Conductive silica gel electrode patch manufacturing mold

Abstract

The embodiment of the utility model provides a conductive silica gel electrode paste manufacturing mold which comprises an upper mold, a lower mold and a mandrel, the upper mold is provided with a first cavity, a gel injection opening and a gel overflow opening, the first cavity is formed in the first side of the upper mold, the gel injection opening and the gel overflow opening are formed in the second side of the upper mold, the gel injection opening is communicated with the first cavity, and the gel overflow opening penetrates through the upper mold; the mandrel is arranged in the first cavity in a penetrating mode. The lower die is provided with a second cavity and a glue overflowing groove, the second cavity and the glue overflowing groove are both formed in the first side of the lower die, the glue overflowing groove is located in the side face of the second cavity, and the glue overflowing groove communicates with the second cavity; the upper die and the lower die are matched together, the first cavity is communicated with the second cavity, and the glue overflowing opening is communicated with the glue overflowing groove.

Description

Technical Field

[0001] The present application relates to the technical field of silicone electrode patch manufacturing, and in particular to a conductive silicone electrode patch manufacturing mold. Background Art

[0002] Conductive silicone electrode patches are electrode patches that incorporate conductive silicone material and are primarily used in medical and electronic devices. They offer excellent conductivity and a comfortable fit, making them suitable for biomedical sensors, implantable devices, and other applications requiring electrical connections.

[0003] like Figure 1 As shown, the conductive silicone electrode patch includes a main body and a connecting seat. The connecting seat is arranged on the main body and is used to connect to the wire of the device. The main body is used to connect to the human body.

[0004] The present application provides a conductive silicone electrode patch manufacturing mold for manufacturing the conductive silicone electrode patch. Utility Model Content

[0005] The embodiment of the present application provides a conductive silicone electrode patch manufacturing mold for manufacturing a conductive silicone electrode patch.

[0006] The embodiment of the present application provides a conductive silicone electrode patch manufacturing mold, including an upper mold, a lower mold and a core shaft;

[0007] The upper mold is provided with a first mold cavity, a glue injection port, and a glue overflow port. The first mold cavity is provided on a first side of the upper mold, and the glue injection port and the glue overflow port are provided on a second side of the upper mold. The glue injection port is communicated with the first mold cavity, and the glue overflow port passes through the upper mold. The core shaft is provided in the first mold cavity.

[0008] The lower mold is provided with a second mold cavity and a glue overflow groove, the second mold cavity and the glue overflow groove are both provided on the first side of the lower mold, the glue overflow groove is located on the side of the second mold cavity, and the glue overflow groove is communicated with the second mold cavity;

[0009] The upper mold and the lower mold are matched together, the first cavity is communicated with the second cavity, and the glue overflow port is communicated with the glue overflow groove.

[0010] In a feasible implementation, there are at least two glue overflow grooves, and the at least two glue overflow grooves are respectively arranged on both sides of the second cavity.

[0011] In a feasible implementation, the upper mold is provided with a core shaft fitting hole, the core shaft fitting hole extends along the width direction of the upper mold, and the core shaft fitting hole passes through the first cavity, and the core shaft is fitted in the core shaft fitting hole.

[0012] In a feasible implementation, the conductive silicone electrode patch manufacturing mold further includes a demoulding screw, which passes through the upper mold and the end of the demoulding screw abuts against the lower mold.

[0013] In a feasible implementation, the upper mold is provided with a plurality of screw holes, and the screw holes are used to set the demoulding screws.

[0014] In a feasible implementation, the conductive silicone electrode patch manufacturing mold further includes a guide post, which is arranged on the first side of the lower mold and is used to cooperate with the upper mold.

[0015] In a feasible implementation, the upper mold is provided with a guide matching hole, and the guide matching hole is used to match with the guide column.

[0016] In a feasible implementation, the guide post includes a first guide post and a second guide post, and the first guide post and the second guide post are arranged along diagonal corners of the second cavity.

[0017] In a possible implementation, the cross section of the core shaft is configured to be elliptical.

[0018] In a feasible implementation, the glue overflow port is configured to be funnel-shaped.

[0019] The present invention provides a mold for manufacturing a conductive silicone electrode patch, comprising an upper mold, a lower mold, and a mandrel. The upper mold is provided with a first cavity, a glue injection port, and a glue overflow port. The first cavity is located on a first side of the upper mold, and the glue injection port and glue overflow port are located on a second side of the upper mold. The glue injection port is connected to the first cavity, and the glue overflow port extends through the upper mold. The mandrel is inserted into the first cavity. The lower mold is provided with a second cavity and a glue overflow groove. Both the second cavity and the glue overflow groove are located on the first side of the lower mold. The glue overflow groove is located on the side of the second cavity and is connected to the second cavity. The upper mold and the lower mold are assembled together, the first cavity is connected to the second cavity, and the glue overflow port is connected to the glue overflow groove. When manufacturing the conductive silicone electrode patch, the upper mold and the lower mold are first assembled together, the mandrel is inserted into the first cavity, and finally, molten conductive silicone liquid is injected from the glue injection port into the first and second cavities. This conductive silicone electrode patch manufacturing mold can complete the production of conductive silicone electrode patches in one step, with high production efficiency. The produced conductive silicone electrode patches have a smooth surface and high quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present application and do not constitute an improper limitation on the present invention.

[0021] In the attached figure:

[0022] Figure 1 This is a schematic diagram of a conductive silicone electrode patch;

[0023] Figure 2 This is an exploded view of the structure of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application;

[0024] Figure 3 This is a first cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application;

[0025] Figure 4 This is a second cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application;

[0026] Figure 5 This is a third cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application;

[0027] Figure 6 yes Figure 2 A first schematic diagram of the lower mold of the conductive silicone electrode patch manufacturing mold;

[0028] Figure 7 yes Figure 2 A second schematic diagram of the lower mold of the conductive silicone electrode patch manufacturing mold;

[0029] Figure 8 yes Figure 2 A first schematic diagram of an upper mold of a conductive silicone electrode patch manufacturing mold;

[0030] Figure 9 yes Figure 2 A second schematic diagram of the upper mold of the conductive silicone electrode patch manufacturing mold;

[0031] Figure 10 yes Figure 2 Schematic diagram of the mandrel of the conductive silicone electrode patch manufacturing mold;

[0032] Figure 11 yes Figure 2 Schematic diagram of the first guide column of the conductive silicone electrode patch manufacturing mold;

[0033] Figure 12 yes Figure 2 Schematic diagram of the second guide column of the conductive silicone electrode patch manufacturing mold;

[0034] Figure 13 yes Figure 2 Schematic diagram of the structure of the demoulding screw of the conductive silicone electrode patch manufacturing mold.

[0035] Description of reference numerals:

[0036] 100-upper mold; 200-lower mold; 300-mandrel; 400-mold stripping screw; 500-guide post; 600-conductive silicone electrode patch;

[0037] 110-first cavity; 120-glue injection port; 130-glue overflow port; 140-core shaft matching hole; 150-screw hole; 160-guide matching hole; 210-second cavity; 220-glue overflow groove; 510-first guide column; 520-second guide column; 610-main body; 620-connecting seat. DETAILED DESCRIPTION

[0038] In order to enable those skilled in the art to better understand the technical solutions in this application, the following will provide a clear and complete description of the technical solutions in the embodiments of this application in conjunction with the drawings in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of this application.

[0039] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, for example, two, three, etc., unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0041] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it can mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it can mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it can mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0042] Conductive silicone electrode patches are electrode patches that incorporate conductive silicone material and are primarily used in medical and electronic devices. They offer excellent conductivity and a comfortable fit, making them suitable for biomedical sensors, implantable devices, and other applications requiring electrical connections.

[0043] like Figure 1 As shown, the conductive silicone electrode patch 600 includes a main body 610 and a connecting seat 620. The connecting seat 620 is set on the main body 610. The connecting seat 620 is used to connect to the wire of the device, and the main body 610 is used to connect to the human body.

[0044] The present application provides a conductive silicone electrode patch manufacturing mold for manufacturing a conductive silicone electrode patch. The following will describe in detail the solution provided by the embodiment of the present application in conjunction with the accompanying drawings.

[0045] Figure 2 This is an exploded view of the structure of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application; Figure 3 This is a first cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application; Figure 4 This is a second cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application; Figure 5 This is a third cross-sectional view of the interior of a mold for manufacturing a conductive silicone electrode patch provided in one embodiment of the present application; Figure 6 yes Figure 2 A first schematic diagram of the lower mold 200 of the conductive silicone electrode patch manufacturing mold; Figure 7 yes Figure 2 A second schematic diagram of the lower mold 200 of the conductive silicone electrode patch manufacturing mold; Figure 8 yes Figure 2 A first schematic diagram of an upper mold 100 of a conductive silicone electrode patch manufacturing mold; Figure 9 yes Figure 2 A second schematic diagram of the upper mold 100 of the conductive silicone electrode patch manufacturing mold.

[0046] Reference Figures 2 to 9As shown, an embodiment of the present application provides a mold for manufacturing a conductive silicone electrode patch, comprising an upper mold 100, a lower mold 200 and a core shaft 300, wherein the upper mold 100 is provided with a first cavity 110, a glue injection port 120 and a glue overflow port 130. The first cavity 110 is arranged on the first side of the upper mold 100, the glue injection port 120 and the glue overflow port 130 are arranged on the second side of the upper mold 100, the glue injection port 120 is connected to the first cavity 110, and the glue overflow port 130 passes through the upper mold 100. It should be noted that the first side and the second side are two opposite side surfaces in the upper mold 100. For the convenience of description, they are specifically referred to as the first side and the second side. In addition, the core shaft 300 is passed through the first cavity 110. When manufacturing the conductive silicone electrode patch, a glue injection machine is used to inject glue from the glue injection port 120 into the first cavity 110, so that the first cavity 110 is filled more completely, avoiding defects such as bubbles and defects in the conductive silicone electrode patch.

[0047] The lower mold 200 is provided with a second cavity 210 and a glue overflow groove 220. Both the second cavity 210 and the glue overflow groove 220 are arranged on the first side of the lower mold 200. The glue overflow groove 220 is located on the side of the second cavity 210 and is connected to the second cavity 210. The first cavity 110 and the second cavity 210 are both used to prepare conductive silicone electrode patches. In this conductive silicone electrode patch manufacturing mold, the upper mold 100 and the lower mold 200 are matched together, the first cavity 110 is connected to the second cavity 210, and the glue overflow port 130 is connected to the glue overflow groove 220.

[0048] To manufacture a conductive silicone electrode patch, the upper mold 100 and lower mold 200 are first assembled together, the mandrel 300 is inserted into the first cavity 110, and molten conductive silicone liquid is injected from the injection port 120 into the first cavity 110 and the second cavity 210. This conductive silicone electrode patch manufacturing mold can complete the production of conductive silicone electrode patches in one step, with high production efficiency, and the resulting conductive silicone electrode patches have a smooth surface and high quality.

[0049] Continue to refer to Figure 2 As shown, there are at least two glue overflow grooves 220 , and the at least two glue overflow grooves 220 are respectively arranged on both sides of the second cavity 210 .

[0050] When the second mold cavity 210 is filled with conductive silicone liquid, excess conductive silicone liquid flows into the overflow trough 220. Exemplarily, the overflow trough 220 is connected to the second mold cavity 210 via multiple overflow channels. The overflow channels and overflow trough 220 ensure that the mold cavity is evenly filled with silicone, ensuring that the conductive silicone electrode patch is produced intact, while also avoiding the waste of raw materials and the need for repeated injections.

[0051] Reference Figure 2 and Figure 8As shown, in some examples, the glue overflow port 130 is configured as a funnel shape. Specifically, its size close to the first cavity 110 is small, and its size close to the top of the upper mold 100 is large. It can be understood that since the glue overflow port 130 is configured as a funnel shape, when the first cavity 110 is filled with conductive silicone liquid, the overflowed conductive silicone liquid can be discovered in time. Similarly, the funnel-shaped glue overflow port 130 can temporarily collect the overflowed conductive silicone liquid and facilitate the cleaning of the conductive silicone vulcanized at the glue overflow port 130.

[0052] In some examples, the lower mold 200 is provided with two exhaust holes, and the mating surfaces of the upper mold 100 and the lower mold 200 are polished to a mirror finish and are very smooth and flat. After using a flat vulcanizer at high temperature and high pressure, it is easy to form a vacuum in the middle and adsorb them together. The lower mold 200 is provided with two exhaust holes to avoid vacuum adsorption, which is beneficial for the separation of the upper mold 100 and the lower mold 200.

[0053] Continue to refer to Figure 2 and Figure 3 As shown, the upper mold 100 is provided with a mandrel fitting hole 140, which extends along the width direction of the upper mold 100 and penetrates the first mold cavity 110. The mandrel 300 is fitted into the mandrel fitting hole 140. The mandrel fitting hole 140 has the same size and shape as the mandrel 300, and the mandrel 300 can be inserted into the mandrel fitting hole 140.

[0054] Figure 10 yes Figure 2 Schematic diagram of the core shaft 300 of the conductive silicone electrode patch manufacturing mold.

[0055] Reference Figure 2 and Figure 10 As shown, in some examples, the cross-section of the shaft is configured to be elliptical. Specifically, the cross-section of the portion of the mandrel 300 located in the first cavity 110 is designed to be elliptical, thereby ensuring that the conductive silicone electrode patch that is finally glued out has an elliptical hole. The round metal plug connected to the device cooperates with the elliptical elastic silicone hole on the conductive silicone electrode patch, and the two can be firmly and tightly connected to ensure a more reliable conductive effect. In other examples, one end of the mandrel 300 is designed to be a frustum, which is convenient for entering the upper mold 100 to complete the assembly, and the other end is designed to be flat, which is convenient for clamping the mandrel 300 with a clamp when the upper mold 100 and the lower mold 200 are separated, thereby facilitating the removal of the mandrel 300 from the upper mold 100, so that the mandrel 300 has no scratches, burrs, defects or other defects around the elliptical cross-section. Since the structure around the elliptical cross-section of the mandrel 300 is intact, without scratches, burrs, defects or other defects, the upper mold 100 cavity will not be damaged during assembly.

[0056] Continue to refer to Figures 2 to 5As shown, the mold for manufacturing the conductive silicone electrode patch also includes a demoulding screw 400, which passes through the upper mold 100 and the end of the demoulding screw 400 abuts against the lower mold 200. When the upper mold 100 and the lower mold 200 need to be separated, the demoulding screw 400 is rotated to separate the upper mold 100 from the lower mold 200. Exemplarily, the upper mold 100 is provided with a plurality of screw holes 150, and the screw holes 150 are used to set the demoulding screws 400. In the example of the present application, the upper mold 100 is provided with four screw holes 150, and a demoulding screw 400 is respectively provided in the four screw holes 150. The four screws are rotated synchronously to separate the upper mold 100 from the lower mold 200, saving effort and not damaging the mold and the silicone product. During the demolding process, four demolding screws 400 are screwed in synchronously, and the demolding screws 400 contact the lower mold 200, so that the lower mold 200 and the upper mold 100 are lifted and separated, ensuring that the force is evenly distributed when the lower mold 200 and the upper mold 100 are separated, without damaging the positioning accuracy of the guide column 500 and the strength of the conductive silicone electrode patch, making it easier to demold the conductive silicone electrode patch and completing the demolding.

[0057] Throughout the entire process of closing the upper mold 100 and lower mold 200, injecting glue, vulcanizing in the vulcanizer at high temperature and high pressure, and then separating the molds, the demolding screw 400 remains connected to the demolding screw hole 150 of the upper mold 100, avoiding repeated disassembly and assembly. Especially when the upper mold 100 and lower mold 200 are closed and entering the vulcanizer, the head of the demolding screw 400 does not exceed the top of the upper mold 100, so there is no need to remove it. After vulcanization is completed and the mold cools down, the demolding screw 400 is simply tightened to separate the upper mold 100 and lower mold 200.

[0058] In order to facilitate the closing of the upper mold 100 and the lower mold 200, the conductive silicone electrode patch manufacturing mold further includes a guide post 500. The guide post 500 is arranged on the first side of the lower mold 200, and the guide post 500 is used to cooperate with the upper mold 100. Specifically, the upper mold 100 is provided with a guide matching hole 160, and the guide matching hole 160 is used to cooperate with the guide post 500. It can be understood that under the action of the guide post 500 and the guide matching hole 160, the closing precision of the lower mold 200 and the upper mold 100 is accurate and reliable.

[0059] Figure 11 yes Figure 2 Schematic diagram of the first guide column 510 of the conductive silicone electrode patch manufacturing mold; Figure 12 yes Figure 2 Schematic diagram of the second guide post 520 of the conductive silicone electrode patch manufacturing mold; Figure 13 yes Figure 2 Schematic diagram of the structure of the demoulding screw 400 of the conductive silicone electrode patch manufacturing mold.

[0060] In some other examples, the guide post 500 includes a first guide post 510 and a second guide post 520, and the first guide post 510 and the second guide post 520 are arranged along the diagonal edges of the second cavity 210. Figure 11 As shown, the first guide post 510 is configured as a columnar body, and the size of its end portion is smaller than the size of its column body, so as to facilitate the cooperation of the remaining guide matching holes 160. Figure 12 As shown, similarly, in the embodiment of the present application, the second guide post 520 is also configured as a columnar body, and the size of its end portion is smaller than the size of its column body, so as to facilitate the engagement with the remaining guide mating holes 160. It is understood that the first guide post 510 and the second guide post 520 can also be configured as a prismatic structure.

[0061] Reference Figure 13 As shown, the end of the demoulding screw 400 is a hexagonal structure, which is convenient for screwing.

[0062] When using a conductive silicone electrode patch to manufacture a mold, the core shaft 300 is first inserted and installed into the upper mold 100 along the core shaft matching hole 140; the upper mold 100 and the lower mold 200 are precisely matched together through the guide column 500 and the guide matching hole 160. At this time, the first cavity 110, the second cavity 210 and the core shaft 300 form a cavity, and then the upper mold 100 and the lower mold 200 are connected together with fastening screws. A glue injection machine is used to inject glue into the first cavity 110 from the glue injection port 120. The conductive silicone liquid flowing out of the glue injection machine passes through the glue injection port 120, the first cavity 110, the second cavity 210, the overflow channel, the overflow groove 220, and finally overflows from the overflow port 130. At this point, the entire glue injection process is completed.

[0063] In addition, the first cavity 110 and the second cavity 210 can be filled with a combination of this method of pre-filling with silicone and a glue injection machine, which further avoids the risk that the first cavity 110 and the second cavity 210 are not completely filled with conductive silicone liquid, and overflow from the glue overflow port 130, indicating that the first cavity 110 and the second cavity 210 are completely filled with conductive silicone liquid from top to bottom and left to right. After the glue injection is completed, the upper mold 100 and the lower mold 200 are placed together in a flat-plate vulcanizer for high-temperature and high-pressure vulcanization. After the vulcanization is completed, wait for the mold temperature to cool to room temperature, and pull the core shaft 300 out of the upper mold 100. Then, four demoulding screws 400 are simultaneously screwed into the bottom of the screw hole 150. The top of the demoulding screw 400 contacts the lower mold 200, so that the lower mold 200 is lifted and separated from the upper mold 100, as shown in FIG. Figure 5 As shown, this method ensures uniform and slow force during the separation of the lower mold 200 and upper mold 100, allowing the upper mold 100 and lower mold 200 to separate in parallel, without compromising the positioning accuracy of the guide post 500 or the strength of the conductive silicone electrode patch. After the molds are separated, the conductive silicone electrode patch is removed and the excess glue injection port 120 and the glue overflow channel are trimmed with scissors. This completes the conductive silicone electrode patch.

[0064] It is easy to understand that those skilled in the art can combine, split, reorganize, etc. the embodiments of the present application based on the several embodiments provided in the present application to obtain other embodiments, and these embodiments do not exceed the scope of protection of the present application.

[0065] The above specific implementation methods further explain in detail the purpose, technical solutions and beneficial effects of the embodiments of the present application. It should be understood that the above are only specific implementation methods of the embodiments of the present application and are not intended to limit the scope of protection of the embodiments of the present application. Any modifications, equivalent replacements, improvements, etc. made on the basis of the technical solutions of the embodiments of the present application should be included in the scope of protection of the embodiments of the present application.

Claims

1. A conductive silicone electrode patch manufacturing mold, characterized in that: It comprises an upper die (100), a lower die (200) and a core shaft (300); The upper mold (100) is provided with a first mold cavity (110), a glue injection port (120) and a glue overflow port (130); the first mold cavity (110) is arranged on a first side of the upper mold (100); the glue injection port (120) and the glue overflow port (130) are arranged on a second side of the upper mold (100); the glue injection port (120) is communicated with the first mold cavity (110), and the glue overflow port (130) passes through the upper mold (100); the core shaft (300) is passed through the first mold cavity (110); The lower mold (200) is provided with a second mold cavity (210) and a glue overflow groove (220), the second mold cavity (210) and the glue overflow groove (220) are both provided on a first side of the lower mold (200), the glue overflow groove (220) is located on a side of the second mold cavity (210), and the glue overflow groove (220) is communicated with the second mold cavity (210); The upper mold (100) and the lower mold (200) are matched together, the first mold cavity (110) and the second mold cavity (210) are communicated with each other, and the glue overflow port (130) and the glue overflow groove (220) are communicated with each other.

2. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: There are at least two glue overflow grooves (220), and the at least two glue overflow grooves (220) are respectively arranged on both sides of the second cavity (210).

3. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: The upper mold (100) is provided with a core shaft fitting hole (140), the core shaft fitting hole (140) extends along the width direction of the upper mold (100), and the core shaft fitting hole (140) passes through the first cavity (110), and the core shaft (300) is fitted and arranged in the core shaft fitting hole (140).

4. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: The conductive silicone electrode patch manufacturing mold further includes a demoulding screw (400), wherein the demoulding screw (400) passes through the upper mold (100) and the end of the demoulding screw (400) abuts against the lower mold (200).

5. The conductive silicone electrode patch manufacturing mold according to claim 4, characterized in that: The upper mold (100) is provided with a plurality of screw holes (150), and the screw holes (150) are used to set the demoulding screws (400).

6. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: The conductive silicone electrode patch manufacturing mold further includes a guide post (500), which is arranged on a first side of the lower mold (200) and is used to cooperate with the upper mold (100).

7. The conductive silicone electrode patch manufacturing mold according to claim 6, characterized in that: The upper die (100) is provided with a guide matching hole (160), and the guide matching hole (160) is used to match with the guide column (500).

8. The conductive silicone electrode patch manufacturing mold according to claim 6, characterized in that: The guide column (500) includes a first guide column (510) and a second guide column (520), wherein the first guide column (510) and the second guide column (520) are arranged along diagonal edges of the second cavity (210).

9. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: The cross section of the core shaft (300) is configured to be elliptical.

10. The conductive silicone electrode patch manufacturing mold according to claim 1, characterized in that: The glue overflow port (130) is configured in a funnel shape.

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