Spiral solder structure

Abstract

In order to solve the problems that an existing soldering lug for cutting pick soldering is insufficient in material consumption accuracy, many in stamping leftover materials and unstable in quality, the utility model provides a spiral solder structure which comprises a solder wire and a resin layer, the solder wire is spirally wound to form a disc-shaped structure, and the resin layer is arranged on the solder wire. And the resin layer is positioned on the brazing filler metal wire rod so as to play a role in fixing the disc-shaped structure. The spiral solder structure provided by the utility model has better controllability of feeding quantity, can be used for producing multiple spiral solder structures with different specifications and feeding quantity through single winding equipment, is beneficial to reducing the investment of production equipment, has higher strength and operability, and is convenient for improving the production efficiency and realizing automation.

Description

Technical Field

[0001] The utility model belongs to the technical field of brazing structures, and in particular relates to a spiral solder structure. Background Art

[0002] Picks are classified as shearer picks and roadheader picks. They are used in mining and tunneling machinery, and are crucial components for mining and tunneling. They are primarily found in equipment such as shearers, roadheaders, milling machines, and hard rock tunneling machines. A pick consists primarily of a shank and a head. The head is the portion that extends beyond the adapter / sleeve, with a carbide tip welded (or inlaid) to the top. The shank is the portion that fits into the adapter / sleeve. Currently, brazing is the primary method for welding carbide picks. This involves pre-placing the carbide head, brazing filler metal, and brazing flux within a steel substrate. The pick is then heated using an induction coil or placed in a vacuum furnace where it is heated by radiation from a heating element. Once the brazing filler metal reaches a certain temperature, it melts and flows to fill the braze seam. After cooling, the carbide and steel substrate are securely bonded.

[0003] Currently, the welding pieces used in traditional pick brazing are primarily made by stamping strips. Specifically, multiple metals are melted and alloyed, then cast into ingots. These ingots are then rolled through multiple rolling processes to form a strip of uniform thickness. Finally, the ingots are punched using dies on a punch press to form the welding pieces. However, this method for producing welding pieces has significant disadvantages: The investment in strip rolling equipment is large, and waste such as flash is inevitably generated during the manufacturing process. Furthermore, since the outer diameter of the punched pieces is uniform, the thickness of the punched pieces must be strictly controlled, resulting in insufficient precision in controlling the amount of welding piece material used. Welding pieces of varying sizes require multiple sets of dies, making the process complex. Stamping welding pieces from strips generates a large amount of scrap. Returning scrap to the furnace makes it difficult to control the alloy composition. The ingot casting process inevitably leads to alloy composition segregation in different parts of the ingot, resulting in unstable welding piece composition and fluctuations in the final weld quality. Utility Model Content

[0004] Aiming at the problems of insufficient material quantity accuracy, large amount of stamping scraps and unstable quality in existing pick brazing welding sheets, the utility model provides a spiral welding structure.

[0005] The technical solutions adopted by the present invention to solve the above technical problems are as follows:

[0006] The utility model provides a spiral solder structure, comprising a solder wire and a resin layer. The solder wire is spirally wound to form a disc-shaped structure, and the resin layer is located on the solder wire to fix the disc-shaped structure.

[0007] Optionally, the resin layer is selected from epoxy resin, polyvinyl butyral resin, nitrocellulose, ethyl cellulose or acrylic resin and derivatives thereof.

[0008] Optionally, the resin layer includes a first resin layer, and the first resin layer is coated on the outer surface of the disc-shaped structure.

[0009] Optionally, the thickness of the first resin layer is 0.01 mm to 1 mm.

[0010] Optionally, the resin layer includes a second resin layer, and in the disc-shaped structure, gaps are formed between adjacent solder wires, and the second resin layer is located in the gaps between adjacent solder wires.

[0011] Optionally, the gap width between adjacent solder wires is 0 to 1 mm.

[0012] Optionally, the disc-shaped structure is disc-shaped, flat oval-shaped, flat square-shaped or irregularly shaped.

[0013] Optionally, along a direction perpendicular to the extension direction of the solder wire, the cross-section of the solder wire is circular, square, elliptical or irregular.

[0014] Optionally, the outer diameter of the solder wire is 0.3 mm to 4 mm.

[0015] Optionally, the disc-shaped structure is wound with two or more turns.

[0016] The spiral solder structure provided by the present invention utilizes a solder wire material to form a coiled disc-shaped structure. Compared to controlling the thickness of a stamped sheet, the outer diameter of the solder wire material is easier to control. Consequently, by adjusting the length of the solder wire material, the material quantity used can be precisely controlled. Furthermore, the processing process does not produce scrap, thus avoiding material waste and quality issues caused by scrap material being recycled. Furthermore, this spiral solder structure only requires adjusting the winding length to meet different material quantities. Consequently, a single winding device can be used to produce spiral solder structures with various specifications and material quantities, thereby reducing investment in production equipment.

[0017] On the other hand, since the solder is usually soft in texture, the disc-shaped structure wound with solder wire of smaller diameter or lower material rigidity has problems such as insufficient overall rigidity, easy deformation, and easy opening of wire ends. It is inconvenient to operate manually or clamp mechanically, which reduces production efficiency. In order to avoid the problem of looseness or deformation of the disc-shaped structure after winding, a resin layer is provided in the disc-shaped structure to act as a bond, so that it forms an integrated structure with a certain deformation resistance, avoiding deformation during use, overcoming the disadvantage of insufficient strength of the spiral solder structure wound with small wire diameter, making it have higher strength and operability, facilitating improved production efficiency and automation, and not affecting the brazing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural diagram of a spiral solder structure provided by an embodiment of the present utility model;

[0019] Figure 2 It is a cross-sectional schematic diagram of a spiral solder structure provided by an embodiment of the present utility model;

[0020] Figure 3 It is a cross-sectional schematic diagram of a spiral solder structure provided by another embodiment of the present invention.

[0021] The reference numerals in the drawings of the specification are as follows:

[0022] 1. Solder wire; 2. Resin layer; 21. First resin layer; 22. Second resin layer. DETAILED DESCRIPTION

[0023] In order to make the technical problems, technical solutions and beneficial effects solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0024] See also Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a spiral solder structure, including a solder wire 1 and a resin layer 2. The solder wire 1 is spirally wound to form a disc-shaped structure, and the resin layer 2 is located on the solder wire 1 to fix the disc-shaped structure.

[0025] In the spiral solder structure, a solder wire 1 is wound to form a disc-shaped structure. Compared to controlling the thickness of a stamped sheet, the outer diameter of the solder wire 1 is easier to control. Consequently, by adjusting the length of the solder wire 1, the amount of material used can be precisely controlled. Furthermore, the processing process does not produce scrap, thus avoiding material waste and quality issues caused by scrap recycling. Furthermore, this spiral solder structure only requires adjusting the winding length to meet different material requirements. This allows the production of multiple spiral solder structures with different material specifications and requirements using a single winding device, which helps reduce investment in production equipment. On the other hand, since the solder is usually soft in texture, the disc-shaped structure wound with a solder wire 1 with a small diameter or low material rigidity has problems such as insufficient overall rigidity, easy deformation, and easy opening of the wire ends. It is inconvenient to operate manually or clamp mechanically, which reduces production efficiency. In order to avoid the problem of looseness or deformation of the disc-shaped structure after winding, a resin layer 2 is provided in the disc-shaped structure to act as a bond, so that it forms an integrated structure with a certain deformation resistance, avoiding deformation during use, overcoming the disadvantage of insufficient strength of the spiral solder structure wound with a small wire diameter, making it have higher strength and operability, facilitating improved production efficiency and automation, and not affecting the brazing effect.

[0026] The spiral solder structure can be applied to the brazing operation of the pick. During the brazing operation, the spiral solder structure is placed in the hole of the pick by manual placement or mechanical clamping, and is heated by an induction coil. The solder wire 1 in the spiral solder structure melts after heating and fills the gap between the pick and the hole. After cooling, it plays a fixing role, and the resin layer 2 on its surface is thermally decomposed under high temperature conditions and removed from the weld in the form of gas, leaving no or only very little carbon, which will not affect the brazing effect.

[0027] In some embodiments, the resin layer 2 is selected from epoxy resin, polyvinyl butyral resin, nitrocellulose, ethyl cellulose or acrylic resin and derivatives thereof.

[0028] When the resin layer 2 is selected from the resins described above, it has a better bonding and reinforcement effect on the disc-like structure, and at the same time has a lower thermal decomposition temperature, so that the resin layer 2 can be removed by thermal decomposition at a lower temperature, avoiding the influence of excessive resin layer 2 residue or carbon residue on the brazing effect.

[0029] In a preferred embodiment, the resin layer 2 is selected from acrylic resin.

[0030] The acrylic resin has the best bonding strength, low thermal cracking temperature, and very little residual carbon. Examples of acrylic resins that meet the requirements include Dow's Paraloid series resins and Mitsubishi's Elvacite series resins.

[0031] In some embodiments, the resin layer 2 includes a first resin layer 21 , and the first resin layer 21 is coated on the outer surface of the disc-shaped structure.

[0032] On the one hand, the first resin layer 21 can play a role in bonding and solidifying the spiral solder wire 1, thereby improving the overall strength of the spiral solder structure; on the other hand, the first resin layer 21 is coated on the outer surface of the disc-shaped structure, and can serve as a protective layer to isolate the disc-shaped structure from the external environment, thereby preventing external water vapor and oxygen from corroding the spiral solder structure, extending the storage time of the spiral solder structure, and improving its soldering quality.

[0033] In some embodiments, the thickness of the first resin layer 21 is 0.01 mm to 1 mm.

[0034] If the thickness of the first resin layer 21 is too thin, it is difficult to fix and prevent corrosion of the solder wire 1; if the thickness of the first resin layer 21 is too thick, it is easy to cause excessive residue during the soldering process, affecting the soldering quality.

[0035] In some embodiments, the resin layer 2 includes a second resin layer 22 . In the disc-shaped structure, gaps are formed between adjacent solder wires 1 , and the second resin layer 22 is located in the gaps between adjacent solder wires 1 .

[0036] The resin layer 2 is applied to the disc-shaped structure in the form of a resin emulsion or solution. When the resin emulsion or solution is added to the disc-shaped structure by dipping, coating, spraying or dripping, part of the resin emulsion or solution will adhere to the outer surface of the disc-shaped structure, dry and solidify to form the first resin layer 21, while part of the resin emulsion or solution will penetrate into the gap between the adjacent solder wires 1, dry and solidify to form the second resin layer 22. The second resin layer 22 serves to bond the adjacent solder wires 1 to improve the overall strength of the spiral solder structure.

[0037] In some embodiments, the second resin layer 22 is a continuous layer or a discontinuous layer. For example, in one embodiment, the solder wires 1 in the disc-shaped structure are wound relatively tightly, and the resin emulsion or solution only penetrates into a portion of the gap between adjacent solder wires 1 to form a discontinuous layer.

[0038] In some embodiments, when the solder wire 1 is wound tightly enough, the second resin layer 22 may not exist, and only the first resin layer 21 may exist.

[0039] In some embodiments, the gap width between adjacent solder wires 1 is 0 to 1 mm.

[0040] In the present invention, there are no particular restrictions on the material of the solder wire 1. Any metal material that can melt under high temperature conditions, has a melting point lower than that of the workpiece to be brazed, and provides a strong connection after solidification can be used. Various existing solders can be used, such as silver-based solders, including Ag-Cu-Zn and Ag-Cu-Ni; copper-based solders, including Cu-Zn and Cu-P; nickel-based solders, including Ni-Cr-B-Si; tin-based solders, including Sn-Pb and Sn-Ag-Cu; and lead-based solders. Depending on specific needs, solders containing other elements, such as silicon, manganese, and cobalt, can also be used to meet specific performance requirements.

[0041] In one embodiment, the solder wires 1 are on the same plane.

[0042] In some embodiments, the center of the disc-shaped structure is a solid structure or a hollow structure, and the disc-shaped structure is formed by winding the solder wire 1. Specifically, one end of the solder wire 1 is fixed on a winding needle, and the solder wire 1 is driven to be wound by the rotation of the winding needle. When the winding length reaches a preset length, the solder wire 1 is cut to form the disc-shaped structure. When the winding needle is small, the center of the disc-shaped structure is a solid structure; when the winding needle is large, the winding needle withdraws after the winding is completed, and a hollow structure is formed in the center of the disc-shaped structure.

[0043] In some embodiments, the disc-shaped structure is disc-shaped, flat oval-shaped, flat square-shaped, or irregularly shaped.

[0044] In a preferred embodiment, the disc-shaped structure is in the shape of a circular disc.

[0045] In other embodiments, the shape of the winding needle can be controlled to form a disk-shaped structure in different shapes, or the disk-shaped structure can be first wound to form a circular disk-shaped structure, and then the disk-shaped structure can be formed into other different shapes by extrusion or the like.

[0046] In some embodiments, along a direction perpendicular to the extension direction of the solder wire 1 , the cross-section of the solder wire 1 is circular, square, elliptical or irregular.

[0047] like Figure 2 As shown, in a preferred embodiment, the cross section of the solder wire 1 is circular.

[0048] Since the spiral solder structure provided by the present invention mainly controls the solder amount by controlling the length of the solder wire 1, the consistency of the cross-sectional area will affect the accuracy of the solder amount control of the spiral solder structure. Compared with other shapes, the solder wire 1 with a circular cross-section has the characteristic of high cross-sectional area consistency, which is conducive to the control of the solder amount in the spiral solder structure.

[0049] like Figure 3 As shown, in one embodiment, the cross section of the solder wire 1 is square.

[0050] In some embodiments, the outer diameter of the solder wire 1 is 0.3 mm to 4 mm.

[0051] In some embodiments, the disc-shaped structure is wound with two or more turns.

[0052] The long diameter and height of the disc-shaped structure affect the content of the solder wire 1 , and the long diameter and height of the disc-shaped structure can be selected accordingly based on the amount required for brazing.

[0053] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A spiral solder structure, characterized in that: The invention comprises a solder wire and a resin layer. The solder wire is spirally wound to form a disc-shaped structure. The resin layer is located on the solder wire to fix the disc-shaped structure. The resin layer is selected from epoxy resin, polyvinyl butyral resin, nitrocellulose, ethyl cellulose or acrylic resin and its derivatives.

2. The spiral solder structure according to claim 1, characterized in that The resin layer includes a first resin layer, and the first resin layer is coated on the outer surface of the disc-shaped structure.

3. The spiral solder structure according to claim 2, characterized in that The thickness of the first resin layer is 0.01 mm to 1 mm.

4. The spiral solder structure according to claim 1, characterized in that The resin layer includes a second resin layer. In the disc-shaped structure, gaps are formed between adjacent solder wires, and the second resin layer is located in the gaps between adjacent solder wires.

5. The spiral solder structure according to claim 4, characterized in that The width of the gap between adjacent solder wires is 0 to 1 mm.

6. The spiral solder structure according to claim 1, characterized in that The disc-shaped structure is in the shape of a disc, a flat oval or a flat square.

7. The spiral solder structure according to claim 1, wherein: Along a direction perpendicular to the extension direction of the solder wire, the cross section of the solder wire is circular, square or elliptical.

8. The spiral solder structure according to claim 1, wherein: The outer diameter of the solder wire is 0.3 mm to 4 mm.

9. The spiral solder structure according to claim 1, wherein: The number of winding turns of the disc-shaped structure is two or more.

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