the two; A workpiece imager (15) located on one side of the transflective mirror (12) is provided on the portion of the imaging optical path (10) that does not overlap with the laser optical path (11), and the transflective mirror (12) is used to transmit imaging light; A laser emitter (16) located on one side of the transflective mirror (12) is provided on the non-overlapping portion of the laser light path (11) and the imaging light path (10). The transflective mirror (12) is used to reflect laser light.

2. The optical imaging processing device according to claim 1, characterized in that: The workpiece imager (15) includes a CCD camera (151) and an imaging mirror (152) arranged between the CCD camera (151) and the transflective mirror (12).

3. The optical imaging processing device according to claim 1, characterized in that: The laser emitter (16) includes a laser collimator.

4. The optical imaging processing device according to claim 3, characterized in that: The laser in the laser collimator is a solid laser, a gas laser or a fiber laser.

5. The optical imaging processing device according to claim 1, characterized in that: The scanning galvanometer (13) is a two-dimensional scanning galvanometer.

6. The optical imaging processing device according to claim 1, characterized in that: The transflective mirror (12) is arranged on an adjustment frame (19).

7. The optical imaging processing device according to claim 1, characterized in that: The transflective mirror (12) is a 45° transflective mirror.

8. The optical imaging processing device according to claim 1, characterized in that: It also includes a mounting seat (17), and the imaging optical path (10) and the laser optical path (11) are both arranged on the mounting seat (17).

9. The optical imaging processing device according to claim 8, characterized in that: It also includes a Z-axis motion mechanism (18), and the mounting seat (17) is arranged on the Z-axis motion mechanism (18).

10. A wire drawing die laser drilling machine, characterized in that: The optical imaging processing device comprises a frame (1), a Z-axis motion table (2) arranged on the frame (1), and a punching device (3) arranged on the Z-axis motion table (2), wherein the punching device (3) is the optical imaging processing device according to any one of claims 1 to 9.

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