Wire cutting treatment device for waste wire spool for manufacturing integrated circuit packaging wire

By adjusting the position of the electric scissors through electric slides and linear modules, combined with vacuum tubes and fan negative pressure adsorption, the problem of incomplete cleaning of waste wires on uneven surfaces of circuit boards in the manufacturing of integrated circuit packaging lines is solved, and the waste wires can be quickly collected and thoroughly cleaned.

CN223405887UActive Publication Date: 2025-10-03SHANXI HYDROGEN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202422449322.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-10
Publication Date
2025-10-03
Estimated Expiration
2034-10-10

AI Technical Summary

Technical Problem

In the prior art, during the manufacturing process of integrated circuit packaging lines, the waste wires on the uneven surfaces of the circuit board are not cleaned thoroughly, especially the sparse and broken waste wires are difficult to fall off or are adsorbed on the circuit board surface, resulting in incomplete cleaning.

Method used

Electric slide rails and linear modules are used to adjust the position of the electric scissors. Combined with the vacuum tube and fan negative pressure adsorption, the waste wire is cut and sucked into the collection box through the vacuum hood and vacuum tube. The splint and limit plate are used to quickly fix and clamp the packaging box.

Benefits of technology

It can quickly clean the waste wires on the uneven surface of the circuit board, ensure the complete collection of the waste wires, and improve the cleaning efficiency and thoroughness.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN223405887U_ABST
    Figure CN223405887U_ABST
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Abstract

The utility model belongs to the technical field of integrated circuit packaging, and particularly relates to a wire spool waste wire cutting treatment device for integrated circuit packaging wire manufacturing, which comprises a working table, two electric sliding rails are fixedly connected to the top of the working table, a mounting frame is slidably connected to the two electric sliding rails, a linear module is fixedly connected to the bottom of the mounting frame, and the linear module is fixedly connected to the top of the working table. A moving block is arranged on the linear module; the dust collection pipe and the dust collection cover are matched with the electric scissors, the position of the electric scissors in the horizontal direction is adjusted through the electric sliding rail and the linear module, and the position of the electric scissors in the vertical direction is adjusted through the electric push rod; then the integrated circuit packaging wire head is sheared through the electric scissors, the waste wire falls on the circuit board, the draught fan is started while shearing is conducted, the waste wire on the circuit board is sucked into the collecting box through the dust suction cover and the dust suction pipe through negative pressure adsorption of the draught fan, and the function of rapidly adsorbing the waste wire is achieved; the problem that waste wires at uneven positions of the surface of the circuit board are inconvenient to clean is solved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit packaging, in particular to a spool waste wire cutting and processing device for integrated circuit packaging line manufacturing. Background Art

[0002] An integrated circuit is a miniature electronic device or component that is made by interconnecting the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit using a certain process. It is manufactured on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function.

[0003] A Chinese patent with announcement number CN214263174U discloses a waste wire collection device for wire bonding equipment in the integrated circuit packaging industry, comprising a base, a clamping device rotatably provided on one side opposite to the fixed plate, a collecting box movably provided on the top of the base, the collecting box being located in the inner cavity on the opposite side of the fixed plate, and a handle fixedly connected to the surface of the collecting box; by rotating the manual screw rod, the manual screw rod is rotated on the surface of the connecting plate, so that one end of the manual screw rod leaves the rotating handle, and then the rotating handle is rotated, the placement plate is rotated through the bearing rod so that the placement plate faces downward, so that all the waste wires on the surface of the integrated circuit board fall into the inner cavity of the collection box, and then the handle is rotated to straighten the placement plate, so that one end of the manual screw rod is against the surface of the rotating handle for fixing, and the operation is repeated until the work is completed and the collection box is taken out through the handle to clean the waste wire in the inner cavity of the collection box.

[0004] In the above technology, by rotating the placement plate, when the placement plate is facing downward, the waste wires on the integrated circuit board will fall into the collection box. However, the surface of the integrated circuit board is uneven due to electric welding, and some of the broken waste wires fall into the concave part of the circuit board or even adsorb on the surface of the circuit board and will not fall directly, resulting in incomplete cleaning.

[0005] Therefore, in order to solve the above problems, a device for cutting and processing waste wire spools used in manufacturing integrated circuit packaging lines is proposed. Utility Model Content

[0006] In order to make up for the shortcomings of the existing technology and solve the problem that waste wires are inconvenient to clean on the uneven surface of the circuit board, a spool waste wire cutting and processing device for integrated circuit packaging line manufacturing is proposed.

[0007] The technical solution adopted by the present invention to solve its technical problems is: the present invention describes a wire spool waste wire cutting and processing device for integrated circuit packaging line manufacturing, comprising a workbench, two electric slide rails fixedly connected to the top of the workbench, a mounting frame slidably connected to the two electric slide rails, a linear module fixedly connected to the bottom of the mounting frame, a moving block provided on the linear module, an electric push rod fixedly connected to the bottom of the moving block, a fixed sleeve fixedly connected to the output end of the electric push rod, an electric scissors fixedly connected to the fixed sleeve, a dust suction pipe connected to and passing through the fixed sleeve, a dust hood installed at one end of the dust suction pipe; a collection box fixedly connected to the bottom of the workbench, a fan installed on the collection box; the bottom of the dust suction pipe is connected and fixed to the collection box.

[0008] Preferably, two fixed plates are fixedly connected to the bottom of the workbench, a bidirectional ball screw is rotatably connected between the two fixed plates through bearings, two movable plates are threadedly connected to the bidirectional ball screw, the tops of the movable plates are fixed with splints, the bottom of one of the fixed plates is fixed with a motor, and the output shaft of the motor is fixed to one end of the bidirectional ball screw.

[0009] Preferably, support plates are fixedly connected to the inner side walls of the clamping plates, and sliding grooves are provided on the support plates. Two limiting plates are slidably connected in the sliding grooves; and packaging boxes are provided on the two support plates.

[0010] Preferably, a sliding rod is fixedly connected to the inner wall of the sliding groove, and springs are sleeved on both ends of the sliding rod, and both ends of the spring are respectively fixedly connected to the limiting plate and the inner wall of the sliding groove.

[0011] Preferably, two guide rods are fixedly connected between the two fixed plates, and the movable plates are slidably connected to the guide rods.

[0012] Preferably, two side panels are fixedly connected to the side walls of the electric scissors; and the dust suction pipe is connected through the side panels.

[0013] Beneficial effects of the utility model:

[0014] The utility model provides a spool waste wire cutting and processing device for manufacturing integrated circuit packaging wires. The device cooperates with electric scissors through a dust suction pipe and a dust suction hood. The surface of the integrated circuit board becomes uneven due to electric welding. Some sparse waste wires fall into the concave part of the circuit board or are even adsorbed on the surface of the circuit board and do not fall directly, resulting in incomplete cleaning. The horizontal position of the electric scissors is adjusted respectively by an electric slide rail and a linear module, and the vertical position of the electric scissors is adjusted by an electric push rod. Then, the integrated circuit packaging wire ends are cut by the electric scissors, and the waste wires fall onto the circuit board. The fan is turned on at the same time of cutting, and the waste wires on the circuit board are sucked into a collection box through the dust suction hood and the dust suction pipe through the negative pressure adsorption of the fan, thereby realizing the function of quickly adsorbing the waste wires and solving the problem that it is inconvenient to clean the waste wires on the uneven surface of the circuit board.

[0015] The utility model provides a spool waste wire cutting and processing device for manufacturing integrated circuit packaging lines. By arranging a clamping plate and a limiting plate, when fixing a packaging box body, by turning on a motor, a bidirectional ball screw is driven to rotate by the output shaft of the motor. Since a ball nut seat is provided at the connection between the bidirectional ball screw and the movable plate, the radial movement of the movable plate is ensured by the ball nut seat, the movable plate is driven to move in different directions by the bidirectional ball screw, and the clamping plate is driven to move in different directions by the movable plate until the packaging box body is fixed, thereby realizing the function of quickly fixing and clamping the packaging box body. Then, when placing the packaging box body, the packaging box body is placed between the two limiting plates, and the limiting plates compress the springs on both sides. When the packaging box body is released, the packaging box body is limited to a middle position under the action of the springs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 It is the first stereogram of the present utility model;

[0018] Figure 2 It is a second stereogram of the present utility model;

[0019] Figure 3 It is a three-dimensional diagram of the dust collection pipe and dust collection cover in the utility model;

[0020] Figure 4 It is a three-dimensional diagram of the splint in the utility model;

[0021] Figure 5 It is a three-dimensional diagram of the limiting plate in the utility model;

[0022] Legend:

[0023] 1. Workbench; 2. Mounting frame; 3. Linear module; 4. Moving block; 5. Electric push rod; 6. Fixed sleeve; 7. Electric scissors; 8. Dust hood; 9. Dust tube; 10. Side panel; 11. Collection box; 12. Fan; 13. Electric slide rail; 14. Clamp; 15. Fixed plate; 16. Motor; 17. Bidirectional ball screw; 18. Guide rod; 19. Moving plate; 20. Support plate; 21. Limit plate; 22. Spring; 23. Slide rod; 24. Packaging box; 25. Slide groove. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Specific examples are given below.

[0026] See also Figure 1-Figure 5 The utility model provides a spool waste wire cutting and processing device for integrated circuit packaging line manufacturing, comprising a workbench 1, with two electric slide rails 13 fixedly connected to the top of the workbench 1, and a mounting frame 2 slidably connected to the two electric slide rails 13, and a linear module 3 fixedly connected to the bottom of the mounting frame 2, a moving block 4 is provided on the linear module 3, and an electric push rod 5 is fixedly connected to the bottom of the moving block 4, and a fixed sleeve 6 is fixedly connected to the output end of the electric push rod 5, and an electric scissors 7 is fixedly connected to the fixed sleeve 6, and a dust suction pipe 9 is connected and passes through the fixed sleeve 6, and a dust suction hood 8 is installed at one end of the dust suction pipe 9; a collecting box 11 is fixedly connected to the bottom of the workbench 1, and a fan 12 is installed on the collecting box 11; the bottom of the dust suction pipe 9 is connected and fixed to the collecting box 11.

[0027] During operation, the surface of the integrated circuit board becomes uneven due to electric welding, and some shredded waste wires fall into the concave parts of the circuit board or even adsorb on the surface of the circuit board and will not fall directly, resulting in incomplete cleaning; the horizontal position of the electric scissors 7 is adjusted respectively by the electric slide rail 13 and the linear module 3, and the vertical position of the electric scissors 7 is adjusted by the electric push rod 5; then the integrated circuit package wire ends are cut by the electric scissors 7, and the waste wires fall on the circuit board. The fan 12 is turned on while cutting, and the waste wires on the circuit board are sucked into the collection box 11 through the vacuum hood 8 and the vacuum tube 9 through the negative pressure adsorption of the fan 12, thereby realizing the function of quickly adsorbing the waste wires and solving the problem that it is inconvenient to clean the waste wires on the uneven surface of the circuit board.

[0028] Further, such as Figure 2 and Figure 4 As shown, two fixed plates 15 are fixed to the bottom of the workbench 1, and a bidirectional ball screw 17 is rotatably connected between the two fixed plates 15 through a bearing. Two movable plates 19 are threadedly connected to the bidirectional ball screw 17, and the tops of the movable plates 19 are fixed with a splint 14. The bottom of one of the fixed plates 15 is fixed with a motor 16, and the output shaft of the motor 16 is fixed to one end of the bidirectional ball screw 17.

[0029] During operation, when fixing the packaging box body 24, the motor 16 is turned on, and the bidirectional ball screw 17 is driven to rotate by the output shaft of the motor 16. Since a ball nut seat is provided at the connection between the bidirectional ball screw 17 and the movable plate 19, the radial movement of the movable plate 19 is ensured by the ball nut seat. The bidirectional ball screw 17 drives the movable plate 19 to move in different directions, and the movable plate 19 drives the clamping plate 14 to move in different directions until the packaging box body 24 is fixed, thereby realizing the function of quickly fixing and clamping the packaging box body 24.

[0030] Further, such as Figure 4 As shown, support plates 20 are fixed to the inner side walls of the clamping plates 14 , and sliding grooves 25 are provided on the support plates 20 . Two limiting plates 21 are slidably connected in the sliding grooves 25 ; and packaging boxes 24 are provided on the two support plates 20 .

[0031] During operation, when limiting the position of the packaging box body 24 , the packaging box body 24 is placed between the limiting plates 21 , and the limiting plates 21 limit the packaging box body 24 to the middle of the support plate 20 .

[0032] Further, such as Figure 5 As shown, a slide rod 23 is fixed to the inner wall of the slide groove 25 , and springs 22 are sleeved on both ends of the slide rod 23 . The two ends of the spring 22 are fixed to the limit plate 21 and the inner wall of the slide groove 25 respectively.

[0033] During operation, when placing the packaging box body 24, the packaging box body 24 is placed between the two limiting plates 21. The limiting plates 21 compress the springs 22 on both sides. When the packaging box body 24 is released, the packaging box body 24 is limited to the middle position under the action of the springs 22.

[0034] Further, such as Figure 4 As shown, two guide rods 18 are fixedly connected between the two fixed plates 15 , and the movable plates 19 are slidably connected to the guide rods 18 .

[0035] During operation, the movable plate 19 is limited in a horizontal direction by the guide rod 18 during the movement.

[0036] Further, such as Figure 3As shown, two side panels 10 are fixedly connected to the side walls of the electric scissors 7 ; the dust suction pipe 9 is connected through the side panels 10 .

[0037] During operation, the dust suction pipe 9 is fixed to one side of the electric scissors 7 through the side plate 10 , so that the dust suction pipe 9 can move along with the movement of the electric scissors 7 .

[0038] Working principle: The surface of the integrated circuit board is uneven due to electric welding, and some shredded waste wires fall into the concave parts of the circuit board or even adsorb on the surface of the circuit board and do not fall directly, resulting in incomplete cleaning; the horizontal position of the electric shears 7 is adjusted respectively by the electric slide rail 13 and the linear module 3, and the vertical position of the electric shears 7 is adjusted by the electric push rod 5; then the integrated circuit package wire ends are cut by the electric shears 7, and the waste wires fall onto the circuit board. At the same time of cutting, the fan 12 is turned on, and the waste wires on the circuit board are sucked into the collection box 11 through the vacuum hood 8 and the vacuum tube 9 by the negative pressure adsorption of the fan 12, thereby realizing the function of quickly adsorbing the waste wires and solving the problem of inconvenient cleaning of the waste wires on the uneven surface of the circuit board;

[0039] When fixing the packaging box body 24, by turning on the motor 16, the bidirectional ball screw 17 is driven to rotate by the output shaft of the motor 16. Since a ball nut seat is provided at the connection between the bidirectional ball screw 17 and the movable plate 19, the radial movement of the movable plate 19 is ensured by the ball nut seat. The movable plate 19 is driven to move in different directions by the bidirectional ball screw 17, and the clamping plate 14 is driven to move in different directions by the movable plate 19 until the packaging box body 24 is fixed, thereby realizing the function of quickly fixing and clamping the packaging box body 24; then, when placing the packaging box body 24, the packaging box body 24 is placed between the two limit plates 21, and the limit plates 21 compress the springs 22 on both sides. When the packaging box body 24 is released, the packaging box body 24 is limited to the middle position under the action of the springs 22.

[0040] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and improvements may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and improvements fall within the scope of the present invention as claimed.

Claims

1. A device for cutting and processing spool waste wire used in manufacturing integrated circuit packaging lines, comprising a workbench (1), characterized in that: The top of the workbench (1) is fixedly connected to two electric slide rails (13), and a mounting frame (2) is slidably connected to the two electric slide rails (13). The bottom of the mounting frame (2) is fixedly connected to a linear module (3), and a moving block (4) is provided on the linear module (3). The bottom of the moving block (4) is fixedly connected to an electric push rod (5), and the output end of the electric push rod (5) is fixedly connected to a fixed sleeve (6), and an electric scissors (7) is fixedly connected to the fixed sleeve (6). A dust suction pipe (9) is connected and passed through the fixed sleeve (6), and a dust hood (8) is installed at one end of the dust suction pipe (9); the bottom of the workbench (1) is fixedly connected to a collection box (11), and a fan (12) is installed on the collection box (11); the bottom of the dust suction pipe (9) is connected and fixed to the collection box (11).

2. The device for cutting and processing waste spool wire used in manufacturing integrated circuit packaging lines according to claim 1, characterized in that: Two fixed plates (15) are fixedly connected to the bottom of the workbench (1), a bidirectional ball screw (17) is rotatably connected between the two fixed plates (15) via a bearing, two movable plates (19) are threadedly connected to the bidirectional ball screw (17), the tops of the movable plates (19) are fixedly connected to a clamping plate (14), a motor (16) is fixedly connected to the bottom of one of the fixed plates (15), and the output shaft of the motor (16) is fixedly connected to one end of the bidirectional ball screw (17).

3. The device for cutting and processing waste spool wire used in manufacturing integrated circuit packaging lines according to claim 2, characterized in that: The inner side walls of the clamping plates (14) are fixedly connected with support plates (20), the support plates (20) are provided with sliding grooves (25), and two limiting plates (21) are slidably connected in the sliding grooves (25); and the two support plates (20) are provided with packaging boxes (24).

4. The device for cutting and processing waste spool wire used in manufacturing integrated circuit packaging lines according to claim 3, characterized in that: A slide rod (23) is fixedly connected to the inner wall of the slide groove (25), and springs (22) are sleeved on both ends of the slide rod (23). The two ends of the spring (22) are respectively fixedly connected to the limit plate (21) and the inner wall of the slide groove (25).

5. The device for cutting and processing waste spool wire used in manufacturing integrated circuit packaging lines according to claim 4, characterized in that: Two guide rods (18) are fixedly connected between the two fixed plates (15), and the movable plates (19) are slidably connected to the guide rods (18).

6. The device for cutting and processing waste spool wire used in manufacturing integrated circuit packaging lines according to claim 5, characterized in that: Two side panels (10) are fixedly connected to the side walls of the electric scissors (7); the dust suction pipe (9) is connected through the side panels (10).

Citation Information

Patent Citations

  • Waste wire collecting device of wire welding equipment in integrated circuit packaging industry

    CN214263174U