Glass micro-melting process pressure sensor
The pressure sensor manufactured through the glass micro-melting process solves the problems of traditional sensors being prone to cracking and leakage, achieves higher sealing and reliability, and improves the pressure sensing accuracy and stability.
Patent Information
- Application Number
- CN202423033839.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-09-26
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Existing vehicle pressure sensors have problems such as easy cracking of materials, easy deformation of diaphragms, and easy leakage during installation, resulting in low accuracy and poor reliability.
The pressure sensor is manufactured using a glass micro-melting process. The base, intermediate housing and end cover are connected as one. The strain gauge and sensing circuit board are reasonably arranged. The interior of the intermediate housing is sealed to prevent the pressure medium from entering. Laser welding is used instead of traditional processes to enhance sealing and reliability.
The sealing and reliability of the sensor are improved, the influence of medium intrusion caused by gaps is avoided, and the pressure sensing accuracy and the stability of the overall structure are improved.
Smart Images

Figure CN223389310U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensors, in particular to a glass micro-melting process pressure sensor. Background Art
[0002] A pressure sensor is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to certain rules. It is usually composed of a pressure sensitive element and a signal processing unit. From the perspective of materials, the mainstream vehicle pressure sensor embryos in the current market are mainly divided into ceramic piezoresistors, ceramic capacitors, silicon and other mainstream application materials. There are mainly the following problems: 1. The production process of the ceramic embryo is subject to temperature, raw materials and other aspects, and it is easy to crack or impurities in the sintering process may cause explosions during subsequent use. At the same time, circuit etching is required on the ceramic embryo, which has low precision. 2. The main problem of the oil-filled silicon body is that The contact surface between the silicon body and the pressure medium is made of stainless steel, which is thin, with a common thickness of about 0.03mm. When the pressure medium is impacted by particles, it is easy to cause deformation of the diaphragm. At the same time, it is also easy to cause deformation of the diaphragm during the production process. Various reasons will lead to a large fluctuation range of pressure output and even diaphragm rupture; 3. Whether ceramic or oil-filled silicon body, there is an installation leakage problem, because no matter which of the above materials is used, the core module and the shell need to be tightly matched. This process often uses EPDM or Dingqing O-rings for assembly and sealing. When the pressure is too high or water hammer occurs, it is easy to cause rupture or leakage. Utility Model Content
[0003] The purpose of this utility model is to provide a glass micro-melting process pressure sensor. The base, intermediate housing, and end caps of the utility model are connected as one body, the strain gauge and sensing circuit board are rationally arranged, and the interior of the intermediate housing is sealed to prevent the ingress of pressure media, thus having the advantage of high reliability.
[0004] The technical solution of the utility model is as follows: a glass micro-melting process pressure sensor includes an intermediate shell with two ends connected, and the bottom of the intermediate shell is provided with a base that closes its lower end; the bottom of the base is provided with a strain gauge, and the top of the base is provided with a strain head connected to the strain gauge and located in the intermediate shell; the intermediate shell is provided with an inductive circuit board connected to the strain head; the top of the intermediate shell is provided with an end cover that closes its upper end, and the end cover is provided with an interface connected to the inductive circuit board.
[0005] In the above-mentioned glass micro-melting process pressure sensor, the strain gauge is embedded in the bottom of the base through glass micro-melting sintering.
[0006] In the aforementioned glass micro-melting process pressure sensor, a threaded joint is provided at the bottom of the base.
[0007] In the aforementioned glass micro-melting process pressure sensor, a connecting seat is provided in the intermediate shell, a locking cavity that fits with the strain head is provided in the connecting seat, and a slot that fits with the sensing circuit board is provided on the top of the connecting seat.
[0008] In the aforementioned glass micro-melting process pressure sensor, the sensing circuit board includes a receiving circuit board and a conditioning circuit board. The receiving circuit board is connected to the strain head and is connected to the conditioning circuit board via a pin header. The conditioning circuit board is connected to the interface.
[0009] In the aforementioned glass micro-melting process pressure sensor, the intermediate shell and the base are connected by laser welding.
[0010] In the aforementioned glass micro-melting process pressure sensor, the intermediate shell and the end cover are connected by laser welding.
[0011] In the aforementioned glass micro-melting process pressure sensor, the interface and the end cover are threadedly matched, and the threaded joint of the two is sealed with thread glue.
[0012] In the aforementioned glass micro-melting process pressure sensor, the intermediate shell, base and end cover are all made of stainless steel.
[0013] In the aforementioned glass micro-melting process pressure sensor, an O-ring for sealing is provided on the outer edge of the strain gauge.
[0014] Compared with the existing technology, the utility model uses strain gauges to sense pressure, transmits the signal to the sensing circuit board through the strain head and outputs it from the interface; the strain gauge is arranged outside the base as the force-bearing body, and the base, the intermediate shell and the end cover effectively disperse the force in turn; the base, the intermediate shell and the end cover are connected to form a whole, the interior of the intermediate shell remains sealed, and the sensing circuit board is independently arranged inside the sealed cavity to avoid the pressure medium from entering due to gaps and affecting the operation of the sensor, and has good reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a structural diagram of the utility model;
[0016] Figure 2 It is a schematic diagram of the explosion structure of the utility model.
[0017] The markings in the accompanying drawings are: 1. intermediate shell; 2. base; 3. strain gauge; 4. strain head; 5. sensing circuit board; 6. end cover; 7. interface; 8. threaded joint; 9. connecting seat; 10. snap-fit cavity; 11. slot; 12. receiving circuit board; 13. conditioning circuit board; 14. O-ring. DETAILED DESCRIPTION
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments, but they are not intended to limit the present invention.
[0019] Embodiment: A glass micro-melting process pressure sensor, as shown in the attached Figure 1 and attached Figure 2 As shown, it comprises a cylindrical stainless steel intermediate shell 1 with two ends connected. The bottom of the intermediate shell 1 is laser welded with a base 2 that closes its lower end, replacing the traditional O-ring matching process, and the sealing effect is better; the bottom of the base 2 is embedded with a strain gauge 3, i.e. a semiconductor strain gauge, by glass micro-melting and sintering. The glass micro-melting and sintering connection is tight, reliable and has no welds, thereby having a better sealing effect. At the same time, reliable fixation helps the strain gauge to have better pressure sensing accuracy. The top of the base 2 is equipped with a strain head 4, i.e. a strain gauge connector, which is connected to the strain gauge 3 and located in the intermediate shell 1; the intermediate shell 1 is equipped with a sensing circuit board 5 connected to the strain head 4; the top of the intermediate shell 1 is laser welded with an end cover 6 that closes its upper end, and the end cover 6 is threaded with an interface 7 connected to the sensing circuit board 5. The threaded joints of the two are sealed with thread glue. Laser welding replaces the traditional rear-end riveting process, which can effectively avoid the problem of rear-end water leakage caused by loose end cover, and can also solve the problem of processing sequence of end cover and plug. The process problem is solved, which makes the processing efficiency higher; a threaded joint 8 is integrally formed at the bottom of the base 2 for connection; a connecting seat 9 is fixed in the intermediate shell 1, and a locking cavity 10 that matches the strain head 4 is processed in the connecting seat 9. A card slot 11 that matches the sensing circuit board 5 is opened on the top of the connecting seat 9, which can effectively match the strain head with the back-end circuit tightly without rotation, thereby avoiding the breakage of the gold wire (signal transmission line) between the two; the sensing circuit board 5 includes a receiving circuit board 12 and a conditioning circuit board 13. The receiving circuit board obtains the pressure signal, and the conditioning circuit converts the pressure signal into a standard signal and outputs it through the interface. The receiving circuit board 12 is connected to the strain head 4 and is welded to the conditioning circuit board 13 through a pin header. At the same time, there is no hole in the middle of the conditioning circuit board, which can effectively protect the gold wire between the receiving circuit board and the strain head to prevent breakage; the intermediate shell 1, base 2 and end cover 6 are all made of stainless steel; the outer edge of the strain gauge 3 is equipped with an O-ring 14 for sealing to improve the sealing performance.
[0020] Working principle: Pressure is sensed through the strain gauge 3, and the signal is transmitted to the sensing circuit board 5 through the strain head 4 and output from the interface 7; the strain gauge 3 is arranged outside the base 2 as the force-bearing body, and the base 2, the intermediate shell 1 and the end cover 6 effectively disperse the force in turn; the base 2, the intermediate shell 1 and the end cover 6 are connected to form a whole, the interior of the intermediate shell 1 remains sealed, and the sensing circuit board 5 is independently arranged in the inner cavity of the intermediate shell to avoid the pressure medium from entering due to gaps and affecting the operation of the sensor, and has good reliability.
[0021] The above embodiments merely represent implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. Furthermore, in these embodiments, the terms "up," "down," "left," "right," "front," and "back" merely represent relative positions and do not represent absolute positions. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.
Claims
1. A glass micro-melting process pressure sensor, characterized in that: The invention comprises an intermediate shell (1) with two ends communicating with each other, wherein the bottom of the intermediate shell (1) is provided with a base (2) for closing its lower end; the bottom of the base (2) is provided with a strain gauge (3); the top of the base (2) is provided with a strain head (4) connected to the strain gauge (3) and located in the intermediate shell (1); the intermediate shell (1) is provided with an inductive circuit board (5) connected to the strain head (4); the top of the intermediate shell (1) is provided with an end cover (6) for closing its upper end, and the end cover (6) is provided with an interface (7) connected to the inductive circuit board (5).
2. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The strain gauge (3) is embedded in the bottom of the base (2) through glass micro-melting and sintering.
3. The glass micro-melting process pressure sensor according to claim 1, characterized in that: A threaded joint (8) is provided at the bottom of the base (2).
4. The glass micro-melting process pressure sensor according to claim 1, characterized in that: A connecting seat (9) is provided in the intermediate housing (1), a locking cavity (10) that fits with the strain head (4) is provided in the connecting seat (9), and a slot (11) that fits with the inductive circuit board (5) is provided on the top of the connecting seat (9).
5. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The sensing circuit board (5) comprises a receiving circuit board (12) and a conditioning circuit board (13); the receiving circuit board (12) is connected to the strain head (4) and is connected to the conditioning circuit board (13) via a pin header; and the conditioning circuit board (13) is connected to the interface (7).
6. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The intermediate shell (1) and the base (2) are connected via laser welding.
7. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The intermediate shell (1) and the end cover (6) are connected via laser welding.
8. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The interface (7) and the end cover (6) are threadedly matched, and the threaded joint of the two is sealed with thread glue.
9. The glass micro-melting process pressure sensor according to claim 1, characterized in that: The intermediate shell (1), base (2) and end cover (6) are all made of stainless steel.
10. The glass micro-melting process pressure sensor according to claim 1, characterized in that: An O-ring (14) for sealing is provided on the outer edge of the strain gauge (3).