Quantitative packaging device for electronic element processing

The design of the limiting component and the discharge component solves the stability and control problems of the packaging barrel during rotation, realizes the uniform and accurate packaging of electronic components, and improves the stability and efficiency of the packaging device.

CN223396474UActive Publication Date: 2025-09-30SUZHOU ASEN SEMICON CO LTD
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Patent Information

Application Number
CN202422718276.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-09-30
Estimated Expiration
2034-11-08

AI Technical Summary

Technical Problem

The existing quantitative packaging device for electronic component processing cannot ensure the stability of the packaging barrel during the packaging process, which easily leads to deviation and lacks an effective control mechanism, affecting the accuracy and efficiency of packaging.

Method used

The limit assembly and discharge assembly are used to drive the packaging barrel to rotate through the driven gear, and the stability of the packaging barrel is ensured by the limit plate and the insertion rod. At the same time, the linkage mechanism is used to control the opening and closing of the feed barrel to achieve quantitative packaging.

Benefits of technology

It improves the stability of the packaging barrel and the accuracy of packaging, ensures that electronic components fall into the packaging barrel evenly and accurately, and improves packaging efficiency and convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a quantitative packaging device for electronic component processing, which belongs to the technical field of electronic component packaging and comprises a packaging barrel used for storing and packaging electronic components, and the packaging barrel is provided with a placing groove used for placing the electronic components. The frame is used for placing a packaging barrel; the rotating assembly comprises a driven gear rotationally connected into the frame and used for placing a packaging barrel; the limiting assembly comprises a limiting plate which is fixedly connected to the driven gear and used for limiting the packaging barrel; the discharging assembly comprises a feeding barrel arranged above the packaging barrel and used for discharging materials into the containing groove and a linkage mechanism used for shielding the feeding barrel when the materials are not discharged, and the packaging barrel can be fixedly connected to a driven gear through a limiting plate and an inserting rod arranged on the driven gear and an inserting groove formed in the packaging barrel; and then when the driving gear is rotated, the packaging barrel is driven by the driven gear to rotate, so that the stability of the packaging barrel during rotation can be ensured, and the packaging barrel is prevented from shifting during quantitative packaging.
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Description

Technical Field

[0001] The utility model relates to the technical field of electronic component packaging, in particular to a quantitative packaging device for processing electronic components. Background Art

[0002] Quantitative packaging is a crucial step in the production and processing of electronic components. Traditional electronic component packaging methods often rely on manual operations, which is not only inefficient but also difficult to ensure packaging accuracy and consistency. With the continuous development of automation technology, quantitative packaging of electronic components is gradually moving towards automation and intelligentization.

[0003] However, existing quantitative packaging devices for electronic component processing still have some shortcomings. For example, some devices fail to maintain the stability of the packaging barrel during the packaging process, which can easily cause the barrel to shift during rotation, affecting packaging accuracy and efficiency. Furthermore, some devices lack effective control mechanisms during the discharge process, making it impossible to ensure that electronic components are evenly and accurately dropped into the packaging barrel. Utility Model Content

[0004] The utility model solves the technical problems in the above-mentioned background technology and provides a quantitative packaging device for processing electronic components.

[0005] In order to solve the above technical problems, the technical solutions provided by the present invention are as follows:

[0006] A quantitative packaging device for processing electronic components, comprising:

[0007] A packaging barrel is used to store and package electronic components, and the packaging barrel is provided with a placement slot for placing the electronic components;

[0008] Frame for placing packaging barrels;

[0009] A rotating assembly including a driven gear rotatably connected to a frame for placing the packaging barrel;

[0010] A limiting assembly, comprising a limiting plate fixed to the driven gear for limiting the position of the packaging barrel;

[0011] The material discharge component comprises a material feed barrel arranged above the packaging barrel for discharging materials into the placement groove and a linkage mechanism for shielding the material feed barrel when no materials are discharged.

[0012] Preferably, the rotating assembly further includes:

[0013] The driving gear meshes with the driven gear to drive the driven gear to rotate and thus rotate the packaging barrel;

[0014] The mounting groove is arranged on one side of the frame and the driving gear penetrates and is rotatably connected in the mounting groove.

[0015] Preferably, the placement slots are provided in five groups and are evenly distributed on the packaging barrel.

[0016] Preferably, the limiting component further includes:

[0017] An insert rod is fixed to the middle of the limiting plate and is used to be inserted into the packaging barrel to limit the packaging barrel;

[0018] A slot is arranged at the bottom of one side of the packaging barrel and the insertion rod slides in the slot.

[0019] Preferably, the inner wall of the limiting plate is in contact with the outer wall of the packaging barrel, and the limiting plate is arc-shaped.

[0020] Preferably, the discharge assembly further comprises:

[0021] The placement rack is fixed to the top side of the feed barrel and is used to place the resistor element and slide it into the feed barrel.

[0022] The mounting frame is fixedly connected to the top of the frame, and the feed barrel passes through and is fixedly connected to the mounting frame.

[0023] Preferably, the linkage mechanism includes:

[0024] A sliding rod, sliding through the frame;

[0025] The baffle is fixed to the sliding rod and fits on the top of the packaging barrel and the bottom of the feeding barrel to limit the electronic components that slide down in the feeding barrel;

[0026] The spring is sleeved on the sliding rod and is used to drive the sliding rod and the baffle to reset.

[0027] Preferably, the placement rack is tilted, the diameters of the feed barrel, the placement rack and the placement slot are consistent, the sliding rod is attached to one side of the packaging barrel, and the shape of the sliding rod attached to the side of the packaging barrel is hemispherical, one end of the spring is fixed to the frame, and the other end of the spring is fixed to the baffle

[0028] With the above structure, the utility model has the following advantages:

[0029] 1. The packaging barrel can be fixed to the driven gear through the limiting plate and the insertion rod provided on the driven gear and the slot provided on the packaging barrel. Then, when the driving gear is rotated, the packaging barrel is driven to rotate through the driven gear, which can ensure the stability of the packaging barrel during rotation and avoid the packaging barrel from shifting during quantitative packaging, thereby improving the convenience of the device.

[0030] 2. When the packaging barrel is not placed on the driven gear, the baffle closes the bottom of the feed barrel to prevent the electronic components in the feed barrel from slipping out. After the packaging barrel is placed, the sliding rod will push the baffle to no longer close the bottom of the feed barrel, thereby achieving quantitative packaging and improving the practicality of the device.

[0031] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 This is a schematic diagram of the structure of a quantitative packaging device for electronic components processing in this utility model. Figure 1 ;

[0034] Figure 2 This is a schematic diagram of the structure of a quantitative packaging device for electronic components processing in this utility model. Figure 2 ;

[0035] Figure 3 This is a partial structural exploded diagram of a quantitative packaging device for processing electronic components of the utility model;

[0036] Figure 4 yes Figure 2 A in the enlarged view.

[0037] As shown in the figure: 1. Packaging barrel; 101. Placement slot; 2. Frame; 301. Driven gear; 302. Driving gear; 303. Mounting slot; 401. Limiting plate; 402. Insert rod; 403. Slot; 501. Feed barrel; 502. Placement rack; 503. Mounting rack; 601. Sliding rod; 602. Baffle; 603. Spring. DETAILED DESCRIPTION

[0038] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0040] The following is a further detailed description of the present invention in conjunction with the full text:

[0041] Example 1:

[0042] Combined with attachment Figures 1 to 4 This embodiment provides a quantitative packaging device for processing electronic components, including a packaging barrel 1 for storing and packaging electronic components. The packaging barrel 1 is provided with a placement groove 101 for placing electronic components, and also includes a frame 2 for placing the packaging barrel 1.

[0043] As a preferred embodiment, five groups of placement slots 101 are provided and evenly distributed on the packaging barrel 1 .

[0044] It should be noted that the placement groove 101 is cylindrical in shape. This device packages cylindrical electronic components such as capacitors, and the radius of the electronic components needs to be greater than half the diameter of the feed barrel 501.

[0045] In order to drive the packaging barrel 1 to rotate for quantitative packaging, a rotating assembly is arranged. The rotating assembly includes a driven gear 301 rotatably connected to the frame 2 for placing the packaging barrel 1.

[0046] As a preferred embodiment, the rotating assembly also includes: a driving gear 302, which is engaged with the driven gear 301 to drive the driven gear 301 to rotate and thereby rotate the packaging barrel 1; a mounting groove 303, which is arranged on one side of the frame 2 and the driving gear 302 is rotatably connected to the mounting groove 303.

[0047] It should be noted that after the packaging barrel 1 is placed on the driven gear 301 , the driven gear 301 can be rotated by rotating the driving gear 302 .

[0048] Example 2:

[0049] On the basis of Example 1, in order to ensure that the packaging barrel 1 rotates stably, a limiting assembly is arranged. The limiting assembly includes a limiting plate 401 fixed to the driven gear 301 for limiting the packaging barrel 1 .

[0050] As a preferred embodiment, the limiting assembly also includes: an insertion rod 402, fixed to the middle part of the limiting plate 401 for inserting into the packaging barrel 1 to limit the packaging barrel 1; a slot 403, arranged at the bottom of one side of the packaging barrel 1 and the insertion rod 402 slides in the slot 403.

[0051] As a preferred embodiment, the inner wall of the limiting plate 401 is in contact with the outer wall of the packaging barrel 1 , and the limiting plate 401 is arc-shaped.

[0052] It should be noted that when the limiting plate 401 is located inside the frame 2, the front end of the driven gear 301 is not blocked. When the packaging barrel 1 is placed on the driven gear 301 and the insertion rod 402 of the packaging barrel 1 is pushed and inserted into the slot 403, the packaging barrel 1 can be stably driven to rotate while the driven gear 301 is rotated.

[0053] Example 3:

[0054] On the basis of Examples 1 and 2, a radiotherapy component is arranged to facilitate uniform discharge of materials into the packaging barrel 1. The discharge component includes a feed barrel 501 arranged above the packaging barrel 1 for discharging materials into the placement groove 101 and a linkage mechanism for covering the feed barrel 501 when no materials are discharged.

[0055] As a preferred embodiment, the discharge assembly also includes: a placement rack 502, fixed to the top side of the feed barrel 501 for placing the resistance element to slide into the feed barrel 501; a mounting rack 503, fixed to the top of the frame 2 and the feed barrel 501 is fixed to the mounting rack 503.

[0056] It should be noted that the mounting rack 503 is U-shaped, and the feed bucket 501 is located directly above the placement slot 101. When several groups of electronic components are placed on the placement rack 502, they will slide evenly into the feed bucket 501 and be transported to the placement slot 101 in the packaging barrel 1. The placement rack 502 can be extended to place several groups of electronic components.

[0057] As a preferred embodiment, the linkage mechanism includes: a sliding rod 601 that slides through the frame 2; a baffle 602 that is fixed to the sliding rod 601 and fits the top of the packaging barrel 1 and the bottom of the feed barrel 501; a limiting spring 603 for electronic components that slip out of the feed barrel 501, which is sleeved on the sliding rod 601 and drives the sliding rod 601 and the baffle 602 to reset.

[0058] It should be noted that when the packaging barrel 1 is not placed on the driven gear 301, the baffle 602 is attached to the bottom of the feed barrel 501 and completely closes the feed barrel 501, so that the electronic components are not transported. When the packaging barrel 1 is placed on the driven gear 301, the sliding rod 601 will be pushed and the baffle 602 will be driven to move. At this time, the electronic components in the feed barrel 501 fall into the placement slot 101 below.

[0059] As a preferred embodiment, the placement rack 502 is set at an angle, the diameters of the feed barrel 501, the placement rack 502 and the placement groove 101 are consistent, the sliding rod 601 is attached to one side of the packaging barrel 1, and the shape of the sliding rod 601 attached to one side of the packaging barrel 1 is hemispherical, one end of the spring 603 is fixed to the frame 2, and the other end of the spring 603 is fixed to the baffle 602.

[0060] It should be noted that the hemispherical shape can ensure that the sliding rod 601 always fits the packaging barrel 1 when the packaging barrel 1 rotates and will not limit the rotation of the frame 2. The width of the baffle 602 needs to be greater than the width of the feed barrel 501.

[0061] The operation steps are as follows: the operator places several groups of electronic components on the placement rack 502. The first group of placed electronic components will fall into the feed bucket 501 and be blocked by the baffle 602. Then the packaging bucket 1 is placed on the driven gear 301 and the packaging bucket 1 is pushed to insert the insertion rod 402 into the slot 403. At this time, the packaging bucket 1 will push the sliding rod 601 to slide outward to stretch the spring 603, and drive the baffle 602 to no longer fit the bottom of the feed bucket 501. At this time, the first group of electronic components falls into the placement slot 101, and then the driving gear 302 is rubbed to rotate and drive the driven gear 301 to rotate in the frame 2, so that the driven gear 301 drives the packaging bucket 1 to rotate, and five groups of electronic components fall into the placement slot 101 in turn. After a group of packaging buckets 1 has collected the electronic components, the packaging bucket 1 is directly taken out. At this time, under the action of the spring 603, the baffle 602 will be driven to reset to close the bottom of the feed bucket 501, and then the operation is carried out in sequence to package the electronic components.

[0062] The above description of the present invention and its embodiments is non-limiting. What is shown in the full text is only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if a person skilled in the art is inspired by this and, without departing from the purpose of the present invention, designs a structure and embodiment similar to the technical solution without creatively designing, they shall fall within the scope of protection of the present invention.

Claims

1. A quantitative packaging device for processing electronic components, characterized by: include: A packaging barrel (1) is used for storing and packaging electronic components, and the packaging barrel (1) is provided with a placement groove (101) for placing the electronic components; A frame (2) for placing the packaging barrel (1); A rotating assembly, comprising a driven gear (301) rotatably connected to a frame (2) for placing the packaging barrel (1); A limiting assembly, comprising a limiting plate (401) fixedly connected to the driven gear (301) and used for limiting the packaging barrel (1); The material discharge assembly comprises a material feed barrel (501) arranged above the packaging barrel (1) for discharging material into the placement groove (101) and a linkage mechanism for shielding the material feed barrel (501) when no material is discharged.

2. The electronic component processing quantitative packaging device according to claim 1, characterized in that: The rotating assembly further includes: The driving gear (302) is meshed with the driven gear (301) to drive the driven gear (301) to rotate and thus rotate the packaging barrel (1); The mounting groove (303) is arranged on one side of the frame (2) and the driving gear (302) is rotatably connected to the mounting groove (303).

3. The electronic component processing quantitative packaging device according to claim 2, characterized in that: The placement slots (101) are provided in five groups and are evenly distributed on the packaging barrel (1).

4. The electronic component processing quantitative packaging device according to claim 3, characterized in that: The inner wall of the limiting plate (401) is in contact with the outer wall of the packaging barrel (1), and the limiting plate (401) is in an arc shape.

5. The electronic component processing quantitative packaging device according to claim 4, characterized in that: The discharge assembly further comprises: The placement rack (502) is fixed to one side of the top of the feed barrel (501) and is used to place the resistor element and slide it into the feed barrel (501). The mounting frame (503) is fixed to the top of the frame (2) and the feed barrel (501) is passed through and fixed to the mounting frame (503).

6. The electronic component processing quantitative packaging device according to claim 5, characterized in that: The linkage mechanism comprises: A sliding rod (601) is inserted and slidably connected to the frame (2); The baffle (602) is fixed to the sliding rod (601) and is attached to the top of the packaging barrel (1) and the bottom of the feeding barrel (501) to limit the electronic components that slide down in the feeding barrel (501); The spring (603) is sleeved on the sliding rod (601) and is used to drive the sliding rod (601) and the baffle (602) to reset.

7. The electronic component processing quantitative packaging device according to claim 6, characterized in that: The placement rack (502) is tilted, the diameters of the feed barrel (501), the placement rack (502) and the placement slot (101) are consistent, the sliding rod (601) is attached to one side of the packaging barrel (1), and the shape of the sliding rod (601) attached to one side of the packaging barrel (1) is hemispherical, one end of the spring (603) is fixed to the frame (2), and the other end of the spring (603) is fixed to the baffle (602).