Thermal imaging temperature measurement dynamic scene device

Abstract

The utility model relates to the technical field of thermal imaging equipment, and discloses a thermal imaging temperature measurement dynamic scene device, which comprises a metal back plate and a base, one side of the metal back plate is fixedly connected with the base, and the surface of the metal back plate is fixedly provided with a main control board. The surface of the metal back plate is divided into three heating areas, and heat conduction hollow areas used for preventing the heating areas at different temperatures are arranged among the heating areas, so that heat conduction of the heating areas at different temperatures is prevented by dividing the metal back plate into the three heating areas and designing the hollow areas; the first silica gel heating piece, the second silica gel heating piece and the third silica gel heating piece are attached to the areas, marked by laser, in the fan-shaped areas respectively, different temperatures are set through the main control board, so that a picture can have richer thermal scenes, and zero shielding, partial shielding and full shielding are achieved on the three heating areas in the rotating process of the metal fan blades; and shielding of different temperature areas realizes a dynamic temperature change scene in a thermal imaging picture.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal imaging equipment, and more specifically, to a thermal imaging temperature measurement dynamic scene device. Background Art

[0002] When current thermal imaging equipment is tested in a single temperature or low temperature gradient scene for a long time, image adjustment anomalies, temperature measurement offset, and low bitrate may occur. Therefore, a dynamically changing temperature scene is needed to achieve dynamic temperature changes and switch between dynamic and static scenes.

[0003] The existing thermal imaging image testing devices mainly include the following solutions:

[0004] Existing solution 1: using a bold font placed in the picture. The main drawbacks are: the picture is monotonous and there is no dynamic scene;

[0005] Existing solution 2: placing leaves to increase the richness, but the main drawback is that the leaves do not have heat and the thermal imaging image is not clear;

[0006] Existing Solution 3: Adding heat-generating plates to the blades of low-speed blades has the following main drawbacks: it is impossible to block or expose the temperature points in the image, and it is impossible to simulate a scene without a heat source.

[0007] Therefore, we propose a thermal imaging temperature measurement dynamic scene device. Utility Model Content

[0008] In order to solve the problems raised in the above background technology, the present invention provides a thermal imaging temperature measurement dynamic scene device.

[0009] The thermal imaging temperature measurement dynamic scene device provided by the utility model adopts the following technical solutions:

[0010] A thermal imaging temperature measurement dynamic scene device includes a metal backplate and a base. One side of the metal backplate is fixedly connected to the base. A main control board is fixedly mounted on the surface of the metal backplate. The surface of the metal backplate is divided into three heating areas, and a heat-conducting hollow area is opened between the heating areas to prevent the heating areas of different temperatures from being heated.

[0011] The main control board is fixedly mounted on the surface of the metal back plate. The output end of the main control board is connected to the control end wire of the motor assembly. The main control board is used to control the movement of the motor assembly. The motor assembly is connected to the metal fan blades, and the motor assembly is used to provide power for the metal fan blades.

[0012] Preferably, the surface of the heating area is adhered with a first silicone heating sheet, a second silicone heating sheet, and a third silicone heating sheet located in the laser-marked area in clockwise order.

[0013] Preferably, the hollow area includes hollow one, hollow two, and hollow three, the hollow two and hollow three are respectively opened between every two heating areas, and the hollow one is opened in a circle surrounding the three heating areas.

[0014] Preferably, the motor assembly includes a motor bracket, a motor, and a coupling. The mounting plate of the motor bracket is fixedly mounted on the surface of the metal backplate, the motor is mounted inside the motor bracket, the output shaft of the motor is transmission-connected with a coupling, and the other end of the coupling is transmission-connected with the metal fan blade.

[0015] Preferably, the input end of the main control board is electrically connected to the output end of the button, the input end of the main control board is electrically connected to the output ends of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3 respectively, the output end of the main control board is electrically connected to the digital tube, the output end of the main control board is electrically connected to the control end of the motor assembly, the output end of the main control board is connected to the RS485 interface end by wire, and the output end of the main control board is electrically connected to the control ends of the first silicone heating plate, the second silicone heating plate, and the third silicone heating plate respectively.

[0016] Preferably, the main control board includes an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip.

[0017] Preferably, the control method steps of the thermal imaging temperature measurement dynamic scene are as follows:

[0018] Step 1: Connect the main control board to the thermal imaging camera via the RS485 interface.

[0019] Step 2: The temperature of the corresponding heating area is collected by temperature sensor 1, temperature sensor 2, and temperature sensor 3, and transmitted to the MCU chip. The MCU chip controls the corresponding first silicone heating sheet, second silicone heating sheet, and third silicone heating sheet respectively through heating drive module 1, heating drive module 2, and heating drive module 3 to start, heat the respective heating areas, and heat the three heating areas to different temperatures;

[0020] Step 3. Set the start, stop, low speed, medium speed, and high speed options of the motor speed by pressing the button. The button transmits the analog signal of the option to the MCU chip. The MCU chip uses four-phase eight-beat control of the motor and realizes the adjustment of the motor start, stop, low speed, medium speed, and high speed by controlling the conversion of the four-phase level.

[0021] Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs them to the digital tube to display the motor speed level and the temperature in different areas;

[0022] Step 5. The level conversion signal is transmitted to the motor driver chip to control the motor speed or start and stop. The rotation of the motor drives the metal blades to rotate, so that the metal blades sequentially block the rear heating area. When the first heating area is blocked, only the second and third heating areas are shown in the picture. When the first and second heating areas are blocked, only the third heating area is shown in the picture. After all are blocked, there is no heating area in the picture. The first, second, and third heating areas are exposed in turn during the rotation process. During the rotation process, due to the blocking and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set at different temperatures, only high temperature / low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

[0023] In summary, the present invention has the following beneficial technical effects:

[0024] The utility model divides the metal back plate into three heating areas and designs a hollow area to prevent heat conduction in heating areas with different temperatures. The first silicone heating plate, the second silicone heating plate, and the third silicone heating plate are respectively attached to the areas marked by laser in the fan-shaped area. Different temperatures are set by the main control board to make the picture have richer thermal scenes. During the rotation of the metal fan blades, zero blocking, partial blocking, and full blocking are achieved for the three heating areas. The blocking of different temperature areas realizes a dynamic temperature change scene in the thermal imaging picture. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the front three-dimensional structure of an embodiment of the utility model;

[0026] Figure 2 This is a front structural diagram of an embodiment of the present utility model;

[0027] Figure 3 It is a schematic diagram of a flow chart in an embodiment of the present utility model.

[0028] Explanation of the accompanying drawings: 1. Metal back plate; 2. Hollow area; 21. Hollow one; 22. Hollow two; 23. Hollow three; 3. Heating area; 31. First silicone heating plate; 32. Second silicone heating plate; 33. Third silicone heating plate; 4. Motor assembly; 41. Motor bracket; 42. Motor; 43. Coupling; 5. Metal fan blades; 6. Base; 7. Main control board. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-3 The utility model is described in further detail.

[0030] It should be noted that the drawings are schematic and not drawn to scale. For clarity and convenience, the relative sizes and proportions of parts shown in the drawings may be exaggerated or reduced in size. Any dimensions are illustrative only and are not intended to be limiting. Identical structures, elements, or components appearing in two or more drawings are denoted by the same reference numerals to indicate similar features.

[0031] The present invention discloses a thermal imaging temperature measurement dynamic scene device. Figure 1-3 A thermal imaging temperature measurement dynamic scene device includes a metal back plate 1 and a base 6. The base 6 is fixedly connected to one side of the metal back plate 1. A main control board 7 is fixedly installed on the surface of the metal back plate 1. The surface of the metal back plate 1 is divided into three heating areas 3 and a heat-conducting hollow area 2 is opened between the heating areas 3 to prevent the heating areas 3 of different temperatures from being heated.

[0032] There are three heating areas 3, namely the first heating area, the second heating area, and the third heating area. The first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 are attached to the surface of the heating area 3 in clockwise order in the laser-marked area.

[0033] The hollow area 2 includes a hollow 1 21, a hollow 2 22, and a hollow 3 23. The hollow 2 22 and the hollow 3 23 are respectively opened between every two heating areas 3, and the hollow 1 21 is opened in a circle around the three heating areas 3.

[0034] The hollow area 2 is arranged between the three heating areas 3, thereby effectively preventing the heating areas 3 with different temperatures from conducting heat;

[0035] A main control board 7 is fixedly mounted on the surface of the metal back plate 1. The output end of the main control board 7 is connected to the control end wire of the motor assembly 4. The main control board 7 is used to control the movement of the motor assembly 4. The motor assembly 4 includes a motor bracket 41, a motor 42, and a coupling 43. The mounting plate of the motor bracket 41 is fixedly mounted on the surface of the metal back plate 1. The motor 42 is mounted inside the motor bracket 41. The output shaft of the motor 42 is transmission-connected to the coupling 43. The other end of the coupling 43 is transmission-connected to the metal fan blade 5. The motor assembly 4 is connected to the metal fan blade 5, and the motor assembly 4 is used to provide power for the metal fan blade 5.

[0036] The main control board 7 includes an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip. The heating drive module 1, the heating drive module 2, and the heating drive module 3 are respectively connected to the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33, so that the MCU chip controls the heating of the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33. The input end of the main control board 7 is electrically connected to the output end of the key, the input end of the main control board 7 is electrically connected to the output end of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3, respectively, the output end of the main control board 7 is electrically connected to the digital tube, the output end of the main control board 7 is electrically connected to the control end of the motor assembly 4, the output end of the main control board 7 is connected to the RS485 interface end wire, and the output end of the main control board 7 is electrically connected to the control ends of the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33;

[0037] Specifically, the main control board 7 controls the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 to heat the corresponding heating areas 3, so that the three heating areas 3 transmit the temperatures in the corresponding three heating areas 3 to the main control board 7 through the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3, and controls the first silicone heating sheet 31, the second silicone heating sheet 32, and the third silicone heating sheet 33 to heat the corresponding heating areas 3 to different temperatures, so that the video screen has a richer thermal scene, and then the main control board 7 controls the motor 42 to start and drive the coupling 43 to rotate, and the rotation of the coupling 43 drives the metal fan blade 5 to rotate, and the three heating areas 3 are zero-blocked, partially blocked, and fully blocked. The blocking of different temperature areas realizes a dynamic temperature change scene in the thermal imaging screen;

[0038] Through the above structural design, the effect of long-term dynamic temperature change scene is achieved;

[0039] Control method steps for dynamic scenes of thermal imaging temperature measurement:

[0040] Step 1: Connect the main control board to the thermal imaging camera via the RS485 interface.

[0041] Step 2: The temperature of the corresponding heating area 3 is collected by temperature sensor 1, temperature sensor 2, and temperature sensor 3, and transmitted to the MCU chip. The MCU chip controls the corresponding first silicone heating sheet 31, second silicone heating sheet 32, and third silicone heating sheet 33 through heating drive module 1, heating drive module 2, and heating drive module 3 to start respectively, heating the respective heating areas 3, so that the three heating areas 3 are heated to different temperatures;

[0042] Step 3. Set the start, stop, low speed, medium speed, and high speed options of the motor speed by pressing the button. The button transmits the analog signal of the option to the MCU chip. The MCU chip uses four-phase eight-beat to control the speed of the motor. The start, stop, low speed, medium speed, and high speed of the motor are adjusted through the conversion interval of the four-phase level.

[0043] Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs them to the digital tube to display the motor speed level and the temperature in different areas;

[0044] In step five, the MCU chip transmits the four-phase high and low electrical signals to the motor driver chip to control the rotation of the motor. The rotation of the motor drives the metal blades to rotate, so that the metal blades sequentially block the rear heating area. When the first heating area is blocked, only the second and third heating areas are shown in the picture. When the first and second heating areas are blocked, only the third heating area is shown in the picture. After all areas are blocked, there is no heating area in the picture. The first, second and third heating areas are exposed in turn during the rotation process. During the rotation process, due to the blocking and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set to different temperatures, only high temperature or low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

[0045] Finally, a few points should be explained: First, in the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "mounted", "connected", and "connected" should be understood in a broad sense, and may refer to mechanical or electrical connections, internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.

[0046] Secondly: The drawings of the embodiments disclosed in this utility model only involve structures related to the embodiments disclosed in this utility model. Other structures can refer to common designs. In the absence of conflicts, the same embodiment and different embodiments of the utility model can be combined with each other.

[0047] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A thermal imaging temperature measurement dynamic scene device, comprising a metal back plate (1) and a base (6), characterized in that: A base (6) is fixedly connected to one side of the metal back plate (1), a main control board (7) is fixedly mounted on the surface of the metal back plate (1), and the surface of the metal back plate (1) is divided into three heating areas (3), and a heat-conducting hollow area (2) is provided between the heating areas (3) to prevent heating areas (3) of different temperatures from being heated; A main control board (7) is fixedly mounted on the surface of the metal back plate (1); an output end of the main control board (7) is connected to a control end wire of the motor assembly (4); the main control board (7) is used to control the movement of the motor assembly (4); the motor assembly (4) is connected to the metal fan blades (5); and the motor assembly (4) is used to provide power to the metal fan blades (5).

2. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: A first silica gel heating sheet (31), a second silica gel heating sheet (32), and a third silica gel heating sheet (33) located in the laser-marked area are adhered to the surface of the heating area (3) in clockwise order.

3. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The hollow area (2) includes a hollow area 1 (21), a hollow area 2 (22), and a hollow area 3 (23). The hollow area 2 (22) and the hollow area 3 (23) are respectively opened between every two heating areas (3), and the hollow area 1 (21) is opened in a circle around the three heating areas (3).

4. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The motor assembly (4) comprises a motor bracket (41), a motor (42), and a coupling (43); the mounting plate of the motor bracket (41) is fixedly mounted on the surface of the metal back plate (1); the motor (42) is mounted inside the motor bracket (41); the output shaft of the motor (42) is transmission-connected to the coupling (43); and the other end of the coupling (43) is transmission-connected to the metal fan blade (5).

5. The thermal imaging temperature measurement dynamic scene device according to claim 4, characterized in that: The input end of the main control board (7) is electrically connected to the key output end, the input end of the main control board (7) is electrically connected to the output ends of the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3 respectively, the output end of the main control board (7) is electrically connected to the digital tube, the output end of the main control board (7) is electrically connected to the control end of the motor assembly (4), the output end of the main control board (7) is connected to the RS485 interface end by wire, and the output end of the main control board (7) is electrically connected to the control ends of the first silica gel heating plate (31), the second silica gel heating plate (32), and the third silica gel heating plate (33).

6. The thermal imaging temperature measurement dynamic scene device according to claim 1, characterized in that: The main control board (7) comprises an MCU chip, a heating drive module 1, a heating drive module 2, a heating drive module 3, a 485 chip, and a motor drive chip.

7. A thermal imaging temperature measurement dynamic scene device according to claims 1-6, characterized in that: The control method steps of the thermal imaging temperature measurement dynamic scene are as follows: Step 1: Connect the main control board to the thermal imaging camera via the RS485 interface. Step 2: The temperature of the corresponding heating area (3) is collected by the temperature sensor 1, the temperature sensor 2, and the temperature sensor 3, and the collected temperature is transmitted to the MCU chip. The MCU chip controls the corresponding first silicone heating plate (31), the second silicone heating plate (32), and the third silicone heating plate (33) to start respectively through the heating drive module 1, the heating drive module 2, and the heating drive module 3, and heats the respective heating areas (3), so that the three heating areas (3) are heated to different temperatures. Step 3. Set the start, stop, low speed, medium speed, and high speed options of the motor speed by pressing the button. The button transmits the analog signal of the option to the MCU chip. The MCU chip uses four-phase eight-beat control of the motor and realizes the adjustment of the motor start, stop, low speed, medium speed, and high speed by controlling the conversion of the 4-phase pin level. Step 4: The MCU chip obtains the motor speed level and the temperature information transmitted by the temperature sensor according to the corresponding value calculated by the key, and outputs them to the digital tube to display the motor speed level and the temperature in different areas; In step five, the four-phase level signal is transmitted to the motor driver chip to control the motor speed or start and stop. The rotation of the motor drives the metal blades to rotate, so that the metal blades cover the rear heating area in turn. When the first heating area is covered, only the second and third heating areas are in the picture. When the first and second heating areas are covered, only the third heating area is in the picture. After all are covered, there is no heating area in the picture. The first, second and third heating areas are exposed in turn during the rotation process. During the rotation process, due to the covering and exposure of different heating areas, the scene in the thermal imaging picture is in a constantly changing state. Since the heating plates on the heating areas are set at different temperatures, only high temperature / low temperature areas appear during the operation of the device, realizing a dynamic temperature change scene.

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