Power amplifier structure and integrated power amplifier circuit board applying same

Abstract

The utility model discloses a power amplifier structure and an integrated power amplifier circuit board using the same, comprising a power amplifier circuit board, the power amplifier circuit board is provided with a capacitor board arranged vertical to the power amplifier circuit board, and the capacitor board is fixed at the edge of the power amplifier circuit board; a circuit is arranged on the capacitor plate and is used for connecting a capacitor fixed on the capacitor plate; wherein the plurality of capacitors are arranged in a preset position. The integrated power amplifier circuit board is formed by splicing the power amplifier structure and further comprises a positive busbar and a negative busbar. And the positive busbar and the negative busbar are used for fixing a plurality of power amplifier structures. The capacitor and the power supply circuit are independent from the power amplifier circuit board, so that the space occupied by the high-capacity capacitor in the power amplifier circuit board is greatly reduced, and the size of the power amplifier circuit board is reduced; after the size of the power amplifier circuit board is reduced, the port spacing and the size of the power divider and the synthesizer matched with the power amplifier circuit board are reduced, and the space utilization rate is greatly improved while the size of the whole power amplifier unit is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic information, in particular to a power amplifier structure and an integrated power amplifier circuit board using the structure. Background Art

[0002] Power amplifier circuit board design often requires large quantities of large capacitors, especially in pulse amplifier circuit boards, where the instantaneous power is high and the capacitor requirements are even higher. Conventional capacitor placement, where the capacitors are soldered directly onto the amplifier circuit board, takes up a significant amount of space, resulting in a significantly larger amplifier circuit board. Furthermore, the DC power supply circuitry of the amplifier circuit board is integrated onto the board, also occupying some space and increasing the size of the board. Furthermore, since the capacitors are soldered directly onto the board and the power supply circuitry is integrated onto the board, the need for additional large-capacity capacitors necessitates a significantly larger circuit board to accommodate them. This, combined with the additional space occupied by the power supply circuitry, further increases the size of the amplifier circuit board. This larger circuit board increases the spacing between the circuit boards, which in turn increases the size of the splitters and combiners, ultimately resulting in a larger amplifier unit.

[0003] Currently, there are two options for capacitor placement in the layout design of power amplifier circuit boards. One is to invert the capacitors, which takes up a large space on the power amplifier circuit board. To obtain a larger capacitor capacity, the power amplifier circuit board must be designed to be large; and the power supply circuit will also take up a large area.

[0004] The second solution is to stand the capacitor upright, which will relatively reduce the space it occupies, but it will still occupy the space of the power amplifier circuit board, and the height space will increase, which will increase the thickness of the power amplifier unit, which is not conducive to the miniaturization and lightweight of the power amplifier unit. Utility Model Content

[0005] In view of this, the present invention provides a power amplifier structure and an integrated power amplifier circuit board using the structure to solve the above problems.

[0006] In order to solve the above technical problems, the present invention provides a power amplifier structure, comprising:

[0007] The power amplifier circuit board is equipped with a capacitor plate arranged perpendicular to it, and the capacitor plate is fixed to the edge of the power amplifier circuit board; a circuit is provided on the capacitor plate, and the circuit is used to connect the capacitor fixed on the capacitor plate; wherein the capacitor includes multiple capacitors and is arranged in a preset position.

[0008] As an optional manner, a metal pad is further provided on a side of the power amplifier circuit board away from the capacitor plate.

[0009] As an option, the metal spacer is a copper spacer.

[0010] As an optional manner, the power amplifier circuit board is equipped with at least one or two capacitor plates; if two capacitor plates are equipped, they are arranged in parallel with each other.

[0011] As an optional method, the capacitor plate and the power amplifier circuit board are fixed by screws.

[0012] As an optional method, the capacitor plate is laid out by copper foil welding, and the circuit is used to connect the capacitor to provide energy for the power amplifier circuit board.

[0013] As an optional method, the capacitors are arranged in an array on the capacitor plate with preset gaps, and the preset gaps are used to install PCB terminals.

[0014] As an optional method, the PCB terminal is welded to the capacitor board, and a threaded hole is provided on the end surface of the PCB terminal in the normal direction for connecting to the busbar.

[0015] On the other hand, the present invention also provides an integrated power amplifier circuit board, which is spliced ​​together by the power amplifier structure as described above, and as an optional method, also includes a positive bus and a negative bus; the positive bus and the negative bus are used to fix multiple power amplifier structures.

[0016] As an optional method, the power amplifier structure is linearly spliced ​​in sequence, the positive bus is fixed on the PCB terminal, and the negative bus is fixed on the power amplifier circuit board.

[0017] The beneficial effects of the utility model are:

[0018] The utility model separates the capacitor and the power supply circuit from the power amplifier circuit board, greatly reducing the space occupied by the large-capacity capacitor on the power amplifier circuit board and reducing the size of the power amplifier circuit board; after the capacitor plate and the power amplifier circuit board are separated, any damaged components can be replaced separately, reducing after-sales costs; after the size of the power amplifier circuit board is reduced, the port spacing of the power divider and synthesizer matched therewith is reduced, and the size is reduced, while the size of the entire power amplifier unit is reduced, the space utilization rate is greatly improved; the bus is directly fixed with screws for power supply, and no wiring and welding are required, which is neater and saves labor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a power amplifier layout of the prior art provided in Example 1 of the present utility model;

[0020] Figure 2 A schematic diagram of another power amplifier layout of the prior art provided in Example 1 of the present utility model;

[0021] Figure 3A schematic diagram of the power amplifier structure layout provided in Example 1 of the present utility model;

[0022] Figure 4 This is a schematic diagram of the structural layout of the integrated power amplifier circuit board provided in Example 2 of the present utility model.

[0023] Reference numerals and their corresponding relationships:

[0024] 1-power amplifier circuit board, 11-metal pad, 2-capacitor plate, 21-power supply circuit, 22-PCB terminal, 3-capacitor, 41-positive bus, 42-negative bus. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods.

[0026] Example 1

[0027] See also Figure 1 , Figure 1 This is a common capacitor 3 layout scheme in the current layout design of the power amplifier circuit board 1. The capacitor 3 is inverted. In this way, the capacitor 3 will occupy a large space on the power amplifier circuit board 1 due to the floor space. To obtain a larger capacitor 3 capacity, the power amplifier circuit board 1 must be designed to be larger; and the power supply circuit 21 will also occupy a large area. Please refer to Figure 2 , Figure 2 This is another layout scheme in the current power amplifier layout design. Putting the capacitor 3 upright will relatively reduce the space occupied, but it will still occupy the space of the power amplifier circuit board 1, and the height space will increase, which will increase the thickness of the power amplifier unit, which is not conducive to the miniaturization and lightweight of the power amplifier unit.

[0028] To do this, see Figure 3 This embodiment provides a power amplifier structure, including a power amplifier circuit board 1, on which is mounted a capacitor plate 2 perpendicularly disposed thereto, secured to an edge of the power amplifier circuit board 1. Capacitor plate 2 is provided with a circuit for connecting to capacitors 3 secured to capacitor plate 2. Multiple capacitors 3 are arranged in predetermined positions. This arrangement allows the capacitors 3 and circuit to be separated from the power amplifier circuit board 1, facilitating replacement and removal, while also fully utilizing the space above the components of the power amplifier circuit board 1.

[0029] In this embodiment, the power amplifier circuit board 1 is further provided with a metal pad 11 on the side away from the capacitor plate 2. In this embodiment, the pad is preferably made of copper to achieve better heat dissipation. Optionally, the capacitor plate 2 and the power amplifier circuit board 1 are fixed by screws. The capacitor plate 2 is welded with copper foil to achieve circuit laying. The circuit is used to connect the capacitor 3 to provide energy for the power amplifier circuit board 1. Please refer to Figure 3 In this embodiment, the power amplifier circuit board 1 is equipped with at least one or two capacitor plates 2. If two capacitor plates 2 are equipped, they are arranged parallel to each other. In this way, the vertical height of the power amplifier components can be limited by only limiting the height of the capacitor plates 2.

[0030] To enable a wider distribution and configuration of capacitors 3, the capacitors 3 of this embodiment are arranged in an array on the capacitor plate 2, with predetermined gaps provided for mounting PCB terminals 22. PCB terminals 22 are soldered to the capacitor plate 2 for connection to the busbar. Threaded holes are provided on the end faces of the PCB terminals 22 facing vertically away from the power amplifier circuit board, facilitating busbar attachment.

[0031] Through the above scheme, this embodiment separates the capacitor 3 and the power supply circuit 21 into a separate circuit board and capacitor plate 2. After the capacitor plate 2 and the power amplifier circuit board 1 are connected by screws, the copper foil is welded together to conduct the circuit, thereby realizing the large-capacity capacitor 3 and supplying power to the power amplifier circuit board 1; a welding type PCB terminal 22 with a threaded hole is designed on the upper part of the capacitor plate 2. When the power amplifier circuit board 1 is arranged, the bus installed on this terminal can be used to power multiple circuit boards.

[0032] Example 2

[0033] See also Figure 4 This embodiment utilizes the power amplifier structures described in Example 1 above, optionally including a positive bus 41 and a negative bus 42. These bus 41 and negative bus 42 are used to secure multiple power amplifier structures. In this embodiment, the power amplifier structures are sequentially connected in a linear fashion, with the positive bus 41 secured to the PCB terminal 22 and the negative bus 42 secured to the power amplifier circuit board 1. This embodiment does not limit the number of power amplifier structures.

[0034] With this solution, the capacitor plate 2 is welded to the PCB terminal block at the power supply circuit 21, and the entire power amplifier circuit board 1 is powered via a busbar, which is directly fixed with screws, eliminating the need for wiring and soldering. Optionally, the capacitor plate 2 and the power amplifier circuit board 1 are fixed using an L-shaped bracket and screws, and then soldered to the corresponding copper foil positions after fixation to achieve circuit conduction; the capacitor plates 2 are placed symmetrically on both sides of the power amplifier circuit board 1, further increasing the capacity of the capacitors 3 so that the bottom row of capacitors 3 on the capacitor plate 2 avoids the components on the power amplifier circuit board 1, making full use of the longitudinal space on the top of the power amplifier circuit board 1. With the design of this embodiment, the size of the power amplifier circuit board 1 will be much smaller.

[0035] Compared with the prior art, this embodiment separates the capacitor 3 and the power supply circuit 21 from the power amplifier circuit board 1, greatly reducing the space occupied by the large-capacity capacitor 3 on the power amplifier circuit board 1 and reducing the size of the power amplifier circuit board 1; after the capacitor plate 2 and the power amplifier circuit board 1 are separated, any damaged components can be replaced separately, reducing after-sales costs; after the size of the power amplifier circuit board 1 is reduced, the port spacing and size of the accompanying power divider and synthesizer are reduced, and the size of the entire power amplifier unit is reduced, while greatly improving space utilization; the bus is directly fixed with screws for power supply, and no wiring and welding are required, which is neater and saves more labor.

[0036] The above are merely preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be construed as limiting the present invention. The scope of protection of the present invention shall be determined by the scope defined in the claims. Persons skilled in the art will appreciate that improvements and modifications may be made without departing from the spirit and scope of the present invention, and such improvements and modifications shall also be considered within the scope of protection of the present invention.

Claims

1. A power amplifier structure, characterized in that: include: A power amplifier circuit board (1) is provided with a capacitor plate (2) arranged perpendicularly thereto, the capacitor plate (2) being fixed to an edge of the power amplifier circuit board (1); a circuit is provided on the capacitor plate (2), the circuit being used to connect a capacitor (3) fixed on the capacitor plate (2); wherein the capacitor (3) comprises a plurality of capacitors arranged in a preset position.

2. A power amplifier structure according to claim 1, characterized in that: The power amplifier circuit board (1) is further provided with a metal pad (11) on a side away from the capacitor plate (2).

3. A power amplifier structure according to claim 2, characterized in that: The metal pad (11) is a copper pad.

4. The power amplifier structure according to claim 1, characterized in that: The power amplifier circuit board (1) is equipped with at least one or two capacitor plates (2); if two capacitor plates (2) are equipped, they are arranged parallel to each other.

5. The power amplifier structure according to claim 1, characterized in that: The capacitor plate (2) and the power amplifier circuit board (1) are fixed by screws.

6. The power amplifier structure according to claim 1, characterized in that: The capacitor plate (2) is laid out as a circuit by copper foil welding, and the circuit is used to connect the capacitor (3) to provide energy for the power amplifier circuit board (1).

7. The power amplifier structure according to claim 1, characterized in that: The capacitors (3) are arranged in an array on the capacitor plate (2) with a preset gap, and the preset gap is used to install the PCB terminal (22).

8. The power amplifier structure according to claim 7, characterized in that: The PCB terminal (22) is welded to the capacitor plate (2), and a threaded hole is provided on the normal end surface of the PCB terminal (22) for connecting to a busbar.

9. An integrated power amplifier circuit board (1), formed by splicing the power amplifier structure according to any one of claims 1 to 8, characterized in that: It also includes a positive busbar (41) and a negative busbar (42); the positive busbar (41) and the negative busbar (42) are used to fix the plurality of power amplifier structures.

10. The integrated power amplifier circuit board (1) according to claim 9, characterized in that: The power amplifier structure is linearly spliced ​​in sequence, the positive busbar (41) is fixed on the PCB terminal (22), and the negative busbar (42) is fixed on the power amplifier circuit board (1).

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