Semiconductor probe current testing device

Abstract

The utility model discloses a semiconductor probe current testing device, which is characterized in that the semiconductor probe current testing device comprises a bearing jig, the top of the bearing jig is used for placing a semiconductor probe to be tested, a pressing mechanism is arranged above the bearing jig, and the pressing mechanism is used for pressing the semiconductor probe to be tested. The pressing and covering mechanism is used for pressing a semiconductor probe on the bearing jig above the bearing jig, a first guide rail is laid at the bottom of the bearing jig, conductive parts are connected to the two sides of the first guide rail respectively, one side of each conductive part is aligned to the bearing jig, and an adjusting mechanism is installed on the side, away from the bearing jig, of each conductive part. The adjusting mechanism is used for driving the conductive part to move along the first guide rail until the conductive part makes contact with the semiconductor probe, current parameters can be measured more accurately through contact between the probe and the conductive part, the conductivity and stability of a probe material can be evaluated more accurately, the structure is simple, the reliability is high, and the manufacturing cost is low.

Description

Technical Field

[0001] The utility model relates to the field of testing devices, in particular to a semiconductor probe current testing device. Background Art

[0002] A semiconductor probe current tester is a device used to evaluate the current parameters of semiconductor probes. This device is primarily used to test and analyze the electrical performance of semiconductor probes to ensure they meet design specifications and expected performance.

[0003] Existing semiconductor probe current testing devices usually only connect wires on both sides of the semiconductor probe and then use the wires to connect to the current testing device. Such test results are affected by various factors, resulting in that the test results are often not very accurate. Utility Model Content

[0004] In order to solve the above-mentioned problems, the utility model provides a semiconductor probe current testing device, including a supporting jig, the top of the supporting jig is used to place the semiconductor probe to be tested, and a pressing mechanism is arranged above the supporting jig, and the pressing mechanism is used to press the semiconductor probe onto the supporting jig above the supporting jig, and a first guide rail is laid on the bottom of the supporting jig, and conductive parts are respectively connected to both sides of the first guide rail, one side of the conductive part is aligned with the supporting jig, and an adjustment mechanism is installed on the side away from the supporting jig, and the adjustment mechanism is used to drive the conductive part to move along the first guide rail until it comes into contact with the semiconductor probe.

[0005] Furthermore, the pressing mechanism includes a bracket vertically arranged on one side of the supporting fixture, an operating rod is provided at the top of the bracket, an axial connection is formed between the operating rod and the bracket, a connecting rod and a pressure block are installed at the bottom of the operating rod, and the pressure block is arranged below the connecting rod.

[0006] Furthermore, a second guide rail is provided on the side of the bracket, and the pressing block is clamped on the second guide rail.

[0007] Furthermore, a groove is provided on the top of the supporting fixture, the groove is used to place a semiconductor probe, and a tapered portion is provided on the bottom of the pressing block.

[0008] Furthermore, the laying direction of the first guide rail is consistent with the length direction of the semiconductor probe.

[0009] Furthermore, a power-on point is provided at the top of the conductive member, an insulating member is provided at the rear end of the conductive member, and a sliding seat is provided at the bottom of the insulating member. The sliding seat is installed above the first guide rail and can slide along the first guide rail.

[0010] Furthermore, guide rods are provided on both sides of the first guide rail, and the guide rods are connected between the insulating members on both sides of the first guide rail.

[0011] Furthermore, the adjustment mechanism includes a support base, a handle is provided on one side of the support base, an output shaft is provided in the handle, and the output shaft passes through the support and is connected to the insulating member.

[0012] Compared with the prior art, the beneficial effects of the present invention are:

[0013] The present application makes contact between the probe and the conductive part, thereby being able to more accurately measure the current parameters and evaluate the conductive performance and stability of the probe material. It has a simple structure, high reliability and low manufacturing cost.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic structural diagram of the pressing mechanism of the present utility model;

[0018] Figure 3 This is a structural diagram of the conductive member and the adjustment structure of the utility model.

[0019] The reference numerals and names in the figures are as follows:

[0020] Support fixture 10, pressing mechanism 100, first guide rail 20, conductive member 30, adjustment mechanism 200, bracket 110, operating rod 120, connecting rod 130, pressure block 140, second guide rail 111, groove 11, tapered portion 141, power point 31, insulating member 40, sliding seat 50, guide rod 60, support seat 210, handle 220, output shaft 230. DETAILED DESCRIPTION

[0021] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] The present invention will be described in more detail. It should be understood that the specific embodiments described herein are intended only to explain the present invention and are not intended to limit the present invention. It should be noted that when an element is described as being "fixed to" another element, it may be directly on the other element, or one or more intervening elements may be present therebetween. When an element is described as being "connected to" another element, it may be directly connected to the other element, or one or more intervening elements may be present therebetween.

[0023] In the description of the present invention, it should be noted that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise stated, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention. The directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself. In the description of the present invention, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above words have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art in the art of the present invention. The terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0025] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0026] The preferred embodiments of the present invention will be further described with reference to the accompanying drawings. Figure 1As shown, a semiconductor probe current testing device includes a supporting jig 10, the top of the supporting jig 10 is used to place the semiconductor probe to be tested, and a pressing mechanism 100 is arranged above the supporting jig 10, and the pressing mechanism 100 is used to press the semiconductor probe onto the supporting jig 10 above the supporting jig 10, and a first guide rail 20 is laid on the bottom of the supporting jig 10, and conductive members 30 are respectively connected to both sides of the first guide rail 20, and the conductive member 30 is electrically connected to an external current testing device (not shown in the figure), one side of the conductive member 30 is aligned with the supporting jig 10, and an adjustment mechanism 200 is installed on the side away from the supporting jig 10, and the adjustment mechanism 200 is used to drive the conductive member 30 to move along the first guide rail 20 until it forms contact with the semiconductor probe.

[0027] When operating in this embodiment, the semiconductor probe is first placed on the supporting fixture 10, and then the pressing mechanism 100 is operated to press down and press the semiconductor probe against the top of the supporting fixture 10. After completion, the conductive member 30 is driven to move along the first guide rail 20 by operating the adjustment structure until the conductive member 30 forms contact with both ends of the semiconductor probe. Finally, the external current testing device is started, and after the conductive member 30 is energized, the current passing through the semiconductor probe is measured to ensure the quality and reliability of the semiconductor probe and reduce the R&D time and manufacturing process costs. This application makes contact between the probe and the conductive member 30, so that the current parameters can be measured more accurately, and the conductive performance and stability of the probe material can be evaluated. The structure is simple, the reliability is high, and the manufacturing cost is low.

[0028] On the basis of the above embodiment, Figure 2 As shown, the pressing mechanism 100 includes a bracket 110 vertically arranged on one side of the supporting fixture 10, and an operating rod 120 is arranged at the top of the bracket 110. The operating rod 120 and the bracket 110 are axially connected, and a connecting rod 130 is installed at the bottom of the operating rod 120. When the operating rod 120 rotates relative to the bracket 110, it drives the connecting rod 130 to move up and down. A pressing block 140 is provided at the bottom of the connecting rod 130. Under normal circumstances, the operating rod 120 is first rotated clockwise relative to the bracket 110 to drive the connecting rod 130 and the pressing block 140 to rise, and then the semiconductor probe is placed on the top of the supporting fixture 10, and then the operating rod 120 is rotated counterclockwise relative to the bracket 110 to drive the connecting rod 130 and the pressing block 140 to descend, thereby pressing the semiconductor probe tightly on the supporting fixture 10.

[0029] In some embodiments, as Figure 2As shown, a second guide rail 111 is provided on the side of the bracket 110, and the pressure block 140 is clamped on the second guide rail 111. When the operating rod 120 drives the connecting rod 130 and the pressure block 140 to rise or fall, it can guide the rising and falling path of the pressure block 140.

[0030] In some embodiments, as Figure 2 As shown, a groove 11 is provided on the top of the supporting jig 10, and the groove 11 is used to place the semiconductor probe. A tapered portion 141 is provided at the bottom of the pressing block 140. When the pressing block 140 descends, the tapered portion 141 presses on the semiconductor probe to make its pressing effect better. In addition, the semiconductor probe is placed in the groove 11 and can also be placed on the supporting jig 10 to prevent the semiconductor probe from slipping when being pressed.

[0031] In some embodiments, as Figure 3 As shown, the laying direction of the first guide rail 20 is consistent with the length direction of the semiconductor probe, so that when the adjustment structure drives the conductive member 30 to move along the first guide rail 20, the conductive member 30 can better form contact with both ends of the semiconductor probe.

[0032] On the basis of the above embodiment, Figure 3 As shown, the top of the conductive member 30 is provided with a power point 31, which is used to electrically connect to an external current testing device (not shown). An insulating member 40 is provided at the rear end of the conductive member 30, and a sliding seat 50 is provided at the bottom of the insulating member 40. The sliding seat 50 is mounted above the first guide rail 20 and can slide along the first guide rail 20.

[0033] In some embodiments, as Figure 3 As shown, guide rods 60 are provided on both sides of the first guide rail 20, and the guide rods 60 are connected between the insulating parts 40 on both sides of the first guide rail 20. When the conductive part 30 moves along the first guide rail 20, the guide rods 60 can assist the first guide rail 20 in guiding the movement of the conductive part 30.

[0034] On the basis of the above embodiment, Figure 3As shown, the adjustment mechanism 200 includes a support base 210, a handle 220 is provided on one side of the support base 210, and an output shaft 230 is provided in the handle 220. When the handle 220 is rotated, the output shaft 230 can be rotated in and out of the handle 220. The output shaft 230 passes through the support and is connected to the insulating member 40. When the handle 220 is rotated to operate the output shaft 230 to rotate out relative to the handle 220, the insulating member 40 is pushed to move along the first guide rail 20, thereby driving the conductive member 30 to move along the first guide rail 20 until it comes into contact with the semiconductor probe.

[0035] The above exemplary embodiments are detailed, and the present invention may be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the foregoing description, and it is intended that all changes that come within the meaning and range of equivalents of the claims be included within the present invention.

Claims

1. A semiconductor probe current testing device, characterized in that: The invention comprises a supporting jig (10), wherein the top of the supporting jig (10) is used for placing a semiconductor probe to be tested, a pressing mechanism (100) is provided above the supporting jig (10), and the pressing mechanism (100) is used for pressing the semiconductor probe onto the supporting jig (10) above the supporting jig (10), a first guide rail (20) is laid on the bottom of the supporting jig (10), and conductive members (30) are respectively connected to both sides of the first guide rail (20), one side of the conductive member (30) is aligned with the supporting jig (10), and an adjusting mechanism (200) is installed on the side away from the supporting jig (10), and the adjusting mechanism (200) is used for driving the conductive member (30) to move along the first guide rail (20) until it comes into contact with the semiconductor probe.

2. The semiconductor probe current testing device according to claim 1, characterized in that: The pressing mechanism (100) includes a bracket (110) vertically arranged on one side of the supporting fixture (10), an operating rod (120) is arranged at the top end of the bracket (110), an axial connection is formed between the operating rod (120) and the bracket (110), a connecting rod (130) and a pressing block (140) are installed at the bottom of the operating rod (120), and the pressing block (140) is arranged below the connecting rod (130).

3. The semiconductor probe current testing device according to claim 2, characterized in that: A second guide rail (111) is provided on the side of the bracket (110), and the pressing block (140) is clamped on the second guide rail (111).

4. The semiconductor probe current testing device according to claim 2, characterized in that: A groove (11) is provided on the top of the supporting jig (10), and the groove (11) is used to place a semiconductor probe, and a tapered portion (141) is provided on the bottom of the pressing block (140).

5. The semiconductor probe current testing device according to claim 1, wherein: The laying direction of the first guide rail (20) is consistent with the length direction of the semiconductor probe.

6. The semiconductor probe current testing device according to claim 1, characterized in that: The top of the conductive member (30) is provided with a power-on point (31), the rear end of the conductive member (30) is provided with an insulating member (40), the bottom of the insulating member (40) is provided with a sliding seat (50), and the sliding seat (50) is installed above the first guide rail (20) and can slide along the first guide rail (20).

7. The semiconductor probe current testing device according to claim 6, characterized in that: Guide rods (60) are provided on both sides of the first guide rail (20), and the guide rods (60) are connected between the insulating members (40) on both sides of the first guide rail (20).

8. The semiconductor probe current testing device according to claim 6, characterized in that: The adjustment mechanism (200) comprises a support seat (210), a handle (220) is provided on one side of the support seat (210), an output shaft (230) is provided in the handle (220), and the output shaft (230) passes through the support and is connected to the insulating member (40).

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