Wafer transport box

Abstract

The utility model discloses a wafer transportation box, which is characterized in that an upper cover and a bottom shell are respectively provided with a filter window which is integrally formed, and a filter membrane is arranged in an inner interlayer of each filter window, so that air flow in the wafer transportation box is realized, the humidity of the air is ensured to be consistent with that of external air, and the cleanliness in the wafer transportation box is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer storage, in particular to a wafer transport box. Background Art

[0002] Wafers require repeated cleaning during processing. Although wafers undergo a drying process after cleaning, they may not be fully dried. Wafer shipping boxes also require cleaning before use, as plastic materials absorb water (at a low level). Wafers are kept in a confined space during transportation. If moisture remains in the wafers and shipping boxes after insufficient drying, this moisture cannot escape, leaving the wafers damp. Utility Model Content

[0003] The purpose of the utility model is to propose a wafer transport box in response to the technical problems existing in the background technology.

[0004] In order to achieve the above technical objectives, the technical solutions adopted in the first aspect of the present invention are as follows:

[0005] A wafer transport box includes an upper cover and a bottom shell, which are detachably connected. Both the upper cover and the bottom shell are provided with an integrally formed filter window, which includes multiple through holes and a mounting groove. The mounting groove is placed in an internal interlayer of the multiple through holes. A filter membrane is placed in the mounting groove, and the filter membrane covers the multiple through holes.

[0006] Preferably, the pore size of the filter membrane is 0.2 μm.

[0007] Preferably, the filter window includes a plurality of positioning holes, the plurality of positioning holes are respectively placed beside the plurality of through holes, and the positioning holes pass through the mounting groove.

[0008] Preferably, the upper cover and the bottom shell are both opened on one side, a buckle is provided at the opening of the upper cover, and a card slot is provided at the opening of the bottom shell. The upper cover and the bottom shell are detachably connected through the cooperation and engagement of the buckle and the card slot.

[0009] Preferably, the buckle and the upper cover are integrally formed.

[0010] Compared with the existing technology, the utility model has the following beneficial technical effects: by providing an integrally formed filter window on both the upper cover and the bottom shell, and placing a filter membrane in the internal interlayer of the filter window, air flow in the wafer transport box is achieved, ensuring that the humidity is consistent with that of the outside air, and ensuring the cleanliness of the wafer transport box. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic structural diagram of an embodiment of the present utility model;

[0012] Figure 2 for Figure 1Cross-sectional view of the middle AA section;

[0013] Figure 3 for Figure 2 A partial enlarged view of part B in the middle;

[0014] Figure 4 This is an exploded diagram of an embodiment of the present invention.

[0015] Reference numerals: 100 upper cover, 101 fastener, 200 bottom shell, 201 card slot, 300 filter window, 301 through hole, 302 mounting slot, 303 filter membrane, 304 positioning hole. DETAILED DESCRIPTION

[0016] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features therein can be combined with each other.

[0017] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or group referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0018] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connection, connection, or specific connection; they can refer to mechanical connection or electrical connection; they can refer to direct connection or indirect connection through an intermediate medium; and they can refer to communication within two groups. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood based on specific circumstances.

[0019] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0020] like Figure 1-Figure 4As shown, the utility model proposes a wafer transport box, which includes an upper cover 100 and a bottom shell 200. The upper cover 100 and the bottom shell 200 are detachably connected. The upper cover 100 and the bottom shell 200 are both provided with an integrally formed filter window 300. The filter window 300 includes a plurality of through holes 301 and a mounting groove 302. The mounting groove 302 is placed in the internal interlayer of the plurality of through holes 301. A filter membrane 303 is placed in the mounting groove 302. The filter membrane 303 covers the plurality of through holes 301.

[0021] The specific embodiment is that at least one filter window 300 is provided on each of the upper cover 100 and the bottom shell 200, and is integrally formed with the corresponding upper cover 100 or bottom shell 200. In this embodiment, the upper cover 100 and the bottom shell 200 are both obtained by injection molding, wherein the mounting groove 302 and the filter membrane 303 are placed in the mounting groove 302 during the injection molding process or the secondary injection molding process. Of course, the time period for selecting the injection molding process or the secondary injection molding process is determined by the difficulty of placing the filter membrane 303. Generally, the workshops for producing wafer transport boxes are dust-free workshops. The sandwich structure of the mounting groove 302 is designed. During the injection molding process, the filter membrane 303 is directly placed in the mounting groove 302, and the injection molding process is continued. The installation step of the filter membrane 303 is integrated into the injection molding process, which is conducive to simplifying the production steps and reducing the labor installation cost. In addition, since this process is dust-free, the risk of contamination when adding an additional step to install the filter membrane 303 is avoided, which also reduces labor cost.

[0022] In another embodiment, the filter window 300 may be an independent plate, and may be installed on the corresponding upper cover 100 and bottom shell 200 in a detachable or directly fixed manner.

[0023] Furthermore, the pore size of the filter membrane 303 is 0.2 μm.

[0024] Specifically, this aperture allows water molecules in the air to pass through while blocking particulate impurities larger than 0.2 microns. This ensures that the humidity of the air inside the transport box is consistent with that of the outside air, while also ensuring the cleanliness of the transport box. When packaging wafers, a desiccant is placed near the filter window 300 to fully dry any inadequately dried wafers.

[0025] Furthermore, the filter window 300 includes a plurality of positioning holes 304 . The plurality of positioning holes 304 are respectively disposed beside the plurality of through holes 301 , and the positioning holes 304 pass through the mounting slot 302 .

[0026] See attached Figure 3The positioning hole 304 directly passes through the installation groove 302 and also passes through the filter membrane 303. Therefore, the positioning hole 304 can be equipped with corresponding positioning piles to fix the filter membrane 303, thereby preventing the filter membrane 303 from offsetting in the installation groove 302, thereby causing poor filtering effect.

[0027] Furthermore, the upper cover 100 and the bottom shell 200 are both opened on one side. A buckle 101 is provided at the opening of the upper cover 100, and a card slot 201 is provided at the opening of the bottom shell 200. Through the cooperation and engagement of the buckle 101 and the card slot 201, the upper cover 100 and the bottom shell 200 are detachably connected.

[0028] Specifically, the upper cover 100 and the bottom shell 200 are relative and fitted together through their openings, and then detachably connected through the fastener 101 and the card slot 201. Since the fastener 101 and the upper cover 100 are integrally formed, the upper cover 100 and the bottom shell 200 are obtained through an injection molding process, and their openings are relatively thin and have a certain deformation ability. Therefore, the installation and disassembly of the upper cover 100 and the bottom shell 200 are achieved through their own deformation ability and the cooperative connection between the fastener 101 and the card slot 201.

[0029] The above descriptions provide one or more embodiments in conjunction with the specific content, and do not limit the specific implementation of the present invention to these descriptions. Any similarity or similarity with the methods, structures, etc. of the present invention, or any technical deduction or substitution based on the concept of the present invention, shall be deemed to be within the scope of protection of the present invention.

Claims

1. A wafer transport box, characterized in that: The invention comprises an upper cover (100) and a bottom shell (200), wherein the upper cover (100) and the bottom shell (200) are detachably connected, and each of the upper cover (100) and the bottom shell (200) is provided with an integrally formed filter window (300), wherein the filter window (300) comprises a plurality of through holes (301) and a mounting groove (302), wherein the mounting groove (302) is disposed in an inner interlayer of the plurality of through holes (301), and a filter membrane (303) is disposed in the mounting groove (302), and the filter membrane (303) covers the plurality of through holes (301).

2. The wafer transport box according to claim 1, characterized in that: The pore size of the filter membrane (303) is 0.2 μm.

3. The wafer transport box according to claim 1, characterized in that: The filter window (300) comprises a plurality of positioning holes (304), the plurality of positioning holes (304) being respectively positioned beside the plurality of through holes (301), and the positioning holes (304) passing through the mounting groove (302).

4. The wafer transport box according to claim 1, characterized in that: The upper cover (100) and the bottom shell (200) are both opened on one side. A buckle (101) is provided at the opening of the upper cover (100), and a card slot (201) is provided at the opening of the bottom shell (200). The upper cover (100) and the bottom shell (200) are detachably connected through the engagement of the buckle (101) and the card slot (201).

5. The wafer transport box according to claim 4, characterized in that: The buckle (101) and the upper cover (100) are integrally formed.

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