High-performance marine inverter power supply

Abstract

The utility model belongs to the technical field of inverters, and discloses a high-performance marine inverter power supply which comprises a sealed shell and an integrated circuit assembly, the sealed shell has magnetic conductivity, and the integrated circuit assembly is arranged in an installation cavity. Therefore, the closed shell can effectively shield radiation-proof electromagnetic interference generated by the high-frequency signal switch in the closed shell to the outside, so that the inverter power supply has better electromagnetic compatibility. The integrated circuit assembly comprises a boost power board, a boost inductance board, an energy storage capacitor board, an extended energy storage capacitor board, an inversion power board, a three-phase output filtering inductance board and an EMC filtering board, the boost power board and the boost inductance board form a boost circuit, the inversion power board, the three-phase output filtering inductance board and the EMC filtering board form an inversion circuit, the extended energy storage capacitor board is electrically connected with the energy storage capacitor board, and the EMC filtering board is electrically connected with the boost circuit. The expansion energy storage capacitor plate is provided with a plurality of electrolytic capacitors which are connected in parallel, so that the electrolytic capacitors can select smaller models, and the electric power impact resistance of the inverter power supply is improved.

Description

Technical Field

[0001] The present application belongs to the technical field of inverters, and specifically relates to a high-performance marine inverter power supply. Background Art

[0002] Ships are one of the important means of transportation. The reliability and stability of the power system plays an important role in the safety and comfort of the ship. Marine inverters, as key equipment for power conversion, play a vital role in the reliability and stability of the power system.

[0003] During the operation of a ship, the start and stop of the motor will cause an instantaneous large current impact on the power system, causing serious damage to the stability of the operation of marine power equipment. In addition, there are a large number of electronic and electrical equipment on the ship, which will generate a large amount of electromagnetic interference while working. At the same time, when the inverter power supply is working, the switching frequency of the switching conversion circuit is as high as tens of kilohertz. The on and off of the switching devices will generate strong electromagnetic interference, causing serious damage to the stability of the operation of marine power equipment.

[0004] Therefore, designing a marine inverter power supply with good anti-electrical shock performance and high electromagnetic compatibility performance has become a technical problem that needs to be solved urgently. Utility Model Content

[0005] The present application provides a high-performance marine inverter power supply to improve the marine inverter power supply's anti-electrical shock performance and electromagnetic compatibility performance.

[0006] The technical solutions adopted in this application are:

[0007] A high-performance marine inverter power supply, comprising:

[0008] A sealed housing having a mounting cavity therein and having magnetic permeability;

[0009] An integrated circuit assembly, wherein the integrated circuit is arranged in the mounting cavity, and the integrated circuit assembly includes a boost power board, a boost inductor board, an energy storage capacitor board, an extended energy storage capacitor board, an inverter power board, a three-phase output filter inductor board and an EMC filter board. The boost power board and the boost inductor board constitute a boost circuit, the inverter power board, the three-phase output filter inductor board and the EMC filter board constitute an inverter circuit, the energy storage capacitor board is arranged between the boost circuit and the inverter circuit, the extended energy storage capacitor board is electrically connected to the energy storage capacitor board, and the extended energy storage capacitor board has a plurality of electrolytic capacitors connected in parallel.

[0010] By adopting the above technical solution, since the sealed housing has magnetic permeability and the integrated circuit is arranged in the installation cavity, the sealed housing can effectively shield the anti-radiation electromagnetic interference (EMI) generated by the high-frequency signal switch in the sealed housing to the outside world, and at the same time, the inverter power supply has better electromagnetic compatibility (EMC); and since the extended energy storage capacitor board has multiple electrolytic capacitors in parallel, the electrolytic capacitors can be selected to be smaller. On the one hand, a three-dimensional design can be realized to comprehensively utilize the space of the installation cavity, reduce the volume of the inverter power supply, and improve the power density. On the other hand, multiple electrolytic capacitors can absorb the impact generated by instantaneous large currents, thereby improving the inverter power supply's resistance to power shocks.

[0011] Optionally, the energy storage capacitor plate is provided with a common-mode filtering inductor to eliminate common-mode interference generated by the front-end device.

[0012] By adopting the above technical solution, since the energy storage capacitor plate is provided with a common-mode filter inductor, the common-mode filter inductor can eliminate the common-mode interference generated by the front-end equipment. At the same time, the common-mode filter inductor can absorb the differential-mode interference generated by the front-end electrical equipment, thereby improving the anti-interference performance of the inverter power supply.

[0013] Optionally, the EMC filter board is arranged at the rear end of the inverter circuit, and the EMC filter board is provided with a three-phase common-mode filter inductor and a filter capacitor.

[0014] By adopting the above technical solution, since the EMC filter board is arranged at the rear end of the inverter circuit, and the EMC filter board is provided with a three-phase common-mode filter inductor and a filter capacitor, the filter capacitor can eliminate the common-mode interference generated by the inverter circuit, and the filter capacitor can eliminate the differential-mode interference generated by the inverter circuit, thereby improving the electromagnetic compatibility performance of the inverter power supply and preventing the electromagnetic interference of the inverter power supply from affecting the back-end equipment.

[0015] Optionally, it also includes a heat dissipation shell arranged at the bottom of the sealed shell, a heat dissipation cavity is formed inside the heat dissipation shell, a cooling fan is provided in the heat dissipation cavity, and the heat dissipation shell is provided with heat dissipation holes, the top wall of the heat dissipation shell constitutes the bottom wall of the sealed shell, and the boost power board, the boost inductor board, the inverter power board, the three-phase output filter inductor board and the EMC filter board are all arranged on the bottom wall of the sealed shell.

[0016] By adopting the above technical solution, since the boost power board, boost inductor board, inverter power board, three-phase output filter inductor board and EMC filter board are all arranged on the bottom wall of the sealed housing, and the top wall of the heat dissipation shell constitutes the bottom wall of the sealed housing, the heat generated by the boost power board, boost inductor board, inverter power board, three-phase output filter inductor board and EMC filter board during operation can be quickly transferred to the heat dissipation cavity, and the heat transferred to the heat dissipation cavity can be quickly discharged from the heat dissipation cavity under the action of the cooling fan, so as to reduce the temperature of the boost power board, boost inductor board, inverter power board, three-phase output filter inductor board and EMC filter board, ensure the normal operation of the inverter power supply, extend the continuous working time of the inverter power supply and improve the service life of the inverter power supply.

[0017] Optionally, a mica sheet is provided between the boost power board and the inverter power board and the bottom wall of the sealed housing, and both end surfaces of the mica sheet are coated with a heat conductive layer;

[0018] And / or, the boost inductor plate has a boost inductor, the boost inductor plate is provided with a first heat-conducting shell sleeved on the boost inductor, the first heat-conducting shell is connected to the bottom wall of the sealed housing, and a heat-conducting medium is provided in the first heat-conducting shell;

[0019] And / or, the three-phase output filter inductor plate has a three-phase output filter inductor, the three-phase output filter inductor plate is provided with a second heat-conducting shell that is sleeved on the three-phase output filter inductor, the second heat-conducting shell is connected to the bottom wall of the sealed housing, and a heat-conducting medium is provided in the second heat-conducting shell;

[0020] And / or, the EMC filter board has an EMC filter inductor, and the EMC filter inductor is located between the EMC filter board and the bottom wall of the sealed housing and contacts the bottom wall of the sealed housing through a heat-conducting structure.

[0021] By adopting the above technical solution, since mica sheets are arranged between the boost power board and the inverter power board and the bottom wall of the sealed housing, and both end faces of the mica sheets are coated with thermal conductive layers, the heat generated by the boost power board and the inverter power board can be quickly transferred to the heat dissipation shell and then to the heat dissipation cavity through the mica sheets and the thermal conductive layers, thereby shortening the heat transfer path, improving the heat dissipation efficiency of the boost power board and the inverter power board, further reducing the operating temperature of the boost power board and the inverter power board, and further reducing the temperature of the inverter power supply during operation.

[0022] Since the boost inductor plate has a boost inductor, the boost inductor plate is provided with a first heat-conducting shell that is sleeved on the boost inductor, the first heat-conducting shell is connected to the bottom wall of the sealed housing, and a heat-conducting medium is provided in the first heat-conducting shell, so that the heat generated by the boost inductor plate and the boost inductor can be quickly transferred to the top wall of the heat dissipation shell and enter the heat dissipation cavity through the first heat-conducting shell and the heat-conducting medium, so as to improve the heat dissipation efficiency of the boost inductor plate and the boost inductor, further reduce the temperature of the boost inductor plate and the boost inductor during operation, and further reduce the temperature of the inverter power supply during operation.

[0023] Since the three-phase output filter inductor plate has a three-phase output filter inductor, the three-phase output filter inductor plate is provided with a second heat-conducting shell that is sleeved on the three-phase output filter inductor, the second heat-conducting shell is connected to the bottom wall of the sealed shell, and a heat-conducting medium is provided in the second heat-conducting shell, so that the heat generated by the three-phase output filter inductor plate and the three-phase output filter inductor can be transferred to the top wall of the heat dissipation shell and enter the heat dissipation cavity through the second heat-conducting shell and the heat-conducting medium, so as to improve the heat dissipation efficiency of the three-phase output filter inductor plate and the three-phase output filter inductor, so as to further reduce the temperature of the three-phase output filter inductor plate and the three-phase output filter inductor during operation, and further reduce the temperature of the inverter power supply during operation.

[0024] Since the EMC filter board has an EMC filter inductor, the EMC filter inductor is located between the EMC filter board and the bottom wall of the sealed shell and contacts the bottom wall of the sealed shell through the heat-conducting structure. As a result, the heat generated by the EMC filter board and the EMC filter inductor can be quickly transferred to the top wall of the heat dissipation shell through the heat-conducting structure and enter the heat dissipation cavity, so as to improve the heat dissipation efficiency of the EMC filter board and the EMC filter inductor, further reduce the working temperature of the EMC filter board and the EMC filter inductor, and further reduce the working temperature of the inverter power supply.

[0025] Optionally, the heat dissipation shell includes a base plate, a mounting plate, a sealing plate and a radiator, the circumferential side of the base plate is bent upward to form a side plate, the mounting plate is provided on one side of the base plate to form a side wall extending continuously along the circumference of the base plate together with the side plate, the radiator includes a connector and a plurality of fin bodies, the sealing plate is provided flush with the top of the connector to form a top wall of the heat dissipation shell together with the connector, a heat dissipation channel is formed between the plurality of fin bodies, the cooling fan is provided at the channel mouth of the heat dissipation channel and is located on the side of the fin body close to the mounting plate, and the heat dissipation hole is provided on the mounting plate.

[0026] By adopting the above technical solution, since the cooling fan is arranged at the channel opening of the heat dissipation channel and is located on the side of the fin body close to the mounting plate, when the cooling fan is working, the external airflow can quickly enter the heat dissipation cavity through the heat dissipation holes provided on the mounting plate and directly enter the heat dissipation channel to take away the heat in the heat dissipation channel, thereby improving the heat dissipation efficiency of the radiator, thereby further reducing the temperature of the inverter power supply during operation.

[0027] At the same time, through the setting of the radiator, the contact area between the heat dissipation cavity and the cold air flow is increased, thereby improving the heat dissipation efficiency of the heat dissipation cavity, and the heat dissipation channel can also guide the cold air flow so that the cold air flow can be quickly discharged from the heat dissipation cavity after heat exchange with the heat dissipation cavity, thereby further improving the heat dissipation efficiency of the heat dissipation cavity, and further reducing the temperature of the inverter power supply during operation.

[0028] Optionally, the heat dissipation holes include a main air inlet hole arranged opposite to the cooling fan and an auxiliary air inlet hole arranged offset from the cooling fan.

[0029] By adopting the above technical solution, since the heat dissipation holes include the main air inlet holes arranged opposite to the cooling fan and the auxiliary air inlet holes arranged staggered with the cooling fan, the air inlet area of ​​the mounting plate is increased to increase the amount of cold air flow into the heat dissipation cavity, and at the same time improve the smoothness of the cold air flow entering the heat dissipation cavity, thereby further improving the heat dissipation efficiency of the radiator and the heat dissipation cavity, and further reducing the temperature of the inverter power supply during operation.

[0030] Optionally, the extended energy storage capacitor plate is located above the boost power plate and the boost inductor plate.

[0031] By adopting the above technical solution, since the extended energy storage capacitor plate is located above the boost power plate and the boost inductor plate, a three-dimensional design can be achieved to comprehensively utilize the space of the installation cavity, thereby further reducing the volume of the inverter power supply and improving the power density of the inverter power supply.

[0032] Optionally, it also includes a main control board with integrated communication and control functions. The sealed shell has a front side and a rear side opposite to the front side. The front side is provided with a communication and control interface, and the rear side is provided with a main power interface. The main control board is arranged close to the front side to be electrically connected to the communication and control interface.

[0033] By adopting the above technical solution, since a communication and control interface is provided on the front side and a main power interface is provided on the rear side, the strong and weak currents of the inverter power supply can be separated, and the circuit paths of the strong and weak currents can be made as small as possible, thereby avoiding electromagnetic interference caused by the power line to the communication line, thereby improving the electromagnetic compatibility of the equipment itself.

[0034] Optionally, the sealed shell includes a sealed bottom plate, a cover plate, a back plate and a panel, the sealed bottom plate is arranged opposite to the cover plate, the back plate is arranged opposite to the panel, and both sides of the back plate are bent and extended toward the direction of the panel to be connected to the panel.

[0035] By adopting the above technical solution, since the sealed housing includes a sealed bottom plate, a cover plate, a back plate and a panel, the sealed housing is formed by assembly, thereby reducing the difficulty of producing the sealed housing. At the same time, it is convenient to install the device in the installation cavity, thereby improving the assembly efficiency of the inverter power supply.

[0036] Due to the adoption of the above technical solution, the beneficial effects achieved by this application are as follows:

[0037] 1. The inverter power supply in this application includes a sealed housing and an integrated circuit component. The sealed housing has an installation cavity inside, and the sealed housing has magnetic permeability. The integrated circuit is arranged in the installation cavity, thereby enabling the sealed housing to effectively shield the high-frequency signal switch in the sealed housing from radiated electromagnetic interference (EMI) generated by the outside world, while making the inverter power supply have better electromagnetic compatibility (EMC); the integrated circuit component includes a boost power board, a boost inductor board, an energy storage capacitor board, an extended energy storage capacitor board, an inverter power board, a three-phase output filter inductor board and an EMC filter board, a boost power board and b The oost inductor board constitutes a boost circuit, the inverter power board, the three-phase output filter inductor board and the EMC filter board constitute an inverter circuit, the energy storage capacitor board is arranged between the boost circuit and the inverter circuit, the extended energy storage capacitor board is electrically connected to the energy storage circuit board, and the extended energy storage capacitor board has multiple electrolytic capacitors in parallel, which enables the electrolytic capacitors to be selected with smaller models. On the one hand, it can realize three-dimensional design and comprehensive utilization of the space of the installation cavity, reduce the volume of the inverter power supply, and improve the power density. On the other hand, multiple electrolytic capacitors can absorb the impact generated by instantaneous large current to improve the inverter power supply's anti-electrical shock performance.

[0038] 2. The energy storage capacitor board in this application is provided with a common-mode filter inductor, which enables the common-mode filter inductor to eliminate the common-mode interference generated by the front-end equipment. At the same time, the common-mode filter inductor can absorb the differential-mode interference generated by the front-end electrical equipment, thereby improving the anti-interference performance of the inverter power supply.

[0039] 3. The EMC filter board in this application is arranged at the rear end of the inverter circuit. The EMC filter board is provided with a three-phase common-mode filter inductor and a filter board capacitor, so that the filter capacitor can eliminate the common-mode interference generated by the inverter circuit, and the filter capacitor can eliminate the differential-mode interference generated by the inverter circuit, thereby improving the electromagnetic compatibility performance of the inverter power supply to prevent the electromagnetic interference of the inverter power supply from affecting the back-end equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0041] Figure 1 This is a schematic structural diagram of an inverter power supply according to one embodiment of the present application;

[0042] Figure 2 This is an exploded diagram of the inverter power supply according to one embodiment of the present application;

[0043] Figure 3 This is a top view of the inverter power supply according to one embodiment of the present application, wherein the cover plate is omitted;

[0044] Figure 4 This is a top view of the inverter power supply according to one embodiment of the present application, in which the cover plate and the extended energy storage capacitor plate are omitted.

[0045] Reference numerals:

[0046] 1. Sealed casing; 11. Cover; 12. Back panel; 13. Panel; 2. Boost power board; 3. Boost inductor board; 4. Energy storage capacitor board; 5. Extended energy storage capacitor board; 6. Inverter power board; 7. Three-phase output filter inductor board; 8. EMC filter board; 9. Heat dissipation housing; 91. Cooling fan; 92. Bottom plate; 921. Side panel; 93. Mounting plate; 931. Heat dissipation holes; 94. Cover plate; 95. Radiator; 10. Main control board. DETAILED DESCRIPTION

[0047] In order to more clearly illustrate the overall concept of the present application, a detailed description is given below in an illustrative manner in conjunction with the accompanying drawings.

[0048] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0049] In addition, in the description of the present application, it should be understood that the terms "top", "bottom", "inside", "outside", "axial", "radial", "circumferential", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present application.

[0050] In this application, unless otherwise expressly specified or limited, terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, a first feature "above" or "below" a second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. In the description of this specification, the reference terms "implementation method", "embodiment", "one embodiment", "example" or "specific example" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in an appropriate manner in any one or more embodiments or examples.

[0052] Reference Figures 1 to 4 Disclosed is a high-performance marine inverter power supply, which includes a sealed housing 1 and an integrated circuit assembly, wherein the sealed housing 1 has an installation cavity inside and has magnetic permeability; the integrated circuit is arranged in the installation cavity, and the integrated circuit assembly includes a boost power board 2, a boost inductor board 3, an energy storage capacitor board 4, an extended energy storage capacitor board 5, an inverter power board 6, a three-phase output filter inductor board 7 and an EMC filter board 8, the boost power board 2 and the boost inductor board 3 constitute a boost circuit, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 constitute an inverter circuit, the energy storage capacitor board 4 is arranged between the boost circuit and the inverter circuit, the extended energy storage capacitor board 5 is electrically connected to the energy storage capacitor board 4, and the extended energy storage capacitor board 5 has multiple electrolytic capacitors connected in parallel.

[0053] Specifically, since the sealed housing 1 has magnetic permeability and the integrated circuit is arranged in the installation cavity, the sealed housing 1 can effectively shield the radiation-proof electromagnetic interference (EMI) generated by the high-frequency signal switch in the sealed housing 1 to the outside world, and at the same time make the inverter power supply have better electromagnetic compatibility (EMC); and since the extended energy storage capacitor plate 5 has multiple electrolytic capacitors in parallel, the electrolytic capacitors can be selected with smaller models. On the one hand, it can realize the three-dimensional design and comprehensive utilization of the space of the installation cavity, reduce the volume of the inverter power supply, and improve the power density. On the other hand, multiple electrolytic capacitors can absorb the impact generated by instantaneous large current to improve the inverter power supply's resistance to power shock.

[0054] In a preferred embodiment, the energy storage capacitor plate 4 is provided with a common-mode filter inductor to eliminate the common-mode interference generated by the front-end equipment, so that the common-mode filter inductor can eliminate the common-mode interference generated by the front-end equipment. At the same time, the common-mode filter inductor can absorb the differential-mode interference generated by the front-end electrical equipment, thereby improving the anti-interference performance of the inverter power supply.

[0055] In a preferred embodiment, the EMC filter board 8 is arranged at the rear end of the inverter circuit. The EMC filter board 8 is provided with a three-phase common-mode filter inductor and a filter capacitor, so that the filter capacitor can eliminate the common-mode interference generated by the inverter circuit, and the filter capacitor can eliminate the differential-mode interference generated by the inverter circuit, thereby improving the electromagnetic compatibility performance of the inverter power supply to prevent the electromagnetic interference of the inverter power supply from affecting the back-end equipment.

[0056] In a preferred embodiment, referring to Figure 1 and Figure 2 The inverter power supply also includes a heat dissipation shell 9 arranged at the bottom of the sealed housing 1. A heat dissipation cavity is formed inside the heat dissipation shell 9. A cooling fan 91 is provided in the heat dissipation cavity, and the heat dissipation shell 9 is provided with heat dissipation holes 931. The top wall of the heat dissipation shell 9 constitutes the bottom wall of the sealed housing 1. The boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 are all arranged on the bottom wall of the sealed housing 1.

[0057] Specifically, since the boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 are all arranged on the bottom wall of the sealed housing 1, and the top wall of the heat dissipation shell 9 constitutes the bottom wall of the sealed housing 1, the heat generated by the boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 during operation can be quickly transferred to the heat dissipation cavity, and the heat transferred to the heat dissipation cavity can be quickly discharged from the heat dissipation cavity under the action of the cooling fan 91, so as to reduce the temperature of the boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8, thereby ensuring the normal operation of the inverter power supply, extending the continuous working time of the inverter power supply and improving the service life of the inverter power supply.

[0058] Since the top wall of the heat dissipation shell 9 constitutes the bottom wall of the sealed housing 1, that is, the boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 are all arranged on the top wall of the heat dissipation shell 9, the difficulty of assembling the boost power board 2, the boost inductor board 3, the inverter power board 6, the three-phase output filter inductor board 7 and the EMC filter board 8 can be reduced, thereby greatly improving the assembly efficiency of the inverter power supply, improving the production efficiency of the inverter power supply and reducing the production cost of the inverter power supply.

[0059] The present application does not make any specific limitation on the contact method between the boost power board 2 and the inverter power board 6 and the bottom wall of the sealed housing 1. Preferably, mica sheets are provided between the boost power board 2 and the inverter power board 6 and the bottom wall of the sealed housing 1, and both end faces of the mica sheet are coated with a thermal conductive layer, so that the heat generated by the boost power board 2 and the inverter power board 6 can be quickly transferred to the heat dissipation shell 9 and then to the heat dissipation cavity through the mica sheet and the thermal conductive layer, so as to shorten the heat transfer path, improve the heat dissipation efficiency of the boost power board 2 and the inverter power board 6, further reduce the operating temperature of the boost power board 2 and the inverter power board 6, and further reduce the temperature of the inverter power supply during operation.

[0060] The present application does not specifically limit the method for forming the thermal conductive layer. Preferably, the thermal conductive layer is formed by thermal conductive silicone grease coated on a mica sheet to improve the heat transfer efficiency between the boost power board 2 and the inverter power board 6 and the bottom wall of the sealed housing 1. In other embodiments, the thermal conductive layer can also be formed by thermal conductive glue coated on a mica sheet.

[0061] Preferably, the mica sheet, the boost power board 2 and the inverter power board 6 are fixedly connected to the bottom wall of the sealed housing 1 through a bridge-type fixing member.

[0062] In other embodiments, the boost power board 2 and the inverter power board 6 may also be directly fixedly connected to the bottom wall of the sealed housing 1 , or contact the bottom wall of the sealed housing 1 through thermal grease.

[0063] The present application does not specifically limit the contact method between the boost inductor plate 3 and the bottom wall of the sealed housing 1. Preferably, the boost inductor plate 3 has a boost inductor, and the boost inductor plate 3 is provided with a first heat-conducting shell that is sleeved on the boost inductor. The first heat-conducting shell is connected to the bottom wall of the sealed housing 1, and a heat-conducting medium is provided in the first heat-conducting shell, so that the heat generated by the boost inductor plate 3 and the boost inductor can be quickly transferred to the top wall of the heat dissipation shell and enter the heat dissipation cavity through the first heat-conducting shell and the heat-conducting medium. That is, the boost inductor plate 3 and the boost inductor transfer heat to the bottom wall of the sealed housing 1 through the first heat-conducting shell and the heat-conducting medium, so as to improve the heat dissipation efficiency of the boost inductor plate 3 and the boost inductor, so as to further reduce the temperature of the boost inductor plate 3 and the boost inductor during operation, and thereby further reduce the temperature of the inverter power supply during operation.

[0064] Preferably, the first heat-conducting shell is made of aluminum material, which can reduce the production cost of the first heat-conducting shell on the one hand, and improve the heat transfer efficiency on the other hand, so as to further reduce the temperature of the inverter power supply during operation.

[0065] In this embodiment, the heat-conducting medium is not specifically limited. Preferably, the heat-conducting medium is a thermally conductive adhesive poured into the first heat-conducting shell to improve heat transfer efficiency, reduce the operating temperature of the inverter power supply, and increase the stability of the boost inductor plate 3. In other embodiments, the heat-conducting medium may also be a superconducting material disposed in the first heat-conducting shell.

[0066] In other embodiments, the boost inductor plate 3 may also be directly fixedly connected to the bottom wall of the sealed housing 1 , or contact the bottom wall of the sealed housing 1 through thermal grease.

[0067] The present application does not make any specific limitation on the contact method of the three-phase output filter inductor plate 7 with the bottom wall of the sealed housing 1. Preferably, the three-phase output filter inductor plate 7 has a three-phase output filter inductor, and the three-phase output filter inductor plate 7 is provided with a second heat-conducting shell which is sleeved on the three-phase output filter inductor, the second heat-conducting shell is connected to the bottom wall of the sealed housing 1, and a heat-conducting medium is provided in the second heat-conducting shell, so that the heat generated by the three-phase output filter inductor plate 7 and the three-phase output filter inductor can be transferred to the top wall of the heat dissipation shell 9 through the second heat-conducting shell and the heat-conducting medium width and enter the heat dissipation cavity. That is to say, the heat generated by the three-phase output filter inductor plate 7 and the three-phase output filter inductor is transferred to the bottom wall of the sealed housing 1 through the second heat dissipation shell and the heat-conducting medium, so as to improve the heat dissipation efficiency of the three-phase output filter inductor plate 7 and the three-phase output filter inductor, so as to further reduce the temperature of the three-phase output filter inductor plate 7 and the three-phase output filter inductor during operation, and further reduce the temperature of the inverter power supply during operation.

[0068] Preferably, the second heat-conducting shell is made of aluminum material, which can reduce the production cost of the second heat-conducting shell on the one hand, and improve the heat transfer efficiency on the other hand, so as to further reduce the temperature of the inverter power supply during operation.

[0069] In this embodiment, the heat-conducting medium is not specifically limited. Preferably, the heat-conducting medium is a thermally conductive adhesive poured into the second heat-conducting shell to improve heat transfer efficiency, reduce the operating temperature of the inverter power supply, and increase the stability of the boost inductor plate 3. In other embodiments, the heat-conducting medium may also be a superconducting material disposed in the second heat-conducting shell.

[0070] In other embodiments, the three-phase output filter inductor plate 7 may also be directly fixedly connected to the bottom wall of the sealed housing 1 , or contact the bottom wall of the sealed housing 1 through thermal conductive silicone grease.

[0071] The present application does not specifically limit the contact method between the EMC filter board 8 and the bottom wall of the sealed housing 1. Preferably, the EMC filter board 8 has an EMC filter inductor, which is located between the EMC filter board 8 and the bottom wall of the sealed housing 1 and contacts the bottom wall of the sealed housing through a heat-conducting structure. The heat generated by the EMC filter board 8 and the EMC filter inductor can then be quickly transferred to the top wall of the heat dissipation housing 9 through the heat-conducting structure and enter the heat dissipation cavity, so as to improve the heat dissipation efficiency of the EMC filter board 8 and the EMC filter inductor, so as to further reduce the temperature of the EMC filter board 8 and the EMC filter inductor during operation, and thereby further reduce the temperature of the inverter power supply during operation.

[0072] The present application does not specifically limit the thermal conductive structure. Preferably, the thermal conductive structure is a thermal conductive silicone pad. In other words, the heat generated by the EMC filter board 8 and the EMC filter inductor is transferred to the bottom wall of the sealed housing 1 through the thermal conductive silicone pad, thereby improving the heat dissipation efficiency of the heat generated by the EMC filter board 8 and the EMC filter inductor. In other embodiments, the thermal conductive structure can also be formed by thermal conductive silicone grease applied to the EMC filter inductor, or the thermal conductive structure can refer to the contact method between the boost inductor board 3 and the three-phase output filter inductor board 7 and the bottom wall of the sealed housing 1.

[0073] The present application does not make any specific limitation on the structure of the heat dissipation housing 9. Preferably, refer to Figure 1 and Figure 2 The heat dissipation shell 9 includes a bottom plate 92, a mounting plate 93, a sealing plate 94 and a radiator 95. The peripheral side of the bottom plate 92 is bent upward to form a side plate 921. The mounting plate 93 is arranged on one side of the bottom plate 92 to form a side wall extending continuously along the circumference of the bottom plate 92 together with the side plate 921. The radiator 95 includes a connector and a plurality of fin bodies. The sealing plate 94 is arranged flush with the top of the connector to form the top wall of the heat dissipation shell 9 together with the connector. A heat dissipation channel is formed between the plurality of fin bodies. The cooling fan 91 is arranged at the channel mouth of the heat dissipation channel and is located on the side of the fin body close to the mounting plate 93. The heat dissipation hole 931 is provided on the mounting plate 93. When the cooling fan 91 is working, the external airflow can quickly enter the heat dissipation cavity through the heat dissipation hole 931 provided on the mounting plate 93 and directly enter the heat dissipation channel to take away the heat in the heat dissipation channel, so as to improve the heat dissipation efficiency of the radiator 95, thereby further reducing the temperature of the inverter power supply during operation.

[0074] At the same time, through the setting of the radiator 95, the contact area between the heat dissipation cavity and the cold air flow is increased, thereby improving the heat dissipation efficiency of the heat dissipation cavity, and the heat dissipation channel can also guide the cold air flow so that the cold air flow can be quickly discharged from the heat dissipation cavity after heat exchange with the heat dissipation cavity, thereby further improving the heat dissipation efficiency of the heat dissipation cavity, and further reducing the temperature of the inverter power supply during operation.

[0075] Specifically, one end of the fin body facing away from the connector contacts the bottom plate 92 , thereby forming a good contact between the heat sink 95 and the bottom plate 92 to form a good grounding.

[0076] Preferably, the side panel 921 is provided with a hole structure to allow more cold air flow to enter the heat dissipation cavity to improve the heat dissipation efficiency of the heat dissipation cavity, and at least part of the hole structure is arranged opposite to the heat dissipation hole 931 to shorten the flow path of the cold air flow in the heat dissipation cavity, thereby further improving the heat dissipation efficiency of the heat dissipation cavity.

[0077] Preferably, multiple radiators 95 are provided in sequence to further improve the heat dissipation efficiency of the heat dissipation cavity. Part of the sealing plate 94 is provided between two adjacent radiators 95, and the remaining sealing plate 94 is provided at the end of the radiator 95 located at the end.

[0078] Furthermore, the heat dissipation holes 931 include a main air inlet hole arranged opposite to the cooling fan 91 and an auxiliary air inlet hole arranged offset from the cooling fan 91, thereby increasing the air inlet area of ​​the mounting plate 93 to increase the amount of cold air flow entering the heat dissipation cavity, while improving the smoothness of the cold air flow entering the heat dissipation cavity, thereby further improving the heat dissipation efficiency of the radiator 95 and the heat dissipation cavity, and further reducing the temperature of the inverter power supply during operation.

[0079] In other embodiments, the heat dissipation housing 9 may also be formed by a welded box to reduce the number of parts required for assembly.

[0080] The present application does not make any specific limitation on the position of the extended energy storage capacitor plate 5. Preferably, refer to Figure 2 The extended energy storage capacitor plate 5 is located above the boost power plate 2 and the boost inductor plate 3, thereby realizing a three-dimensional design to comprehensively utilize the space of the installation cavity, thereby further reducing the volume of the inverter power supply and improving the power density of the inverter power supply.

[0081] In other embodiments, the extended energy storage capacitor plate 5 can also be set at other positions, as long as the extended energy storage capacitor plate 5 is located inside the installation cavity.

[0082] In a preferred embodiment, referring to Figure 2 The inverter power supply also includes a main control board 10 with integrated communication and control functions. The sealed housing 1 has a front side and a rear side opposite to the front side. The front side is provided with a communication and control interface, and the rear side is provided with a main power interface. The main control board 10 is arranged close to the front side so as to be electrically connected to the communication and control interface.

[0083] Specifically, since the communication and control interface is provided on the front side and the main power interface is provided on the back side, the strong and weak currents of the inverter power supply can be separated, and the circuit paths of the strong and weak currents can be made as small as possible, avoiding electromagnetic interference caused by the power line to the communication line, thereby improving the electromagnetic compatibility of the equipment itself.

[0084] Preferably, the main control board 10 is located above the inverter power board 6 to rationally utilize the vertical space, reduce the volume of the inverter power supply, and improve the power density of the inverter power supply.

[0085] The present application does not make any specific limitation on the structure of the sealed housing 1. Preferably, refer to Figure 1 and Figure 2The sealed housing 1 includes a sealed bottom plate 92, a cover plate 11, a back plate 12 and a panel 13. The sealed bottom plate 92 is arranged opposite to the cover plate 11, and the back plate 12 is arranged opposite to the panel 13. Both sides of the back plate 12 are bent and extended toward the direction of the panel 13 to be connected to the panel 13. Then, the sealed housing 1 is formed by assembly to reduce the production difficulty of the sealed housing 1. At the same time, it is convenient to install the device in the installation cavity, so as to improve the assembly efficiency of the inverter power supply.

[0086] Specifically, the sealing plate 94 and the connector constitute a closed bottom plate 92, the back plate 12 is fixedly connected to the side plate 921 by screws or bolts, the mounting plate 93 is integrally formed on the panel 13 or fixedly connected to the panel 13 by screws or bolts, the panel 13 is fixedly connected to the extended part of the back plate 12 by screws or bolts, and the cover plate 11 is fixedly connected to the back plate 12 and the panel 13 by screws or bolts.

[0087] It should be noted that the side where the panel 13 is located forms the front side of the sealed housing 1 , that is, the communication and control interface is provided on the panel 13 , and the main power interface is provided on the back panel 12 .

[0088] Preferably, the heat dissipation housing 9 also has magnetic permeability so that the inverter power supply can form a good grounding, which can not only ensure the heat dissipation efficiency of the inverter power supply, but also improve the anti-interference performance of the inverter power supply, and also improve the electromagnetic compatibility (EMC) of the inverter power supply.

[0089] Since both the sealed housing 1 and the heat dissipation housing 9 have magnetic permeability, it is understood that the sealed housing 1 and the heat dissipation housing 9 are made of a material having magnetic permeability. Preferably, the magnetic permeability material is galvanized steel plate to improve the corrosion resistance of the sealed housing 1 and the heat dissipation housing 9 and provide a higher level of protection for the internal components. Of course, the magnetic permeability material can also be other materials such as steel plate.

[0090] In other embodiments, the sealed housing 1 may also be formed as a box with an open bottom to reduce the number of required assembly parts.

[0091] Anything not described in this application can be achieved by adopting or drawing on existing technologies.

[0092] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0093] The foregoing is merely an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application should all be included within the scope of the claims of the present application.

Claims

1. A high-performance marine inverter power supply, characterized in that: include: A sealed housing (1), wherein the sealed housing (1) has a mounting cavity therein, and the sealed housing (1) has magnetic permeability; An integrated circuit assembly is provided in the mounting cavity, the integrated circuit assembly comprising a boost power board (2), a boost inductor board (3), an energy storage capacitor board (4), an extended energy storage capacitor board (5), an inverter power board (6), a three-phase output filter inductor board (7) and an EMC filter board (8), the boost power board (2) and the boost inductor board (3) forming a boost circuit, the inverter power board (6), the three-phase output filter inductor board (7) and the EMC filter board (8) forming an inverter circuit, the energy storage capacitor board (4) being provided between the boost circuit and the inverter circuit, the extended energy storage capacitor board (5) being electrically connected to the energy storage capacitor board (4), and the extended energy storage capacitor board (5) having a plurality of parallel electrolytic capacitors.

2. A high-performance marine inverter power supply according to claim 1, characterized in that: The energy storage capacitor plate (4) is provided with a common-mode filtering inductor to eliminate common-mode interference generated by the front-end equipment.

3. A high-performance marine inverter power supply according to claim 1, characterized in that: The EMC filter board (8) is arranged at the rear end of the inverter circuit, and the EMC filter board (8) is provided with a three-phase common-mode filter inductor and a filter capacitor.

4. A high-performance marine inverter power supply according to claim 1, characterized in that: The invention also includes a heat dissipation shell (9) arranged at the bottom of the sealed housing (1), a heat dissipation cavity is formed inside the heat dissipation shell (9), a cooling fan (91) is arranged in the heat dissipation cavity, and the heat dissipation shell (9) is provided with heat dissipation holes (931), the top wall of the heat dissipation shell (9) constitutes the bottom wall of the sealed housing (1), and the boost power board (2), the boost inductor board (3), the inverter power board (6), the three-phase output filter inductor board (7) and the EMC filter board (8) are all arranged on the bottom wall of the sealed housing (1).

5. A high-performance marine inverter power supply according to claim 4, characterized in that: A mica sheet is provided between the boost power board (2) and the inverter power board (6) and the bottom wall of the sealed housing (1), and both end surfaces of the mica sheet are coated with a heat-conducting layer; And / or, the boost inductor plate (3) has a boost inductor, the boost inductor plate (3) is provided with a first heat-conducting shell sleeved on the boost inductor, the first heat-conducting shell is connected to the bottom wall of the sealed housing (1), and a heat-conducting medium is provided in the first heat-conducting shell; And / or, the three-phase output filter inductor plate (7) has a three-phase output filter inductor, the three-phase output filter inductor plate (7) is provided with a second heat-conducting shell sleeved on the three-phase output filter inductor, the second heat-conducting shell is connected to the bottom wall of the sealed housing (1), and a heat-conducting medium is provided in the second heat-conducting shell; And / or, the EMC filter board (8) has an EMC filter inductor, the EMC filter inductor is located between the EMC filter board (8) and the bottom wall of the sealed housing (1) and contacts the bottom wall of the sealed housing through a heat-conducting structure.

6. A high-performance marine inverter power supply according to claim 4, characterized in that: The heat dissipation shell (9) includes a base plate (92), a mounting plate (93), a sealing plate (94) and a radiator (95). The peripheral side of the base plate (92) is bent upward to form a side plate (921). The mounting plate (93) is arranged on one side of the base plate (92) to form a side wall extending continuously along the circumference of the base plate (92) together with the side plate (921). The radiator (95) includes a connector and a plurality of fin bodies. The sealing plate (94) is arranged flush with the top of the connector to form the top wall of the heat dissipation shell (9) together with the connector. A heat dissipation channel is formed between the plurality of fin bodies. The cooling fan (91) is arranged at the channel mouth of the heat dissipation channel and is located on the side of the fin body close to the mounting plate (93). The heat dissipation hole (931) is arranged on the mounting plate (93).

7. A high-performance marine inverter power supply according to claim 6, characterized in that: The heat dissipation holes (931) include a main air inlet hole arranged opposite to the cooling fan (91) and an auxiliary air inlet hole arranged offset from the cooling fan (91).

8. The high-performance marine inverter power supply according to claim 1, characterized in that: The extended energy storage capacitor plate (5) is located above the boost power plate (2) and the boost inductor plate (3).

9. The high-performance marine inverter power supply according to claim 1, characterized in that: The invention also includes a main control board (10) integrated with communication and control functions. The sealed housing (1) has a front side and a rear side opposite to the front side. The front side is provided with a communication and control interface, and the rear side is provided with a main power interface. The main control board (10) is arranged close to the front side to be electrically connected to the communication and control interface.

10. The high-performance marine inverter power supply according to claim 1, characterized in that: The sealed housing (1) comprises a sealed bottom plate (92), a cover plate (11), a back plate (12) and a panel (13); the sealed bottom plate (92) is arranged opposite to the cover plate (11); the back plate (12) is arranged opposite to the panel (13); and both sides of the back plate (12) are bent and extended in the direction of the panel (13) to be connected to the panel (13).

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