Circuit board carrying frame and circuit board conveying device
By designing a circuit board holder with multiple sizes of bayonet, the problems of high cost and low space utilization caused by the customization of circuit board holders in the existing technology are solved, and the orderly stacking and efficient transportation of circuit boards of various sizes are achieved.
Patent Information
- Application Number
- CN202423038476.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-12-09
AI Technical Summary
Existing circuit board carriers are usually customized for a single size of circuit board, resulting in high cost and low space utilization.
A circuit board support rack is designed. By setting different sizes of bayonet holes and stacking them in sequence, it can support circuit boards of various sizes, reducing the number and cost of support racks.
It enables orderly stacking of circuit boards of various sizes, reduces costs, improves space utilization and the applicability of automated processes, and enhances transportation efficiency.
Smart Images
Figure CN223396574U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to circuit board transportation equipment, and in particular to a circuit board carrier and a circuit board transportation device. Background Art
[0002] In the existing technology, the carriers used in the automated processing of circuit boards are often customized for the processed circuit boards. Even if there are multiple circuit boards that need to be transported in the same production line, the circuit board carriers used to transport the circuit boards are also customized one by one, which leads to increased costs. In addition, the storage of the circuit board carriers when they are idle also requires a large amount of space, thereby reducing the utilization of space. Utility Model Content
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a circuit board carrier that can support circuit boards of multiple sizes on the same circuit board carrier, thereby reducing the number of circuit board carriers required and thus reducing costs.
[0004] The present application also provides a circuit board transport device having the above-mentioned circuit board carrier.
[0005] According to the first embodiment of the present application, a circuit board carrier includes:
[0006] a first supporting frame, wherein the first supporting frame is provided with a first bayonet;
[0007] a second carrier, the second carrier being provided with a second bayonet, wherein the area of the second bayonet is larger than the area of the first bayonet;
[0008] The third bracket is provided with a third bayonet, the area of the third bayonet is larger than the area of the second bayonet, the first bracket, the second bracket and the third bracket are stacked in sequence from bottom to top, the second bayonet is located directly above the first bayonet, and the third bayonet is located directly above the second bayonet, the first bayonet, the second bayonet and the third bayonet are used to clamp circuit boards of different sizes, and the side walls of the first bayonet, the side walls of the second bayonet and the side walls of the third bayonet form a step.
[0009] The circuit board holder according to the embodiment of the present application has at least the following beneficial effects: by setting the first bracket, the second bracket and the third bracket of different sizes, the supporting function of circuit boards of various sizes is realized, thereby reducing costs; by stacking the first bracket, the second bracket and the third bracket in sequence from bottom to top, and arranging the sizes of the brackets from small to large from bottom to top, the orderly stacking of various circuit boards is realized, thereby making it more suitable for automated processes.
[0010] According to some embodiments of the present application, a base frame is further provided, which is arranged on a side of the first support frame away from the second support frame and connected to the first support frame, the base frame is provided with a first groove, the first support frame is provided with a first notch, the first notch is provided on the side wall of the first bayonet and is connected to the first bayonet, the second support frame is provided with a second notch, the second notch is provided on the side wall of the second bayonet and is connected to the second bayonet, and the first notch is provided between the second notch and the first groove.
[0011] According to some embodiments of the present application, the first supporting frame, the second supporting frame, the third supporting frame and the base frame are an integrated structure.
[0012] According to some embodiments of the present application, the base frame is further provided with a first through opening, the first through opening is provided directly below the first bayonet, and the first groove is provided on a side wall of the first through opening.
[0013] According to some embodiments of the present application, the base frame is also provided with a support frame, which is arranged in the first through opening and divides the first through opening into four identical areas. The support frame is provided with a first protrusion on the side close to the first bayonet, and the first protrusion is used to engage with the groove on the circuit board.
[0014] According to some embodiments of the present application, a second groove is provided on the side wall of the one-piece structure.
[0015] According to some embodiments of the present application, the base frame is further provided with a second opening, and there are eight second openings. The second openings are grouped in pairs and are respectively provided on four sides of the first opening.
[0016] According to some embodiments of the present application, the base frame is further provided with a third opening, and the third opening is provided between the two second openings in the same group.
[0017] According to some embodiments of the present application, the chassis is coated with an insulating layer.
[0018] According to the second embodiment of the present application, a circuit board transporting device includes:
[0019] A circuit board carrier according to the first embodiment of the present application.
[0020] The circuit board transport device according to the embodiment of the present application has at least the following beneficial effects: by setting the first bayonet, the second bayonet and the third bayonet of different sizes, the supporting function of circuit boards of various sizes is realized, thereby reducing costs; by stacking the first bracket, the second bracket and the third bracket in sequence from bottom to top, and arranging the sizes of the bayonet from small to large from bottom to top, orderly stacking of various circuit boards is realized, making it more suitable for automated processes; by using the circuit board bracket of the present application, the working efficiency of the circuit board transport device is improved.
[0021] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0023] Figure 1 A schematic diagram of a circuit board carrier according to an embodiment of the present application;
[0024] Figure 2 for Figure 1 A schematic diagram of another perspective of the circuit board carrier is shown;
[0025] Figure 3 A schematic diagram of a chassis according to an embodiment of the present application;
[0026] Figure 4 A schematic diagram of a third carrier according to an embodiment of the present application;
[0027] Figure 5 A schematic diagram of a second carrier according to an embodiment of the present application;
[0028] Figure 6 Schematic diagram of a first supporting rack according to an embodiment of the present application.
[0029] Reference numerals:
[0030] First supporting frame 100; first notch 101; first latch 102; second supporting frame 110; second notch 111; second latch 112; third supporting frame 120; first supporting layer 121; third latch 122; base frame 130; first opening 131; supporting frame 132; first protrusion 133; second opening 134; third opening 135; first groove 136; second protrusion 137; second supporting layer 138; second groove 140. DETAILED DESCRIPTION
[0031] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.
[0032] In the description of this application, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application.
[0033] In the description of this application, "several" means one or more, "many" means more than two, "greater than," "less than," and "exceed" are understood to exclude the number itself, while "above," "below," and "within" are understood to include the number itself. The terms "first" and "second" are used solely to distinguish technical features and are not to be construed as indicating or implying relative importance, or as implicitly specifying the number or order of the technical features indicated.
[0034] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, and connecting should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0035] At present, in the existing automated circuit board processing lines, the circuit board carriers used to hold circuit boards during transportation are usually customized based on the size of the circuit boards to be processed. Each circuit board has its own exclusive circuit board carrier. This operation is relatively simple for circuit boards from different batches. However, if the same batch contains circuit boards of different sizes, not to mention the need to arrange a transportation line for each circuit board, its circuit board carrier also needs to be customized and produced separately. In this case, the production cost will increase significantly, which will be detrimental to the profitability of the product.
[0036] Based on this, the present application proposes a circuit board support, which can simultaneously support circuit boards of various sizes by stacking a first support 100, a second support 110 and a third support 120 from bottom to top, thereby reducing the use of transportation lines and circuit board supports, thereby reducing costs.
[0037] The following references Figure 1 、 Figure 4 、 Figure 5 and Figure 6 A circuit board carrier according to an embodiment of the present application is described.
[0038] It can be understood that the circuit board holder of the embodiment of the present application includes: a first holder 100, a second holder 110 and a third holder 120, the first holder 100 is provided with a first latch 102; the second holder 110 is provided with a second latch 112, the area of the second latch 112 is larger than the area of the first latch 102; the third holder 120 is provided with a third latch 122, the area of the third latch 122 is larger than the area of the second latch 112, the first holder 100, the second holder 110 and the third holder 120 are stacked in sequence from bottom to top, the second latch 112 is located directly above the first latch 102, and the third latch 122 is located directly above the second latch 112, the first latch 102, the second latch 112 and the third latch 122 are used to clamp circuit boards of different sizes, and the side walls of the first latch 102, the second latch 112 and the third latch 122 form steps.
[0039] The beneficial effects of the circuit board support of the embodiment of the present application are as follows: by setting the first bracket 102, the second bracket 112 and the third bracket 122 of different sizes, the support function of circuit boards of various sizes is realized, thereby reducing costs; by stacking the first bracket 100, the second bracket 110 and the third bracket 120 from bottom to top, and arranging the sizes of the brackets from small to large from bottom to top, orderly stacking of various circuit boards is achieved, making it more suitable for automated processes.
[0040] For example, in some embodiments, reference Figure 1 、 Figure 4 、 Figure 5 and Figure 6 , in this embodiment, Figure 5 and Figure 6They are respectively cross-sectional views of the second bracket 110 and the first bracket 100 in the integral circuit board bracket. The first bracket 100, the second bracket 110 and the third bracket 120 are stacked in sequence from bottom to top. The sizes of the first bayonet 102, the second bayonet 112 and the third bayonet 122 are also from small to large, so as to achieve the stacking of circuit boards of multiple sizes, and the orderly arrangement is more convenient for automated operation. The first bayonet 102 and the second bayonet 112 are only provided with side walls at the four corners to achieve the clamping of the circuit board, while also reducing the materials required for the circuit board bracket, reducing its weight and reducing the cost. The side walls of the first bayonet 102, the side walls of the second bayonet 112 and the side walls of the third bayonet 122 form a step. The third carrier 120 is further provided with a first supporting layer 121. The first supporting layer 121 is distributed along the side walls of the third bayonet 122 and protrudes from the side walls of the third bayonet 122. The first supporting layer 121 is provided between the third bayonet 122 and the second bayonet 112 so as to provide a certain degree of support for the largest circuit board engaged in the third bayonet 122 to prevent the circuit board from detaching and being damaged. At the same time, gaps are left between the circuit boards provided in the first bayonet 102, the second bayonet 112 and the third bayonet 122 to prevent components from being squeezed against each other during transportation and causing damage to the components.
[0041] It can be understood that: the circuit board support of the embodiment of the present application is also provided with a base frame 130, the base frame 130 is arranged on the side of the first support 100 away from the second support 110 and is connected to the first support 100, the base frame 130 is provided with a first groove 136, the first support 100 is provided with a first notch 101, the first notch 101 is provided on the side wall of the first bayonet 102 and is connected to the first bayonet 102, the second support 110 is provided with a second notch 111, the second notch 111 is provided on the side wall of the second bayonet 112 and is connected to the second bayonet 112, and the first notch 101 is provided between the second notch 111 and the first groove 136.
[0042] For example, in some embodiments, reference Figure 1 、 Figure 2 、 Figure 5 and Figure 6In this embodiment, the base frame 130 is arranged on the side of the first carrier 100 away from the second carrier 110. The base frame 130 is connected to the first carrier 100 to prevent the circuit board from accidentally falling off during transportation, reducing the risk of serious damage to the circuit board due to detachment. The side walls of the four corners of the first bayonet 102 are each provided with a first notch 101, so there are four first notches 101, and the four first notches 101 are all connected to the first bayonet 102. The side walls of the four corners of the second bayonet 112 are each provided with a second notch 111, so there are four second notches 111, and the four second notches 111 are all connected to the second bayonet 112. The base frame 130 is provided with four first grooves 136, and the four first grooves 136 correspond to the four first notches 101 and the four second notches 111 respectively. The first grooves 136, the first notches 101 and The second notches 111 are stacked from bottom to top to form a deeper notch, and the back of the first groove 136 is a corresponding second protrusion 137. The second protrusion 137 is adapted to the first groove 136 so that when idle, multiple circuit board carriers can be stacked through the second protrusion 137 and the first groove 136, reducing the used area of the space and improving the utilization rate of the space. The notch formed by the first groove 136, the first notch 101 and the second notch 111 makes the snap connection between the second protrusion 137 and the first groove 136 more secure.
[0043] It can be understood that the first supporting frame 100, the second supporting frame 110, the third supporting frame 120 and the base frame 130 are an integrated structure.
[0044] For example, in some embodiments, reference Figure 1 In this embodiment, the first bracket 100, the second bracket 110, the third bracket 120 and the base frame 130 are an integrally formed structure, which facilitates the automated mass production of the circuit board brackets and reduces the cost by reducing the use of connecting fasteners. At the same time, it also reduces the weight of the circuit board brackets.
[0045] It is understandable that the base frame 130 further defines a first opening 131 . The first opening 131 is located directly below the first latch 102 , and the first groove 136 is located on a sidewall of the first opening 131 .
[0046] For example, in some embodiments, reference Figure 1 、 Figure 3 and Figure 6In this embodiment, the first opening 131 is a square shape. The area of the first opening 131 is smaller than the first latch 102 and is located below the first latch 102. The first grooves 136 are provided on the side walls of the four corners of the first opening 131. By providing the first opening 131, the center of the circuit board engaged with the first latch 102, where electronic components are concentrated, does not contact the base frame 130, thereby preventing the electronic components on the circuit board from being crushed. At the same time, the base frame 130 is further provided with a second supporting layer 138. The second supporting layer 138 is provided between the base frame 130 and the first carrier 100. The second supporting layer 138 provides a certain support for the circuit board engaged with the first latch 102 and raises the horizontal height of the circuit board, thereby preventing the components on the circuit board from being worn out due to friction with the conveyor belt when the components pass through the first opening 131, and further protecting the components on the circuit board engaged with the first latch 102.
[0047] It can be understood that: the base frame 130 is also provided with a support frame 132, the support frame 132 is arranged in the first opening 131 and divides the first opening 131 into four identical areas, and the support frame 132 is provided with a first protrusion 133 on the side close to the first bayonet 102, and the first protrusion 133 is used to engage with the groove on the circuit board.
[0048] For example, in some embodiments, reference Figure 1 and Figure 6 In this embodiment, a "cross"-shaped support frame 132 is provided in the first opening 131, thereby providing a certain support for the circuit board engaged with the first bayonet 102. The support frame 132 divides the first opening 131 into four areas of equal size. A plurality of first protrusions 133 are distributed along the support frame 132 on the side of the support frame 132 close to the first carrier 100. The portion of the circuit board engaged with the first bayonet 102 corresponding to the support frame 132 is not provided with any components, and the portion is provided with a plurality of grooves corresponding to the first protrusions 133 (not shown in the drawings), so that the circuit board is engaged and connected with the first protrusions 133 through the grooves without causing pressure or damage to the components.
[0049] It can be understood that the side wall of the one-piece structure is provided with a second groove 140 .
[0050] For example, in some embodiments, reference Figure 1In this embodiment, the sidewalls of the integrated structure formed by the first bracket 100, the second bracket 110, the third bracket 120 and the base frame 130 are provided with a plurality of second grooves 140, with two second grooves 140 on each side, for a total of eight second grooves 140. The second grooves 140 are used when an automated machine transports a circuit board bracket. The mechanical clamping arm clamps the circuit board bracket along the second grooves 140 to thereby transport the circuit board bracket.
[0051] It is understandable that the bottom frame 130 is further provided with eight second openings 134 , which are arranged in groups of two at four sides of the first opening 131 .
[0052] For example, in some embodiments, reference Figure 1 and Figure 3 In this embodiment, eight second openings 134 are provided, and the second openings 134 are distributed in groups of two along the four sides of the first opening 131. By providing the second openings 134, it is convenient to manually hold the circuit board carrier when manually carrying it.
[0053] It is understandable that the bottom frame 130 is further provided with a third opening 135 , and the third opening 135 is provided between the two second openings 134 in the same group.
[0054] For example, in some embodiments, reference Figure 1 and Figure 3 In this embodiment, four third openings 135 are provided. The third openings 135 are all rectangular in size and are arranged between the two second openings 134 in the same group. The first opening 131 is located in the shape surrounded by the second openings 134 and the third openings 135. When transporting the circuit board carrier, a fixed block (not shown in the drawings) is often provided on the conveyor belt. The fixed block matches the third openings 135. When the circuit board carrier is placed on the conveyor belt, the third openings are sleeved on the fixed block to achieve the positioning of the circuit board carrier during transportation, thereby avoiding the misalignment caused by improper position of the circuit board carrier during automatic stacking of circuit boards.
[0055] It is understood that the chassis 130 is coated with an insulating layer.
[0056] For example, in some embodiments, the side of the base frame 130 close to the first carrier 100 is coated with an insulating layer (not shown in the drawings) to prevent static electricity from being generated during transportation of the circuit board and damaging the circuit board and its components.
[0057] The circuit board transport device according to the second embodiment of the application includes the circuit board carrier according to the first embodiment of the application.
[0058] According to the circuit board transport device of the embodiment of the present application, by setting the first bracket 102, the second bracket 112 and the third bracket 122 of different sizes, the supporting function of circuit boards of various sizes is realized, thereby reducing costs. By stacking the first bracket 100, the second bracket 110 and the third bracket 120 in sequence from bottom to top, and arranging the sizes of the brackets from small to large from bottom to top, orderly stacking of various circuit boards is achieved, making it more suitable for automated processes. By using the circuit board bracket of the present application, the working efficiency of the circuit board transport device is improved.
[0059] Since the circuit board transport device includes the circuit board support frame of the first embodiment, the corresponding contents of the circuit board support frame in the first embodiment are applicable to the circuit board transport device of the second aspect and have the same implementation principles and technical effects. In order to avoid redundant description, they will not be described in detail here.
[0060] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the scope of knowledge possessed by ordinary technicians in the technical field without departing from the purpose of the present application.
Claims
1. A circuit board carrier, characterized in that: include: a first supporting frame, wherein the first supporting frame is provided with a first bayonet; a second carrier, the second carrier being provided with a second bayonet, wherein the area of the second bayonet is larger than the area of the first bayonet; The third bracket is provided with a third bayonet, the area of the third bayonet is larger than the area of the second bayonet, the first bracket, the second bracket and the third bracket are stacked in sequence from bottom to top, the second bayonet is located directly above the first bayonet, and the third bayonet is located directly above the second bayonet, the first bayonet, the second bayonet and the third bayonet are used to clamp circuit boards of different sizes, and the side walls of the first bayonet, the side walls of the second bayonet and the side walls of the third bayonet form a step.
2. The circuit board carrier according to claim 1, wherein: A base frame is also provided, which is arranged on a side of the first supporting frame away from the second supporting frame and connected to the first supporting frame, the base frame is provided with a first groove, the first supporting frame is provided with a first notch, the first notch is provided on the side wall of the first bayonet and is connected to the first bayonet, the second supporting frame is provided with a second notch, the second notch is provided on the side wall of the second bayonet and is connected to the second bayonet, and the first notch is provided between the second notch and the first groove.
3. The circuit board carrier according to claim 2, wherein: The first supporting frame, the second supporting frame, the third supporting frame and the base frame are an integrated structure.
4. The circuit board carrier according to claim 2, wherein: The base frame is further provided with a first through opening, which is arranged directly below the first bayonet, and the first groove is arranged on the side wall of the first through opening.
5. The circuit board carrier according to claim 4, wherein: The base frame is also provided with a support frame, which is arranged in the first through opening and divides the first through opening into four identical areas. The support frame is provided with a first protrusion on the side close to the first bayonet, and the first protrusion is used to engage with the groove on the circuit board.
6. The circuit board carrier according to claim 3, wherein: The side wall of the one-piece structure is provided with a second groove.
7. The circuit board carrier according to claim 4, wherein: The base frame is further provided with eight second openings, and the second openings are grouped in pairs and are respectively provided on four sides of the first opening.
8. The circuit board carrier according to claim 7, wherein: The base frame is further provided with a third opening, and the third opening is provided between the two second openings in the same group.
9. The circuit board carrier according to claim 2, wherein: The chassis is coated with an insulating layer.
10. A circuit board transport device, characterized in that: include: The circuit board carrier according to any one of claims 1 to 9.