Gold wire bonding clamp for multi-P-pin emitter

Abstract

The utility model discloses a gold wire bonding clamp for a multi-P-pin emitter, and the clamp comprises a pedestal which is provided with a placing groove for placing a semi-finished product of the multi-P-pin emitter; and the pressing sheet is detachably connected with the base and is provided with a base capable of clamping the semi-finished product of the multi-P-pin emitter and a deformation groove for pressing the base in the placing groove. The multi-P-pin emitter semi-finished product is placed on the base, the base of the multi-P-pin emitter semi-finished product is clamped through the deformation groove of the pressing piece, finally, the multi-P-pin emitter semi-finished product is fixed through connection of the pressing piece and the base, the multi-P-pin emitter semi-finished product is limited at multiple positions, and the pressing effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of optical device production, in particular to a gold wire bonding fixture for multi-P pin emitters. Background Art

[0002] In the field of optical device manufacturing, during the manufacturing process of transmitter products, the transmitter needs to be wire-bonded with the chip. To ensure the stability of the product during wire bonding, a carrier is usually used to carry the semi-finished multi-P-pin transmitter. However, when working with different wire bonding machines, the product cannot be pressed tightly. Therefore, a multi-P-pin transmitter wire bonding fixture is designed. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a gold wire bonding fixture for a multi-P pin emitter which can be used to press the multi-P pin emitter during gold wire bonding.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solution: a gold wire bonding fixture for a multi-P pin emitter, comprising:

[0005] The base is provided with a placement slot for placing the semi-finished product of the multi-P pin transmitter;

[0006] The pressing sheet is detachably connected to the base and is provided with a base for clamping the semi-finished product of the multi-P pin transmitter and pressing the base tightly into the deformation groove in the placement groove.

[0007] Furthermore, the deformation groove includes a circular groove portion and two strip groove portions respectively arranged on both sides of the circular groove portion, and the two strip groove portions are both connected to the circular groove portion.

[0008] Furthermore, the placement groove includes a first groove portion for placing the P pin of the semi-finished multi-P pin transmitter and a second groove portion for placing the base.

[0009] Furthermore, a plurality of the placement grooves are provided, and the plurality of second groove portions are interconnected.

[0010] Furthermore, the base is provided with a plurality of positioning posts, and the pressing piece is provided with a plurality of sockets that correspond one-to-one with the plurality of positioning posts.

[0011] Furthermore, the pressing sheet is made of a steel sheet with rebound properties.

[0012] Furthermore, the base is provided with a plurality of grooves for placing magnets.

[0013] Furthermore, both sides of the base are respectively provided with long sides for connecting with the gold wire bonding machine.

[0014] Furthermore, the two long sides are arranged at different heights from the base, and the distance between the two long sides is just enough to accommodate the pressing sheet.

[0015] Furthermore, notches are respectively provided on both sides of the base.

[0016] The beneficial effects of the present invention are as follows:

[0017] The utility model discloses a gold wire bonding fixture for a multi-P pin transmitter. The base is provided to place the multi-P pin transmitter semi-finished product. The base of the multi-P pin transmitter semi-finished product is clamped by the deformation groove of the pressing piece. Finally, the multi-P pin transmitter semi-finished product is fixed by connecting the pressing piece and the base. The multi-P pin transmitter semi-finished product is limited at multiple locations, and the pressing effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the structure of the gold wire bonding fixture for multi-P pin emitters of the utility model;

[0019] Figure 2 This is a structural diagram of the multi-P pin transmitter of the utility model.

[0020] The components in the accompanying drawings are marked as follows: 1. Base; 101. Placement slot; 1011. First slot portion; 1012. Second slot portion; 102. Groove; 103. Notch; 2. Pressing piece; 201. Deformation slot; 2011. Circular slot portion; 2012. Strip slot portion; 202. Socket; 3. Positioning column; 4. Along the long side; A. Semi-finished product of multi-P-pin transmitter; A1. Base; A2. P-pin. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0022] See also Figure 1 、 2 .

[0023] The utility model discloses a gold wire bonding fixture for a multi-P pin emitter, comprising:

[0024] The base 1 is provided with a placement slot 101 for placing the semi-finished product A of the multi-P pin transmitter;

[0025] The pressing sheet 2 is detachably connected to the base 1 and is provided with a base A1 capable of clamping the multi-P pin transmitter semi-finished product A and pressing the base A1 tightly against the deformation groove 201 in the placement groove 101 .

[0026] The utility model arranges a base to place the semi-finished product of the multi-P pin transmitter, clamps the base A1 of the semi-finished product A of the multi-P pin transmitter through the deformation groove 201 of the pressing sheet 2, and finally fixes the semi-finished product A of the multi-P pin transmitter through the connection between the pressing sheet 2 and the base 1, limits the semi-finished product A of the multi-P pin transmitter at multiple locations, and has a good pressing effect.

[0027] In one embodiment, see Figure 1 The deformation groove 201 includes a circular groove portion 2011 and two strip groove portions 2012 respectively provided on both sides of the circular groove portion 2011, and both strip groove portions 2012 are connected to the circular groove portion 2011. This design allows the circular groove portion 2011 to deform and securely engage when clamping the base A1.

[0028] In one embodiment, see Figure 1 The placement slot 101 includes a first slot portion 1011 for accommodating the P pins A2 of the multi-P-pin transmitter semi-finished product A, and a second slot portion 1012 for accommodating the base A1. This design provides separate placement areas for the base A1 and the P pins A2, ensuring the stability of the P-pin transmitter semi-finished product A within the placement slot 101. In this embodiment, the first slot portion 1011 can be configured to accommodate the number of P pins in the multi-P-pin transmitter semi-finished product A to be wire-bonded.

[0029] In one embodiment, see Figure 1 The placement slots 101 are provided with multiple, interconnected second slots 1012. This design creates a connecting slot between two adjacent second slots 1012, making it easier to insert tweezers into the bottom of the base A1 when placing and removing the multi-P-pin transmitter semi-finished product A. In this embodiment, multiple corresponding deformation slots 201 are also provided.

[0030] In one embodiment, see Figure 1 The base 1 is further provided with a plurality of positioning posts 3, and the pressing sheet 2 is further provided with a plurality of jacks 202 corresponding to the plurality of positioning posts 3. This design realizes detachable connection through the hole-column structure, and the structure is simple and easy to operate.

[0031] In one embodiment, see Figure 1 The pressing sheet 2 is made of a steel sheet with a rebound property. This design makes the pressing sheet 2 tough and not easy to be damaged.

[0032] In one embodiment, see Figure 1 , the base 1 is also provided with a plurality of grooves 102 for placing magnets. Designed in this way, the pressing piece 2 can be further fixed by placing magnets in the grooves 102, thereby enhancing the stability of the connection between the pressing piece 2 and the base and facilitating removal.

[0033] In one embodiment, see Figure 1 The base 1 is also provided with two sides along the long side 4 for connecting to the wire bonder. In this embodiment, the wire bonder can be a Kaijo bonding machine or a KNS bonding machine, and the long side 4 is connected to the bonding machine to achieve a limited locking connection. This is a prior art and the details are not repeated in detail.

[0034] In one embodiment, see Figure 1 The two long sides 4 are arranged at different heights relative to the base 1, and the distance between the two long sides 4 is just enough to accommodate the pressing piece 2. This design allows the two long sides 4 to not only connect with the gold wire bonding machine, but also serve as a pre-positioning structure for connecting the pressing piece 2 to the base 1.

[0035] In one embodiment, see Figure 1 , notches 103 are also respectively provided on both sides of the base 1. This design can reduce the quality of the base 1.

[0036] It should be understood that the examples and implementation methods described herein are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art may make various modifications or changes based on them. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0037] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the various components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indications will also change accordingly.

[0038] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or schemes in which A and B are satisfied at the same time. In addition, "multiple" refers to more than two. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A multi-P pin emitter gold wire bonding fixture, characterized in that: include: The base (1) is provided with a placement slot (101) for placing the multi-P pin transmitter semi-finished product (A); The pressing sheet (2) is detachably connected to the base (1) and is provided with a base (A1) capable of clamping the multi-P pin transmitter semi-finished product (A), and pressing the base (A1) tightly against the deformation groove (201) in the placement groove (101).

2. The gold wire bonding fixture for multi-P pin transmitter according to claim 1, characterized in that: The deformation groove (201) comprises a circular groove portion (2011) and two strip-shaped groove portions (2012) respectively arranged on both sides of the circular groove portion (2011), and both of the strip-shaped groove portions (2012) are in communication with the circular groove portion (2011).

3. The gold wire bonding fixture for multi-P pin transmitter according to claim 1, characterized in that: The placement groove (101) comprises a first groove portion (1011) for placing the P pin (A2) of the multi-P pin transmitter semi-finished product (A) and a second groove portion (1012) for placing the base (A1).

4. The gold wire bonding fixture for multi-P pin transmitter according to claim 3, characterized in that: A plurality of the placement grooves (101) are provided, and the plurality of second groove portions (1012) are interconnected.

5. The gold wire bonding fixture for multi-P pin transmitter according to claim 1, characterized in that: The base (1) is also provided with a plurality of positioning posts (3), and the pressing sheet (2) is also provided with a plurality of sockets (202) corresponding one-to-one with the plurality of positioning posts (3).

6. The gold wire bonding fixture for multi-P pin emitters according to any one of claims 1 to 5, characterized in that: The pressing sheet (2) is made of a steel sheet with rebound properties.

7. The gold wire bonding fixture for multi-P pin transmitter according to claim 6, characterized in that: The base (1) is also provided with a plurality of grooves (102) for accommodating magnets.

8. The gold wire bonding fixture for multi-P pin transmitter according to claim 1, characterized in that: Both sides of the base (1) are also provided with long sides (4) respectively connected to the gold wire bonding machine.

9. The gold wire bonding fixture for multi-P pin transmitter according to claim 8, characterized in that: The two long sides (4) and the base (1) are arranged at different heights, and the distance between the two long sides (4) is just enough to accommodate the pressing sheet (2).

10. The gold wire bonding fixture for multi-P pin transmitter according to claim 1, characterized in that: Notches (103) are also respectively provided on both sides of the base (1).

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