Inverter module structure

Abstract

The utility model discloses an inverter module structure, comprising an IGBT, a radiator, a capacitor, a current sensor, a driving circuit board, an AC jack, a DC jack, a laminated bus bar, a fan, a control unit and a box body, two ends of the box body are provided with an air inlet and an air outlet; the fan is mounted on the air inlet or the air outlet; the IGBT is stacked on the front surface of the radiator, and the driving circuit board is stacked on the back surface of the radiator; the AC jack and the DC jack are embedded into the front surface of the box body; the control unit is connected to the top surface in the shell; the capacitor is connected to the bottom of the box body. The IGBT and the driving circuit board are respectively stacked on the front surface and the back surface of the radiator; the surface of the radiator is fully utilized, heat generated by the IGBT and the driving circuit board is transmitted through different surfaces of the radiator and exchanges heat with air flowing through the radiator, and the heat is dissipated in the air. Therefore, the temperature of the IGBT and the driving circuit board is reduced, and the IGBT and the driving circuit board are protected from being burnt out.

Description

Technical Field

[0001] The utility model belongs to the technical field related to photovoltaic power generation, and specifically relates to an inverter module structure. Background Art

[0002] Direct current and alternating current are converted through an inverter to drive electrical appliances. However, existing inverters have shortcomings. During operation, they generate heat, causing the inverter temperature to rise. Long-term high-temperature operation can burn out and damage the inverter. Although fans and radiators are installed inside the inverter to cool it, the bottom of the radiator is connected to the heat-generating electronic components, and the other surfaces of the radiator are not used, resulting in poor heat dissipation. The heat generated by electronic components easily accumulates, causing the temperature to rise. Therefore, how to improve the connection structure between the distribution of electronic components inside the existing inverter and the radiator is an urgent problem that those skilled in the art need to solve. Utility Model Content

[0003] In response to one or more of the above-mentioned defects or improvement requirements of the prior art, the present invention provides an inverter module structure to solve the problem of poor heat dissipation effect mentioned in the background technology section.

[0004] The inverter module structure includes a housing, IGBT, heat sink, capacitor, current sensor, driver circuit board, AC socket, DC socket, laminated busbar, fan, control unit and box.

[0005] The two ends of the box are provided with an air inlet and an air outlet; the fan is installed on the air inlet or the air outlet; the radiator is installed in the middle of the box, and the longitudinal direction of the radiator is consistent with the direction of the air blown by the fan;

[0006] The IGBT is stacked on the front of the radiator, and the driver circuit board is stacked on the back of the radiator; the AC socket and the DC socket are embedded in the front of the box; the control unit is connected to the top surface inside the shell; the capacitor is connected to the bottom of the box, and insulating foam is provided between the capacitor and the driver circuit board.

[0007] The emitter, collector, and gate of the IGBT are electrically connected to the driver circuit board, the laminated busbar, and the current sensor. The current sensor is electrically connected to the AC outlet, and the output end of the current sensor is connected to the control unit. The laminated busbar is electrically connected to the capacitor. The DC outlet is electrically connected to the laminated busbar.

[0008] As a further improvement of the present invention, the radiator includes an upper plate, a plurality of fins and a lower plate. The upper plate and the lower plate are arranged in parallel, and the plurality of fins are connected between the upper plate and the lower plate.

[0009] As a further improvement of the present invention, the plurality of fins are arranged obliquely and connected end to end in sequence to form a wave-shaped structure.

[0010] As a further improvement of the present invention, the longitudinal direction of the gap between the adjacent fins is consistent with the direction of the wind blown out by the fan.

[0011] As a further improvement of the present invention, brackets are plugged into the air inlet and the air outlet, and the fan is mounted on the brackets.

[0012] As a further improvement of the present invention, a slide groove is provided on the inner wall of the box, and the edge of the radiator is inserted into the slide groove.

[0013] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0014] In general, the above technical solutions conceived by the present invention have the following beneficial effects compared with the prior art:

[0015] (1) The inverter module structure of the utility model is characterized in that the IGBT is stacked on the front of the radiator and the driver circuit board is stacked on the back of the radiator; the wind flows through the bottom of the radiator. The surface of the radiator is fully utilized, and the heat dissipation area is larger. The heat generated by the IGBT and the driver circuit board is transferred through different surfaces of the radiator and heat exchanged with the wind flowing through the radiator, and the heat is dissipated in the wind. This reduces the temperature of the IGBT and the driver circuit board and protects the IGBT and the driver circuit board from burning.

[0016] (2) The inverter module structure of the present invention comprises an upper plate, a plurality of fins, and a lower plate. The upper plate and the lower plate are arranged in parallel, and the plurality of fins are connected between the upper plate and the lower plate. The radiator structure is stable and not easily deformed. Air flows smoothly inside the radiator, and heat dissipation efficiency is high.

[0017] (3) The inverter module structure of the present invention is quick to install by installing the fan on the air inlet or outlet through a bracket, thereby improving production efficiency.

[0018] (4) The inverter module structure of the present invention is characterized by providing a slide groove on the inner wall of the box, into which the edge of the heat sink is inserted. The sliding connection facilitates assembly. When in use, the electronic components to be cooled are assembled on the heat sink in advance, and then the electronic components are electrically connected to the DC and AC sockets on the box. Finally, the heat sink and the electronic components are inserted into the slide groove together. This saves assembly time and improves efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1This is a schematic diagram of the three-dimensional structure of the inverter module structure in the embodiment of the present utility model;

[0020] Figure 2 yes Figure 1 Schematic diagram of the three-dimensional structure of the heat sink, IGBT, driver circuit board, current sensor and laminated busbar;

[0021] Figure 3 This is a schematic diagram of the inverter module structure with the cabinet omitted;

[0022] Figure 4 It is a structural diagram of the box, radiator and chute.

[0023] In all the drawings, the same figure marks represent the same technical features, specifically: 1. Box; 2. Bracket; 3. Fan; 4. Radiator; 5. AC socket; 6. DC socket; 7. IGBT; 8. Drive circuit board; 9. Current sensor; 10. Slide; 11. Capacitor; 12. Insulating foam; 13. Air inlet; 14. Air outlet; 15. Laminated busbar; 41. Upper piece; 42. Lower piece; 43. Fin. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0026] The inverter module structure in the preferred embodiment of the present utility model is as follows Figures 1 to 4 As shown in the figure, the inverter module structure includes a housing, an IGBT 7, a heat sink 4, a capacitor 11, a current sensor 9, a drive circuit board 8, an AC socket 5, a DC socket 6, a laminated busbar 15, a fan 3, a control unit and a box 1. The box 1 is provided with an air inlet 13 and an air outlet 14 at both ends; the fan 3 is installed on the air inlet 13 or the air outlet 14; the heat sink 4 is installed in the middle of the box 1, and the longitudinal direction of the heat sink 4 is consistent with the direction of the wind blown by the fan 3;

[0027] The IGBT7 is stacked on the front of the radiator 4, and the driving circuit board 8 is stacked on the back of the radiator 4; the AC socket 5 and the DC socket 6 are embedded in the front of the box 1; the control unit is connected to the top surface inside the shell; the capacitor 11 is connected to the bottom of the box 1, and an insulating foam 12 is provided between the capacitor 11 and the driving circuit board 8.

[0028] The emitter, collector, and gate of IGBT 7 are electrically connected to driver circuit board 8, laminated busbar 15, and current sensor 9. Current sensor 9 is electrically connected to AC outlet 5, and its output is connected to a control unit. Laminated busbar 15 is electrically connected to capacitor 11. DC outlet 6 is electrically connected to laminated busbar 15.

[0029] The inverter module structure of this utility model utilizes the IGBT 7 on the front of the heat sink 4 and the driver circuit board 8 on the back. Wind flows over the bottom of the heat sink 4, fully utilizing the surface of the heat sink 4 and increasing the heat dissipation area. The heat generated by the IGBT 7 and the driver circuit board 8 is transferred through the different surfaces of the heat sink 4, exchanging heat with the wind flowing through the heat sink 4 and dissipating the heat in the wind. This reduces the temperature of the IGBT 7 and the driver circuit board 8, protecting them from burning.

[0030] Furthermore, the heat sink 4 includes an upper plate 41, a plurality of fins 43, and a lower plate 42. The upper plate 41 and the lower plate 42 are arranged parallel to each other, and the plurality of fins 43 are connected between the upper plate 41 and the lower plate 42. This structure of the heat sink 4 is stable and not easily deformed. Air flows smoothly within the heat sink 4, passing between the fins 43, and achieving high heat dissipation efficiency.

[0031] Furthermore, the plurality of fins 43 are arranged obliquely and connected end to end to form a wave-shaped structure. Adjacent fins 43 form a stable and secure triangular structure with the upper plate 41 or lower plate 42. Preferably, the wave-shaped fins 43 can be formed by stamping or bending. They are then connected to the upper plate 41 and lower plate 42 to form the heat sink 4, improving manufacturing efficiency.

[0032] Furthermore, the longitudinal direction of the gaps between the adjacent fins 43 is consistent with the direction of the wind blown out by the fan 3 .

[0033] Furthermore, the air inlet 13 and the air outlet 14 are plugged with a bracket 2, and the fan 3 is mounted on the bracket 2. Preferably, the bracket 2 is plug-connected to the housing 1. Mounting the fan 3 on the air inlet 13 or the air outlet 14 via the bracket 2 allows for quick installation and improved production efficiency.

[0034] Furthermore, a chute 10 is provided on the inner wall of the housing 1, into which the edge of the heat sink 4 is inserted. The slidable connection between the heat sink 4 and the chute 10 facilitates assembly. During use, the electronic components to be dissipated are pre-assembled on the heat sink 4, then electrically connected to the DC jack 6 and AC jack 5 on the housing 1. Finally, the heat sink 4 and the electronic components are inserted into the chute 10, saving assembly time and improving efficiency.

[0035] In summary, the method of using the module structure of the inverter shown in the present invention is as follows: first, stack the IGBT7 on the front of the radiator 4, and stack the driver circuit board 8 on the back of the radiator 4; the AC socket 5 and the DC socket 6 are embedded in the front of the box 1; the control unit is connected to the top surface inside the shell; the capacitor 11 is connected to the bottom of the box 1, and a layer of insulating foam 12 is pasted on the capacitor 11. The various electronic components are electrically connected through wires. Afterwards, the radiator 4 together with the electronic components is inserted into the slide 10. Finally, the bracket 2 is connected to the air inlet 13 and the air outlet 14. The present invention only improves the assembly form of the inverter module, the arrangement of its internal electronic components, and the heat dissipation structure. The specific composition and model of the internal functional units, as well as the circuit connection, can refer to the existing technology.

[0036] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0037] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. Inverter module structure, including housing, IGBT, heat sink, capacitor, current sensor, driver circuit board, AC socket, DC socket, laminated busbar, fan, control unit and box, It is characterized by: The two ends of the box are provided with an air inlet and an air outlet; the fan is installed on the air inlet or the air outlet; the radiator is installed in the middle of the box, and the longitudinal direction of the radiator is consistent with the direction of the air blown by the fan; The IGBT is stacked on the front of the radiator, and the driver circuit board is stacked on the back of the radiator; the AC socket and the DC socket are embedded in the front of the box; the control unit is connected to the top surface inside the shell; the capacitor is connected to the bottom of the box, and insulating foam is provided between the capacitor and the driver circuit board.

2. The inverter module structure according to claim 1, characterized in that: The radiator comprises an upper plate, a plurality of fins and a lower plate. The upper plate and the lower plate are arranged in parallel, and the plurality of fins are connected between the upper plate and the lower plate.

3. The inverter module structure according to claim 2, characterized in that: The plurality of fins are arranged obliquely and connected end to end in sequence to form a wave-shaped structure.

4. The inverter module structure according to claim 3, characterized in that: The longitudinal direction of the gaps between the adjacent fins is consistent with the direction of wind blown out by the fan.

5. The inverter module structure according to claim 4, characterized in that: Brackets are plugged into the air inlet and the air outlet, and the fan is mounted on the brackets.

6. The inverter module structure according to claim 5, characterized in that: A sliding groove is provided on the inner wall of the box, and the edge of the radiator is inserted into the sliding groove.

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