Miniaturized radio frequency front-end module

Abstract

The utility model relates to the field of radio frequency front-end modules, in particular to a miniaturized radio frequency front-end module. The technical problem to be solved by the utility model is to provide a miniaturized radio frequency front-end module which can rapidly dissipate internal heat, improve heat dissipation efficiency and ensure use efficiency and service life. The utility model relates to a miniaturized radio frequency front-end module, which comprises a substrate; a plurality of chips are arranged on the upper top surface of the substrate; the plurality of chips are electrically connected with the substrate through bonding wires; the plurality of chips are arranged in a mutually stacked manner; and a plurality of components are fixedly mounted on one side of the chip on the top surface of the substrate. According to the utility model, the effects of rapidly dissipating internal heat, improving the heat dissipation efficiency and ensuring the use efficiency and the service life are achieved.

Description

Technical Field

[0001] The utility model relates to the field of radio frequency front-end modules, and in particular to a miniaturized radio frequency front-end module. Background Art

[0002] The RF front-end module (RFFEM) is located at the front end of the baseband chip in a wireless communication system. It serves as the receiver and transmitter of the radio system, enabling the transmission, conversion, and processing of RF signals. A core component of mobile terminal communications, the RFFEM includes various chips, such as RF switches, RF low-noise amplifiers, RF power amplifiers, duplexers, and RF filters. These chips each play a unique role in wireless communication systems. To meet the high integration and miniaturization requirements of RFFEM, existing technologies typically package RFFEM in a system-level package (SLP). This involves integrating RF chips, passive components, and other components into a single module to achieve high integration and a small package size. During the RFFEM packaging process, as integration increases, the spacing between chips and components decreases, making heat dissipation efficiency a critical issue. Therefore, there is an urgent need to develop a miniaturized RFFEM that can quickly dissipate internal heat, improve heat dissipation efficiency, and ensure operational efficiency and lifespan. Utility Model Content

[0003] In order to overcome the problem that, during the packaging process of the RF front-end module, the spacing between chips and components becomes smaller and smaller as the integration increases, how to improve the heat dissipation efficiency becomes an important issue. The technical problem to be solved by the present invention is to provide a miniaturized RF front-end module that can quickly dissipate internal heat, improve heat dissipation efficiency, and ensure usage efficiency and lifespan.

[0004] The present invention is achieved by the following specific technical means:

[0005] A miniaturized radio frequency front-end module includes a substrate; a plurality of chips are arranged on the top surface of the substrate; the plurality of chips are electrically connected to the substrate via bonding wires; the plurality of chips are stacked on each other; and a plurality of components are fixedly mounted on one side of the chip arranged on the top surface of the substrate;

[0006] A first heat-conducting plate is arranged between the multiple chips stacked on each other; a shell covering the outside of the chips and components is arranged on the top surface of the upper end of the substrate; the shell includes a heat-conducting adhesive layer covering the outside of the chips and components; the outside of the heat-conducting adhesive layer is covered with an insulating adhesive layer; the outside of the insulating adhesive layer is covered with a heat dissipation layer; the shell is sequentially provided with a heat-conducting adhesive layer, an insulating adhesive layer and a heat dissipation layer from the inside to the outside; a plurality of through grooves penetrating the insulating adhesive layer are provided on the insulating adhesive layer, and a second heat-conducting plate is fixedly arranged in the through grooves; the end face of the second heat-conducting plate close to the heat-conducting adhesive layer is in contact with the heat-conducting adhesive layer; the end face of the second heat-conducting plate close to the heat dissipation layer is in contact with the heat dissipation layer.

[0007] Furthermore, the first heat conducting plate is provided with protruding extensions on the sides thereof to cover the sides of the chip; the contact area between the first heat conducting plate and the thermal conductive adhesive layer is increased, so that the heat conducting plate can completely conduct the heat between the stacked chips to the thermal conductive adhesive layer.

[0008] Furthermore, the first heat conducting plate and the second heat conducting plate are made of insulating heat conducting materials, ensuring insulation effect while having good heat conducting performance.

[0009] Furthermore, the heat dissipation layer is an aluminum alloy plate layer; the aluminum alloy plate has a good heat dissipation effect and can quickly dissipate heat.

[0010] Furthermore, a plurality of protrusions are provided on the surface of the heat dissipation layer away from the insulating rubber layer, thereby increasing the contact area between the outer surface of the heat dissipation layer and the air, improving the heat exchange efficiency, and allowing the heat to be quickly transferred to the external air.

[0011] Compared with the prior art, the present invention has the following beneficial effects:

[0012] The utility model can quickly dissipate the internal heat, improve the heat dissipation efficiency, and ensure the use efficiency and lifespan;

[0013] The layered heat-conducting structure achieves efficient heat conduction and dissipation. The first and second heat-conducting plates 5 and 9, as core components of the heat-conducting channel, effectively conduct heat generated by the chip 2 to the external heat dissipation layer 8. The heat dissipation layer 8, with its excellent heat dissipation properties, quickly dissipates the heat into the air, ensuring stable operation of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic cross-sectional structural diagram of the present utility model.

[0015] The markings in the accompanying drawings are: 1-substrate, 2-chip, 3-components, 4-bonding wires, 5-first heat conducting plate, 6-thermal conductive adhesive layer, 7-insulating adhesive layer, 8-heat dissipation layer, 9-second heat conducting plate. DETAILED DESCRIPTION

[0016] The present invention will be further described below with reference to the accompanying drawings: Example

[0017] A miniaturized RF front-end module, such as Figure 1 As shown, it includes a substrate 1; a plurality of chips 2 are arranged on the top surface of the substrate 1; the plurality of chips 2 are electrically connected to the substrate 1 through bonding wires 4; and the plurality of chips 2 are stacked on each other; a plurality of components 3 are also fixedly mounted on one side of the chip 2 arranged on the top surface of the substrate 1;

[0018] A first heat-conducting plate 5 is arranged between the multiple stacked chips 2; a shell covering the outside of the chip 2 and the component 3 is provided on the top surface of the upper end of the substrate 1; the shell includes a heat-conducting adhesive layer 6 covering the outside of the chip 2 and the component 3; the outside of the heat-conducting adhesive layer 6 is covered with an insulating adhesive layer 7; the outside of the insulating adhesive layer 7 is covered with a heat dissipation layer 8; the shell is sequentially provided with a heat-conducting adhesive layer 6, an insulating adhesive layer 7 and a heat dissipation layer 8 from the inside to the outside; a plurality of through grooves penetrating the insulating adhesive layer 7 are provided on the insulating adhesive layer 7, and a second heat-conducting plate 9 is fixedly provided in the through grooves; the end face of the second heat-conducting plate 9 close to the heat-conducting adhesive layer 6 is in contact with the heat-conducting adhesive layer 6; the end face of the second heat-conducting plate 9 close to the heat dissipation layer 8 is in contact with the heat dissipation layer 8.

[0019] Working principle:

[0020] The plurality of chips 2 on the substrate 1 are electrically connected to the substrate 1 through bonding wires 4, and the chips 2 are stacked on each other to form a compact integrated circuit structure; a first heat conducting plate 5 is provided between the stacked chips 2, and the sides thereof are also protruded with extensions, which are wrapped around the sides of the chips 2, thereby greatly increasing the contact area between the first heat conducting plate 5 and the thermal conductive adhesive layer 6; such a design enables the first heat conducting plate 5 to effectively conduct the heat generated between the chips 2 to the external thermal conductive adhesive layer 6; the thermal conductive adhesive layer 6 is tightly wrapped around the outside of the chip 2 and the component 3 to form a continuous heat conduction channel; the thermal conductive adhesive layer 6 not only has excellent thermal conductivity, but also can ensure the firm fixation of the chip 2 and the component 3; the outside of the thermal conductive adhesive layer 6 is also wrapped with a An insulating adhesive layer 7 is provided, which plays the role of electrical isolation and ensures the safe operation of the entire device; at the same time, a number of through grooves are provided on the insulating adhesive layer 7, and a second heat conducting plate 9 is fixed in these through grooves; one side of the second heat conducting plate 9 is in contact with the thermally conductive adhesive layer 6, and the other side is in contact with the external heat dissipation layer 8, thereby further enhancing the heat conduction efficiency; the heat dissipation layer 8 is an aluminum alloy plate layer, which has a good heat dissipation effect; the aluminum alloy plate can quickly dissipate the received heat to the external environment; in order to improve the heat dissipation efficiency, the surface of the heat dissipation layer 8 away from the insulating adhesive layer 7 is further provided with a number of protrusions, which increase the contact area between the outer surface of the heat dissipation layer 8 and the air, thereby improving the heat exchange efficiency and allowing the heat to be conducted to the external air faster.

[0021] The layered heat-conducting structure achieves efficient heat conduction and dissipation. The first and second heat-conducting plates 5 and 9, as core components of the heat-conducting channel, effectively conduct heat generated by the chip 2 to the external heat dissipation layer 8. The heat dissipation layer 8, with its excellent heat dissipation properties, quickly dissipates the heat into the air, ensuring stable operation of the entire device.

[0022] While the present disclosure has been described in detail with reference to exemplary embodiments, the present disclosure is not limited thereto, and it will be apparent to those skilled in the art that various modifications and changes may be made thereto without departing from the scope of the present disclosure.

Claims

1. A miniaturized radio frequency front-end module, comprising a substrate (1); a plurality of chips (2) are arranged on the top surface of the substrate (1); the plurality of chips (2) are electrically connected to the substrate (1) via bonding wires (4); and the plurality of chips (2) are stacked on each other; and a plurality of components (3) are fixedly mounted on one side of the chip (2) arranged on the top surface of the substrate (1); It is characterized by: A first heat conducting plate (5) is provided between the plurality of chips (2) stacked on each other; a shell covering the outside of the chip (2) and the component (3) is provided on the top surface of the upper end of the substrate (1); the shell includes a heat conducting adhesive layer (6) covering the outside of the chip (2) and the component (3); the heat conducting adhesive layer (6) is covered with an insulating adhesive layer (7); the insulating adhesive layer (7) is covered with a heat dissipation layer (8); the shell is sequentially provided with a heat conducting adhesive layer (6), an insulating adhesive layer (7) and a heat dissipation layer (8) from the inside to the outside; the insulating adhesive layer (7) is provided with a plurality of through grooves penetrating the insulating adhesive layer (7), and a second heat conducting plate (9) is fixedly provided in the through grooves; the end face of the second heat conducting plate (9) close to the heat conducting adhesive layer (6) contacts the heat conducting adhesive layer (6); the end face of the second heat conducting plate (9) close to the heat dissipation layer (8) contacts the heat dissipation layer (8).

2. The miniaturized RF front-end module according to claim 1, characterized in that: The first heat conducting plate (5) is provided with protruding extensions on the sides thereof, which cover the sides of the chip (2).

3. The miniaturized RF front-end module according to claim 1, wherein: The first heat conducting plate (5) and the second heat conducting plate (9) are made of insulating heat conducting material.

4. The miniaturized RF front-end module according to claim 1, wherein: The heat dissipation layer (8) is an aluminum alloy plate layer.

5. The miniaturized RF front-end module according to claim 1, characterized in that: A plurality of protrusions are provided on the surface of the heat dissipation layer (8) away from the insulating rubber layer (7).

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