Transportation device for chip production

Abstract

The utility model relates to the technical field of chip production, and discloses a transportation device for chip production, which comprises a base, a damping spring rod is fixedly connected on the base, a support plate is fixedly connected at one end of the damping spring rod far away from the base, a sliding rod is fixedly connected on the base, a sliding connection block is connected on the sliding rod in a sliding mode, and the support plate is fixedly connected on the sliding connection block. Connecting strips are hinged to the sliding connecting blocks, the ends, away from the sliding connecting blocks, of the connecting strips are hinged to the damping spring rods, and the two sets of sliding connecting blocks are symmetrically distributed on the sliding rod. According to the transportation device, the stability and safety in the transportation process are fully emphasized while the transportation efficiency is guaranteed, and the device can effectively absorb and disperse vibration from the ground by introducing the multiple sets of damping spring rods and the dynamic damping structures which are evenly distributed; and the chip placed on the supporting plate is prevented from being damaged by vibration in the transportation process, so that the integrity of the chip is protected, and the service life of the equipment is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip production, in particular to a transportation device for chip production. Background Art

[0002] Chips, also known as integrated circuits (ICs), are a crucial cornerstone of modern technology. They are miniature electronic circuits that integrate numerous tiny electronic components (such as transistors, resistors, and capacitors) onto a single semiconductor substrate. This integration enables chips to perform complex electronic functions within a very small space. The core material of chips is semiconductors, the most common of which is silicon (Si). Silicon possesses unique electronic properties, such as dopability and controllable conductivity, making it an ideal choice for chip manufacturing. Other semiconductor materials, such as germanium (Ge) and gallium arsenide (GaAs), offer unique advantages in specific applications.

[0003] However, traditional chip transportation methods often have problems such as low transportation efficiency, insufficient stability, and difficulty in ensuring safety. Specifically, chips, as highly sophisticated electronic components, are extremely susceptible to external forces such as vibration and impact during transportation, which can cause chip damage or performance degradation. In addition, the ground conditions in different production areas and working environments vary greatly. Fixed transportation equipment often finds it difficult to adapt to various complex and changeable ground conditions, thus affecting the stability and safety of transportation. For this reason, a transportation device for chip production is proposed. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a transportation device for chip production.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a transportation device for chip production, comprising a base, a damping spring rod fixedly connected to the base, an end of the damping spring rod away from the base is fixedly connected to a support plate, a sliding rod fixedly connected to the base, a sliding connecting block slidably connected to the sliding rod, a connecting strip hinged on the sliding connecting block, an end of the connecting strip away from the sliding connecting block is hinged to the damping spring rod, the sliding connecting blocks are provided with two groups and are symmetrically distributed on the sliding rod, a connecting spring is sleeved on the sliding rod, and both ends of the connecting spring are respectively fixed to the two groups of sliding connecting blocks, a moving wheel is provided at the bottom of the base, and a push handle is provided on one side of the base.

[0006] As a further description of the above technical solution:

[0007] One side of the base is rotatably connected to a rotating shaft, and the rotating shaft is fixedly connected to the first threaded rod, the first threaded rod is threadedly connected to the first threaded block, the first threaded block is hingedly connected to a connecting strip 1, and the end of the connecting strip 1 away from the first threaded block is hingedly connected to a supporting foot, the base is fixedly connected to a second threaded rod, the second threaded rod is threadedly connected to the second threaded block, the second threaded block is hingedly connected to a connecting strip 2, and the end of the connecting strip 2 away from the second threaded block is hinged to the supporting foot, a telescopic rod is fixedly connected between the base and the supporting foot, and one end of the rotating shaft is fixedly connected to a turning handle.

[0008] As a further description of the above technical solution:

[0009] The support plate is provided with a transfer box, a placement base plate is slidably connected in the transfer box, the placement base plate is provided with chip placement slots, the chip placement slots are provided in multiple groups and are evenly distributed on the placement base plate. The placement base plate is provided in multiple groups and is evenly distributed in the transfer box.

[0010] As a further description of the above technical solution:

[0011] The damping spring rods are provided in multiple groups and are evenly distributed between the base and the support plate, and the sliding rods are provided in two groups and are symmetrically distributed on the base.

[0012] As a further description of the above technical solution:

[0013] The first threaded rod and the second threaded rod are symmetrically arranged. The first threaded rod and the second threaded rod are provided in two groups and are symmetrically distributed on the rotating shaft. The rotating shaft is provided in two groups and are symmetrically distributed on both sides of the base.

[0014] As a further description of the above technical solution:

[0015] The moving wheels are provided in multiple groups and are evenly distributed on the bottom of the base.

[0016] As a further description of the above technical solution:

[0017] The bottom of the supporting foot is provided with an anti-skid rubber pad.

[0018] The utility model has the following beneficial effects:

[0019] 1. In the present invention, the transport device not only ensures transport efficiency, but also pays full attention to stability and safety during transportation. By introducing multiple sets of evenly distributed damping spring rods and dynamic shock-absorbing structures, the device can effectively absorb and disperse vibrations from the ground, ensuring that the chips placed on the support plate are protected from vibration damage during transportation, which not only protects the integrity of the chips, but also extends the service life of the equipment.

[0020] 2. In the present invention, the device is equipped with adjustable support feet, which can be accurately adjusted in height according to different ground conditions to ensure that the device can remain stable in various environments. The auxiliary support of the telescopic rod and the addition of anti-slip rubber pads further enhance the stability and anti-slip performance of the device, effectively preventing the device from sliding or tipping over during transportation, thereby improving overall safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the three-dimensional structure of a transportation device for chip production proposed by the present invention;

[0022] Figure 2 This is a schematic diagram of the partial structure of a transport device for chip production proposed by the present invention. Figure 1 ;

[0023] Figure 3 This is a schematic diagram of the partial structure of a transport device for chip production proposed by the present invention. Figure 2 ;

[0024] Figure 4 This is a partial structural cross-sectional view of a transportation device for chip production proposed by the present invention.

[0025] Legend:

[0026] 1. Base; 2. Damping spring rod; 3. Support plate; 4. Sliding rod; 5. Sliding connecting block; 6. Connecting strip; 7. Connecting spring; 8. Moving wheel; 9. Push handle; 10. Rotating shaft; 11. First threaded rod; 12. First threaded block; 13. Connecting strip 1; 14. Support foot; 15. Second threaded rod; 16. Second threaded block; 17. Connecting strip 2; 18. Telescopic rod; 19. Rotating handle; 20. Transfer box; 21. Place substrate; 22. Chip placement slot. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Reference Figure 1-Figure 4The utility model provides an embodiment of a transportation device for chip production, comprising a base 1, a damping spring rod 2 fixedly connected to the base 1, an end of the damping spring rod 2 away from the base 1 is fixedly connected to a support plate 3, a sliding rod 4 is fixedly connected to the base 1, a sliding connecting block 5 is slidably connected to the sliding rod 4, and a connecting bar 6 is hinged on the sliding connecting block 5, and one end of the connecting bar 6 away from the sliding connecting block 5 is hinged to the damping spring rod 2, the sliding connecting block 5 is provided with two groups and is symmetrically distributed on the sliding rod 4, a connecting spring 7 is sleeved on the sliding rod 4, and the two ends of the connecting spring 7 are respectively fixed to the two groups of sliding connecting blocks 5, a moving wheel 8 is provided at the bottom of the base 1, and a push handle 9 is provided on one side of the base 1. While ensuring transportation efficiency, the transportation device also pays full attention to stability and safety during transportation. By introducing multiple groups of evenly distributed damping spring rods 2 and a dynamic shock-absorbing structure, the device can effectively absorb and disperse vibrations from the ground, ensuring that the chips placed on the support plate 3 are protected from vibration damage during transportation, which not only protects the integrity of the chips but also extends the service life of the equipment.

[0029] One side of the base 1 is rotatably connected to a rotating shaft 10, and a first threaded rod 11 is fixed to the rotating shaft 10, and a first threaded block 12 is threadedly connected to the first threaded rod 11, and a connecting strip 13 is hinged on the first threaded block 12, and the end of the connecting strip 13 away from the first threaded block 12 is hinged to a supporting foot 14, a second threaded rod 15 is fixed to the base 1, and a second threaded block 16 is threadedly connected to the second threaded rod 15, and a connecting strip 2 17 is hinged on the second threaded block 16, and the end of the connecting strip 2 17 away from the second threaded block 16 is hinged to the supporting foot 14, a telescopic rod 18 is fixed between the base 1 and the supporting foot 14, and a turning handle 19 is fixed to one end of the rotating shaft 10, and a transfer box 20 is provided on the support plate 3, and a placement base plate 21 is slidably connected in the transfer box 20, and a chip placement groove 22 is provided on the placement base plate 21, and a plurality of chip placement grooves 22 are provided and are evenly distributed on the placement base plate 21. There are multiple groups of placement base plates 21 and they are evenly distributed in the transfer box 20. There are multiple groups of damping spring rods 2 and they are evenly distributed between the base 1 and the support plate 3. There are two groups of sliding rods 4 and they are symmetrically distributed on the base 1. The first threaded rod 11 and the second threaded rod 15 are symmetrically arranged. The first threaded rod 11 and the second threaded rod 15 are provided with two groups and are symmetrically distributed on the rotating shaft 10. The rotating shaft 10 is provided with two groups and is symmetrically distributed on both sides of the base 1. There are multiple groups of moving wheels 8 and they are evenly distributed on the bottom of the base 1. The bottom of the support foot 14 is provided with an anti-slip rubber pad. The device is equipped with an adjustable support foot 14, which can be accurately adjusted in height according to different ground conditions to ensure that the device can remain stable in various environments. The auxiliary support of the telescopic rod 18 and the addition of the anti-slip rubber pad further enhance the stability and anti-slip performance of the device, effectively preventing the device from sliding or tipping over during transportation, and improving the overall safety.

[0030] Working principle: In the transport device for chip production, multiple sets of evenly distributed moving wheels 8 are equipped at the bottom of the device, allowing the operator to easily push the entire device to move through the push handle 9, whether it is transferring between production lines or shuttling between different work areas, fast and flexible transportation can be achieved. The interior of the transfer box 20 set on the support plate 3 is slidably connected with multiple placement substrates 21. This design not only facilitates batch loading of chips, but also supports fast and easy loading and unloading operations. The operator only needs to simply slide the placement substrate 21 containing chips into or out of the transfer box 20 to complete the loading and unloading of chips. The multiple sets of evenly distributed chip placement slots 22 opened on the placement substrate 21 provide a firm fixation for each chip, effectively preventing the chips from colliding with each other and being damaged during transportation, ensuring the safe transportation of chips. Multiple sets of evenly distributed damping spring rods 2 connect the base 1 and the support plate 3, and use their excellent elastic properties to absorb and disperse vibrations from the ground during transportation, thereby protecting the chips placed on the support plate 3 from vibration damage. The dynamic connecting block 5, the connecting bar 6 and the connecting spring 7 form a dynamic shock-absorbing structure. When the device is vibrated, the sliding connecting block 5 slides freely on the sliding rod 4, and the connecting bar 6 swings accordingly. The connecting spring 7 absorbs and releases energy by expanding and contracting, further enhancing the shock-absorbing effect and ensuring the smooth transportation of the chip. The device is equipped with adjustable support feet 14. By rotating the handle 19, the rotating shaft 10 is driven to rotate, thereby driving the first threaded rod 11 and the second threaded rod 15 to rotate. This mechanism enables the first threaded block 12 and the second threaded block 16 to move on the threaded rod, thereby driving the connecting strip 13 and the connecting strip 2 17 to extend or shorten, thereby achieving precise adjustment of the height of the support foot 14. This design enables the device to adapt to different ground conditions and ensure that it can remain stable in various environments. The telescopic rod 18 serves as an auxiliary support structure between the support foot 14 and the base 1, providing additional stability and rigidity, and the anti-slip rubber pad at the bottom of the support foot 14 increases the friction with the ground, effectively preventing the device from sliding or tipping over during transportation, further improving the safety of the device.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent replacements for some of the technical features therein. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A transport device for chip production, comprising a base (1), characterized in that: The base (1) is fixed with a damping spring rod (2), and one end of the damping spring rod (2) away from the base (1) is fixed with a support plate (3). The base (1) is fixed with a sliding rod (4), and a sliding connection block (5) is slidably connected to the sliding rod (4). The sliding connection block (5) is hinged with a connecting strip (6), and one end of the connecting strip (6) away from the sliding connection block (5) is hinged with the damping spring rod (2). The sliding connection block (5) is provided with two groups and is symmetrically distributed on the sliding rod (4). A connecting spring (7) is sleeved on the sliding rod (4), and the two ends of the connecting spring (7) are respectively fixed with the two groups of sliding connection blocks (5). A moving wheel (8) is provided at the bottom of the base (1), and a push handle (9) is provided on one side of the base (1).

2. The chip production transport device according to claim 1, characterized in that: One side of the base (1) is rotatably connected to a rotating shaft (10), a first threaded rod (11) is fixedly connected to the rotating shaft (10), a first threaded block (12) is threadedly connected to the first threaded rod (11), a connecting strip (13) is hingedly connected to the first threaded block (12), an end of the connecting strip (13) away from the first threaded block (12) is hingedly connected to a supporting foot (14), a second threaded rod (15) is fixedly connected to the base (1), a second threaded block (16) is threadedly connected to the second threaded rod (15), a connecting strip (17) is hingedly connected to the second threaded block (16), an end of the connecting strip (17) away from the second threaded block (16) is hingedly connected to the supporting foot (14), a telescopic rod (18) is fixedly connected between the base (1) and the supporting foot (14), and a turning handle (19) is fixedly connected to one end of the rotating shaft (10).

3. The chip production transport device according to claim 2, characterized in that: A transfer box (20) is provided on the support plate (3), a placement base plate (21) is slidably connected in the transfer box (20), a chip placement groove (22) is provided on the placement base plate (21), a plurality of chip placement grooves (22) are provided and are evenly distributed on the placement base plate (21), and a plurality of placement base plates (21) are provided and are evenly distributed in the transfer box (20).

4. The chip production transport device according to claim 3, characterized in that: The damping spring rods (2) are provided in multiple groups and are evenly distributed between the base (1) and the support plate (3); the sliding rods (4) are provided in two groups and are symmetrically distributed on the base (1).

5. The chip production transport device according to claim 4, characterized in that: The first threaded rod (11) and the second threaded rod (15) are symmetrically arranged. The first threaded rod (11) and the second threaded rod (15) are provided in two groups and are symmetrically distributed on the rotating shaft (10). The rotating shaft (10) is provided in two groups and is symmetrically distributed on both sides of the base (1).

6. The transport device for chip production according to claim 5, characterized in that: The moving wheels (8) are provided in multiple groups and are evenly distributed on the bottom of the base (1).

7. The transport device for chip production according to claim 6, characterized in that: The bottom of the supporting foot (14) is provided with an anti-skid rubber pad.

Images