Parallel rectification structure with high stability

By using isolation plates and heat dissipation holes in the parallel rectifier structure, the problem of heat conduction between modules is solved, the stability and heat dissipation efficiency of the system are improved, and the safety and reliability of the modules are ensured.

CN223391237UActive Publication Date: 2025-09-26天津爱信得电力电子技术有限公司
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Patent Information

Application Number
CN202422569749.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-24
Publication Date
2025-09-26
Estimated Expiration
2034-10-24

AI Technical Summary

Technical Problem

In the existing double-layer design of the parallel rectifier structure, the heat generated by the rectifier module during operation affects the adjacent modules through heat conduction and convection, resulting in a heat superposition effect, which affects the stability and reliability of the system.

Method used

An isolation plate is used to separate the rectifier module into two layers, and the airflow is guided through air vents and baffles. Combined with heat dissipation holes and heat sinks, heat management is optimized, heat conduction and accumulation are reduced, and air circulation is enhanced.

Benefits of technology

It effectively reduces the conduction and accumulation of heat between modules, improves the heat dissipation efficiency of the system and the stability of the rectifier module, prevents thermal runaway, and extends the service life.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223391237U_ABST
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Abstract

The utility model provides a parallel rectification structure with high stability, and belongs to the technical field of parallel rectification. Comprising a cabinet body; the two groups of supporting columns are arranged in the cabinet body, and the two groups of supporting columns are respectively positioned on two parallel inner walls of the cabinet body; and the placing frame is arranged between the two groups of supporting columns. Through the arrangement of the isolation plate, heat conduction between the first placing layer and the second placing layer can be effectively reduced, heat of the lower layer is prevented from affecting the upper layer, and then air entering the first placing layer and the second placing layer is guided into the first placing layer and the second placing layer through the air holes and the baffles. And heat generated by the first placement layer and the second placement layer is discharged through the first heat dissipation holes and the second heat dissipation holes, so that hot air accumulation is avoided, and the heat dissipation efficiency is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of parallel rectification, in particular to a parallel rectification structure with high stability. Background Art

[0002] With the advancement of technology and the increasing level of industrial automation, higher requirements are being placed on power conversion systems, such as higher conversion efficiency, lower energy consumption, longer service life, and better thermal management. Parallel rectifier structures are designed to meet these demands, especially when handling high currents and high powers. A single rectifier may not be able to meet the requirements, but a parallel structure can provide the required power capacity. At the same time, current sharing technology ensures load balancing between modules, reducing the burden on individual modules and improving overall system reliability and efficiency.

[0003] In current parallel rectifier structure applications, especially in space-constrained environments, a double-layer design has become a common solution for optimizing space utilization and increasing the installation density of rectifier modules. This design can maximize the use of vertical space, thereby increasing the number of rectifier modules to meet high power requirements.

[0004] During the rectification process, the rectifier module will release a large amount of heat. If the thermal management measures are not in place, the heat generated by the lower module can easily affect the upper module through heat conduction and convection, and vice versa, forming a thermal superposition effect, causing the temperature of the entire system to rise abnormally. Excessive temperature will directly lead to performance degradation of the rectifier module, which is manifested as a decrease in conversion efficiency and unstable working state. It will also accelerate the aging of components inside the module and shorten its service life. In extreme cases, it may even cause thermal runaway of the module, causing the module to burn out, seriously affecting the safety and reliability of the system. Therefore, the present application provides a highly stable parallel rectifier structure to meet the needs. Utility Model Content

[0005] The technical problem to be solved by the present invention is to provide a parallel rectifier structure with high stability to solve the problem that the existing parallel rectifier structure adopts a double-layer design, during the rectification process, the rectifier module releases a large amount of heat, and the heat generated by the lower module can easily affect the upper module through heat conduction and convection.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] A highly stable parallel rectifier structure comprises: a cabinet; two groups of support columns arranged in the cabinet, and the two groups of support columns are respectively located on two parallel inner walls of the cabinet; a placement frame arranged between the two groups of support columns; an isolation plate arranged in the placement frame to separate the placement frame into a first placement layer and a second placement layer; a plurality of rectifier modules are respectively arranged in the first placement layer and the second placement layer; a plurality of air holes are respectively arranged at the top and bottom of the isolation plate; a baffle is arranged in the isolation plate; a first air inlet is arranged at the On the side wall of the isolation plate; a second air inlet is arranged on the cabinet, and the second air inlet corresponds to the first air inlet; the placement frame is usually made of metal, such as aluminum or steel, and sometimes the inner wall is coated with anti-static material to reduce electromagnetic interference, accommodate the rectifier module and the isolation plate, and provide physical isolation and support for the module; the isolation plate is made of metal such as aluminum or non-conductive materials such as plastic or composite materials, and has a heat insulation effect, depending on the design requirements, to separate the placement frame into two layers, reduce heat conduction, optimize the airflow path, and provide isolation between modules; the baffle is made of metal or plastic, etc.

[0008] It also includes: a plurality of first heat dissipation holes, which are arranged on the top of the placement frame.

[0009] It also includes: a plurality of second heat dissipation holes, which are arranged on the side wall of the placement frame and are flush with the first placement layer.

[0010] It also includes: a heat sink, which is arranged at the bottom of the placement frame; the heat sink is usually made of copper or aluminum, has good thermal conductivity, and increases the heat exchange area.

[0011] It also includes: two slide bars, which are detachably arranged at the top and bottom of the placement frame respectively; a partition plate, which is arranged in the placement frame and is used to isolate each of the rectifier modules; the slide bars are made of metal, such as steel or aluminum.

[0012] It also includes: the top of the partition plate is hook-shaped and is slidably engaged with the slide bar.

[0013] It also includes a fixing rod with threads arranged on the partition plate for fixing the partition plate.

[0014] It also includes: an air outlet window, which is arranged on the top of the cabinet.

[0015] The support column includes: a first connecting column, one end of which is arranged in the cabinet body; a second connecting column, which is arranged at the other end of the first connecting column; a buffer pad, which is arranged between the first connecting column and the second connecting column; grooves, which are respectively arranged on the first connecting column and the second connecting column; the buffer pad is made of rubber or elastic polymer to reduce vibration; the first connecting column and the second connecting column are made of high-strength steel or aluminum alloy.

[0016] It also includes: a bidirectional telescopic rod, which is arranged in the groove, and the two ends of the bidirectional telescopic rod are respectively connected to the inner wall of the groove; a tension spring, which is sleeved on the surface of the bidirectional telescopic rod, and the two ends of the tension spring are respectively connected to the inner wall of the groove.

[0017] Compared with the prior art, the present invention has at least the following beneficial effects:

[0018] In the above scheme, by setting up an isolation plate, the heat conduction between the first placement layer and the second placement layer can be effectively reduced, and the heat of the lower layer is prevented from affecting the upper layer. Then, the incoming air is guided into the first placement layer and the second placement layer respectively through the air vents and the baffle, and the heat generated by the first placement layer and the second placement layer is discharged through the first heat dissipation holes and the second heat dissipation holes respectively, thereby avoiding the accumulation of hot air and improving the heat dissipation efficiency.

[0019] By setting up support columns, the physical stability of the rectifier module during operation is ensured, external vibrations and small displacements caused by internal thermal expansion can be absorbed, the mechanical impact on the rectifier module can be reduced, and internal sensitive components can be protected. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of a parallel rectifier structure with high stability.

[0021] Figure 2 Schematic diagram of the second air inlet structure.

[0022] Figure 3 This is a schematic diagram of the placement frame structure.

[0023] Figure 4 Schematic diagram of the isolation plate structure.

[0024] Figure 5 Schematic diagram of the baffle structure.

[0025] Figure 6 Schematic diagram of the partition plate structure.

[0026] Figure 7 Schematic diagram of the heat sink structure.

[0027] Figure 8 This is a cross-sectional view of the local structure of the support column.

[0028] [reference numerals]

[0029] 1. Cabinet; 2. Air outlet window; 3. Placement frame; 4. Rectifier module; 5. Isolation plate; 6. Support column; 7. Second air inlet; 8. Partition plate; 9. Slide bar; 10. First heat dissipation hole; 11. Second heat dissipation hole; 12. Heat sink; 13. Air vent; 14. Baffle; 15. First air inlet; 16. Fixing rod; 31. First placement layer; 32. Second placement layer; 61. First connecting column; 62. Groove; 63. Two-way telescopic rod; 64. Tension spring; 65. Second connecting column; 66. Buffer pad.

[0030] As shown in the figure, in order to clearly implement the structure of the embodiment of the present invention, specific structures and devices are marked in the figure, but this is only for illustrative purposes and is not intended to limit the present invention to the specific structure, device and environment. According to specific needs, ordinary technicians in this field can adjust or modify these devices and environments, and the adjustments or modifications made are still included in the scope of the appended claims. DETAILED DESCRIPTION

[0031] The following describes in detail a polymer material injection molding device provided by the present invention, with reference to the accompanying drawings and specific embodiments. It is also noted that, for the sake of completeness, the following embodiments are best and preferred embodiments, and those skilled in the art may employ alternative methods for implementing the invention in accordance with known techniques. Furthermore, the accompanying drawings are provided solely for the purpose of describing the embodiments in greater detail and are not intended to limit the present invention.

[0032] like Figure 1 - Figure 8 As shown, an embodiment of the present invention provides a parallel rectifier structure with high stability, including: a cabinet 1; two groups of support columns 6, arranged in the cabinet 1, and the two groups of support columns 6 are respectively located on two parallel inner walls of the cabinet 1; a placement frame 3, arranged between the two groups of support columns 6; an isolation plate 5, arranged in the placement frame 3, dividing the placement frame 3 into a first placement layer 31 and a second placement layer 32; a plurality of rectifier modules 4, respectively arranged in the first placement layer 31 and the second placement layer 32; a plurality of air holes 13, respectively arranged at the top and bottom of the isolation plate 5; a baffle 14, arranged in the isolation plate 5; a first air inlet 15, arranged on the side wall of the isolation plate 5; a second air inlet 7, arranged on the cabinet 1, and the second air inlet 7 corresponds to the first air inlet 15.

[0033] By setting up the baffle 14, it mainly acts on the inside of the isolation plate 5, guides the airflow, ensures the directionality of the air flow, avoids airflow chaos, and transports the air to the first placement layer 31 and the second placement layer 32 through the air vents 13, forming an orderly air flow circulation; by setting up the isolation plate 5, the purpose is to isolate the upper and lower layers of the rectifier modules 4, reduce the direct conduction of heat, avoid the heat generated by the lower module affecting the upper module, and vice versa, and prevent the heat superposition effect.

[0034] The second placement layer 32 further includes: a plurality of first heat dissipation holes 10, which are arranged on the top of the placement frame 3. The first heat dissipation holes 10 are provided to serve as outlets for hot air, and the hot air in the second placement layer 32 is discharged, thereby reducing the temperature inside the second placement layer 32.

[0035] The device further includes a plurality of second heat dissipation holes 11 provided on the sidewalls of the placement frame 3 and flush with the first placement layer 31. The second heat dissipation holes 11 serve as outlets for hot air, allowing the hot air in the first placement layer 31 to be discharged, thereby reducing the temperature inside the first placement layer 31.

[0036] The first placement layer 31 further includes a heat sink 12 disposed at the bottom of the placement frame 3. The heat sink 12 increases the heat exchange area and accelerates the transfer of heat from the first placement layer 31 to the surrounding environment, thereby reducing the temperature of the rectifier module 4 in the first placement layer 31.

[0037] The system further comprises two slide bars 9, detachably mounted on the top and bottom of the placement frame 3; and a partition plate 8, mounted within the placement frame 3, for isolating each rectifier module 4. The slide bars 9, mounted to the placement frame 3 by means of snaps, clamps, or bolts, provide a sliding path for the partition plates 8, allowing the position of the partition plates 8 to be quickly adjusted as needed to accommodate different rectifier module 4 layouts, while also providing a fixed position for the partition plates 8.

[0038] The top of the partition plate 8 is hooked and slidably engaged with the slide bar 9. The partition plate 8 is provided to physically isolate each rectifier module 4, reduce electromagnetic interference, facilitate independent installation and maintenance of the modules, and significantly reduce electromagnetic interference between modules.

[0039] The rectifier module 4 further includes a fixing rod 16, which is threadedly disposed on the partition plate 8 and is used to fix the partition plate 8. The fixing rod 16 is provided to provide a reliable fastening mechanism for fixing the partition plate 8 in the placement frame 3, ensuring that the partition plate 8 can be firmly fixed in the predetermined position and preventing the partition plate 8 from being displaced due to factors such as vibration or thermal expansion during the operation of the rectifier module 4.

[0040] The cabinet 1 further includes an air outlet window 2 provided at the top of the cabinet 1. The air outlet window 2 serves as an outlet for hot air, allowing the air that has absorbed heat from the rectifier module 4 to be discharged from the cabinet 1, thereby forming a complete air circulation path and preventing hot air from accumulating inside the cabinet 1.

[0041] The support column 6 includes: a first connecting column 61, one end of which is set in the cabinet 1; a second connecting column 65, which is set at the other end of the first connecting column 61; a buffer pad 66, which is set between the first connecting column 61 and the second connecting column 65; and a groove 62, which is respectively set on the first connecting column 61 and the second connecting column 65.

[0042] The first connecting column 61 is provided to fix the support column 6 inside the cabinet 1, thereby ensuring stable support and positioning of the placement frame 3, while providing sufficient strength and rigidity to bear the weight of the placement frame 3 and the rectifier module 4 therein.

[0043] It also includes: a two-way telescopic rod 63, which is arranged in the groove 62, and the two ends of the two-way telescopic rod 63 are respectively connected to the inner wall of the groove 62; a tension spring 64, which is sleeved on the surface of the two-way telescopic rod 63, and the two ends of the tension spring 64 are respectively connected to the inner wall of the groove 62.

[0044] By setting up the buffer pad 66, its main function is to provide physical buffering and reduce the structural stress caused by external vibration or internal thermal expansion and contraction; by setting up the bidirectional telescopic rod 63, it is extended and retracted when the first connecting column 61 and the second connecting column 65 are squeezed, and at the same time the tension spring 64 is compressed and deformed, providing elastic restoring force, helping the bidirectional telescopic rod 63 to return to its initial position after being subjected to force.

[0045] The technical solution provided by the present invention is to insert multiple partition plates 8 into the placement frame 3, and then pass the slide bar 9 through the hook on the top of the partition plate 8 and install it on the placement frame 3. After the partition plate 8 is moved to a suitable position, the fixing rod 16 is rotated to fix the partition plate 8, and then the rectifier module 4 is installed in the placement frame 3; when the system is started, the external cold air enters the cabinet 1 through the second air inlet 7 and enters the isolation plate 5 through the first air inlet 15. The air passes through the baffle 14 and the air vent 13 and enters the first placement layer 31 and the second placement layer 32 respectively; the air enters the first placement layer 31, Its rectifier module 4 absorbs heat, and the heat floats upward out of the placement frame 3 through the first heat dissipation hole 10; air enters the second placement layer 32, absorbs heat from its rectifier module 4, and the heat is discharged to the outside of the placement frame 3 through the second heat dissipation hole 11. At the same time, the heat generated by the second placement layer 32 is absorbed and dissipated through the heat sink 12, and finally the heat in the cabinet 1 is discharged to the outside through the air outlet window 2; when the cabinet 1 vibrates, the first connecting column 61 and the second connecting column 65 jointly squeeze the buffer pad 66, and at the same time the bidirectional telescopic rod 63 is bidirectionally telescopic, thereby reducing the external vibration from being transmitted to the placement frame 3.

[0046] This invention encompasses any alternatives, modifications, equivalents, and solutions that do not depart from the spirit and scope of this invention. While specific details are described in detail in the preferred embodiments of this invention to provide a thorough understanding, those skilled in the art will be able to fully understand this invention without these details. Furthermore, to avoid unnecessary confusion regarding the essence of this invention, well-known methods, processes, procedures, components, and circuits have not been described in detail.

[0047] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A parallel rectifier structure with high stability, characterized in that: include: Cabinet (1); Two groups of support columns (6) are arranged in the cabinet (1), and the two groups of support columns (6) are respectively located on two parallel inner walls of the cabinet (1); A placement frame (3) is arranged between the two groups of support columns (6); An isolation plate (5) is arranged in the placement frame (3) to separate the placement frame (3) into a first placement layer (31) and a second placement layer (32); A plurality of rectifier modules (4) are respectively arranged in the first placement layer (31) and the second placement layer (32); A plurality of air holes (13) are respectively arranged on the top and bottom of the isolation plate (5); a baffle (14) disposed inside the isolation plate (5); a first air inlet (15) provided on a side wall of the isolation plate (5); A second air inlet (7) is provided on the cabinet (1), and the second air inlet (7) corresponds to the first air inlet (15).

2. The parallel rectifier structure with high stability according to claim 1, characterized in that: Also includes: A plurality of first heat dissipation holes (10) are arranged on the top of the placement frame (3).

3. The parallel rectifier structure with high stability according to claim 1, characterized in that: Also includes: A plurality of second heat dissipation holes (11) are arranged on the side wall of the placement frame (3) and are flush with the first placement layer (31).

4. The parallel rectifier structure with high stability according to claim 1, characterized in that: Also includes: A heat sink (12) is arranged at the bottom of the placement frame (3).

5. The parallel rectifier structure with high stability according to claim 1, characterized in that: Also includes: Two slide bars (9) are detachably arranged on the top and bottom of the placement frame (3); A partition plate (8) is arranged in the placement frame (3) and is used to isolate each of the rectifier modules (4).

6. The parallel rectifier structure with high stability according to claim 5, characterized in that: Also includes: The top of the partition plate (8) is hook-shaped and is slidably engaged with the slide bar (9).

7. The parallel rectifier structure with high stability according to claim 6, characterized in that: Also includes: A fixing rod (16) is threadedly arranged on the partition plate (8) and is used to fix the partition plate (8).

8. The parallel rectifier structure with high stability according to claim 1, characterized in that: Also includes: An air outlet window (2) is arranged on the top of the cabinet (1).

9. The parallel rectifier structure with high stability according to claim 1, characterized in that: The support column (6) comprises: A first connecting column (61), one end of which is disposed inside the cabinet (1); a second connecting post (65) provided at the other end of the first connecting post (61); a buffer pad (66) disposed between the first connecting post (61) and the second connecting post (65); The grooves (62) are respectively provided on the first connecting column (61) and the second connecting column (65).

10. The parallel rectifier structure with high stability according to claim 9, characterized in that: Also includes: A bidirectional telescopic rod (63) is arranged in the groove (62), and both ends of the bidirectional telescopic rod (63) are respectively connected to the inner wall of the groove (62); A tension spring (64) is sleeved on the surface of the bidirectional telescopic rod (63), and both ends of the tension spring (64) are respectively connected to the inner wall of the groove (62).