Semiconductor refrigeration assembly

Abstract

The utility model provides a semiconductor refrigeration assembly, which relates to the technical field of refrigeration assemblies and comprises an equipment inner wall, a mounting seat is fixed on the front surface of the equipment inner wall, a semiconductor refrigerator main body is mounted on the front surface of the mounting seat, and a mounting plate is fixed on the back surface of the semiconductor refrigerator main body corresponding to the mounting seat. A placement groove is formed in the position, corresponding to the mounting plate, of the front face of the mounting base, sliding blocks are symmetrically mounted on the outer side wall of the mounting plate, sliding grooves are formed in the positions, corresponding to the sliding blocks, of the inner side wall of the placement groove, a mounting groove is formed in the position, close to the top end, of the interior of the mounting base, and a push rod is mounted in the mounting groove. Compared with an existing semiconductor refrigeration assembly, the semiconductor refrigeration assembly has the advantages that the semiconductor refrigeration assembly is convenient to mount and dismount, the maintenance efficiency of the semiconductor refrigeration assembly is improved, and the time consumed by maintenance work is greatly shortened.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration components, in particular to a semiconductor refrigeration component. Background Art

[0002] In the 1950s, with the rapid development of semiconductor materials, thermoelectric coolers gradually moved from the laboratory to engineering practice and were applied in defense, industry, agriculture, medicine and daily life. They can be used as air conditioners for nuclear submarines or as small as cooling infrared detectors. Therefore, thermoelectric coolers are usually called semiconductor coolers.

[0003] Existing semiconductor coolers are generally installed on the inner wall of the equipment by bolts. However, the internal electronic components of the semiconductor cooler may be damaged during operation. In this case, the staff will disassemble the entire semiconductor cooler for maintenance, and it is necessary to remove the bolts one by one, which is cumbersome and time-consuming. Therefore, we propose a semiconductor cooling assembly. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the existing technology. The existing semiconductor cooler is generally installed on the inner wall of the equipment by bolts. However, the internal electronic components of the semiconductor cooler may be damaged during operation. At this time, the staff will disassemble the entire semiconductor cooler for maintenance, and it is necessary to remove the bolts one by one, which is cumbersome and time-consuming.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A semiconductor refrigeration component includes an inner wall of an equipment, a mounting seat is fixed on the front side of the inner wall of the equipment, a semiconductor refrigerator body is installed on the front side of the mounting seat, a mounting plate is fixed on the back side of the semiconductor refrigerator body corresponding to the mounting seat, a placement groove is provided on the front side of the mounting seat corresponding to the mounting plate, sliders are symmetrically installed on the outer side wall of the mounting plate, a slide groove is provided on the inner side wall of the placement groove corresponding to the slider, a mounting groove is provided inside the mounting seat near the top, a push rod is installed inside the mounting groove, a card block is fixed to one end of the push rod near the slide groove and extending to the inside of the slide groove, the other end of the push rod extends to the periphery of the mounting seat and is fixed to a handle, and a card groove is provided on the outer side wall of the slider corresponding to the card block.

[0007] As a preferred solution of the present invention, the mounting base and the inner wall of the equipment can be fixed by welding.

[0008] The technical effect of adopting the above further solution is that the overall structure can be made more stable and firm by welding the mounting base to the inner wall of the device.

[0009] As a preferred solution of the present invention, the mounting plate is adapted to the placement groove, and the sliding block is adapted to the sliding groove.

[0010] The technical effect of adopting the above further solution is that by adapting the mounting plate to the placement groove and the sliding block to the slide groove, it is convenient for workers to install and disassemble the semiconductor refrigerator body.

[0011] As a preferred solution of the present invention, the push rod is adapted to the mounting groove and is made of stainless steel.

[0012] The technical effect of adopting the above further solution is that the push rod made of stainless steel is strong enough to help the card block fit into the interior of the card slot, is not easily corroded, and has a long service life.

[0013] As a preferred solution of the present invention, the card block is adapted to the card slot, and the card block is triangular in design.

[0014] The technical effect of adopting the above further solution is: by adapting the card block to the card slot and designing the card block as a triangle, the card block can be easily inserted into the card slot without affecting normal installation and disassembly work.

[0015] As a preferred solution of the present invention, a limit plate is sleeved on the outer circumferential wall of the push rod near the sliding groove, and a spring is sleeved on the outer periphery of the push rod and located between the limit plate and the inner wall of the installation groove.

[0016] The technical effect of adopting the above further solution is: through the design of the limit plate and the spring, the spring can apply force to the limit plate, so that the limit plate can drive the push rod to move to send the card block into the card slot.

[0017] As a preferred solution of the present invention, the outer cover of the handle is provided with a protective cover, and the protective cover is made of rubber material.

[0018] The technical effect of adopting the above further solution is that the protective cover made of rubber material can play an anti-slip protection role when the staff pulls the handle.

[0019] Compared with the prior art, the beneficial effects of the present invention are:

[0020] In the utility model, through the design of the mounting seat, the push rod block, the handle, the mounting plate and the slot, when a semiconductor refrigeration component needs to be disassembled for maintenance, the staff can pull the handle so that the push rod can drive the block to move and separate from the slot. At this time, the staff can directly disassemble the semiconductor refrigerator body, thereby directly repairing the semiconductor refrigerator body. The disassembly is more convenient, the efficiency of the semiconductor refrigeration component maintenance is improved, and the time of maintenance work is greatly reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the overall structure of a semiconductor refrigeration component provided by the utility model;

[0022] Figure 2 A front anatomical diagram of the slot structure of a semiconductor refrigeration component provided by the utility model;

[0023] Figure 3 This is an enlarged schematic diagram of structure A of a semiconductor refrigeration component provided by the present invention.

[0024] Legend: 1. Inner wall of the device; 2. Mounting seat; 201. Placement slot; 202. Slide slot; 203. Mounting slot; 204. Push rod; 205. Block; 206. Handle; 207. Limit plate; 208. Spring; 209. Protective cover; 3. Semiconductor cooler body; 301. Mounting plate; 302. Slider; 303. Slot. DETAILED DESCRIPTION

[0025] The following will combine the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] To facilitate understanding of the present invention, the present invention will be described more comprehensively below with reference to relevant references, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are for the purpose of describing specific embodiments only and are not intended to limit this invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0029] Example 1

[0030] like Figure 1-3 As shown, the utility model provides a technical solution: a semiconductor cooling component, including an inner wall 1 of the device, a mounting base 2 is fixed on the front of the inner wall 1 of the device, the mounting base 2 is used to install and fix the semiconductor cooler body 3, the front of the mounting base 2 is installed with the semiconductor cooler body 3, the back of the semiconductor cooler body 3 is fixed with a mounting plate 301 corresponding to the mounting base 2, the front of the mounting base 2 is provided with a placement groove 201 corresponding to the mounting plate 301, the mounting plate 301 can be fixed inside the placement groove 201, the outer side wall of the mounting plate 301 is symmetrically installed with a slider 302, and the inner side wall of the placement groove 201 is provided with a slider 302 corresponding to the slider 302. The slide groove 202 and the slider 302 can slide inside the slide groove 202. A mounting groove 203 is provided inside the mounting seat 2 near the top. A push rod 204 can be installed inside the mounting groove 203. A push rod 204 is installed inside the mounting groove 203. The push rod 204 is close to one end of the slide groove 202 and extends to the inside of the slide groove 202 where a block 205 is fixed. The other end of the push rod 204 extends to the periphery of the mounting seat 2 where a handle 206 is fixed. Pulling the handle 206 can drive the block 205 to move. A slot 303 is provided on the outer wall of the slider 302 corresponding to the block 205, and the block 205 can be inserted into the inside of the slot 303.

[0031] Example 2

[0032] like Figure 1-3 As shown, the mounting base 2 and the inner wall 1 of the device can be fixed by welding. By welding the mounting base 2 and the inner wall 1 of the device, the overall structure can be more stable and firm.

[0033] The mounting plate 301 is adapted to the placement groove 201, and the slider 302 is adapted to the slide groove 202. By adapting the mounting plate 301 to the placement groove 201 and the slider 302 to the slide groove 202, it is convenient for workers to install and disassemble the semiconductor refrigerator body 3.

[0034] The push rod 204 is adapted to the mounting groove 203 and is made of stainless steel. The push rod 204 made of stainless steel is strong enough to help the block 205 fit into the inside of the groove 303. It is not susceptible to corrosion and has a long service life.

[0035] The card block 205 is adapted to the card slot 303 and is triangular in design. Due to the adaptation of the card block 205 to the card slot 303 and the triangular design of the card block 205, the card block 205 can be easily inserted into the card slot 303 without affecting normal installation and disassembly work.

[0036] A limit plate 207 is sleeved on the outer circumferential wall of the push rod 204 near the slide groove 202, and a spring 208 is sleeved on the outer periphery of the push rod 204 and located between the limit plate 207 and the inner wall of the installation groove 203. Through the design of the limit plate 207 and the spring 208, the spring 208 can apply a force to the limit plate 207, so that the limit plate 207 can drive the push rod 204 to move, so as to send the block 205 into the inside of the slot 303.

[0037] The outer cover of the handle 206 is provided with a protective cover 209 , which is made of rubber material. The protective cover 209 made of rubber material can play an anti-slip protection role when the staff pulls the handle 206 .

[0038] The working process of the utility model is as follows: when a semiconductor refrigeration component needs to be disassembled for maintenance, the staff can first pull the handle 206, so that the push rod 204 can drive the block 205 to move, thereby separating the block 205 from the slot 303. At this time, the staff can directly pull out the semiconductor refrigerator body 3 together with the mounting plate 301, so that the semiconductor refrigerator body 3 can be directly repaired. After the semiconductor refrigerator body 3 is repaired, it is only necessary to align the slider 302 with the slide groove 202 and insert the mounting plate 301. When the slider 302 descends, it exerts a force on the block 205, causing the block 205 to retreat a distance until the slot 303 moves to the same level as the block 205. The spring 208 then exerts a force on the limit plate 207 to push the block 205 back into the slot 303, thereby completing the installation of the semiconductor refrigerator body 3. Compared with existing semiconductor refrigerator components, this is more convenient during installation and removal, thereby improving the efficiency of semiconductor refrigerator component maintenance and greatly reducing the time spent on maintenance work.

[0039] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigeration component, comprising an inner wall of the device (1), characterized in that: A mounting seat (2) is fixed on the front of the inner wall (1) of the device, a semiconductor cooler body (3) is mounted on the front of the mounting seat (2), a mounting plate (301) is fixed on the back of the semiconductor cooler body (3) corresponding to the mounting seat (2), a placement groove (201) is provided on the front of the mounting seat (2) corresponding to the mounting plate (301), a slider (302) is symmetrically mounted on the outer side wall of the mounting plate (301), and a slider (302) is provided on the inner side wall of the placement groove (201) corresponding to the slider (302). A slide groove (202), a mounting groove (203) is provided inside the mounting seat (2) near the top, a push rod (204) is installed inside the mounting groove (203), a clamping block (205) is fixed on one end of the push rod (204) close to the slide groove (202) and extending to the inside of the slide groove (202), and a handle (206) is fixed on the other end of the push rod (204) extending to the periphery of the mounting seat (2), and a clamping groove (303) is provided on the outer wall of the slider (302) corresponding to the clamping block (205).

2. A semiconductor refrigeration component according to claim 1, characterized in that: The mounting seat (2) and the inner wall (1) of the device can be fixed by welding.

3. A semiconductor refrigeration component according to claim 1, characterized in that: The mounting plate (301) is adapted to the placement groove (201), and the sliding block (302) is adapted to the sliding groove (202).

4. A semiconductor refrigeration component according to claim 1, characterized in that: The push rod (204) is adapted to the mounting groove (203), and the push rod (204) is made of stainless steel.

5. A semiconductor refrigeration component according to claim 1, characterized in that: The card block (205) is adapted to the card slot (303), and the card block (205) is triangular in design.

6. A semiconductor refrigeration component according to claim 1, characterized in that: A limiting plate (207) is sleeved on the outer circumferential wall of the push rod (204) near the slide groove (202), and a spring (208) is sleeved on the outer periphery of the push rod (204) and located between the limiting plate (207) and the inner wall of the installation groove (203).

7. A semiconductor refrigeration component according to claim 1, characterized in that: The outer shell of the handle (206) is provided with a protective sleeve (209), and the protective sleeve (209) is made of rubber material.

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