Radiator and power equipment

Abstract

The utility model discloses a radiator and power equipment, and the radiator comprises a heat dissipation housing and a heat dissipation substrate, and the heat dissipation housing is provided with a liquid inlet and a liquid outlet; the heat dissipation substrate is provided with a first plate face and a second plate face, the first plate face is provided with at least two bearing areas which are sequentially arranged in the preset direction and used for bearing heating sources, the second plate face and the heat dissipation shell cover define a flow channel structure extending in the preset direction, and the flow channel structure is provided with flow channel areas corresponding to the bearing areas. According to the heat dissipation structure, the circulation sectional areas of the flow channel areas sequentially arranged in the preset direction are gradually decreased in a stepped mode, the preset direction is the direction extending from the side where the liquid inlet is located to the side where the liquid outlet is located, the heat dissipation uniformity of the flow channel areas corresponding to the two adjacent bearing areas is better through the heat dissipation structure, and the overall heat dissipation uniformity of the heat dissipation device can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation structures of radiators, and more specifically, to a radiator and a power device. Background Art

[0002] As a key component in power devices, the heat dissipation performance of the heat sink is crucial to the normal operation of the power device. As the heat dissipation requirements of power devices continue to increase, higher requirements are placed on the heat dissipation uniformity of the heat sink.

[0003] In summary, how to improve the heat dissipation uniformity of a radiator has become a technical problem that needs to be urgently solved by those skilled in the art. Utility Model Content

[0004] In view of this, the present application provides a heat sink and a power device to improve the heat dissipation uniformity of the heat sink.

[0005] To achieve the above objectives, in the first aspect, this application provides the following technical solutions:

[0006] A radiator, comprising:

[0007] A heat dissipation shell having a liquid inlet and a liquid outlet;

[0008] A heat dissipation substrate having a first plate surface and a second plate surface, wherein the first plate surface has at least two receiving areas arranged in sequence along a preset direction for receiving a heat source, and the second plate surface and the heat dissipation cover enclose a flow channel structure extending along the preset direction, wherein the flow channel structure has a flow channel area corresponding to the receiving area;

[0009] The flow cross-sectional areas of the flow channel regions sequentially arranged along the preset direction decrease in sequence, and the preset direction is a direction extending from the side where the liquid inlet is located to the side where the liquid outlet is located.

[0010] In some embodiments of the present application, the inner wall of the flow channel opposite to the heat dissipation shell cover and the second plate surface is the shell cover bottom wall, and the distance between the shell cover bottom wall and the second plate surface is defined as the flow channel height, and the flow channel heights of the flow channel areas arranged in sequence along the preset direction decrease in steps.

[0011] In some embodiments of the present application, the bottom wall of the housing is configured as a stepped surface, and each step surface of the stepped surface corresponds one-to-one to the flow channel area.

[0012] In some embodiments of the present application, the second plate surface is configured as a stepped surface, and each step surface of the stepped surface corresponds one-to-one to the flow channel area.

[0013] In some embodiments of the present application, the heat dissipation cover and the heat dissipation substrate are constructed as a separate fixed connection structure or an integrally formed structure.

[0014] In some embodiments of the present application, the heat dissipation substrate is constructed as a pin-tooth liquid cooling plate, and a densely distributed pin-fin structure is provided on the second plate surface.

[0015] In some embodiments of the present application, the density of the pin-fin structures corresponding to the flow channel areas arranged sequentially along the preset direction increases sequentially.

[0016] In some embodiments of the present application, the needle teeth of the pin-fin structure are alternately staggered along the preset direction.

[0017] In some embodiments of the present application, the cross section of the needle tooth is oblate, and the direction indicated by the major axis of the oblate is the same as the preset direction;

[0018] Alternatively, the cross section of the needle teeth is rhombus-shaped, and a direction indicated by a symmetry axis of the rhombus is the same as the preset direction.

[0019] Compared with the background technology introduction, the above-mentioned radiator includes a heat dissipation shell and a heat dissipation substrate, wherein the heat dissipation shell has a liquid inlet and a liquid outlet; the heat dissipation substrate has a first plate surface and a second plate surface, the first plate surface has at least two receiving areas arranged in sequence along a preset direction for receiving a heat source, the second plate surface and the heat dissipation shell are enclosed to form a flow channel structure extending along a preset direction, the flow channel structure has a flow channel area corresponding to the receiving area; the flow cross-sectional area of ​​the flow channel area arranged in sequence along the preset direction decreases in steps, and the preset direction is the direction extending from the side where the liquid inlet is located to the side where the liquid outlet is located. In actual application of this radiator, each receiving area receives its own corresponding heat source, and the liquid inlet and liquid outlet of the radiator are respectively connected to the liquid supply pipe and liquid return pipe of the liquid cooling circulation system. The coolant flows into the flow channel structure from the liquid inlet and then flows out from the liquid outlet. Since the flow rate of the coolant flowing through each flow cross-section of the flow channel structure is the same, the flow channel structure is designed to be arranged in sequence along a preset direction (that is, the direction extending from the side where the liquid inlet is located to the side where the liquid outlet is located) with the flow cross-sectional area decreasing in a step-by-step manner, that is, in the flow channel area corresponding to the two adjacent receiving areas, the flow channel located downstream in the flow direction of the coolant The flow cross-sectional area of ​​the region relative to the flow channel region located upstream becomes smaller, which can make the flow velocity corresponding to the flow channel region located downstream (that is, the flow channel region with a small flow cross-sectional area) higher than the flow velocity of the flow channel region located upstream (that is, the flow channel region with a large flow cross-sectional area), thereby compensating for the relatively poor heat exchange efficiency caused by the coolant temperature flowing through the downstream flow channel region (that is, the flow channel region with a small flow cross-sectional area) being higher than the coolant temperature of the upstream flow channel region (that is, the flow channel region with a large flow cross-sectional area), thereby making the heat dissipation uniformity of the flow channel regions corresponding to the two adjacent receiving areas better, which helps to improve the overall heat dissipation uniformity of the radiator.

[0020] In a second aspect, the present application further provides a power device comprising a power device and a heat sink for dissipating heat from the power device, wherein the heat sink is any of the heat sinks described in any of the above-mentioned solutions. Since the heat sink has the above-mentioned technical effects, a power device having the heat sink should also have the corresponding technical effects, which will not be further described here.

[0021] In some embodiments of the present application, the power device is a single motor controller, the heat dissipation substrate of the radiator has at least three receiving areas, and the single motor controller has three-phase heat source areas and is respectively arranged in three different receiving areas.

[0022] In some embodiments of the present application, the power device is a dual-motor controller, the heat dissipation substrate of the radiator has at least two receiving areas, and the dual-motor controller has two heat source areas and is respectively arranged in two different receiving areas. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0024] Figure 1 A schematic diagram of the appearance and structure of a radiator provided in an embodiment of the present application;

[0025] Figure 2 A schematic diagram of the main structure of the radiator provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the top view of the radiator provided in an embodiment of the present application;

[0027] Figure 4 for Figure 3 AA cross-sectional structural diagram;

[0028] Figure 5 for Figure 2 BB cross-sectional structure diagram;

[0029] Figure 6 A schematic structural diagram of the first plate surface of the heat dissipation substrate provided in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of the axial structure of the heat dissipation housing provided in an embodiment of the present application;

[0031] Figure 8 A schematic diagram of the axial structure of the heat dissipation substrate provided in an embodiment of the present application;

[0032] Figure 9 A schematic top view of the heat dissipation substrate provided in an embodiment of the present application;

[0033] Figure 10 This is a schematic diagram of the main structure of the heat dissipation substrate provided in an embodiment of the present application.

[0034] in, Figures 1-10 middle:

[0035] 1- heat dissipation shell;

[0036] 10- bottom wall of the housing;

[0037] 11-liquid inlet;

[0038] 12-Liquid outlet;

[0039] 2- heat dissipation substrate;

[0040] 21- first board surface;

[0041] 210-Acceptance area;

[0042] 22- second board surface;

[0043] 220-heat dissipation area;

[0044] 23-pin-fin structure;

[0045] 230-needle teeth;

[0046] 3-Flow channel structure;

[0047] 30-flow channel area;

[0048] M - Preset direction. DETAILED DESCRIPTION

[0049] The core of this application is to provide a radiator and a power device to improve the heat dissipation uniformity of the radiator.

[0050] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0051] Reference Figure 1 and Figure 2 As shown, the present application provides a radiator in an embodiment of the first aspect, which specifically includes a heat dissipation housing 1 and a heat dissipation substrate 2. The heat dissipation housing 1 has a liquid inlet 11 and a liquid outlet 12, and a flow channel extending from the side where the liquid inlet 11 is located to the side where the liquid outlet 12 is located is formed in the heat dissipation housing 1. The flow channel can be specifically Figure 7 In addition, the liquid inlet 11 and the liquid outlet can be specifically designed to Figure 1 and Figure 2 The manner shown, i.e., designed on the top side of the heat dissipation shell 1, can also be designed on both ends of the heat dissipation shell 1, as long as a flow channel extending from the side where the liquid inlet 11 is located to the side where the liquid outlet 12 is located can be formed.

[0052] Reference Figure 10 As shown, the heat dissipation substrate 2 has a first plate surface 21 and a second plate surface 22, Figure 4 It can be seen that the first board surface 21 refers to the side of the heat dissipation substrate 2 facing away from the heat dissipation housing 1 , and the second board surface 22 refers to the side of the heat dissipation substrate 2 facing the heat dissipation housing 1 .

[0053] Reference Figure 6As shown, the first plate surface 21 has at least two (ie, two or more) receiving areas 210 arranged in sequence along a preset direction M for receiving a heat source. The heat source here can be a power device, such as a MOS, IGBT, SiC or other power device. Figure 4 Combine Figure 10 The second plate surface 22 and the flow channel of the heat dissipation shell 1 (i.e., the aforementioned groove structure) are enclosed to form a flow channel structure 3 extending along the preset direction M. The flow channel structure 3 has a flow channel area 30 corresponding to the receiving area 210. When the radiator is working, when the coolant flows through the corresponding flow channel area 30, the power device installed at the receiving area 210 corresponding to the flow channel area 30 can be cooled; wherein, Figure 4 As shown, the flow cross-sectional areas of the flow channel regions 30 arranged in sequence along the preset direction M can be specifically designed to be stepped and decreasing, and the preset direction M is the direction extending from the side where the liquid inlet 11 is located to the side where the liquid outlet 12 is located.

[0054] It is worth mentioning that Figure 4 The preset direction M shown is only the corresponding extension direction when the flow channel structure 3 is designed as a linear flow channel, but the technical solution of this application is not limited to Figure 4 The straight line direction shown, when the flow channel structure 3 is in a curved or broken line form, the preset direction also changes with the path of the flow channel structure 3, but the preset direction is always the direction extending from the side where the liquid inlet 11 is located to the side where the liquid outlet 12 is located.

[0055] In actual application, the radiator Figure 4 and Figure 6, each receiving area 210 receives its own corresponding heat source, the liquid inlet 11 and the liquid outlet 12 of the radiator are respectively connected to the liquid supply pipe and the liquid return pipe of the liquid cooling circulation system, the liquid cooling circulation system can have liquid cooling components such as a circulation pump, which mainly provides power for the coolant to circulate through the radiator. Since the liquid cooling circulation system itself is a relatively mature technology, it will not be described in more detail here; the coolant of the liquid cooling circulation system flows from the liquid inlet 11 into the flow channel structure 3 and then flows out from the liquid outlet 12. Since the flow rate of the coolant flowing through each flow cross-section of the flow channel structure 3 is the same (because all the coolant flowing into the sub-liquid inlet 11 flows out from the liquid outlet 12, the flow rate of each flow cross-section is the same), the flow channel structure 3 is designed to be arranged in sequence along the preset direction M (that is, the direction extending from the side where the liquid inlet is located to the side where the liquid outlet is located), the flow cross-sectional area of ​​the flow channel area 30 is The step-by-step decreasing manner, that is, in the flow channel areas 30 corresponding to the two adjacent receiving areas 210, the flow cross-sectional area of ​​the flow channel area 30 located downstream in the flow direction of the coolant becomes smaller than that of the flow channel area 30 located upstream, so that the flow velocity corresponding to the flow channel area 30 located downstream (that is, the flow channel area 30 with a small flow cross-sectional area) will be higher than the flow velocity of the flow channel area 30 located upstream (that is, the flow channel area 30 with a large flow cross-sectional area), thereby compensating for the relatively poor heat exchange efficiency caused by the coolant temperature flowing through the downstream flow channel area 30 (that is, the flow channel area 30 with a small flow cross-sectional area) being higher than the coolant temperature of the upstream flow channel area 30 (that is, the flow channel area 30 with a large flow cross-sectional area), so that the heat dissipation uniformity of the flow channel areas 30 corresponding to the two adjacent receiving areas 210 is better, which helps to improve the overall heat dissipation uniformity of the radiator.

[0056] It should be noted that the above-mentioned heat dissipation shell 1 and the heat dissipation substrate 2 can be specifically selected to be constructed as a split fixed connection structure, such as a welding sealed connection, or a bonding method; or an integral molding structure can be selected, such as an integral casting molding, etc. In actual application, the configuration can be selected according to actual needs, and no more specific restrictions are made here.

[0057] It should also be noted that when the flow path of a single flow channel area 30 is relatively short, the energy loss of the coolant in the path as it flows and exchanges heat can be ignored. At this time, the flow cross-sectional area on the flow path of the flow channel area 30 can be designed to be the same. When the flow path of a single flow channel area 30 is relatively long, the energy loss of the coolant in the path as it flows and exchanges heat needs to be taken into account. The single flow channel area 30 can be designed to have a structure with a gradually decreasing flow cross-sectional area along the preset direction M, which can also refine and compensate for the energy loss generated in the coolant flow path. The specific degree of gradual contraction is related to the energy loss generated by the flow of the coolant.

[0058] In some specific embodiments, the inner wall of the flow channel opposite to the above-mentioned heat dissipation shell cover 1 and the second plate surface 22 is the shell cover bottom wall 10, and the distance between the shell cover bottom wall 10 and the second plate surface 22 is defined as the flow channel height. At that time, the specific implementation method of the step-by-step decrease in the flow cross-sectional area of ​​the flow channel area 30 arranged sequentially along the preset direction M can be that the flow channel height of the flow channel area 30 arranged sequentially along the preset direction is stepped down.

[0059] For example, refer to Figure 4 and Figure 7 As shown, the bottom wall 10 of the housing is constructed as a stepped surface, and each step surface of the stepped surface corresponds to the flow channel area 30 one by one. This structural form is more convenient for processing and manufacturing.

[0060] For another example, the second plate surface 22 is constructed as a stepped surface, and each step surface of the stepped surface corresponds to the flow channel area 30 one by one. Although the relevant diagram is not given for this structural form, based on Figure 4 and Figure 7 , it is not difficult to understand the specific structure of the second plate surface 22 being constructed as a stepped surface.

[0061] Of course, it is understood that in order to achieve a step-wise decrease in the flow channel height of the flow channel areas 30 arranged sequentially along a preset direction, the housing bottom wall 10 can be configured as a stepped surface, the second plate surface 22 can be configured as a stepped surface, or both can be configured as stepped surfaces. In actual application, the arrangement can be selected according to actual needs, and no further specific limitations are given here.

[0062] It is worth mentioning that the specific implementation method of the step-by-step decrease in the flow cross-sectional area of ​​the flow channel area 30 arranged in sequence along the preset direction M can be selected as follows: in addition to the step-by-step decrease in the flow channel height of the flow channel area 30 arranged in sequence along the preset direction, the flow channel width can also be designed to be stepped, which can also achieve a step-by-step decrease in the flow cross-sectional area.

[0063] In some specific embodiments, reference Figure 4 、 Figure 5 and Figures 8-10 The heat dissipation substrate 2 can be specifically configured as a pin-tooth liquid cooling plate, where the second plate surface 22 is provided with a densely distributed pin-fin structure 23. The pin-fin structure 23 increases the contact area between the heat dissipation substrate 2 and the coolant, thereby improving the heat dissipation effect. It is understood that the pin-tooth liquid cooling plate is only one preferred arrangement for the heat dissipation substrate 2; other conventional heat dissipation substrate structures, such as those without pin-fin structures, are also within the scope of protection of this application.

[0064] It is worth mentioning that when a pin-fin structure 23 is provided on the second plate surface 22 of the heat dissipation substrate 2, the specific implementation method of the step-by-step decrease in the flow cross-sectional area of ​​the flow channel area 30 arranged in sequence along the preset direction M can be designed to be a step-by-step decrease in the flow channel height of the flow channel area 30 arranged in sequence along the preset direction. At that time, it can better adapt to or better meet the arrangement structure of the needle-tooth liquid cold plate. As shown in Reference 4, the coolant flows in from the liquid inlet 11 and can flow more smoothly into the downstream liquid outlet 12 through the stepped surface of the shell bottom wall 10 of the heat dissipation shell 1, which helps to reduce the flow resistance and ensure that the pin-fin structure 23 is in full contact with the coolant.

[0065] In a further embodiment, referring to Figure 4 、 Figure 5 and Figures 8-10 The density of the pin-fin structures 23 corresponding to the flow channel regions 30 arranged in sequence along the preset direction can be designed to be a structure in which the density increases in sequence. Figure 9 Combine Figure 4 and Figure 5 As shown, the second plate surface 22 has heat dissipation areas 220 arranged in sequence along a preset direction, and the heat dissipation areas correspond to the flow channel areas 30 one by one, and the density of the pin-fin structures 23 corresponding to the heat dissipation areas arranged in sequence along the preset direction increases in sequence. By designing the pin-fin structure 23 on the heat dissipation substrate 2 into the above-mentioned structural form, it helps to achieve a more uniform cooling capacity when the coolant flows through each flow channel area 30. This is because the temperature of the coolant flowing through the flow channel area 30 located upstream is relatively low relative to the temperature of the coolant in the flow channel area 30 located downstream. Therefore, by designing the density of the pin-fin structure 23 in the flow channel area 30 located upstream to be lower and the density of the pin-fin structure 23 in the flow channel area 30 located downstream to be higher, it is more helpful to achieve uniform heat dissipation in different flow channel areas 30. It should be noted that the high and low densities here are relative and do not specifically refer to a certain density.

[0066] In some other specific embodiments, referring to Figures 8-10 As shown, the pin teeth 230 of the pin-fin structure 23 can be specifically designed to be arranged in an alternating staggered manner along a preset direction. By designing this structural form, the coolant can fully contact the pin teeth 230, thereby improving the heat dissipation capacity. Of course, it is understandable that the arrangement of the pin teeth 230 of the pin-fin structure 23 is merely an example of the embodiment of the present application. In actual application, other arrangements can also be designed, as long as the purpose of increasing the heat exchange area can be achieved. No further specific restrictions are made here.

[0067] In a further embodiment, referring to Figures 8-10As shown, the cross section of the needle tooth 230 can be specifically designed to be oblate, and the direction indicated by the long axis of the oblate is the same as the preset direction M. Such a design can ensure that the needle tooth 230 is in full contact with the coolant while minimizing the flow resistance brought by the needle tooth 230. Of course, it is understandable that the cross section of the needle tooth 230 can also be designed to be rhombus, and the direction indicated by one of the symmetry axes of the rhombus is the same as the preset direction. Designing this structural form can also achieve the effect of reducing flow resistance and satisfying the effect of full contact. In addition, the needle tooth 230 can also be designed to have other cross-sectional shapes, such as circular, etc. In actual application, the design can be selected according to actual needs, and no more specific restrictions are made here.

[0068] On the other hand, embodiments of the present application further provide a power device, comprising a power device and a heat sink for dissipating heat from the power device, wherein the heat sink is the heat sink described in any of the above-mentioned solutions. Since the aforementioned heat sink has the aforementioned technical effects, a power device incorporating the heat sink should also have the corresponding technical effects, which will not be further described here.

[0069] In a further embodiment, the power device may be a single motor controller, referring to Figures 1-10 As shown, the heat sink substrate 2 of the heat sink has at least three receiving areas 210, and the single-motor controller has three-phase heat source areas (such as a UNW three-phase heat source device) respectively arranged in three different receiving areas 210. By applying the heat sink to the single-motor controller, heat dissipation uniformity in the three-phase heat source areas can be ensured, thereby maximizing the capacity of the power device.

[0070] Alternatively, the power device may be a dual-motor controller. In this case, the heat sink substrate of the heat sink has at least two receiving areas 210, and the dual-motor controller has two heat source areas, each located in the two different receiving areas 210. By applying the heat sink to the dual-motor controller, uniform heat dissipation across the entire controller can be ensured, maximizing the power device's capabilities.

[0071] It should also be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0072] As used in this application and the claims, unless the context clearly indicates an exception, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular and may include the plural, unless the context clearly indicates otherwise. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements. The phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, product, or apparatus that includes the elements.

[0073] In the description of the embodiments of this application, unless otherwise specified, " / " represents or. For example, A / B can represent A or B. "And / or" in this article is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of this application, "plurality" means two or more than two.

[0074] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A radiator, characterized in that: include: A heat dissipation housing (1) having a liquid inlet (11) and a liquid outlet (12); A heat dissipation substrate (2) having a first plate surface (21) and a second plate surface (22), wherein the first plate surface (21) has at least two receiving areas (210) arranged in sequence along a preset direction for receiving a heat source, and the second plate surface (22) and the heat dissipation housing (1) are enclosed to form a flow channel structure (3) extending along the preset direction, and the flow channel structure (3) has a flow channel area (30) corresponding to the receiving area (210); The flow cross-sectional areas of the flow channel regions (30) arranged in sequence along the preset direction decrease in a step-by-step manner, and the preset direction is a direction extending from the side where the liquid inlet (11) is located to the side where the liquid outlet (12) is located.

2. The radiator according to claim 1, wherein The inner wall of the flow channel of the heat dissipation shell (1) facing the second plate surface (22) is the shell bottom wall (10), the distance between the shell bottom wall (10) and the second plate surface (22) is defined as the flow channel height, and the flow channel heights of the flow channel areas (30) arranged in sequence along the preset direction decrease in steps.

3. The radiator according to claim 2, wherein: The housing bottom wall (10) is configured as a stepped surface, and each step surface of the stepped surface corresponds one-to-one to the flow channel area (30).

4. The radiator according to claim 2, wherein: The second plate surface (22) is configured as a stepped surface, and each step surface of the stepped surface corresponds one-to-one to the flow channel area (30).

5. The radiator according to claim 1, wherein The heat dissipation shell (1) and the heat dissipation substrate (2) are constructed as a split fixed connection structure or an integrally formed structure.

6. The heat sink according to claim 1, wherein The heat dissipation substrate (2) is constructed as a pin-tooth liquid cooling plate, and a densely distributed pin-fin structure (23) is provided on the second plate surface (22).

7. The heat sink according to claim 6, wherein: The density of the pin-fin structures (23) corresponding to the flow channel regions (30) arranged sequentially along the preset direction increases sequentially.

8. The heat sink according to claim 6, wherein: The needle teeth (230) of the needle-fin structure (23) are arranged in an alternating staggered manner along the preset direction.

9. The heat sink according to claim 6, wherein: The cross section of the needle tooth (230) is an oblate circle, and the direction indicated by the major axis of the oblate circle is the same as the preset direction; Alternatively, the cross section of the needle tooth (230) is rhombus-shaped, and a symmetry axis of the rhombus points in the same direction as the preset direction.

10. A power device comprising a power device and a heat sink for dissipating heat from the power device, characterized in that: The radiator is the radiator according to any one of claims 1 to 9.

11. The power device according to claim 10, wherein: The power device is a single motor controller, the heat dissipation substrate (2) of the radiator has at least three receiving areas (210), and the single motor controller has three-phase heat source areas which are respectively arranged in the three different receiving areas (210).

12. The power device according to claim 10, wherein: The power device is a dual-motor controller, the heat dissipation substrate of the radiator has at least two receiving areas (210), and the dual-motor controller has two heat source areas which are respectively arranged in two different receiving areas (210).

Images