Surface-mounted capacitor protection structure

Abstract

The utility model provides a surface-mounted capacitor protection structure which comprises a packaging box, a plurality of placing plates are arranged in the packaging box, a box cover is arranged on the upper side of the packaging box, damping structures are arranged between the packaging box and the placing plates and between the box cover and the placing plates, a plurality of placing grooves are formed in the placing plates, protection boxes are arranged in the placing grooves, and the protection boxes are arranged in the placing grooves. The protection box comprises an upper shell and a lower shell, a surface-mounted capacitor is arranged in the lower shell, a convex block is fixed on the upper shell, and the convex block corresponds to the lower shell and the surface-mounted capacitor. According to the utility model, the protection box is installed in the placing groove, the surface-mounted capacitor is placed in the lower shell, the surface-mounted capacitor can be fixed through the convex block on the upper shell and the lower shell, and the protection box can be extruded and fixed through the damping structure, so that the surface-mounted capacitor can be well protected; in addition, the chip capacitor in use can be protected through the lower shell, and the application range of the device is expanded.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitor protection structures, in particular to a chip-type capacitor protection structure. Background Art

[0002] The full name of chip capacitors is: multilayer ceramic capacitors, also known as chip capacitors, chip capacitance. There are two ways to express chip capacitors, one is to express it in inches and the other is to express it in millimeters. The pressure resistance of chip capacitors is not strong enough. They are easily squeezed or bent during use, which causes damage to the chip capacitors and makes them unable to be used normally. Therefore, the prior art has designed a protective structure for chip capacitors, such as the patent with publication number CN215377229U, which discloses a chip capacitor packaging structure, including a packaging box, a protection box and an arched plate. The upper surface of the packaging box is movably connected to a top cover, and a number of shock-absorbing devices are installed on the bottom surface of the packaging box. The protection box is installed on the upper surface of the shock-absorbing device. The inside of the protection box is filled with epoxy resin, and a number of placement grooves are provided on the upper surface of the epoxy resin. Chip capacitors are installed in the placement grooves. The two opposite surfaces inside the packaging box are provided with mounting grooves, and the two mounting grooves are installed with arched plates. One surface of the arched plate cooperates with one surface of the protection box. The device uses an arched plate and epoxy resin structure to buffer the vibration and impact generated by the outside world on the packaging box, thereby preventing the chip capacitors from being damaged. However, the chip capacitors are placed in the placement slots. Although this can buffer the vibration and impact generated by the packaging box, it cannot directly protect the chip capacitors. If the placement slots and chip capacitors do not match, it is easy for the chip capacitors to collide with the slot walls of the placement slots, and when the chip capacitors are in use, the chip capacitors cannot be protected.

[0003] To this end, the utility model provides a chip capacitor protection structure. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a chip capacitor protection structure to solve the problems raised in the above background technology. The present invention can fix the chip capacitor through the protrusions on the upper shell and the lower shell, and can squeeze and fix the protection box through the shock-absorbing structure, thereby better protecting the chip capacitor. It can also protect the chip capacitor in use and expand the scope of application of the device.

[0005] In order to achieve the above-mentioned purpose, the present invention is implemented through the following technical solutions: a chip capacitor protection structure, including a packaging box, a plurality of placement plates are installed in the packaging box, a box cover is installed on the upper side of the packaging box, a shock-absorbing structure is installed between the packaging box and the placement plates and between the box cover and the placement plates, a plurality of placement slots are opened in the placement plates, a protection box is installed in the placement slots, the protection box includes an upper shell and a lower shell, a chip capacitor is installed in the lower shell, a bump is fixed on the upper shell, and the bump corresponds to the lower shell and the chip capacitor.

[0006] Furthermore, the packaging box and the box cover are fixedly connected by adhesive, and the shock-absorbing structure includes a plurality of first springs and a plurality of damping blocks, and the first springs and the damping blocks are both fixedly connected to the packaging box.

[0007] Furthermore, the shock-absorbing structure also includes a plurality of second springs. A pressure plate is installed on the lower side of the box cover. The second springs are fixedly connected to the pressure plate. The pressure plate, the first spring and the damping block are all in contact with the placement plate.

[0008] Furthermore, a plurality of pressing blocks are fixed on the lower side of the pressing plate and the lower side of the placement plate located on the upper side, and the pressing blocks correspond to the placement grooves.

[0009] Furthermore, the bottom of the placement plate is made of rubber material, and the bottom of the placement plate contacts the inner side of the box wall of the packaging box.

[0010] Furthermore, the upper shell and the lower shell are fixedly connected by adhesive, and a plurality of heat dissipation holes are opened in the lower shell.

[0011] Furthermore, the bump is made of rubber material, the bump is located in the lower shell and is in contact with the chip capacitor.

[0012] Beneficial effects of the present invention: The present invention provides a chip capacitor protection structure, comprising a placement slot; a protection box; a lower shell; a chip capacitor; an upper shell; and a bump.

[0013] A protective box is installed in the placement groove, and a chip capacitor is placed in the lower shell. The chip capacitor can be fixed by the protrusions on the upper shell and the lower shell, and the protective box can be squeezed and fixed by the shock-absorbing structure, thereby better protecting the chip capacitor. The chip capacitor in use can also be protected by the lower shell, expanding the scope of application of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall assembly of a chip capacitor protection structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the assembly cross-sectional structure of the entire chip capacitor protection structure of the present utility model;

[0016] Figure 3 for Figure 2 Schematic diagram at A in the middle;

[0017] Figure 4 This is a schematic diagram of a protection box in a chip capacitor protection structure of the present invention;

[0018] Figure 5 This is an exploded view of the overall structure of a chip capacitor protection structure of the present invention;

[0019] In the figure: 1. Packaging box; 2. First spring; 3. Box cover; 4. Placement plate; 5. Placement groove; 6. Pressing plate; 7. Second spring; 8. Damping block; 9. Pressing block; 10. Upper shell; 11. Lower shell; 12. Heat dissipation hole; 13. Bump; 14. Protective box. DETAILED DESCRIPTION

[0020] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0021] See also Figures 1 to 5 The utility model provides a technical solution: a chip capacitor protection structure, including a packaging box 1, wherein a plurality of placement plates 4 are installed in the packaging box 1, a box cover 3 is installed on the upper side of the packaging box 1, and a shock-absorbing structure is installed between the packaging box 1 and the placement plate 4 and between the box cover 3 and the placement plate 4. A plurality of placement grooves 5 are opened in the placement plate 4, and a protection box 14 is installed in the placement groove 5. The protection box 14 includes an upper shell 10 and a lower shell 11, and the lower shell 11 is equipped with a chip capacitor. A bump 13 is fixed on the upper shell 10, and the bump 13 corresponds to the lower shell 11 and the chip capacitor.

[0022] In this embodiment, the packaging box 1 and the box cover 3 are fixedly connected by glue, and the shock-absorbing structure includes multiple first springs 2 and multiple damping blocks 8. The first springs 2 and the damping blocks 8 are all fixedly connected to the packaging box 1. The shock-absorbing structure also includes multiple second springs 7. A pressure plate 6 is installed on the lower side of the box cover 3. The second spring 7 is fixedly connected to the pressure plate 6. The pressure plate 6, the first spring 2 and the damping block 8 are all in contact with the placement plate 4. A plurality of pressure blocks 9 are fixed on the lower side of the pressure plate 6 and the lower side of the placement plate 4 located on the upper side. The pressure blocks 9 correspond to the placement grooves 5. The bottom of the placement plate 4 is made of rubber material, and the bottom of the placement plate 4 is in contact with the inner side of the box wall of the packaging box 1.

[0023] Specifically, the chip capacitor is placed in the protective box 14, and then the protective box 14 is placed in the placement groove 5, and multiple placement plates 4 are stacked and placed in the packaging box 1, so that the pressure block 9 enters the placement groove 5, and the pressure block 9 squeezes and fixes the protective box 14, thereby fixing the protective box 14, and the first spring 2, damping block 8 and second spring 7 can buffer the vibration of the packaging box 1 to ensure the stability of the placement plate 4.

[0024] The upper shell 10 and the lower shell 11 are fixedly connected by adhesive. A plurality of heat dissipation holes 12 are opened in the lower shell 11. The bump 13 is made of rubber material. The bump 13 is located in the lower shell 11 and contacts the chip capacitor.

[0025] Specifically, the chip capacitor is placed in the lower shell 11, and then the upper shell 10 is covered so that the protrusion 13 is inserted into the lower shell 11, and the chip capacitor can be squeezed and fixed. When the chip capacitor is used, the chip capacitor can be taken out of the lower shell 11 and soldered on the PCB board, and then the lower shell 11 is covered on the upper shell 11 to protect the chip capacitor in use. The heat dissipation hole 12 can achieve a better heat dissipation effect.

[0026] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A chip capacitor protection structure, comprising a packaging box (1), characterized in that: The packaging box (1) is provided with a plurality of placement plates (4), a box cover (3) is provided on the upper side of the packaging box (1), a shock-absorbing structure is provided between the packaging box (1) and the placement plates (4) and between the box cover (3) and the placement plates (4), a plurality of placement slots (5) are provided in the placement plates (4), a protection box (14) is provided in the placement slots (5), the protection box (14) comprises an upper shell (10) and a lower shell (11), a chip capacitor is provided in the lower shell (11), a convex block (13) is fixed on the upper shell (10), and the convex block (13) corresponds to the lower shell (11) and the chip capacitor.

2. The chip capacitor protection structure according to claim 1, wherein: The packaging box (1) and the box cover (3) are fixedly connected by glue, and the shock-absorbing structure includes a plurality of first springs (2) and a plurality of damping blocks (8), and the first springs (2) and the damping blocks (8) are both fixedly connected to the packaging box (1).

3. The chip capacitor protection structure according to claim 2, wherein: The shock-absorbing structure further comprises a plurality of second springs (7). A pressure plate (6) is provided on the lower side of the box cover (3). The second springs (7) are fixedly connected to the pressure plate (6). The pressure plate (6), the first springs (2) and the damping block (8) are all in contact with the placement plate (4).

4. The chip capacitor protection structure according to claim 3, wherein: A plurality of pressing blocks (9) are fixed on the lower side of the pressing plate (6) and the lower side of the placement plate (4) located on the upper side, and the pressing blocks (9) correspond to the placement grooves (5).

5. The chip capacitor protection structure according to claim 1, wherein: The bottom of the placement plate (4) is made of rubber material, and the bottom of the placement plate (4) is in contact with the inner side of the box wall of the packaging box (1).

6. The chip capacitor protection structure according to claim 1, wherein: The upper shell (10) and the lower shell (11) are fixedly connected by adhesive, and a plurality of heat dissipation holes (12) are provided in the lower shell (11).

7. The chip capacitor protection structure according to claim 1, wherein: The convex block (13) is made of rubber material, the convex block (13) is located in the lower housing (11), and the convex block (13) is in contact with the chip capacitor.

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