Broadband filter plate type tantalum capacitor

Abstract

A broadband filter plate type tantalum capacitor comprises a lead frame, a tantalum core and a ceramic capacitor, a positive electrode and a negative electrode of the tantalum core are connected with a positive electrode frame and a negative electrode frame of the lead frame respectively, the positive electrode frame and the negative electrode frame are connected through the ceramic capacitor, and the tantalum core and the ceramic capacitor are of a parallel structure. According to the utility model, through the design of the lead frame and the parallel combination mode of the ceramic capacitor and the tantalum capacitor, the volume efficiency maximization of the tantalum capacitor and the volume maximization of the tantalum core are realized, the reliability and the stability of the tantalum capacitor are improved, the use is simple, and the effect is obvious.

Description

Technical Field

[0001] The utility model relates to the field of electronic components, in particular to a broadband filter-type tantalum capacitor. Background Art

[0002] Tantalum capacitors are widely used in a variety of high-precision electronic devices. As electronic devices become increasingly sophisticated, higher technical requirements are placed on the electronic components used in these devices. Tantalum capacitors, when used in electronic devices, have even higher technical requirements for electrical performance, stability, reliability, and size. However, existing tantalum capacitor technology still cannot meet market demand for tantalum capacitor technology.

[0003] For example, patent application publication number CN206976173U discloses a parallel structure in which a tantalum capacitor and a ceramic capacitor are bonded side by side with the aid of a cathode lead frame. This structure utilizes the tantalum capacitor and ceramic capacitor in parallel to increase capacitance and reduce equivalent series resistance. However, this patented technology sacrifices the volume of the tantalum capacitor's tantalum core, and given the inherently small capacitance of the ceramic capacitor, the resulting capacitance is low.

[0004] For example, the patent application document with publication number CN205645547U specifically discloses a ceramic-packaged fully sealed solid electrolyte tantalum capacitor. By adding a nickel strip between the anode tantalum core and the adhesive silver paste, the anode tantalum core is connected to the shell using a soft nickel strip to release the temperature stress generated by the tantalum core, avoid affecting the product's electrical performance parameters, and improve the high-temperature resistance of the capacitor. The chip tantalum electrolytic capacitor is sealed using ceramic parallel seam welding; this solves the problem that existing capacitors cannot meet high-temperature working environments, but the tantalum core of the tantalum capacitor is still small in size and low in capacitance.

[0005] Therefore, the structure of the chip tantalum capacitor in the prior art still has the following problems: while ensuring high temperature resistance and no reduction in capacitance, the overall volume of the tantalum capacitor is large, the space utilization rate is low, and the volume of the tantalum core is reduced. Utility Model Content

[0006] In view of the problems existing in the prior art, the utility model provides a broadband filter chip type tantalum capacitor.

[0007] The utility model is implemented as follows: a broadband filter-type tantalum capacitor includes a lead frame, a tantalum core and a ceramic capacitor, wherein the positive electrode and cathode of the tantalum core are respectively connected to the positive frame and cathode frame of the lead frame, and the positive frame and cathode frame are connected by a ceramic capacitor, and the tantalum core and the ceramic capacitor are in a parallel structure.

[0008] Furthermore, the tantalum core includes a tantalum wire and a polytetrafluoroethylene sheet. One end of the tantalum wire is welded to the positive electrode frame, and the other end passes through the polytetrafluoroethylene sheet and enters the interior of the tantalum core from the outer shell of the tantalum core. The bottom of the right end of the tantalum core contacts the cathode frame.

[0009] Furthermore, the positive electrode frame includes a positive electrode lead-out terminal and a positive electrode bent surface, the cathode frame includes a cathode lead-out terminal and a cathode bent surface, and the two ends of the ceramic capacitor are respectively solidified at the positive electrode bent surface end and the cathode bent surface end by bonding silver paste B.

[0010] Furthermore, a manganese dioxide layer is provided on the outer surface of the tantalum core, and a U-shaped graphite layer opening to the left is provided on the outer surface of the manganese dioxide layer.

[0011] Furthermore, a U-shaped silver paste layer opening to the left is provided on the outer surface of the U-shaped graphite layer opening to the left.

[0012] Furthermore, an epoxy resin packaging layer is provided between the lead frame, the tantalum core and the ceramic capacitor, the tantalum core of the ceramic capacitor is packaged in the epoxy resin packaging layer, and the positive lead terminal and the cathode lead terminal of the lead frame are exposed from the epoxy resin packaging layer.

[0013] Furthermore, a positive electrode positioning hole is provided on the left side of the lead frame, and a cathode positioning hole is provided on the right side of the lead frame.

[0014] Furthermore, a positive electrode positioning pin is provided between the positive electrode positioning hole and the positive electrode curved surface, and a cathode positioning pin is provided between the cathode positioning hole and the cathode curved surface.

[0015] Furthermore, an insulating layer is provided between the bent surface of the positive electrode and the solidified back surface of the ceramic capacitor.

[0016] Furthermore, the insulating layer is insulating glue or insulating paint.

[0017] In summary, the beneficial effects of the present invention are as follows: the volume efficiency of the tantalum capacitor is maximized through the lead frame design; through the structural design between the lead frame, tantalum core and ceramic capacitor, while ensuring that the volume of the tantalum core of the tantalum capacitor remains unchanged, it can be connected in parallel with a ceramic capacitor with small volume, small capacity and low ESR to achieve the purpose of large capacity and low ESR, while realizing the broadband filtering function. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following briefly introduces the drawings required for describing the embodiments.

[0019] Figure 1 This is a schematic diagram of the lead frame structure of the utility model;

[0020] Figure 2This is a schematic diagram of the lead frame bending of the utility model;

[0021] Figure 3 This is a schematic diagram of the bending and bonding of the tantalum capacitor of the utility model;

[0022] Figure 4 This is a schematic diagram of the internal structure of the tantalum capacitor of the utility model;

[0023] Figure 5 This is a schematic diagram of the structure of a ceramic capacitor of the present invention.

[0024] Explanation of the accompanying numbers: 1. Lead frame; 2. Positive electrode positioning hole; 3. Cathode positioning hole; 4. Positive electrode positioning pin; 5. Cathode positioning pin; 6. Cathode bending surface; 7. Positive electrode bending surface; 8. Tantalum core; 9. Tantalum wire; 10. Polytetrafluoroethylene sheet; 11. Bonding silver paste A; 12. Insulation layer; 13. Bonding silver paste B; 14. Ceramic capacitor; 15. Manganese dioxide layer; 16. Graphite layer; 17. Silver paste layer; 18. Packaging layer. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0026] Combine Figures 1 to 4 The following is a specific embodiment of a broadband filter-type tantalum capacitor provided by the present invention, and the specific contents are as follows:

[0027] An embodiment of the present utility model provides a broadband filter chip tantalum capacitor, comprising a lead frame 1, a tantalum core 8 and a ceramic capacitor 14. The positive electrode and cathode of the tantalum core 8 are respectively connected to the positive frame and cathode frame of the lead frame 1, and the positive frame and the cathode frame are connected by a ceramic capacitor 14. The tantalum core 8 and the ceramic capacitor 14 are in a parallel structure. Through the structural design of the lead frame, the tantalum core 8 and the ceramic capacitor 14 are connected in parallel in a space with a predetermined external dimension, thereby ensuring the volume utilization of the tantalum capacitor and ensuring the advantages of the tantalum capacitor such as large capacity and high voltage, so as to achieve the purpose of large capacity and low ESR, while realizing a broadband filtering function.

[0028] In this embodiment, the tantalum core 8 includes a tantalum wire 9 and a polytetrafluoroethylene sheet 10. One end of the tantalum wire 9 is welded to the positive electrode frame, and the other end passes through the polytetrafluoroethylene sheet and enters the interior of the tantalum core 8 from the outer shell of the tantalum core 8. The bottom of the right end of the tantalum core 8 is in contact with the cathode frame. The provision of the polytetrafluoroethylene sheet 10 can improve the high temperature tolerance and electrical insulation of the tantalum core 8.

[0029] In this embodiment, the positive electrode frame includes a positive electrode lead-out terminal and a positive electrode bent surface 7, the cathode frame includes a cathode lead-out terminal and a cathode bent surface 6, and the two ends of the ceramic capacitor 14 are respectively solidified at the end of the positive electrode bent surface 7 and the end of the cathode bent surface 6 by bonding silver paste B13. The volume efficiency of the tantalum capacitor is maximized through the design of the above-mentioned lead frame.

[0030] In this embodiment, a manganese dioxide layer 15 is provided on the outer surface of the tantalum core 8, and a U-shaped graphite layer 16 opening to the left is provided on the outer surface of the manganese dioxide layer 15. By providing the manganese dioxide layer 15, the performance of the tantalum capacitor can be significantly improved, including capacity, loss angle, and ESR, etc., and the circuit stability can be enhanced, and circuit isolation and filtering functions can be achieved. By providing the graphite layer 16, it can be used as a lead-out connection, so that the tantalum capacitor can better adapt to the needs of electronic device assembly automation, and also help to improve the conductive performance of the capacitor, reduce resistance, and improve the efficiency and stability of the capacitor. In addition, the graphite layer 16 can also provide a certain mechanical strength, enhance the structural stability of the capacitor, and prevent damage caused by external pressure or vibration.

[0031] In this embodiment, a U-shaped silver paste layer 17 opening to the left is provided on the outer surface of the U-shaped graphite layer 16 opening to the left. The provision of the silver paste layer 17 can improve the reliability and stability of the capacitor in a high temperature environment.

[0032] In this embodiment, an epoxy resin encapsulation layer 18 is provided between the lead frame 1, the tantalum core 8 and the ceramic capacitor 14. The tantalum core 8 of the ceramic capacitor 14 is encapsulated in the epoxy resin encapsulation layer 18. The positive lead terminal and the cathode lead terminal of the lead frame 1 are exposed from the epoxy resin encapsulation layer 18, thereby maintaining stable insulation and high temperature resistance.

[0033] In this embodiment, a positive electrode positioning hole 2 is provided on the left side of the lead frame 1, and a cathode positioning hole 3 is provided on the right side of the lead frame 1 to fix the lead-out positions of the positive electrode and the cathode, which is convenient for installation and connection with other components in the circuit.

[0034] In this embodiment, a positive electrode positioning pin 4 is provided between the positive electrode positioning hole 2 and the positive electrode bending surface 7, and a cathode positioning pin 5 is provided between the cathode positioning hole 3 and the cathode bending surface 6, so as to enhance the stability of the positive electrode and the cathode, prevent them from being offset during use, and improve the reliability of the tantalum capacitor.

[0035] In this embodiment, an insulating layer 12 is provided on the back of the positive electrode curved surface 7 and the solidified ceramic capacitor 14 to improve the electrical performance and reliability of the tantalum capacitor.

[0036] In this embodiment, the insulating layer 12 is insulating glue or insulating paint, which has the characteristics of withstanding harsh environments such as high temperature and high humidity and having high insulation performance and good toughness, thereby improving the electrical performance and reliability of the tantalum capacitor.

[0037] In the embodiment of the present invention, the lead frame 1 is processed by punching and etching; the lead frame 1 has a plating structure of two or more layers, and the material of the lead frame 1 is nickel, copper, or an alloy metal containing nickel, copper, and iron.

[0038] In the embodiment of the present invention, the packaging method is molded plastic packaging, ceramic packaging, or metal shell packaging.

[0039] In the embodiment of the present invention, the ceramic capacitor 14 is a chip-type mounted capacitor with the characteristics of small size, good insulation, high voltage resistance, small capacitance and low equivalent series resistance, with a packaging layer in the middle and lead terminals on both sides.

[0040] The embodiment of the present invention maximizes the volume efficiency of the tantalum capacitor through the design of the lead frame 1. Through the structural design of the lead frame 1 and the parallel combination of the ceramic capacitor 14 and the tantalum capacitor, the internal volume utilization of the tantalum capacitor is maximized, and the volume of the tantalum core is maximized. The capacitance or rated voltage of the tantalum capacitor can be increased, and the reliability and stability of the tantalum capacitor can be improved. After the tantalum capacitor and the ceramic capacitor 14 are molded and packaged, a broadband filter chip tantalum capacitor is realized.

[0041] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. All equivalent structural transformations made based on the concept of the present invention and the contents of the present invention description and drawings, or direct / indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A broadband filter-type tantalum capacitor, characterized by: The invention comprises a lead frame (1), a tantalum core (8) and a ceramic capacitor (14); the positive electrode and the cathode of the tantalum core (8) are respectively connected to the positive electrode frame and the cathode frame of the lead frame (1); the positive electrode frame and the cathode frame are connected by a ceramic capacitor (14); and the tantalum core (8) and the ceramic capacitor (14) are in a parallel structure.

2. The broadband filter-type tantalum capacitor according to claim 1, wherein: The tantalum core (8) comprises a tantalum wire (9) and a polytetrafluoroethylene sheet (10), one end of the tantalum wire (9) is welded to the positive electrode frame, and the other end passes through the polytetrafluoroethylene sheet and enters the interior of the tantalum core (8) from the outer shell of the tantalum core (8), and the bottom of the right end of the tantalum core (8) contacts the cathode frame.

3. The broadband filter-type tantalum capacitor according to claim 2, wherein: The positive electrode frame includes a positive electrode lead-out terminal and a positive electrode bent surface (7), the cathode frame includes a cathode lead-out terminal and a cathode bent surface (6), and the two ends of the ceramic capacitor (14) are respectively solidified at the ends of the positive electrode bent surface (7) and the cathode bent surface (6) by bonding silver paste B (13).

4. The broadband filter-type tantalum capacitor according to claim 3, wherein: A manganese dioxide layer (15) is provided on the outer surface of the tantalum core (8), and a U-shaped graphite layer (16) opening to the left is provided on the outer surface of the manganese dioxide layer (15).

5. The broadband filter chip tantalum capacitor according to claim 4, wherein: A U-shaped silver paste layer (17) opening to the left is provided on the outer surface of the U-shaped graphite layer (16) opening to the left.

6. The broadband filter chip tantalum capacitor according to claim 1, wherein: An epoxy resin encapsulation layer (18) is provided between the lead frame (1), the tantalum core (8) and the ceramic capacitor (14); the tantalum core (8) of the ceramic capacitor (14) is encapsulated in the epoxy resin encapsulation layer (18); and the positive lead terminal and the cathode lead terminal of the lead frame (1) are exposed from the epoxy resin encapsulation layer (18).

7. The broadband filter chip tantalum capacitor according to claim 1, wherein: A positive electrode positioning hole (2) is provided on the left side of the lead frame (1), and a cathode positioning hole (3) is provided on the right side of the lead frame (1).

8. The broadband filter-type tantalum capacitor according to claim 7, wherein: A positive electrode positioning pin (4) is provided between the positive electrode positioning hole (2) and the positive electrode curved surface (7), and a cathode positioning pin (5) is provided between the cathode positioning hole (3) and the cathode curved surface (6).

9. The broadband filter chip tantalum capacitor according to claim 3, wherein: An insulating layer (12) is provided on the positive electrode bent surface (7) and the solidified back surface of the ceramic capacitor (14).

10. The broadband filter chip tantalum capacitor according to claim 9, wherein: The insulating layer (12) is insulating glue or insulating paint.

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