Packaging built-in transformer
By introducing an insulating dielectric layer and an electrical connection between the packaging frame and the transformer, the problems of low voltage resistance and long processing cycle of the existing transformer are solved, higher voltage resistance and more flexible processing are achieved, and the processing cycle is shortened.
Patent Information
- Application Number
- CN202422778431.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-14
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2034-11-14
AI Technical Summary
Existing transformers have problems such as low withstand voltage performance, poor processing convenience of multi-layer windings, fixed winding turns ratio and long processing cycle.
An encapsulated built-in transformer structure is adopted. An insulating dielectric layer is added between the primary winding and the secondary winding, and the primary winding and the secondary winding are electrically connected to the packaging frame. The additional insulating dielectric layer is added to increase the physical distance, reduce the electric field strength, and electrically connect to the outside through the frame pins.
The voltage resistance of the packaged built-in transformer is improved, the processing flexibility and convenience are enhanced, the processing cycle is shortened, and the production efficiency is improved.
Smart Images
Figure CN223401469U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic devices, and in particular to a packaged built-in transformer. Background Art
[0002] A transformer is a device that uses electromagnetic induction to change voltage and is a common component in circuits. Commercially available transformers typically feature a single-piece primary and secondary winding. These transformers typically come in various forms: planar transformers based on printed circuit boards (PCBs), planar transformers based on printed circuit boards (PCBs), and sintered ceramic transformers. PCB-based planar transformers utilize copper foil and prepreg laminated together, with the primary and secondary windings formed in one piece. While these transformers can be fabricated into multiple layers, their low insulation strength prevents them from meeting requirements exceeding 10,000 volts, and even if they could, they would require very thick dielectrics. Wafer-based on-chip transformers utilize a similar rewiring technology, with the primary and secondary windings isolated by a PI dielectric. The number of transformer winding layers depends on the rewiring technology, making it difficult to fabricate multiple layers. Furthermore, the isolation strength depends on the wafer process, so the PI layer cannot be made too thick, resulting in a lower upper voltage rating. Sintered ceramic transformers utilize green ceramic sheets and tungsten conductors, offering high voltage ratings but requiring long processing cycles and high costs. Consequently, existing transformers suffer from low voltage ratings, poor multi-layer winding fabrication, a fixed turns ratio, and long processing cycles. Utility Model Content
[0003] The main purpose of this application is to propose a packaged built-in transformer, which aims to solve the problems of low voltage resistance, poor processing convenience of multi-layer windings, fixed winding turn ratio and long processing cycle in existing transformers.
[0004] To achieve the above objectives, the packaged built-in transformer proposed in this application includes:
[0005] The primary winding comprises a first coil and a first insulating package, wherein the first coil is arranged in the first insulating package;
[0006] The secondary winding comprises a second coil and a second insulating package, wherein the second coil is arranged in the second insulating package;
[0007] an insulating dielectric layer, provided between the primary winding and the secondary winding;
[0008] The packaging frame is connected to a side of the primary winding or the secondary winding away from the insulating medium layer; the packaging frame is electrically connected to the primary winding or the secondary winding.
[0009] In one embodiment, the frame includes a first base island and a second base island, one side of the first base island is connected to the primary winding or the secondary winding, one side of the second base island is connected to the primary winding or the secondary winding, and the first base island and the second base island are respectively arranged at both ends of the primary winding or the secondary winding.
[0010] In one embodiment, the packaged built-in transformer also includes a third insulating package body, the primary winding, the secondary winding, and the package frame are arranged in the third insulating package body, and the frame pins at least partially extend to the outside of the third insulating package body to form a pin lead-out structure.
[0011] In one embodiment, a side of the first base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a first pin; a side of the second base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a second pin, and the pin structure includes the first pin and the second pin.
[0012] In one embodiment, the first insulating packaging body, the second insulating packaging body and the third insulating packaging body are made of epoxy resin, polyester resin, acrylic resin or polyimide material.
[0013] In one embodiment, two opposite sides of the third insulating packaging body parallel to the packaging frame are provided with flat surfaces.
[0014] In one embodiment, the packaged built-in transformer further includes a connecting wire, and the primary winding or the secondary winding is electrically connected to the packaging frame via the connecting wire.
[0015] In one embodiment, the packaged built-in transformer also includes a first magnet and a second magnet, the first magnet is arranged on the side of the primary winding away from the insulating medium layer; the second magnet is arranged on the side of the secondary winding away from the insulating medium layer, and the second magnet is located between the first substrate and the second substrate.
[0016] In one embodiment, the primary winding and the insulating dielectric layer are bonded; and / or,
[0017] The secondary winding is bonded to the insulating dielectric layer; and / or,
[0018] The primary winding or the secondary winding is bonded to the packaging frame.
[0019] In one embodiment, the insulating dielectric layer is made of one or more materials selected from the group consisting of quartz, polytetrafluoroethylene, epoxy resin, mica, asbestos, and nano-composite insulation.
[0020] The technical solution of the present application is to add an insulating dielectric layer between the primary winding and the secondary winding, and electrically connect the primary winding and the secondary winding to the frame, and then electrically connect to the outside through the frame pin; the addition of the insulating dielectric layer can increase the physical distance between the primary winding and the secondary winding, which can effectively reduce the overall electric field strength; and the insulating dielectric layer can disperse the electric field more evenly, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer can reduce the electric field strength and make the electric field distribution more uniform, thereby improving the withstand voltage performance of the packaged built-in transformer. Secondly, the primary winding includes a first coil and a first insulating package, and the secondary winding includes a second coil and a second insulating package, which facilitates the independent manufacturing and pre-assembly of the primary winding and the secondary winding; it is also possible to select primary windings and secondary windings of different performances for combination according to different input and output requirements, thereby improving the processing flexibility and convenience of the packaged built-in transformer; and because the primary winding and the secondary winding can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened, and the production efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.
[0022] Figure 1 This is a structural diagram of an embodiment of a packaged built-in transformer provided by this application;
[0023] Figure 2 This is a schematic top view of an embodiment of a packaged built-in transformer provided in the present application;
[0024] Figure 3 This is a structural schematic diagram of another embodiment of the packaged built-in transformer provided by this application.
[0025] Description of Figure Numbers:
[0026] 1. Primary winding; 11. First coil; 12. First insulating package; 2. Secondary winding; 21. Second coil; 22. Second insulating package; 3. Insulating dielectric layer; 4. Package frame; 51. First base island; 52. Second base island; 6. Third insulating package; 61. Plane; 7. Connecting wire; 8. First magnet; 9. Second magnet.
[0027] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0028] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of this application.
[0029] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0030] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of such features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0031] A transformer is a device that uses electromagnetic induction to change voltage and is a common component in circuits. Commercially available transformers typically feature a primary and secondary windings machined together into a single unit. These transformers typically come in various forms: planar transformers based on printed circuit boards (PCBs), planar transformers based on printed circuit boards (PCBs), and sintered ceramic transformers. PCB-based planar transformers utilize copper foil and prepreg laminated together, with the primary and secondary windings formed in one step. This allows for multiple winding layers, but due to their low insulation strength, they are unsuitable for applications exceeding 10,000 volts. Wafer-based on-chip transformers utilize a similar rewiring technology, with the primary and secondary coils isolated by a PI dielectric. The number of winding layers depends on the rewiring technology, making it difficult to machine multiple winding layers. Furthermore, the isolation strength depends on the wafer process, so the PI layer cannot be made too thick, resulting in a lower upper voltage rating. Sintered ceramic transformers utilize green ceramic sheets and tungsten conductors, offering high voltage ratings but requiring a long processing cycle and high cost. Consequently, existing transformers suffer from low voltage ratings, poor processing convenience for multi-layer windings, and long processing cycles.
[0032] In order to solve the above problems, the present application proposes a packaged built-in transformer.
[0033] See also Figures 1 to 2 In one embodiment of the present application, the packaged built-in transformer includes a primary winding 1, a secondary winding 2 and an insulating dielectric layer 3, the primary winding 1 includes a first coil 11 and a first insulating package 12, and the first coil 11 is arranged in the first insulating package 12; the secondary winding 2 includes a second coil 21 and a second insulating package 22, and the second coil 21 is arranged in the second insulating package 22; the insulating dielectric layer 3 is arranged between the primary winding 1 and the secondary winding 2; the packaging frame 4 is connected to the side of the primary winding 1 or the secondary winding 2 away from the insulating dielectric layer 3; the packaging frame 4 is electrically connected to the primary winding 1 or the secondary winding 2.
[0034] In the above structure, an insulating dielectric layer 3 is added between the primary winding 1 and the secondary winding 2, and the primary winding 1 and the secondary winding 2 are electrically connected to the packaging frame 4, and then electrically connected to the outside through the packaging frame 4; the addition of the insulating dielectric layer 3 can increase the physical distance between the primary winding 1 and the secondary winding 2, which can effectively reduce the overall electric field strength; and the insulating dielectric layer 3 can make the electric field more evenly dispersed, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer 3 can reduce the electric field strength, and at the same time make the electric field distribution more uniform, thereby improving the voltage resistance performance of the packaged built-in transformer. Secondly, the primary winding 1 includes a first coil 11 and a first insulating package 12, and the secondary winding 2 includes a second coil 21 and a second insulating package 22, which facilitates independent manufacturing and pre-assembly of the primary winding 1 and the secondary winding 2; it is also possible to select primary windings 1 and secondary windings 2 with different performances for combination according to different input and output requirements, thereby improving the processing flexibility and convenience of the packaged built-in transformer; and since the primary winding 1 and the secondary winding 2 can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened and production efficiency is improved.
[0035] During production, appropriate first and second coils 11 and 21 can be selected based on the transformer design requirements, such as the design requirements for the packaged built-in transformer, such as input and output performance, power rating, and voltage rating. A molten packaging material (such as epoxy resin, polyurethane, etc.) is poured or injected onto the first coil 11 and then allowed to solidify to form a first insulating packaging body 12. The first insulating packaging body 12 protects the first coil 11, provides mechanical support, and enhances the electrical insulation performance of the coil. A molten packaging material (such as epoxy resin, polyurethane, etc.) is then poured or injected onto the second coil 21 and allowed to solidify to form a second insulating packaging body 22. The second insulating packaging body 22 also protects the second coil 21, provides mechanical support, and enhances the electrical insulation performance of the coil. The solidified primary winding 1 and secondary winding 2 are then placed on either side of an insulating dielectric layer 3 and bonded together using an adhesive. The insulating dielectric layer 3 can be made of quartz, mica, polyimide film, or other high-insulation material to ensure sufficient electrical isolation between the primary and secondary windings 2. The primary winding 1, the secondary winding 2 and the insulating medium layer 3 are bonded to the packaging frame 4. Specifically, either the primary winding 1 or the secondary winding 2 can be bonded to the packaging frame 4. In this embodiment, the secondary winding 2 is bonded to the packaging frame 4. The packaging frame 4 is used to fix the built-in transformer and provide electrical connection. Finally, the molten packaging material (such as epoxy resin, polyurethane, etc.) can be poured on the overall structure formed by the primary winding 1, the secondary winding 2, the insulating medium layer 3 and the packaging frame 4, and then allowed to solidify to form the following third insulating packaging body 6, so that the primary winding 1, the secondary winding 2 and the packaging frame 4 are wrapped in the third insulating packaging body 6.
[0036] In one embodiment, the packaging frame 4 includes a first base island 51 and a second base island 52. One side of the first base island 51 is connected to the primary winding 1 or the secondary winding 2, and one side of the second base island 52 is connected to the primary winding 1 or the secondary winding 2. The first base island 51 and the second base island 52 are respectively disposed at the ends of the primary winding 1 or the secondary winding 2. The first base island 51 and the second base island 52 provide electrical connection points for the transformer, allowing the primary winding 1 and the secondary winding 2 to be electrically connected to external circuits or other electronic components through the first base island 51 and the second base island 52. In addition, the packaging frame 4 also provides support for the ends of the primary winding 1 or the secondary winding 2, thereby enhancing the mechanical stability of the packaged built-in transformer. The first base island 51 and the second base island 52 also serve as heat conduction paths, helping to transfer heat generated by the windings to the housing or other heat dissipation components of the packaged built-in transformer, thereby improving the thermal management efficiency of the transformer.
[0037] In one embodiment, the encapsulated built-in transformer further includes a third insulating package body 6, wherein the primary winding 1, the primary winding 1, and the package frame 4 are disposed within the third insulating package body 6, and the package frame 4 at least partially extends to the outside of the third insulating package body 6 to form a pin structure. By enclosing all components in a continuous insulating package body, the third insulating package body 6 can significantly improve the overall insulation performance of the encapsulated built-in transformer, reduce the risk of electrical failure, and enhance the electrical safety and reliability of the encapsulated built-in transformer; the third insulating package body 6 can also provide additional mechanical protection for the transformer, enabling it to withstand physical shock and vibration; the third insulating package body 6 can also prevent moisture, dust, and other environmental factors from corroding the internal components of the encapsulated built-in transformer, thereby extending its service life. The package frame 4 at least partially extends to the outside of the third insulating package body 6, so that the encapsulated built-in transformer can be directly connected to an external circuit or other components, simplifying the assembly and connection process.
[0038] In one embodiment, a first base island 51 extends from a side of the primary winding 1 or secondary winding 2 to the exterior of the third insulating package 6 to form a first pin; a second base island 52 extends from a side of the primary winding 1 or secondary winding 2 to the exterior of the third insulating package 6 to form a second pin. The pin structure includes the first pin and the second pin. The extensions of the first and second base islands 51, 52 provide additional electrical connection points for connecting the packaged transformer to external circuits or other electronic components. The first base island 51 can be used as an input terminal, and the second base island 52 as an output terminal, providing a clear electrical interface and making circuit design and connection more intuitive.
[0039] In one embodiment, the first insulating package body 12, the second insulating package body 22 and the third insulating package body 6 are made of epoxy resin, polyester resin, acrylic resin or polyimide material. Epoxy resin has good adhesive properties and electrical insulation properties, and after curing, it forms a hard plastic body that can provide good mechanical protection. Polyester resin also has good heat resistance and electrical insulation properties, and its cost-effectiveness is high, making it an economical insulating material that can reduce the production cost of the transformer. Acrylic resin has good transparency and weather resistance, making it easy to observe the internal structure of the transformer. Polyimide has excellent heat resistance and electrical insulation properties, which helps to dissipate heat from the transformer.
[0040] In one embodiment, flat surfaces 61 are provided on opposite sides of the third insulating package body 6, parallel to the package frame 4. Flat surfaces 61 of the third insulating package body 6 help to more evenly distribute internal stress caused by temperature changes or other mechanical stresses, reducing material fatigue or damage caused by stress concentration. Furthermore, flat surfaces 61 of the third insulating package body 6 help the transformer be stably placed on the mounting surface 61, facilitating connection and fixing of the transformer to external electrical connections, such as during electrical welding.
[0041] In one embodiment, the packaged built-in transformer further includes a connecting wire 7, through which the primary winding 1 or the secondary winding 2 is electrically connected to the package frame 4. The connecting wire 7 provides a flexible connection method, which can easily adjust the connection between the primary winding 1 or the secondary winding 2 and the package frame 4 to accommodate different circuit designs and layout requirements.
[0042] In one embodiment, referring to Figure 3 The encapsulated transformer also includes a first magnet 8 and a second magnet 9. The first magnet 8 is disposed on the side of the primary winding 1 away from the insulating dielectric layer 3; the second magnet 9 is disposed on the side of the secondary winding 2 away from the insulating dielectric layer 3, and the second magnet 9 is located between the first base island 51 and the second base island 52. By arranging the first magnet 8 and the second magnet 9 around the primary winding 1 and the secondary winding 2, the magnetic flux density can be enhanced, thereby improving the efficiency and power density of the encapsulated transformer. The first magnet 8 and the second magnet 9 can be made of materials such as ferrite, neodymium iron boron, and samarium cobalt.
[0043] In one embodiment, the primary winding 1 is bonded to the insulating dielectric layer 3; the secondary winding 2 is bonded to the insulating dielectric layer 3; and the primary winding 1 or the secondary winding 2 is bonded to the packaging frame 4. Bonding the primary winding 1 and the secondary winding 2 to the insulating dielectric ensures a tight connection between the windings and the insulating dielectric layer 3, improving the overall structural stability of the packaged built-in transformer and reducing displacement caused by vibration or impact. Furthermore, bonding the primary winding 1 and the secondary winding 2 to the insulating dielectric layer 3 reduces the air gap between the windings and the insulating dielectric layer 3, thereby reducing electromagnetic interference and improving the electromagnetic compatibility of the packaged built-in transformer. For example, the bonding material may be glue.
[0044] In one embodiment, the insulating dielectric layer 3 can be made of various high-voltage materials depending on the application scenario, such as one or more of polytetrafluoroethylene, epoxy resin, mica, asbestos, and nanocomposite insulation. Quartz has very high dielectric strength and can withstand very high voltages without conducting electricity. Quartz can also withstand high electric field strengths without breakdown, enabling the transformer to meet ultra-high voltage requirements. It should be noted that other high-temperature resistant insulating materials can also be used to form the insulating dielectric layer 3 as needed.
[0045] The technical solution of the present application is to add an insulating dielectric layer 3 between the primary winding 1 and the secondary winding 2, and electrically connect the primary winding 1 and the secondary winding 2 to the packaging frame 4, and then electrically connect to the outside through the packaging frame 4; the addition of the insulating dielectric layer 3 can increase the physical distance between the primary winding 1 and the secondary winding 2, which can effectively reduce the overall electric field strength; and the insulating dielectric layer 3 can make the electric field more evenly dispersed, reduce the area where the electric field is concentrated, thereby reducing the risk of local discharge and breakdown of the transformer; therefore, the addition of the insulating dielectric layer 3 can reduce the electric field strength, and at the same time make the electric field distribution more uniform, thereby improving the voltage resistance performance of the packaged built-in transformer. Secondly, the primary winding 1 includes a first coil 11 and a first insulating package 12, and the secondary winding 2 includes a second coil 21 and a second insulating package 22, which facilitates independent manufacturing and pre-assembly of the primary winding 1 and the secondary winding 2; it is also possible to select primary windings 1 and secondary windings 2 with different performances for combination according to different input and output requirements, thereby improving the processing flexibility and convenience of the packaged built-in transformer; and since the primary winding 1 and the secondary winding 2 can be manufactured independently and in parallel, the overall processing cycle of the transformer is shortened and production efficiency is improved.
[0046] The above are merely exemplary embodiments of the present application and are not intended to limit the patent scope of the present application. All equivalent structural transformations made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect application in other related technical fields are included in the patent protection scope of the present application.
Claims
1. A packaged built-in transformer, characterized in that: include: The primary winding comprises a first coil and a first insulating package, wherein the first coil is arranged in the first insulating package; The secondary winding comprises a second coil and a second insulating package, wherein the second coil is arranged in the second insulating package; an insulating dielectric layer, provided between the primary winding and the secondary winding; a packaging frame connected to a side of the primary winding or the secondary winding away from the insulating dielectric layer; The packaging frame is electrically connected to the primary winding or the secondary winding.
2. The packaged built-in transformer according to claim 1, wherein: The packaging frame assembly includes a first base island and a second base island, one side of the first base island is connected to the primary winding or the secondary winding, one side of the second base island is connected to the primary winding or the secondary winding, and the first base island and the second base island are respectively arranged at the two ends of the primary winding or the secondary winding.
3. The packaged built-in transformer according to claim 2, wherein: It also includes a third insulating package body, wherein the primary winding, the secondary winding, and the package frame are arranged in the third insulating package body, and the package frame at least partially extends to the outside of the third insulating package body to form a pin structure.
4. The packaged built-in transformer according to claim 3, wherein: A side of the first base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a first pin; a side of the second base island away from the primary winding or the secondary winding extends to the outside of the third insulating package to form a second pin, and the pin structure includes the first pin and the second pin.
5. The packaged built-in transformer according to claim 4, wherein: The first insulating packaging body, the second insulating packaging body and the third insulating packaging body are made of epoxy resin, polyester resin, acrylic resin or polyimide material.
6. The packaged built-in transformer according to claim 4, wherein: Two opposite sides of the third insulating packaging body parallel to the packaging frame are both provided with flat surfaces.
7. The encapsulated built-in transformer according to any one of claims 1 to 5, wherein: It also includes a connecting wire, through which the primary winding or the secondary winding is electrically connected to the packaging frame.
8. The encapsulated built-in transformer according to any one of claims 2 to 5, wherein: It also includes a first magnet and a second magnet, the first magnet is arranged on the side of the primary winding away from the insulating medium layer; the second magnet is arranged on the side of the secondary winding away from the insulating medium layer, and the second magnet is located between the first base island and the second base island of the frame.
9. The encapsulated built-in transformer according to any one of claims 1 to 5, wherein: The primary winding and the insulating medium layer are bonded; and / or, The secondary winding is bonded to the insulating dielectric layer; and / or, The primary winding or the secondary winding is bonded to the packaging frame.
10. The encapsulated built-in transformer according to any one of claims 1 to 5, wherein: The insulating medium layer is made of one or more materials selected from quartz, polytetrafluoroethylene, epoxy resin, mica, asbestos, and nano-composite insulation.