Chip cutting device

Abstract

The utility model provides a chip cutting device, which relates to the technical field of chip cutting and comprises a bottom box, a first fixing rod, a base, a first lead screw, a first motor, a second motor, a vacuum sucker, a sucker nozzle, a fixing disc, a housing, a second fixing rod, a sliding seat, a second lead screw and a third motor. A cutting blade is arranged at the output end of the fourth motor, a balance weight water tank is arranged at the other end of the sliding seat, an electromagnetic valve is arranged on the balance weight water tank, two spraying pipes are arranged on the electromagnetic valve, and the two spraying pipes are located on the two sides of the cutting blade correspondingly. And by moving the fixed disc, the fixed disc is moved to the outside of the housing, so that the wafer is convenient to place, the cutting disc does not influence the placement of the wafer, the placement and cutting efficiency is improved, and the use effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of chip cutting, in particular to a chip cutting device. Background Art

[0002] In the process of making chips, the wafer needs to be cut (diced). The cutting produces grooves with a certain depth and width distributed vertically and horizontally on the wafer. After the wafer is cut, the wafer is separated into multiple semi-finished chips along the grooves produced by the cutting. The cutting of the grooves requires the use of a cutting device. When the existing cutting device is in use, the wafer is cut by moving the cutting tool up and down and horizontally. However, since the base for placing the wafer is always located below the cutting tool, the placement of the wafer is not convenient and is easily affected by the cutting tool, thereby affecting the wafer placement and cutting efficiency. Utility Model Content

[0003] The purpose of the present invention is to provide a chip cutting device, aiming to solve the problems mentioned in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model adopts the following technical solution: the chip cutting device includes a bottom box, two first fixing rods are symmetrically arranged inside the bottom box, a base is slidably connected to the two first fixing rods, a first screw threadedly connected to the base is arranged inside the bottom box, a first motor for driving the first screw to rotate is arranged outside the bottom box, the upper end of the base is open, a second motor is arranged inside the base, a vacuum suction cup is arranged at the upper end of the base, the output end of the second motor is fixedly connected to the vacuum suction cup, a suction cup nozzle is arranged on the vacuum suction cup, a fixed disk is arranged on the vacuum suction cup, and the fixed disk A through hole is provided, and the suction cup nozzle is located in the through hole of the fixed plate, and a cover shell is provided on one side of the upper end of the bottom box, and two second fixed rods are symmetrically provided inside the cover shell, and also includes a slide seat slidably connected to the two fixed rods, and a second screw threadedly connected to the slide seat is provided inside the cover shell, and a third motor for driving the second screw to rotate is provided outside the cover shell, a fourth motor is provided at one end of the slide seat, and a cutting blade is provided at the output end of the fourth motor, and a counterweight water tank is provided at the other end of the slide seat, and a solenoid valve is provided on the counterweight water tank, and two spray pipes are provided on the solenoid valve, and the two spray pipes are respectively located on both sides of the cutting blade.

[0005] Preferably, a groove is provided at the center of the upper end of the fixed disk, a compressible silicone pad is provided inside the groove, the silicone pad is provided with an air hole that communicates with the through hole on the fixed disk, and the upper end of the silicone pad is located outside the groove.

[0006] Preferably, a limiting plate is provided on the other side of the upper end of the bottom box, and an arc-shaped groove is opened on one side of the limiting plate.

[0007] Preferably, the height of the arc-shaped groove is greater than the height of the portion of the silicone pad protruding outside the groove when it is not compressed.

[0008] Preferably, the cover is made of transparent material.

[0009] The beneficial effects of the utility model are:

[0010] When the device is in use, the height of the cutting blade will not change, and it can only move back and forth in a straight line along the second lead screw. By moving the fixed plate, the fixed plate is moved to the outside of the cover, thereby facilitating the placement of the wafer. The cutting blade will not affect the placement of the wafer, thereby improving the placement and cutting efficiency and having a good use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural schematic diagram of a specific embodiment of the utility model.

[0012] Figure 2 It is a structural diagram of a silicone pad.

[0013] Figure 3 This is a schematic diagram of the internal structure of the base.

[0014] Figure 4 This is a top view of the bottom box.

[0015] Figure 5 This is a schematic diagram of the positions of the spray pipe and cutting disc.

[0016] In the figure: 1. Wafer; 2. Bottom box; 3. First fixing rod; 4. Base; 5. First screw; 6. First motor; 7. Second motor; 8. Vacuum suction cup; 9. Suction cup nozzle; 10. Fixed plate; 11. Cover; 12. Second fixing rod; 13. Slide; 14. Second screw; 15. Third motor; 16. Fourth motor; 17. Cutting disc; 18. Counterweight water tank; 19. Solenoid valve; 20. Spray pipe; 21. Silicone pad; 22. Limit plate. DETAILED DESCRIPTION

[0017] The specific embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0018] like Figure 1-5As shown, a chip cutting device includes a bottom box 2, two first fixing rods 3 are symmetrically arranged inside the bottom box 2, a base 4 is slidably connected to the two first fixing rods 3, a first screw 5 threadedly connected to the base 4 is arranged inside the bottom box 2, a first motor 6 for driving the first screw 5 to rotate is arranged outside the bottom box 2, the upper end of the base 4 is open, a second motor 7 is arranged inside the base 4, a vacuum suction cup 8 is arranged at the upper end of the base 4, the output end of the second motor 7 is fixedly connected to the vacuum suction cup 8, a suction cup nozzle 9 is provided on the vacuum suction cup 8, a fixing plate 10 is provided on the vacuum suction cup 8, a through hole is provided on the fixing plate 10, and the suction cup nozzle 9 is located in the through hole of the fixing plate 10 A cover shell 11 is provided on one side of the upper end of the bottom box 2. Two second fixed rods 12 are symmetrically provided inside the cover shell 11, and a slide 13 is also provided with the two fixed rods in a sliding connection. A second screw 14 is provided inside the cover shell 11 and is threadedly connected to the slide 13. A third motor 15 for driving the second screw 14 to rotate is provided on the outside of the cover shell 11. A fourth motor 16 is provided at one end of the slide 13, and a cutting blade 17 is provided at the output end of the fourth motor 16. A counterweight water tank 18 is provided at the other end of the slide 13, and an electromagnetic valve 19 is provided on the counterweight water tank 18. Two spray pipes 20 are provided on the electromagnetic valve 19, and the two spray pipes 20 are respectively located on both sides of the cutting blade 17.

[0019] When cutting the wafer 1, first place the wafer 1 to be cut on the fixed plate 10, then start the vacuum suction cup 8, which adsorbs the wafer 1 on the fixed plate 10 through the suction cup mouth and the through hole on the fixed plate 10, then start the first motor 6, which drives the first screw 5 to rotate, and the first screw 5 is connected to the base 4 through the threaded connection, and the base 4 is connected to the first fixed rod 3 through the sliding connection, so that the base 4 can move linearly along the first screw 5. When the fixed plate 10 enters the cover 11 from the upper end of the bottom box 2 When the first cutting position is reached, the first motor 6 stops working, and the third motor 15 and the fourth motor 16 are started. The third motor 15 drives the second lead screw 14 to rotate, and the second lead screw 14 is connected to the slide 13 through a thread, and the slide 13 is slidably connected to the second fixed rod 12, so that the slide 13 can move linearly along the second lead screw 14. At the same time, the fourth motor 16 drives the cutting blade 17 to rotate rapidly, and the cutting blade 17 cuts the wafer 1 on the fixed plate 10 to cut a groove of a certain depth. At the same time, the weight water The box 18 is connected to an external deionized water source, and water enters the counterweight water tank 18 and is sprayed to the position where the cutting blade 17 is cutting through the electromagnetic valve 19 and the spray pipe 20. After completing the cutting of a single groove, the first motor 6 controls the base 4 to continue to move a certain distance into the cover 11, and the third motor 15 controls the slide 13 to move in the opposite direction to continue grooving the wafer 1. By continuously controlling the movement of the base 4 and the repeated movement of the slide 13, the wafer 1 is grooved. When all the cutting is completed in one direction of the wafer 1, the groove is cut. After the groove is formed, the second motor 7 is started. The second motor 7 drives the vacuum suction cup 8 and the fixed plate 10 on the vacuum suction cup 8 to rotate, thereby driving the wafer 1 on the fixed plate 10 to rotate and rotate it 90°. Then, the first motor 6 controls the base 4 to intermittently move toward the outside of the cover 11, and at the same time continues to drive the cutting blade 17 to move back and forth through the third motor 15 to continuously cut the wafer 1, thereby realizing the cutting of the wafer 1. When the wafer 1 is cut, the wafer 1 is completely moved out from the inside of the cover 11 to the outside of the cover 11.

[0020] Furthermore, a groove is provided at the center position of the upper end of the fixed disk 10, and a compressible silicone pad 21 is provided inside the groove. The silicone pad 21 is provided with an air hole that is connected to the through hole on the fixed disk 10, and the upper end of the silicone pad 21 is located outside the groove. When the wafer 1 is placed on the silicone pad 21, there is a certain distance between the lower surface of the wafer 1 and the fixed disk 10, which is convenient for controlling and adjusting the wafer 1. After the wafer 1 is placed, the vacuum suction cup 8 is started, and the suction force generated will cause the wafer 1 to squeeze the silicone pad 21 and make the wafer 1 abut against the fixed disk 10. Since the shortest distance between the horizontal plane where the lower end of the cutting blade 17 is located and the horizontal plane where the upper surface of the fixed disk 10 is located is fixed, when the wafer 1 is fixed on the fixed disk 10, the cutting depth on the wafer 1 can be made the same, thereby improving the cutting stability.

[0021] Furthermore, a limiting plate 22 is provided on the other side of the upper end of the bottom box 2, and an arc-shaped groove is opened on one side of the limiting plate 22. When placing the wafer 1, the placement efficiency of the wafer 1 can be improved by the provided arc-shaped groove, and the cutting device can be used in conjunction with the visual system. After the wafer 1 is fixed to the fixed plate 10, the visual system is used to observe whether the placement of the wafer 1 is tilted and the tilt angle. After measuring the tilt angle, the second motor 7 can be controlled to rotate the corresponding angle, so that the wafer 1 can be placed accurately to facilitate accurate cutting by the cutting blade 17.

[0022] Furthermore, the height of the arc groove is greater than the height of the part of the silicone pad 21 protruding outside the groove when it is not compressed. When the wafer 1 is placed on the silicone pad 21, there is no need to press down the silicone pad 21. The arc groove can always limit the wafer 1, thereby improving the convenience of placing the wafer 1.

[0023] Furthermore, the cover 11 is made of a transparent material, and the cover 11 is made of plastic.

[0024] When the device is in use, the height of the cutting blade 17 will not change, and it can only move back and forth in a straight line along the second screw 14. By moving the fixed plate 10, the fixed plate 10 is moved to the outside of the cover 11, thereby facilitating the placement of the wafer 1. The cutting blade 17 will not affect the placement of the wafer 1, thereby improving the placement and cutting efficiency and having a good use effect.

[0025] In the description of this utility model, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on the specific circumstances.

Claims

1. A chip cutting device, characterized in that: The invention comprises a bottom box, wherein two first fixing rods are symmetrically arranged inside the bottom box, a base is slidably connected to the two first fixing rods, a first lead screw threadedly connected to the base is arranged inside the bottom box, a first motor for driving the first lead screw to rotate is arranged outside the bottom box, the upper end of the base is open, a second motor is arranged inside the base, a vacuum suction cup is arranged at the upper end of the base, an output end of the second motor is fixedly connected to the vacuum suction cup, a suction cup nozzle is arranged on the vacuum suction cup, a fixed disk is arranged on the vacuum suction cup, a through hole is arranged on the fixed disk, and the suction cup nozzle is located in the through hole of the fixed disk. A cover is provided on one side of the upper end of the bottom box, and two second fixed rods are symmetrically provided inside the cover, and the cover also includes a slide slidably connected to the two fixed rods, a second screw threadedly connected to the slide is provided inside the cover, and a third motor for driving the second screw to rotate is provided outside the cover, and the slide can move linearly along the second screw, a fourth motor is provided at one end of the slide, and a cutting blade is provided at the output end of the fourth motor, and a counterweight water tank is provided at the other end of the slide, and an electromagnetic valve is provided on the counterweight water tank, and two spray pipes are provided on the electromagnetic valve, and the two spray pipes are respectively located on both sides of the cutting blade.

2. The chip cutting device according to claim 1, wherein: A groove is provided at the center of the upper end of the fixing plate, a compressible silicone pad is provided inside the groove, an air hole is provided on the silicone pad that is connected to the through hole on the fixing plate, and the upper end of the silicone pad is located outside the groove.

3. The chip cutting device according to claim 2, wherein: A limiting plate is provided on the other side of the upper end of the bottom box, and an arc groove is opened on one side of the limiting plate.

4. The chip cutting device according to claim 3, wherein: The height of the arc-shaped groove is greater than the height of the portion of the silicone pad protruding outside the groove when it is not compressed.

5. The chip cutting device according to any one of claims 1 to 4, characterized in that: The cover is made of transparent material.

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