Silicon wafer clamping device

Abstract

The utility model discloses a silicon wafer clamping device, which belongs to the technical field of photovoltaic cell manufacturing equipment, and comprises two clamping arms and a torsion spring, the two clamping arms are hinged through a rotating shaft, and a groove is arranged on a chuck at one end of each clamping arm, so that two sides of a silicon wafer are clamped through the grooves, and further the silicon wafer is clamped; meanwhile, the torsion spring is arranged, and the torsion arms at the two ends of the torsion spring act on the two clamping arms respectively, so that the two chucks are always in a state tending to be closed, after the silicon wafer is clamped, an operator does not need to apply force again, inward clamping force is provided for the chucks only through the torsion of the torsion spring, operation is convenient, and the labor intensity of the operator is reduced. The silicon wafer clamping device provided by the utility model is simple in structure and convenient to operate, can effectively ensure the completeness of a film layer on the surface of the silicon wafer when the silicon wafer is clamped, can greatly reduce the labor intensity of operators, and has better application prospect and popularization value.

Description

Technical Field

[0001] The utility model belongs to the technical field of photovoltaic cell manufacturing equipment, and particularly relates to a silicon wafer clamping device. Background Art

[0002] Wafer clamps are essential tools for transferring wafers from a basket to another location during battery wafer experiments and production. They are also used when manual operation is required to divide a basket of wafers into 2-3 equal parts to ensure the reliability of experimental results. In order to avoid fingerprints or other human damage during wafer removal, wafer clamps are used instead of manual wafer removal.

[0003] However, the structure of the existing silicon wafer clamps is mainly composed of two clips. The two-clip structure exerts force on the front and back sides of the battery cell. It cannot effectively avoid damage to the front and back film layers during actual battery production or experimental processes. In addition, its actual working force arm is very short, and the tweezers need to continuously apply the same force to the two clips to clamp objects, which is not conducive to long-term repetitive work. Utility Model Content

[0004] In response to one or more of the above-mentioned defects or improvement needs in the prior art, the present invention provides a silicon wafer clamping device that can reduce the force applied when clamping the silicon wafer, facilitate operation, and reduce damage to the silicon wafer.

[0005] To achieve the above objectives, one aspect of the present invention provides a silicon wafer clamping device, comprising:

[0006] Two clamping arms hingedly connected by a rotating shaft; each clamping arm is provided with a gripping portion at one end and a chuck at the other end, the chuck being provided with a groove, the two groove openings being arranged opposite to each other, the groove being used to apply an inward force to the gripping portions of the two clamping arms so that the two chucks can clamp the silicon wafer from both sides when the two chucks are opened;

[0007] A torsion spring, the spring of which is sleeved on the rotating shaft, and the torsion arms at both ends of the torsion spring are respectively connected to the two clamping arms near their respective clamping heads. The torsion spring generates a torsion force on the clamping arms after the clamping arms clamp the silicon wafer, so that no manual force is required for clamping.

[0008] As a further improvement of the present invention, the two clamping arms are provided with limit slots near the clamping head, and the torsion arms at both ends of the torsion spring are respectively connected to the two limit slots.

[0009] As a further improvement of the present invention, each of the limit slots includes multiple limit slots located at different positions, and the limit slots at different positions are used to adjust the different clamping positions of the end of the torsion spring and adjust the initial torsion of the torsion spring.

[0010] As a further improvement of the present invention, the groove is a trapezoidal groove, and its outer opening size is larger than the inner opening size.

[0011] As a further improvement of the present invention, a limit baffle is further provided on the inner side of the clamping arm, and the limit baffle is spaced apart and arranged on a side of the clamping head close to the gripping portion.

[0012] As a further improvement of the present invention, the material of the limit baffle is polypropylene.

[0013] As a further improvement of the present invention, the material of the chuck is polyether or polyvinyl alcohol.

[0014] As a further improvement of the present invention, the clamping arm is made of polypropylene.

[0015] As a further improvement of the present invention, the gripping portion of the clamping arm is provided with a handle, the handle is cylindrical, and an inwardly concave arc-shaped groove is provided on the handle.

[0016] Another aspect of the present invention provides a silicon wafer clamping device, comprising:

[0017] Two clamping arms hingedly connected by a rotating shaft, the two clamping arms being cross-arranged, with the rotating shaft located at the intersection of the two arms; one end of each clamping arm being provided with a gripping portion, and the other end being hingedly connected to a clip; each clip being provided with a chuck at the end away from the rotating shaft, the chuck being provided with a groove, the two groove openings being arranged opposite to each other, the grooves being used to clamp the silicon wafer from both sides when an inward force is applied to the two clamping arms;

[0018] There are two elastic parts, each corresponding to a clamping arm. One end of the elastic part is connected to the outer side of the clamping arm close to the clip, and the other end is connected to the end of the clip away from the clamping head. After the clip clamps the silicon wafer, the elastic part generates an inward elastic force on the end of the clip close to the groove, so that there is no need to apply manual force to clamp.

[0019] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0020] In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:

[0021] The silicon wafer clamping device of the present invention includes two clamping arms hinged by a rotating shaft, and a groove is provided on the clamping head at one end of the clamping arm to clamp both sides of the silicon wafer through the groove, thereby achieving clamping of the silicon wafer; at the same time, by providing a torsion spring and causing the torsion arms at both ends of the torsion spring to act on the two clamping arms respectively, the two clamping heads are always in a state tending to be closed, so that after clamping the silicon wafer, the operator does not need to apply force again, and only the torsion spring provides the clamping head with an inward clamping force, which facilitates operation and reduces the labor intensity of the operator. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer clamping device in an embodiment of the present utility model;

[0024] Figure 2 This is a schematic diagram of the chuck structure in an embodiment of the utility model;

[0025] Figure 3 This is a schematic diagram of a state in which a chuck clamps a silicon wafer in an embodiment of the present utility model;

[0026] Figure 4 yes Figure 1 Enlarged view of part A.

[0027] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. handle; 2. limit slot; 3. clamping arm; 4. chuck; 401. limit baffle; 402. groove; 5. torsion spring; 6. silicon wafer. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of this utility model, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0031] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0033] See also Figures 1 to 4The silicon wafer clamping device in the preferred embodiment of the present invention includes two clamping arms 3 and a torsion spring 5 hinged by a rotating shaft. A gripping portion is provided at one end of each clamping arm 3, and a chuck 4 is provided at the other end. A groove 402 is provided on the chuck 4. The groove 402 extends horizontally, and the openings of the grooves 402 on the two clamping arms 3 are arranged opposite to each other. The groove 402 is used to (artificially) apply an inward force to the gripping portions of the two clamping arms 3 so that the two chucks 4 clamp the silicon wafer 6 from both sides of the silicon wafer when they are opened.

[0034] The spring sleeve of the torsion spring 5 is arranged on the rotating shaft, and the torsion arms at both ends of the torsion spring 5 are respectively connected to the two clamping arms 3 near their respective clamping heads 4. After the clamping arms 3 clamp the silicon wafer 6, the torsion spring 5 generates a torsion force on the clamping arms 3, so that there is no need for manual force to clamp.

[0035] During operation, the torsion spring 5 acts simultaneously on the two clamping arms 3, causing the two clamps 4 to approach each other. After the clamps 4 are opened by applying an inward force to the gripping portion, the torsion spring 5 brings the two clamps 4 closer together to clamp the silicon wafer 6. It is understandable that when it is necessary to clamp the silicon wafer 6, the operator applies inward force from the gripping end to overcome the torsion of the torsion spring 5 to open the clamping end of the clamping arm 3 and clamp the silicon wafer 6. After clamping, no further force is applied. The torsion of the torsion spring 5 causes the two clamps 4 to close, applying an inward force to the silicon wafer 6. The two sides of the silicon wafer 6 will naturally slide to the innermost side of the groove 402, thereby clamping the silicon wafer 6, significantly reducing the operator's workload.

[0036] It should be noted that this embodiment only requires one torsion spring 5 to reduce working fatigue and has a simple structure.

[0037] The silicon wafer clamping device of the present invention includes two clamping arms 3 hinged by a rotating shaft, and a groove 402 is provided on the clamping head 4 at one end of the clamping arm 3, so that the two sides of the silicon wafer 6 are clamped through the groove 402, thereby achieving the clamping of the silicon wafer 6; at the same time, by providing a torsion spring 5 and acting on the two clamping arms 3 at the same time, the two clamping heads 4 are always in a closed state, so that after clamping the silicon wafer 6, the operator does not need to apply force again, and only the torsion spring 5 provides the clamping head 4 with an inward clamping force, which is convenient for operation and reduces the labor intensity of the operator.

[0038] In the silicon wafer clamping device of the present invention, after the silicon wafer 6 is clamped, the groove 402 only contacts the two sides of the silicon wafer 6 but not the upper and lower sides of the silicon wafer 6, having a smaller contact area, which can better protect the silicon wafer 6 from damage and ensure the integrity of the film layers on the upper and lower surfaces of the silicon wafer 6.

[0039] Preferably, the two clamping arms 3 are provided with limit slots 2 near the clamping head 4, and the torsion arms at both ends of the torsion spring 5 are respectively connected to the two limit slots 2. This arrangement facilitates the torsion spring 5 to be more conveniently installed in the silicon wafer clamping device.

[0040] Preferably, if Figure 4 As shown in , each limiting slot 2 includes a plurality of limiting slots located at different positions. The limiting slots at different positions are used to adjust the initial torsion of the torsion spring 5 by adjusting the different clamping positions of the end of the torsion spring 5, thereby adjusting the clamping force, and then adjusting the clamping device to apply different forces and the clamping range, so as to adapt to silicon wafers 6 of different thicknesses and widths and improve the applicability of the device.

[0041] Preferably, if Figure 1 As shown in FIG, a handle 1 is provided on the gripping portion of each clamping arm 3 to facilitate the operator's force application and gripping. Preferably, the handle 1 is provided in a cylindrical shape to increase the force-bearing area, facilitate force application, and save effort. Further preferably, an inwardly concave arc groove is provided on the wall surface of the cylindrical handle 1 to further increase the force-bearing area.

[0042] Preferably, if Figures 2-3 As shown in FIG, the groove 402 is a trapezoidal groove with an outer opening larger than the inner opening, allowing for arbitrary gripping within a certain range when gripping the silicon wafer 6. The outer portion of the groove 402 refers to the opening that first contacts the silicon wafer 6, or the portion closer to the other chuck 4. Furthermore, when gripping the silicon wafer 6, the inner wall of the trapezoidal groove allows the silicon wafer 6 to slide in and be guided.

[0043] Preferably, the material of the chuck 4 is polyether or polyvinyl alcohol, which has a certain buffering effect and can provide good protection for the silicon wafer 6 .

[0044] Preferably, a limit baffle 401 is also provided on the inner side of the clamping arm 3, which is spaced apart from the groove 402 and is provided on the side of the chuck 4 close to the gripping portion, so as to control the clamping depth of the clamping device through the limit baffle 401. When in use, the operator does not need to consider how deep the silicon wafer 6 is clamped. The corresponding side of the silicon wafer 6 is blocked by the limit baffle 401 to ensure the accuracy of clamping, improve operational efficiency, and reduce operational difficulty.

[0045] Preferably, the materials of the clamping arm 3 and the limit baffle 401 are both polypropylene, so that the clamping arm 3 and the limit baffle 401 have a certain elastic deformation ability, so that when the clamping arm 3 and the limit baffle 401 hit the flower basket or table during the movement of clamping the silicon wafer 6, the clamping arm 3 and the limit baffle 401 can absorb a certain impact force and better protect the silicon wafer 6.

[0046] As another aspect of the present invention, a silicon wafer clamping device is also provided, comprising two clamping arms hingedly connected by a rotating shaft and two elastic members. The two clamping arms are arranged crosswise, with the rotating shaft located at the intersection of the two arms. One end of the clamping arm is provided with a gripping portion, and the other end is hingedly connected to a clip. Each clip is provided with a chuck at the end away from the rotating shaft, and a groove is provided on the chuck. The groove extends horizontally, and the groove openings on the two clips are arranged opposite each other. The groove is used to clamp the silicon wafer from both sides when (manually) an inward force is applied to the two clamping arms. The two elastic members each correspond to a clamping arm, one end of the elastic member is connected to the outer side of the clamping arm near the end of the clip, and the other end is connected to the end of the clip away from the chuck. After the clip clamps the silicon wafer, the elastic member generates an inward elastic force on the end of the clip near the groove, eliminating the need for manual force to clamp.

[0047] Preferably, the elastic member is a compression spring. Compared with the above embodiment, this embodiment replaces one torsion spring with two compression springs. This method can also achieve that after clamping the silicon wafer, the operator does not need to apply force again, reducing the operator's labor intensity.

[0048] The silicon wafer clamping device in the utility model has a simple structure and is easy to operate. It can effectively ensure the integrity of the silicon wafer surface film during clamping and can greatly reduce the labor intensity of the operator. It has good application prospects and promotion value.

[0049] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A silicon wafer clamping device, characterized in that: include: Two clamping arms hingedly connected by a rotating shaft; each clamping arm is provided with a gripping portion at one end and a chuck at the other end, the chuck being provided with a groove, the two groove openings being arranged opposite to each other, the groove being used to apply an inward force to the gripping portions of the two clamping arms so that the two chucks can clamp the silicon wafer from both sides when the two chucks are opened; A torsion spring, the spring of which is sleeved on the rotating shaft, and the torsion arms at both ends of the torsion spring are respectively connected to the two clamping arms near their respective clamping heads. The torsion spring generates a torsion force on the clamping arms after the clamping arms clamp the silicon wafer, so that no manual force is required for clamping.

2. The silicon wafer clamping device according to claim 1, characterized in that: The two clamping arms are provided with limit slots near the clamping head, and the torsion arms at both ends of the torsion spring are respectively connected to the two limit slots.

3. The silicon wafer clamping device according to claim 2, characterized in that: Each of the limiting slots includes a plurality of limiting notches located at different positions. The limiting notches at different positions are used to adjust the different clamping positions of the end of the torsion spring and adjust the initial torsion of the torsion spring.

4. The silicon wafer clamping device according to claim 1, wherein: The groove is a trapezoidal groove, and the outer opening size thereof is larger than the inner opening size.

5. The silicon wafer clamping device according to claim 1, wherein: A limit baffle is further provided on the inner side of the clamping arm, and the limit baffle is spaced apart and arranged on a side of the clamping head close to the gripping portion.

6. The silicon wafer clamping device according to claim 5, characterized in that: The material of the limit baffle is polypropylene.

7. The silicon wafer clamping device according to claim 1, wherein: The material of the chuck is polyether or polyvinyl alcohol.

8. The silicon wafer clamping device according to claim 1, wherein: The material of the clamping arm is polypropylene.

9. The silicon wafer clamping device according to claim 1, wherein: The gripping portion of the clamping arm is provided with a handle, the handle is cylindrical, and an inwardly concave arc groove is provided on the handle.

10. A silicon wafer clamping device, characterized in that: include: Two clamping arms hingedly connected by a rotating shaft, the two clamping arms being cross-arranged, with the rotating shaft located at the intersection of the two arms; one end of each clamping arm being provided with a gripping portion, and the other end being hingedly connected to a clip; each clip being provided with a chuck at the end away from the rotating shaft, the chuck being provided with a groove, the two groove openings being arranged opposite to each other, the grooves being used to clamp the silicon wafer from both sides when an inward force is applied to the two clamping arms; There are two elastic parts, each corresponding to a clamping arm. One end of the elastic part is connected to the outer side of the clamping arm close to the clip, and the other end is connected to the end of the clip away from the clamping head. After the clip clamps the silicon wafer, the elastic part generates an inward elastic force on the end of the clip close to the groove, so that there is no need to apply manual force to clamp.

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