Vapor chamber with small thermal deformation

By designing a structure with cross-distribution of horizontal and vertical heat dissipation plates in the heat spreader, and combining it with a capillary structure and a fixing and disassembly mechanism, the problem of heat spreader deformation at high temperatures is solved, and better thermal conductivity and stability are achieved.

CN223402726UActive Publication Date: 2025-09-30SUZHOU REHAN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422634184.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-09-30
Estimated Expiration
2034-10-30

AI Technical Summary

Technical Problem

Existing heat spreaders have good heat dissipation performance while ensuring a small thickness, but they are prone to deformation, resulting in poor thermal conductivity.

Method used

The cross-distribution of horizontal and vertical heat sinks is adopted, combined with a capillary structure and a fixed and disassembled mechanism to ensure that the heat sink fits tightly to the electronic board, conducts heat through the horizontal and vertical heat sinks, and prevents deformation of the support plate.

Benefits of technology

The heat conduction effect and stability of the heat spreader are improved, deformation is prevented, and the adaptability and heat dissipation performance of the device are enhanced.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a vapor chamber with small thermal deformation, which relates to the technical field of vapor chambers and comprises an electronic board, the vapor chamber is arranged on the surface of the electronic board, and a fixing and detaching mechanism is arranged on the surface of the vapor chamber. According to the utility model, the groove is aligned with the electronic component needing heat dissipation on the surface of the electronic plate, so that the bottom plate can be tightly attached to the electronic plate, when the electronic component dissipates heat, the heat transfer working medium in the capillary structure uniformly conducts the heat to the surface of the bottom plate, and meanwhile, the surface of the groove is connected with the fixed plate; heat is conducted to the transverse heat dissipation plates and the vertical heat dissipation plates on the surface of the fixing plate through the grooves and transmitted to the top plate through the transverse heat dissipation plates and the vertical heat dissipation plates, so that the heat is diffused, the contact area is increased, cooling is achieved, meanwhile, the bottom plate and the top plate are fixed through the supporting plates on the surface of the bottom plate, and deformation of the bottom plate and the top plate in the high-temperature state is prevented; and the adaptability of the device is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of vapor chambers, in particular to a vapor chamber with small thermal deformation. Background Art

[0002] A vapor chamber is a vacuum chamber with a microstructured inner wall, typically made of copper. When heat is transferred from the heat source to the evaporation zone, the coolant within the chamber, heated in the low vacuum environment, begins to vaporize. This process absorbs heat energy and rapidly expands, rapidly filling the entire chamber. When the vapor comes into contact with a cooler area, it condenses. This condensation releases the heat accumulated during evaporation, and the condensed coolant returns to the evaporation heat source via the microstructured capillaries. This process repeats itself within the chamber.

[0003] Patent publication number CN214747430U discloses a heat spreader, including an upper cover, a lower cover and a capillary structure, wherein the lower cover is sealed to the upper cover at the periphery, forming a receiving cavity inside, and the receiving cavity contains a heat transfer medium, and the capillary structure is arranged in the receiving cavity, and the cavity in the receiving cavity without the capillary structure is an airway.

[0004] In order to solve the problem of ensuring good heat dissipation performance while ensuring a small thickness, the existing technology uses a heat spreader to absorb heat from the heat source, and the heat transfer medium evaporates into a gaseous state and can quickly diffuse in the airway, diffuse to a position far away from the heat source, release heat and condense into a liquid state. The liquid heat transfer medium quickly enters the capillary structure and flows to the heat source, forming an internal heat transfer medium flow method for processing. However, the heat spreader may deform, which may lead to a problem of poor thermal conductivity. Utility Model Content

[0005] The purpose of the present invention is to provide a heat spreader with small thermal deformation to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] A vapor chamber with small thermal deformation comprises an electronic board. The surface of the electronic board is provided with the vapor chamber, and the surface of the vapor chamber is provided with a fixing and disassembly mechanism.

[0008] The heat spreader includes a bottom plate, the surface of the bottom plate is provided with a groove, the size of the groove is adapted to the electronic components on the surface of the electronic board, a support plate is fixedly installed on the surface of the bottom plate, a top plate is fixedly installed on the top of the support plate, a fixing plate is fixedly installed inside the top plate, a horizontal heat dissipation plate is fixedly installed on the surface of the fixing plate, and a vertical heat dissipation plate is fixedly installed on the surface of the fixing plate.

[0009] A further improvement of the technical solution of the present utility model is that: the horizontal heat dissipation plates and the vertical heat dissipation plates are fixedly installed on the surface of the groove, multiple groups of the horizontal heat dissipation plates and the vertical heat dissipation plates are provided, the horizontal heat dissipation plates and the vertical heat dissipation plates are crossed and evenly distributed on the surface of the fixed plate, and the height values ​​of the horizontal heat dissipation plates and the vertical heat dissipation plates are less than the height value of the fixed plate.

[0010] A further improvement of the technical solution of the present invention is that: the surface of the top plate is fixedly mounted with sockets, the sockets extend to the surface of the bottom plate, and the sockets are evenly distributed around the top plate.

[0011] A further improvement of the technical solution of the present utility model is that: a capillary structure is provided inside the bottom plate, and the capillary structure is evenly distributed inside the bottom plate.

[0012] A further improvement of the technical solution of the present utility model is that the fixing and disassembly mechanism includes a shell, which is movably connected to the inside of the socket, a clamping ring is fixedly installed on the surface of the shell, the diameter of the clamping ring is larger than the diameter of the socket, and the internal thread of the shell is connected with a bolt.

[0013] A further improvement of the technical solution of the present invention is that: fixing columns are fixedly installed on the surface of the bolt, and the fixing columns are symmetrically distributed on the surface of the bolt.

[0014] A further improvement of the technical solution of the present utility model is that: the fixing and disassembly mechanism also includes a first spring, the first spring is fixedly installed at the bottom end of the bolt, one end of the first spring is fixedly installed with a lower pressing block, the surface of the lower pressing block is movably connected with a clamping block, the clamping block is movably connected to the surface of the shell, the clamping blocks are symmetrically distributed on the surface of the shell, the surface of the clamping block is fixedly installed with a second spring, and the second spring connects the clamping blocks to each other.

[0015] Due to the adoption of the above technical solution, the present invention has achieved the following technical advancements compared to the prior art:

[0016] The heat dissipation mechanism is a kind of heat dissipation mechanism, and it is a kind of heat dissipation mechanism that heats the base plate and the base plate, and heatsink is a kind of heat dissipation mechanism that is used for heat dissipation of base plate, and heatsink is a kind of heat dissipation mechanism that is used for heat dissipation of base plate.

[0017] When the first spring is engaged, the second spring between the blocks contracts and pulls the block back into the housing, pushing the lower pressure block upward. At this time, the block is no longer engaged with the electronic board and can be easily pulled out, thereby improving the adaptability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the heat sink of the utility model;

[0020] Figure 3 This is a structural diagram of the fixed plate of the utility model;

[0021] Figure 4 This is a schematic diagram of the structure of the bottom plate of the utility model;

[0022] Figure 5 This is a structural diagram of the fixing and disassembly mechanism of the utility model;

[0023] Figure 6It is a structural schematic diagram of a cross-sectional view of the fixing and disassembly mechanism of the utility model.

[0024] In the figure: 1. Electronic board; 2. Heat spreader; 21. Groove; 22. Bottom plate; 23. Support plate; 24. Top plate; 25. Fixing plate; 26. Horizontal heat dissipation plate; 27. Vertical heat dissipation plate; 28. Jack; 29. ​​Capillary structure; 3. Fixing and disassembly mechanism; 31. Bolt; 32. Fixing column; 33. Housing; 34. Retaining ring; 35. Block; 36. Second spring; 37. First spring; 38. Pressing block. DETAILED DESCRIPTION

[0025] The present invention is further described in detail below with reference to the embodiments:

[0026] Example 1

[0027] like Figure 1-6 As shown, the utility model provides a heat spreader with small thermal deformation, including an electronic board 1, a heat spreader 2 is provided on the surface of the electronic board 1, a fixing and disassembly mechanism 3 is provided on the surface of the heat spreader 2, the heat spreader 2 includes a bottom plate 22, a groove 21 is provided on the surface of the bottom plate 22, the size of the groove 21 is adapted to the electronic components on the surface of the electronic board 1, a support plate 23 is fixedly installed on the surface of the bottom plate 22, a top plate 24 is fixedly installed on the top of the support plate 23, a fixing plate 25 is fixedly installed inside the top plate 24, a horizontal heat dissipation plate 26 is fixedly installed on the surface of the fixing plate 25, and a vertical heat dissipation plate 26 is fixedly installed on the surface of the fixing plate 25. The heat dissipation plate 27, the horizontal heat dissipation plate 26, and the vertical heat dissipation plate 27 are fixedly installed on the surface of the groove 21. There are multiple groups of horizontal heat dissipation plates 26 and vertical heat dissipation plates 27. The horizontal heat dissipation plates 26 and the vertical heat dissipation plates 27 are crossed and evenly distributed on the surface of the fixed plate 25. The height of the horizontal heat dissipation plates 26 and the vertical heat dissipation plates 27 is less than the height of the fixed plate 25. The surface of the top plate 24 is fixedly installed with a socket 28, which extends to the surface of the bottom plate 22. The sockets 28 are evenly distributed around the top plate 24. The inside of the bottom plate 22 is provided with a capillary structure 29, and the capillary structure 29 is evenly distributed inside the bottom plate 22.

[0028] In this embodiment, the groove 21 is aligned with the electronic components on the surface of the electronic board 1 that need to dissipate heat, so that the bottom plate 22 can fit tightly with the electronic board 1. When the electronic components dissipate heat, the heat transfer medium inside the capillary structure 29 evenly transfers the heat to the surface of the bottom plate 22. At the same time, the surface of the groove 21 is connected to the fixed plate 25, and the heat is transferred from the groove 21 to the horizontal heat dissipation plate 26 and the vertical heat dissipation plate 27 on the surface of the fixed plate 25, and is transmitted to the top plate 24 through the horizontal heat dissipation plate 26 and the vertical heat dissipation plate 27, so that the heat is diffused, the contact area is increased, and the temperature is reduced. At the same time, the support plate 23 on the surface of the bottom plate 22 fixes the groove 21 and the top plate 24 to prevent the bottom plate 22 and the top plate 24 from deforming under high temperature conditions. The internal horizontal heat dissipation plate 26 and the vertical heat dissipation plate 27 can support the bottom plate 22 and the top plate 24 while serving as a heat conduction medium, making the heat spreader 2 more stable and not easy to deform, thereby improving the heat conduction effect and improving the adaptability of the device.

[0029] Example 2

[0030] like Figure 1-6 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, the fixing and disassembly mechanism 3 includes a shell 33, which is movably connected to the inside of the socket 28, and a snap ring 34 is fixedly installed on the surface of the shell 33, and the diameter of the snap ring 34 is larger than the diameter of the socket 28. The internal thread of the shell 33 is connected to the bolt 31, and the surface of the bolt 31 is fixedly installed with a fixing column 32, and the fixing column 32 is symmetrically distributed on the surface of the bolt 31. The fixing and disassembly mechanism 3 also includes a first spring 37, which is fixedly installed on the bottom end of the bolt 31, and a downward pressing block 38 is fixedly installed on one end of the first spring 37. The surface of the downward pressing block 38 is movably connected with a clamping block 35, and the clamping block 35 is movably connected to the surface of the shell 33. The clamping blocks 35 are symmetrically distributed on the surface of the shell 33, and a second spring 36 is fixedly installed on the surface of the clamping block 35, and the second spring 36 connects the clamping blocks 35 to each other.

[0031] When the locking nut 35 is unlocked, the locking nut 35 is unlocked and the locking nut 35 is unlocked, so that the locking nut 35 is unlocked.

[0032] The following is a detailed description of the working principle of the heat spreader with small thermal deformation.

[0033] like Figure 1-6As shown, the groove 21 is aligned with the electronic components that need heat dissipation on the surface of the electronic board 1, so that the bottom plate 22 can fit tightly with the electronic board 1, and the shell 33 is inserted into the socket 28, so that the shell 33 connects the heat spreader 2 to the electronic board 1, and the fixing column 32 on the surface of the bolt 31 is rotated. At this time, the bottom end of the bolt 31 rotates and squeezes the first spring 37. The first spring 37 is squeezed, pushing the lower pressing block 38 to be squeezed downward. At this time, the inclined surface of the top of the lower pressing block 38 contacts the inclined surface of the block 35 surface, squeezing the block 35 to extend outward. At this time, the second spring 36 connected to the surface of the block 35 is stretched, and the block 35 is clamped to the inside of the electronic board 1. The block 35 cooperates with the snap ring 34, so that the fixing and disassembly mechanism 3 fixes the heat spreader 2. When the electronic components dissipate heat, the heat transfer medium in the capillary structure 29 evenly conducts the heat to the surface of the bottom plate 22. At the same time, the surface of the groove 21 is connected to the fixing plate 25, and the heat is transferred from the groove 21 to the fixing plate 25. The heat is then transferred to the horizontal heat sinks 26 and vertical heat sinks 27 on the surface of the fixing plate 25 and then to the top plate 24 through the horizontal heat sinks 26 and vertical heat sinks 27, so that the heat is diffused, the contact area is increased, and the temperature is reduced. At the same time, the support plates 23 on the surface of the bottom plate 22 fix the bottom plate 22 and the top plate 24 to prevent the bottom plate 22 and the top plate 24 from deforming under high temperature conditions. The internal horizontal heat sinks 26 and vertical heat sinks 27 can support the bottom plate 22 and the top plate 24 while acting as heat conducting media, making the heat spreader 2 more stable and less likely to deform, thereby improving the heat conduction effect. When it is necessary to disassemble, the fixing post 32 is rotated so that the bolt 31 moves upward and the first spring 37 rebounds. At this time, the second spring 36 between the block 35 contracts to pull the block 35 back into the shell 33, and at the same time push the pressing block 38 to move upward. At this time, the block 35 is no longer clamped to the electronic board 1, and can be easily pulled out, thereby improving the adaptability of the device.

[0034] The above generally describes the present invention in detail. However, it is obvious to those skilled in the art that modifications or improvements may be made to the present invention. Therefore, modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A heat spreader with small thermal deformation, comprising an electronic board (1), characterized in that: A heat spreader (2) is provided on the surface of the electronic board (1), and a fixing and disassembly mechanism (3) is provided on the surface of the heat spreader (2); The heat spreader (2) includes a bottom plate (22), a surface of the bottom plate (22) is provided with a groove (21), the size of the groove (21) is adapted to the electronic components on the surface of the electronic board (1), a support plate (23) is fixedly mounted on the surface of the bottom plate (22), a top plate (24) is fixedly mounted on the top of the support plate (23), a fixing plate (25) is fixedly mounted inside the top plate (24), a horizontal heat dissipation plate (26) is fixedly mounted on the surface of the fixing plate (25), and a vertical heat dissipation plate (27) is fixedly mounted on the surface of the fixing plate (25).

2. The vapor chamber with low thermal deformation according to claim 1, characterized in that: The horizontal heat dissipation plates (26) and the vertical heat dissipation plates (27) are fixedly mounted on the surface of the groove (21); a plurality of groups of the horizontal heat dissipation plates (26) and the vertical heat dissipation plates (27) are provided; the horizontal heat dissipation plates (26) and the vertical heat dissipation plates (27) intersect and are evenly distributed on the surface of the fixed plate (25); and the height values ​​of the horizontal heat dissipation plates (26) and the vertical heat dissipation plates (27) are less than the height value of the fixed plate (25).

3. The vapor chamber with low thermal deformation according to claim 1, characterized in that: The surface of the top plate (24) is fixedly mounted with sockets (28), the sockets (28) extending to the surface of the bottom plate (22), and the sockets (28) are evenly distributed around the top plate (24).

4. The vapor chamber with low thermal deformation according to claim 1, characterized in that: A capillary structure (29) is provided inside the bottom plate (22), and the capillary structure (29) is evenly distributed inside the bottom plate (22).

5. The vapor chamber with low thermal deformation according to claim 3, characterized in that: The fixing and disassembling mechanism (3) comprises a housing (33), the housing (33) being movably connected to the interior of the socket (28), a snap ring (34) being fixedly mounted on the surface of the housing (33), the diameter of the snap ring (34) being larger than the diameter of the socket (28), and a bolt (31) being threadedly connected to the interior of the housing (33).

6. The vapor chamber with low thermal deformation according to claim 5, characterized in that: The surface of the bolt (31) is fixedly mounted with fixing columns (32), and the fixing columns (32) are symmetrically distributed on the surface of the bolt (31).

7. The vapor chamber with low thermal deformation according to claim 6, characterized in that: The fixing and disassembling mechanism (3) further comprises a first spring (37), the first spring (37) being fixedly mounted on the bottom end of the bolt (31), a lower pressing block (38) being fixedly mounted on one end of the first spring (37), a clamping block (35) being movably connected to the surface of the lower pressing block (38), the clamping block (35) being movably connected to the surface of the housing (33), the clamping blocks (35) being symmetrically distributed on the surface of the housing (33), a second spring (36) being fixedly mounted on the surface of the clamping block (35), the second spring (36) connecting the clamping blocks (35) to each other.