Damp-proof touch type industrial personal computer

Abstract

The utility model provides a moisture-proof touch type industrial personal computer, a body comprises a shell and a mainboard, the shell is provided with an electrical cavity, and the mainboard is arranged in the electrical cavity; the touch screen is arranged on the shell and partially extends into the electrical cavity; one end of the heat absorption piece is arranged on one side, deviating from the touch screen, of the mainboard, and the other end is attached to the shell and used for transferring heat of the mainboard to the shell; the industrial personal computer further comprises an isolation plate, the isolation plate is arranged on the peripheral face of the heat absorption piece in a surrounding mode, and the isolation plate and the main board divide the electrical cavity into a first cavity, a second cavity and a third cavity which are sequentially arranged in the height direction of the body. The electrical cavity is divided into a plurality of areas through the isolation plates, so that water vapor can be prevented from directly entering the mainboard through the design. The protection of the mainboard is further enhanced through the isolation plate, so that even if water vapor permeates from the outside, the mainboard can be kept in a relatively dry environment, the heat absorption piece transmits heat generated by the mainboard to the shell, and internal heat can be effectively dissipated outwards through the shell.

Description

Technical Field

[0001] The present application relates to the technical field of industrial computers, and in particular to a moisture-proof touch-type industrial computer. Background Art

[0002] Industrial computers (IPCs), or IPCs, are computer devices designed specifically for industrial environments and widely used in fields such as automated control, data acquisition, and industrial monitoring. Compared to standard computers, IPCs typically offer higher reliability and durability, enabling stable operation in harsh industrial environments. With the increasing automation of industry, IPCs are increasingly being used in a wide range of sectors, including manufacturing, energy, and transportation.

[0003] To address the challenges of humidity in industrial environments, existing technologies typically use sealed designs to improve the moisture resistance of industrial computers. A sealed enclosure effectively prevents moisture from entering, thereby protecting the device's electronic components and circuit boards. However, while this improved moisture resistance also restricts airflow within the computer, making it difficult to effectively address heat dissipation. To address this issue, some technical solutions attempt to add cooling fans, but due to the tight sealing requirements of the enclosure, this approach often compromises moisture resistance.

[0004] Despite various attempts to improve moisture resistance and heat dissipation, existing technologies still have some significant drawbacks. While sealing designs improve moisture resistance, adding cooling fans can compromise the seal, resulting in poor moisture resistance. While the use of waterproof, breathable membranes can achieve a balance between moisture resistance and heat dissipation, in humid industrial environments, moisture can still penetrate the device through the membrane's micropores. Prolonged exposure to humidity weakens the membrane's waterproofing effectiveness, leading to condensation inside the device and affecting its normal operation. Utility Model Content

[0005] In view of this, it is necessary to provide an industrial computer that can perform good heat dissipation while ensuring moisture-proof performance, so as to solve the above problems.

[0006] An embodiment of the present application provides a moisture-proof touch-type industrial computer, comprising:

[0007] The main body includes a shell and a main board, wherein the shell is provided with an electrical cavity, and the main board is arranged in the electrical cavity;

[0008] a touch screen, disposed on the housing and partially extending into the electrical cavity;

[0009] a heat absorbing member, one end of which is disposed on a side of the mainboard facing away from the touch screen, and the other end of which is in contact with the housing, for transferring heat from the mainboard to the housing;

[0010] Among them, the industrial computer also includes an isolation plate, which is arranged around the circumference of the heat absorption component. The isolation plate and the main board separate the electrical cavity into a first cavity, a second cavity and a third cavity arranged in sequence along the height direction of the body.

[0011] In at least one embodiment of the present application, the industrial computer further includes a first heat dissipation fin, which is provided on a side of the housing facing away from the touch screen, and the heat absorption element faces and fits the heat dissipation fin.

[0012] In at least one embodiment of the present application, the industrial computer also includes a second heat dissipation fin, which is symmetrically arranged on two opposite sides of the shell along the geometric center line of the shell, and the opposite sides of the main board and the isolation plate are both attached to the second heat dissipation fin.

[0013] In at least one embodiment of the present application, the second heat dissipation fin includes a fitting portion and a bending portion, one end of the fitting portion is arranged on the touch screen, and the other end is connected to the bending portion, and the bending portion is arranged on a side of the shell away from the touch screen, and the fitting portion and the bending portion are integrally formed.

[0014] In at least one embodiment of the present application, the second heat sink fin further includes a heat absorbing block, one side of the heat absorbing block is attached to the second heat sink fin, and the other side of the heat absorbing block is attached to the mainboard and one side surface of the isolation plate.

[0015] In at least one embodiment of the present application, the industrial computer further includes a heat absorption layer, which is disposed in the third cavity and adheres to the touch screen, and a side surface of the heat absorption layer adheres to the second heat dissipation fin.

[0016] In at least one embodiment of the present application, the heat absorption layer includes a first heat absorption portion and a second heat absorption portion, the first heat absorption portion is attached to the touch screen, and the second heat absorption portion is provided at opposite ends of the first heat absorption portion and attached between the second heat dissipation fins and the touch screen.

[0017] In at least one embodiment of the present application, the second heat dissipation fin is arranged to be tilted upward along the height direction of the industrial computer from one end affixed to the second heat absorption portion.

[0018] In at least one embodiment of the present application, the industrial computer further includes a waterproof layer, which is attached to the touch screen and fixedly connected to the housing to prevent liquid from directly contacting the touch screen.

[0019] In at least one embodiment of the present application, the industrial computer further includes a sealing ring, one end of which is provided on the touch screen, and the other end of which is interference fit with the housing.

[0020] The aforementioned moisture-proof touch-screen industrial computer places the motherboard in the middle of the electrical cavity, i.e., within the second cavity, and divides the electrical cavity into multiple areas using isolation panels. This design increases the distance between the motherboard and the external environment, reducing the possibility of water vapor directly entering the motherboard. Furthermore, the presence of the isolation panels further enhances the protection of the motherboard, allowing it to remain in a relatively dry environment even if external water vapor penetrates, thereby effectively improving the device's moisture-proof performance. The heat absorber transfers heat generated by the motherboard to the housing, effectively dissipating internal heat through the housing, thereby improving heat dissipation while maintaining moisture-proof performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a three-dimensional diagram of a moisture-proof touch-type industrial computer in one embodiment of the present application.

[0022] Figure 2 for Figure 1 A three-dimensional image of the moisture-proof touch-type industrial computer from another perspective.

[0023] Figure 3 for Figure 1 A partially enlarged cross-sectional view of a moisture-proof touch-type industrial computer.

[0024] Figure 4 for Figure 1 A top-down cross-sectional view of the moisture-proof touch-type industrial computer.

[0025] Description of main component symbols

[0026] 100. A moisture-proof touch-type industrial computer; 10. Main body; 11. Housing; 12. Main board; 13. Electrical cavity; 131. First cavity; 132. Second cavity; 133. Third cavity; 20. Touch screen; 30. Heat absorbing element; 40. Isolation plate; 50. First heat sink fin; 60. Second heat sink fin; 61. Fitting portion; 62. Bending portion; 63. Heat absorbing block; 70. Heat absorbing layer; 71. First heat absorbing portion; 72. Second heat absorbing portion; 80. Waterproof layer; 90. Sealing ring. DETAILED DESCRIPTION

[0027] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0028] It should be noted that when a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0029] An embodiment of the present application provides a moisture-proof touch-type industrial computer, comprising:

[0030] The main body includes a shell and a main board, wherein the shell is provided with an electrical cavity, and the main board is arranged in the electrical cavity;

[0031] a touch screen, disposed on the housing and partially extending into the electrical cavity;

[0032] a heat absorbing member, one end of which is disposed on a side of the mainboard facing away from the touch screen, and the other end of which is in contact with the housing, for transferring heat from the mainboard to the housing;

[0033] Among them, the industrial computer also includes an isolation plate, which is arranged around the circumference of the heat absorption component. The isolation plate and the main board separate the electrical cavity into a first cavity, a second cavity and a third cavity arranged in sequence along the height direction of the body.

[0034] The aforementioned moisture-proof touch-screen industrial computer places the motherboard in the middle of the electrical cavity, i.e., within the second cavity, and divides the electrical cavity into multiple areas using isolation panels. This design increases the distance between the motherboard and the external environment, reducing the possibility of water vapor directly entering the motherboard. Furthermore, the presence of the isolation panels further enhances the protection of the motherboard, allowing it to remain in a relatively dry environment even if external water vapor penetrates, thereby effectively improving the device's moisture-proof performance. The heat absorber transfers heat generated by the motherboard to the housing, effectively dissipating internal heat through the housing, thereby improving heat dissipation while maintaining moisture-proof performance.

[0035] The following embodiments of the present application are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0036] See also Figure 1-Figure 4 The embodiment of the present application provides a moisture-proof touch-type industrial computer 100, comprising:

[0037] The main body 10 includes a shell 11 and a main board 12. The shell 11 defines an electrical cavity 13, and the main board 12 is disposed in the electrical cavity 13.

[0038] A touch screen 20 is provided on the housing 11 and partially extends into the electrical cavity 13;

[0039] a heat absorbing member 30 , one end of which is disposed on a side of the mainboard 12 facing away from the touch screen 20 , and the other end of which is in contact with the housing 11 , for transferring heat from the mainboard 12 to the housing 11 ;

[0040] Among them, the industrial computer also includes an isolation plate 40, which is arranged around the circumference of the heat absorption component 30. The isolation plate 40 and the main board 12 separate the electrical cavity 13 into a first cavity 131, a second cavity 132 and a third cavity 133 arranged in sequence along the height direction of the main body 10.

[0041] Specifically, the main body 10 is the core structure of the industrial computer and includes a housing 11 and a mainboard 12. The housing 11, through its structural design, forms a sealed electrical cavity 13 for protecting the electronic components inside. The mainboard 12 is the carrier of the electrical components and is responsible for processing and executing the various functions of the industrial computer. The sealed design of the housing 11 effectively improves the moisture-proof performance, protecting the mainboard 12 and other electronic components from moisture in humid environments, thereby extending the service life of the equipment. The mainboard 12 is arranged in the electrical cavity 13, which also makes the internal structure more compact, facilitating the implementation of heat dissipation design.

[0042] Furthermore, the electrical cavity 13 is a specially provided space inside the shell 11 for accommodating the mainboard 12 and other electronic components. By concentrating these components in an independent cavity, the internal temperature and humidity can be effectively controlled. The airtight design of the electrical cavity 13 not only provides a good moisture-proof effect, but also can quickly dissipate the heat generated by the mainboard 12 through a reasonable heat dissipation structure, thereby avoiding damage to components caused by excessive temperature. The touch screen 20 is installed on the outside of the shell 11 and partially extends into the electrical cavity 13. It serves as an interface for human-computer interaction. The user inputs instructions through the touch screen 20, and the industrial computer receives and processes these instructions. The embedded design of the touch screen 20 makes the appearance of the entire industrial computer more integrated, while enhancing the moisture resistance of the industrial computer. The touch screen 20 partially extends into the electrical cavity 13, which helps to protect the screen interface and circuit and prevent moisture intrusion.

[0043] Furthermore, the heat sink 30 is mounted on the side of the mainboard 12 facing away from the touch screen 20, with the other end attached to the housing 11. It is responsible for transferring the heat generated by the mainboard 12 during operation to the outside of the housing 11. Through the heat conduction effect of the heat sink 30, the heat of the mainboard 12 can be efficiently dissipated, preventing heat accumulation in the electrical cavity 13, ensuring that the industrial computer can still operate stably in a high-humidity environment. This design improves the heat dissipation efficiency, allowing the industrial computer to maintain a suitable operating temperature even in a closed environment; the isolation plate 40 surrounds the heat sink 30 and, together with the mainboard 12, separates the electrical cavity 13 into a first cavity 131, a second cavity 132, and a third cavity 133. The mainboard 12 is located in the second cavity 132 in the middle, ensuring that the mainboard 12 operates in a relatively stable and dry environment.

[0044] In a specific embodiment, the industrial computer also includes a second heat dissipation fin 60, which is symmetrically arranged on two opposite side surfaces of the shell 11 along the geometric center line of the shell 11, and the opposite side surfaces of the main board 12 and the isolation plate 40 are both fitted with the second heat dissipation fin 60.

[0045] Specifically, the first heat sink fins 50 are located on the back of the housing 11, on the side opposite the touch screen 20. This layout places the heat sink fins in the area of ​​the device most suitable for heat dissipation, avoiding direct heat conduction between the heat sink fins and the touch screen 20 and preventing overheating of the touch screen 20. Because the heat sink fins are located away from the touch screen 20, their heat is not directly transferred to the touch screen 20, thereby reducing temperature fluctuations on the touch screen 20 and extending its service life. Furthermore, this location is closer to the external environment, facilitating rapid heat dissipation.

[0046] Furthermore, the heat sink 30 is in close contact with the first heat sink fins 50, ensuring that heat generated by the motherboard 12 is directly transferred to the heat sink fins. This tight fit optimizes heat transfer efficiency, allowing heat to be quickly transferred from the motherboard 12 to the exterior of the housing 11. This maximizes the surface area of ​​the heat sink fins to dissipate heat, thereby improving overall heat dissipation efficiency. The heat sink fins effectively dissipate heat into the external air, preventing heat accumulation within the device and maintaining the normal operating temperature of the industrial computer.

[0047] In a specific embodiment, the industrial computer also includes a second heat dissipation fin 60, which is symmetrically arranged on two opposite side surfaces of the shell 11 along the geometric center line of the shell 11, and the opposite side surfaces of the main board 12 and the isolation plate 40 are both fitted with the second heat dissipation fin 60.

[0048] Specifically, the second heat sink fins 60 are symmetrically distributed along the geometric centerline on both sides of the housing 11, ensuring uniformity in the heat dissipation system. This symmetrical design helps balance temperature distribution and prevents device performance degradation or damage due to local overheating. This symmetrical arrangement provides more uniform heat dissipation, improving overall heat dissipation efficiency and reducing the risk of local overheating.

[0049] Furthermore, both sides of the mainboard 12 and the isolation plate 40 are in contact with the second heat sink fins 60, ensuring that heat is effectively transferred to the fins and dissipated through their surfaces. This design makes the heat dissipation path more direct and efficient. Through this close contact, heat is quickly transferred from the mainboard 12 and isolation plate 40 to the heat sink fins, enhancing the heat dissipation effect, preventing heat accumulation around the mainboard 12, extending the device's service life, and improving its reliability in high-humidity environments.

[0050] In a specific embodiment, the second heat dissipation fin 60 includes a fitting portion 61 and a bending portion 62. One end of the fitting portion 61 is provided on the touch screen 20, and the other end is connected to the bending portion 62. The bending portion 62 is provided on the side of the shell 11 away from the touch screen 20. The fitting portion 61 and the bending portion 62 are integrally formed.

[0051] Specifically, the fitting portion 61 directly contacts one side of the touch screen 20, and transfers the heat generated by the touch screen 20 directly to the heat dissipation fins. Through this direct contact, heat can be quickly conducted from the touch screen 20 to the heat dissipation system, reducing heat accumulation. This direct heat conduction reduces the accumulation of heat inside the device, helps maintain a stable temperature of the touch screen 20, and thus improves the working efficiency and reliability of the device. The bending portion 62 is connected to the fitting portion 61 and is located on the side of the shell 11 away from the touch screen 20. This design ensures that the heat dissipation fins can cover the back of the shell 11, and transfers heat from the fitting portion 61 to a farther area of ​​the shell 11 through the bent structure. The design of the bending portion 62 optimizes the heat dissipation path, allowing heat to be dispersed to more areas of the shell 11, effectively improving the overall heat dissipation effect and preventing local overheating of the device.

[0052] Furthermore, the bend 62 mates with the first heat sink fin 50, allowing the second heat sink fin 60 to be connected to the first heat sink fin 50 via the bend 62, forming a continuous heat dissipation system. The first heat sink fin 50 is located on the back of the housing 11, and the second heat sink fin 60 extends to both sides of the housing 11 via the bend 62. This layout ensures that the heat sink fins cover the housing 11 from all sides, thereby increasing the heat dissipation area and efficiency. The entire heat dissipation system can distribute heat more evenly, reducing the risk of local overheating in the device and improving the overall performance and stability of the device.

[0053] In a specific embodiment, the second heat dissipation fin 60 further includes a heat absorption block 63 , one side of the heat absorption block 63 is attached to the second heat dissipation fin 60 , and the other side is attached to the mainboard 12 and one side of the isolation plate 40 .

[0054] Specifically, one side of the heat sink 63 contacts the second heat sink fin 60, transferring heat absorbed by the heat sink 63 to the second heat sink fin 60. As part of the heat dissipation system, the second heat sink fin 60, through contact with the heat sink 63, diffuses heat to the exterior of the housing 11, effectively promoting heat dissipation. This design ensures that the heat sink 63 can efficiently transfer heat to the heat dissipation system, improving overall heat dissipation efficiency and distributing heat more evenly across the heat sink fins, thereby avoiding localized overheating.

[0055] Furthermore, due to the contact between the heat absorbing block 63, the mainboard 12, and the isolation plate 40, heat generated within the cavity is transferred to the heat absorbing block 63. The heat absorbing block 63 acts as a heat transfer medium, collecting heat from multiple cavities and transferring it to the second heat sink fins 60. Heat from each cavity is transferred to the second heat sink fins 60 via the heat absorbing block 63. Because the second heat sink fins 60 cover opposite sides of the housing 11, they can evenly dissipate heat transferred from each cavity.

[0056] In a specific embodiment, the industrial computer further includes a heat absorption layer 70 . The heat absorption layer 70 is disposed in the third cavity 133 and adheres to the touch screen 20 . The side of the heat absorption layer 70 adheres to the second heat dissipation fins 60 .

[0057] Specifically, the heat absorption layer 70 is positioned within the third cavity 133 of the industrial computer and is in contact with the surface of the touch screen 20. This position ensures that the heat absorption layer 70 can directly contact the touch screen 20, effectively absorbing and managing the heat generated by the touch screen 20. The main function of the heat absorption layer 70 is to absorb heat from the touch screen 20. Through direct contact with the touch screen 20, it absorbs the heat generated by the touch screen 20 and conducts it to the second heat sink fins 60, forming an effective heat conduction path.

[0058] Furthermore, the heat absorption layer 70 helps concentrate and manage heat from the touch screen 20, preventing overheating that could affect its performance. By effectively transferring heat to the second heat sink fins 60, the heat absorption layer 70 improves the efficiency of the entire heat dissipation system. The heat absorption layer 70 evenly distributes heat across the touch screen 20, reducing the risk of localized overheating. This not only protects the touch screen 20 but also minimizes thermal impact on other components of the industrial computer.

[0059] In a specific embodiment, the heat absorption layer 70 includes a first heat absorption portion 71 and a second heat absorption portion 72. The first heat absorption portion 71 is attached to the touch screen 20, and the second heat absorption portion 72 is provided at opposite ends of the first heat absorption portion 71 and attached between the second heat dissipation fins 60 and the touch screen 20.

[0060] Specifically, the first heat sink 71 is directly attached to the touch screen 20 and is responsible for absorbing heat from the touch screen 20. The second heat sink 72 is located at opposite ends of the first heat sink 71, attached between the second heat sink fins 60 and the touch screen 20, further assisting in heat dissipation and heat distribution. The primary function of the first heat sink 71 is to absorb heat directly from the touch screen 20. This design ensures that the heat generated by the touch screen 20 is effectively captured, preventing the touch screen 20 from overheating and affecting its performance. The second heat sink 72 is responsible for further transferring heat conducted from the first heat sink 71 to the second heat sink fins 60. It distributes heat to the area between the touch screen 20 and the second heat sink fins 60, facilitating even heat dissipation.

[0061] Furthermore, the first heat sink 71 and the second heat sink 72 work together to ensure that the heat generated by the touch screen 20 is effectively absorbed and dispersed. This design improves the efficiency of the heat dissipation system, allowing the industrial computer to operate stably under high load or high temperature conditions. By effectively transferring heat to the second heat sink fins 60, localized overheating of the touch screen 20 and its surrounding area is reduced. This helps protect the electronic components within the device and extend its service life. The provision of the second heat sink 72 helps enhance the flow of heat within the heat dissipation system, ensuring that the heat sink fins can evenly absorb and dissipate heat, thereby improving the heat dissipation capacity of the entire system.

[0062] In a specific embodiment, the second heat dissipating fins 60 are arranged to be tilted upward along the height direction of the industrial computer from one end thereof that is in contact with the second heat absorbing portion 72 .

[0063] Specifically, the second heat sink fins 60 are tilted upward along the height of the industrial computer. This means that the heat sink fins are wider in the area contacting the second heat sink 72 and gradually tilt along the height of the industrial computer. Because the second heat sink fins 60 have a wider cross-sectional area in the area contacting the second heat sink 72, they enable faster contact and heat transfer. This wider contact area provides a larger heat exchange surface, helping to more quickly dissipate heat transferred from the touch screen 20 and heat sink 70 to the heat sink fins.

[0064] Furthermore, the tilted configuration can increase the surface area and heat convection efficiency of the heat sink fins. Heat is transferred from the second heat sink 72 to the larger surface area of ​​the heat sink fins, and then carried away by natural convection or fan-accelerated airflow. This configuration improves the heat dissipation effect and helps maintain a stable temperature of the device under high load. By setting the heat sink fins in an inclined structure, heat can be more evenly distributed across the surface of the heat sink fins, avoiding the problem of localized overheating. This helps protect the electronic components inside the industrial computer and reduces the risk of performance degradation or failure due to overheating.

[0065] In a specific embodiment, the industrial computer further includes a waterproof layer 80 , which is attached to the touch screen 20 and fixedly connected to the housing 11 to prevent liquid from directly contacting the touch screen 20 .

[0066] Specifically, the waterproof layer 80 is tightly attached to the touch screen 20. The design of the waterproof layer 80 ensures complete contact with the surface of the touch screen 20. Another portion of the waterproof layer 80 is fixedly connected to the housing 11. This structure allows the waterproof layer 80 to form a closed, protective area within the industrial computer. The primary function of the waterproof layer 80 is to prevent liquids (such as water and oil) from directly contacting the touch screen 20. This effectively prevents liquid damage to the touch screen 20 and reduces the risk of short circuits, corrosion, or other malfunctions caused by liquid intrusion.

[0067] In one embodiment, the waterproof layer 80 is made of PU.

[0068] Furthermore, the design of the waterproof layer 80 blocks liquids from reaching the touch screen 20. This prevents the liquids from directly impacting the touch screen 20. The waterproof layer 80 prevents dirt and residue from the liquids from adhering to the touch screen 20, keeping the touch screen 20 clean and enhancing the sensitivity and accuracy of touch operations.

[0069] In a specific embodiment, the industrial computer further includes a sealing ring 90 , one end of which is disposed on the touch screen 20 , and the other end of which is interference-fitted with the housing 11 .

[0070] Specifically, the main function of the sealing ring 90 is to provide a waterproof seal to prevent external water vapor, dust or other contaminants from entering the interior of the industrial computer. Through interference fit, the sealing ring 90 can form a firm closed interface to ensure that there is no gap between the touch screen 20 and the housing 11, effectively improving the moisture-proof and waterproof performance of the equipment and extending the service life of the industrial computer. One end of the sealing ring 90 is directly provided on the touch screen 20, ensuring the sealing around the touch screen 20. This connection method can ensure close contact between the screen and the sealing ring 90, further enhancing the protective effect. The touch screen 20 can obtain reliable protection without affecting its operational sensitivity. This helps to prevent liquids or other contaminants from entering the electrical cavity 13 from the edge of the touch screen 20, protecting the internal electronic components from damage.

[0071] It should be pointed out here that the implementation methods of the present application can be improved by ordinary technicians in this field without departing from the creative concept of the present application, but these all fall within the scope of protection of the present application.

Claims

1. A moisture-proof touch-type industrial computer, characterized in that: include: The main body includes a shell and a main board, wherein the shell is provided with an electrical cavity, and the main board is arranged in the electrical cavity; a touch screen, disposed on the housing and partially extending into the electrical cavity; a heat absorbing member, one end of which is disposed on a side of the mainboard facing away from the touch screen, and the other end of which is in contact with the housing, for transferring heat from the mainboard to the housing; Among them, the industrial computer also includes an isolation plate, which is arranged around the circumference of the heat absorption component. The isolation plate and the main board separate the electrical cavity into a first cavity, a second cavity and a third cavity arranged in sequence along the height direction of the body.

2. A moisture-proof touch-type industrial computer according to claim 1, characterized in that: The industrial computer further includes a first heat dissipation fin, which is arranged on a side of the housing facing away from the touch screen, and the heat absorption component faces and fits the heat dissipation fin.

3. The moisture-proof touch-type industrial computer according to claim 1, characterized in that: The industrial computer further includes second heat dissipation fins, which are symmetrically arranged on two opposite side surfaces of the shell along the geometric center line of the shell, and the opposite side surfaces of the mainboard and the isolation plate are both in contact with the second heat dissipation fins.

4. The moisture-proof touch-type industrial computer according to claim 3, characterized in that: The second heat dissipation fin includes a fitting portion and a bending portion, one end of the fitting portion is arranged on the touch screen, and the other end is connected to the bending portion, and the bending portion is arranged on a side of the shell away from the touch screen. The fitting portion and the bending portion are integrally formed.

5. The moisture-proof touch-type industrial computer according to claim 4, characterized in that: The second heat dissipation fin further comprises a heat absorption block, one side of the heat absorption block is attached to the second heat dissipation fin, and the other side of the heat absorption block is attached to the main board and one side surface of the isolation plate.

6. The moisture-proof touch-type industrial computer according to claim 3, characterized in that: The industrial computer further includes a heat absorption layer, which is disposed in the third cavity and adheres to the touch screen, and a side surface of the heat absorption layer adheres to the second heat dissipation fin.

7. The moisture-proof touch-type industrial computer according to claim 6, characterized in that: The heat absorption layer includes a first heat absorption portion and a second heat absorption portion. The first heat absorption portion is attached to the touch screen, and the second heat absorption portion is provided at opposite ends of the first heat absorption portion and attached between the second heat dissipation fins and the touch screen.

8. The moisture-proof touch-type industrial computer according to claim 7, characterized in that: The second heat dissipation fin is arranged to be tilted upward along the height direction of the industrial computer from one end thereof that is in contact with the second heat absorption portion.

9. The moisture-proof touch-type industrial computer according to claim 1, characterized in that: The industrial computer further comprises a waterproof layer, which is adhered to the touch screen and fixedly connected to the housing to prevent liquid from directly contacting the touch screen.

10. The moisture-proof touch-type industrial computer according to claim 1, characterized in that: The industrial computer further comprises a sealing ring, one end of which is arranged on the touch screen, and the other end of which is interference-fitted with the housing.

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