Welding pin grinding device

Abstract

The utility model discloses a welding pin grinding device which comprises a bearing bottom plate, a first installation area and a second installation area are formed on the upper side of the bearing bottom plate, the first installation area is in a plane shape and used for laying abrasive paper, the second installation area is in a plane shape, and the second installation area and the first installation area are parallel or located on the same plane. The second mounting area is provided with a sliding module, the sliding module is fixedly connected with a welding pin fixing piece, the sliding module is used for driving the welding pin fixing piece to slide on a plane parallel to the second mounting area, the welding pin fixing piece comprises a welding pin mounting part, and the welding pin mounting part is used for mounting a welding pin and enabling the welding pin to be perpendicular to the first mounting area and the second mounting area; when the sliding module drives the welding pin fixing piece to slide, the welding pin installed on the welding pin installation part can slide on the abrasive paper in the mode of being perpendicular to the abrasive paper. The bottom flatness of the welding pin and the perpendicularity between the bottom plane of the welding pin and the side face of the welding pin can be improved, and the welding area of the welding pin is increased.

Description

Technical Field

[0001] The utility model relates to the technical field of welding needle grinding, in particular to a welding needle grinding device. Background Art

[0002] Currently, lithium-ion / sodium-ion cylindrical power batteries are becoming the mainstream products in the new energy industry due to their high energy density, good capacity consistency, and ability to support high-rate charge and discharge. More and more manufacturers continue to pursue high-stability and high-capacity cylindrical battery performance. However, there are the following problems:

[0003] In order to increase the production capacity of cylindrical power batteries, the resistance welding structure of the shell bottom (and the collecting plate) is generally preferred. Flat-head structure welding pins are generally preferred to increase the welding area. However, during the production of flat-head welding pins, when problems such as explosion points and sticking pins occur, the bottom welding surface is easily damaged, resulting in a small welding area. During loading vibration (the larger internal winding core jumps), direct impact on the welding position may bring the risk of battery open circuit failure.

[0004] The flatness and verticality of the bottom plane of the flat-head soldering pin are highly demanding. When grinding with sandpaper by hand, the bottom is prone to being uneven or the bottom plane is not perpendicular to the side of the soldering pin, resulting in a small welding area and the risk of battery open circuit failure cannot be avoided. Utility Model Content

[0005] The purpose of the utility model is to provide a welding needle grinding device, which can improve the flatness of the bottom of the welding needle and the verticality between the bottom plane of the welding needle and the side surface of the welding needle, thereby increasing the welding area of ​​the welding needle.

[0006] To achieve the above-mentioned objectives, the utility model provides a welding needle grinding device, including a bearing base plate, a first mounting area and a second mounting area are formed on the upper side of the bearing base plate, the first mounting area is planar and is used for laying sandpaper flat, the second mounting area is planar, the second mounting area is parallel to the first mounting area or is located in the same plane, the second mounting area is provided with a sliding module, the sliding module is fixedly connected to a welding needle fixing part, the sliding module is used to drive the welding needle fixing part to slide on a plane parallel to the second mounting area, the welding needle fixing part includes a welding needle mounting portion, the welding needle mounting portion is used to install the welding needle and make the welding needle perpendicular to the first mounting area and the second mounting area, when the sliding module drives the welding needle fixing part to slide, the welding needle installed on the welding needle mounting portion can slide perpendicular to the sandpaper on the sandpaper.

[0007] Optionally, the supporting base plate has a flat upper surface, and the first mounting area and the second mounting area are respectively a part of the upper surface.

[0008] Optionally, the sliding module includes a first slide rail fixedly installed in the second installation area, the first slide rail is arranged along the first direction, a first slider is installed on the first slide rail, the first slider can slide along the first direction, the solder pin fixing part is installed on the first slider, and the solder pin fixing part is driven to move in a plane parallel to the second installation area by the sliding of the first slider.

[0009] Optionally, the sliding module includes a first slide rail fixedly installed in the second mounting area, the first slide rail is arranged along a first direction, a first slider is installed on the first slide rail, the first slider can slide along the first direction, a slide rail fixing plate is installed on the first slider, the upper side of the slide rail fixing plate has a slide rail mounting surface parallel to the second mounting area, a second slide rail is fixedly installed on the slide rail mounting surface, the second slide rail is arranged along a second direction different from the first direction, a second slider is installed on the second slide rail, the second slider can slide along the second direction, and the welding pin fixing part is installed on the second slider, and the welding pin fixing part is driven to move in a plane parallel to the second mounting area by the sliding of the first slider and the second slider.

[0010] Optionally, the first direction and the second direction are perpendicular.

[0011] Optionally, the solder pin fixing member includes a fixing plate, the solder pin mounting portion is plate-shaped and connected to one end of the fixing plate, the fixing plate and the solder pin mounting portion are parallel to each other, and one end of the fixing plate away from the solder pin mounting portion is attached and fixed to the second slider, and at least one solder pin fixing hole is formed on the solder pin mounting portion and vertically passes through the solder pin mounting portion.

[0012] Optionally, a vertical distance between the solder pin mounting portion and the first mounting area is smaller than a vertical distance between the fixing plate and the first mounting area.

[0013] Optionally, the solder pin mounting portion and the fixing plate are connected via a connecting plate, and the connecting plate is perpendicular to the solder pin mounting portion and the fixing plate.

[0014] Optionally, the solder pin mounting portion is provided with a solder pin fixing hole, and an extending direction of the solder pin fixing hole is perpendicular to the first mounting area.

[0015] Optionally, the solder pin mounting portion is provided with a plurality of solder pin fixing holes, and at least some of the solder pin fixing holes have different diameters.

[0016] In an embodiment of the present invention, sandpaper is laid flat on a first mounting area of ​​a supporting base plate, a sliding module is disposed on a second mounting area of ​​the supporting base plate that is parallel to or coplanar with the first mounting area, the sliding module is fixedly connected to a soldering pin fixture and is used to drive the soldering pin fixture to slide on a plane parallel to the second mounting area, the soldering pin fixture is mounted on a soldering pin via a soldering pin mounting portion so that the soldering pin is perpendicular to the first mounting area and the second mounting area, and when the sliding module drives the soldering pin fixture to slide on a plane parallel to the second mounting area, the soldering pin can slide perpendicularly on the sandpaper to grind, thereby improving the flatness of the bottom of the soldering pin after grinding and the perpendicularity between the bottom plane of the soldering pin and the side surface of the soldering pin. When welding with the ground soldering pin, the problem of a small welding area can be solved and the risks associated therewith can be avoided. Furthermore, because the soldering pin can be driven to slide perpendicularly on the sandpaper, the grinding speed of the soldering pin can also be increased. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the welding needle grinding device according to an embodiment of the present utility model.

[0018] Figure 2 and Figure 3 It is a structural schematic diagram of the welding needle grinding device according to an embodiment of the utility model from different perspectives.

[0019] Figure 4 It is a three-dimensional structural schematic diagram of a welding needle fixing part, a welding needle and sandpaper according to an embodiment of the present utility model.

[0020] Figure 5 It is a schematic diagram of the three-dimensional structure of the welding needle according to the embodiment of the present utility model.

[0021] Figure 6 It is a schematic diagram of the three-dimensional structure of a welding needle grinding device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0022] To make the above-mentioned objects, features, and advantages of the present invention more clearly understood, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art may make similar modifications without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0023] Example 1

[0024] See also Figures 1 to 5, this embodiment discloses a welding needle grinding device, including a carrying base plate 1, a first mounting area 11 and a second mounting area 12 are formed on the upper side of the carrying base plate 1, the first mounting area 11 is planar and is used for laying sandpaper 2 flat, the second mounting area 12 is planar, the second mounting area 12 is parallel to the first mounting area 11 or located on the same plane, the second mounting area 12 is provided with a sliding module, the sliding module is fixedly connected to the welding needle fixing part 3, the sliding module is used to drive the welding needle fixing part 3 to slide on a plane parallel to the second mounting area 12, the welding needle fixing part 3 includes a welding needle mounting portion 31, the welding needle mounting portion 31 is used to install the welding needle 4 and make the welding needle 4 perpendicular to the first mounting area 11 and the second mounting area 12, when the sliding module drives the welding needle fixing part 3 to slide, the welding needle 4 installed on the welding needle mounting portion 31 can slide perpendicular to the sandpaper 2 on the sandpaper 2.

[0025] In an embodiment of the present invention, sandpaper 2 is laid flat on a first mounting area 11 of a support base plate 1. A sliding module is disposed on a second mounting area 12 of the support base plate 1 that is parallel to or coplanar with the first mounting area 11. The sliding module is fixedly connected to a solder pin holder 3 and is configured to drive the solder pin holder 3 to slide on a plane parallel to the second mounting area 12. The solder pin holder 3 mounts a solder pin 4 via a solder pin mounting portion 31 such that the solder pin 4 is perpendicular to the first mounting area 11 and the second mounting area 12. As the sliding module drives the solder pin holder 3 to slide on a plane parallel to the second mounting area 12, the solder pin 4 can slide perpendicularly on the sandpaper 2 to be ground. This improves the flatness of the bottom of the ground solder pin 4 and the perpendicularity between the bottom plane of the solder pin 4 and the side surfaces of the solder pin 4. This improves the problem of a smaller welding area when welding using the ground solder pin 4, thereby avoiding the risks associated therewith. Furthermore, since the solder pin 4 can be driven to slide perpendicularly on the sandpaper 2, the grinding speed of the solder pin 4 can also be increased.

[0026] In some embodiments, the carrier base plate 1 has a flat upper surface 13, and the first mounting area 11 and the second mounting area 12 are each part of the upper surface 13. Since the first mounting area 11 and the second mounting area 12 are both part of the flat upper surface 13 of the carrier base plate 1, the first mounting area 11 and the second mounting area 12 can be formed by machining the upper surface 13, eliminating the need for special machining of the first mounting area 11 and the second mounting area 12. This helps reduce the assembly tolerance of the solder pin grinding device and ensures a good grinding effect.

[0027] In some embodiments, the carrier base 1 has a flat lower surface 14, which is parallel to the first mounting area 11 and the second mounting area 12. Because the carrier base 1 has a lower surface 14 that is parallel to the first mounting area 11 and the second mounting area 12, the solder pin grinding device can be placed on a horizontal surface via the carrier base 1, thereby facilitating reliable solder pin 4 grinding.

[0028] In a specific example, the carrier base plate 1 has an upper surface 13 and a lower surface 14 that are parallel to each other, and the first mounting area 11 and the second mounting area 12 are respectively a part of the upper surface 13 .

[0029] In some embodiments, the sliding module includes a first slide rail 5 fixedly installed in the second installation area 12, the first slide rail 5 is arranged along the first direction, and a first slider 6 is installed on the first slide rail 5, the first slider 6 can slide along the first direction, and a slide rail fixing plate 7 is installed on the first slider 6. The upper side of the slide rail fixing plate 7 has a slide rail mounting surface 71 parallel to the second installation area 12, and a second slide rail 8 is fixedly installed on the slide rail mounting surface 71, the second slide rail 8 is arranged along a second direction different from the first direction, and a second slider 9 is installed on the second slide rail 8, the second slider 9 can slide along the second direction, and a solder pin fixing part 3 is installed on the second slider 9, and the solder pin fixing part 3 is driven to move in a plane parallel to the second installation area 12 by sliding of the first slider 6 and the second slider 9. Through the above-described technical means, the sliding of the first slider 6 in the first direction drives the slide rail fixing plate 7, the second slide rail 8, the second slider 9, and the solder pin holder 3 to slide in the first direction as a whole. The sliding of the second slider 9 in the second direction drives the solder pin holder 3 to slide in the second direction. Furthermore, through the combined sliding of the first slider 6 and the second slider 9, the solder pin holder 3 can move in a plane parallel to the second mounting area 12 and the first mounting area 11, and drive the solder pin 4 to slide and grind perpendicularly on the sandpaper 2. Furthermore, the sliding cooperation between the slide rail and the slider ensures sliding reliability, thereby ensuring the grinding effect of the solder pin 4.

[0030] Specifically, the first direction and the second direction are perpendicular to each other, but the present invention is not limited thereto.

[0031] Specifically, the solder pin holder 3 includes a fixing plate 32, a plate-shaped solder pin mounting portion 31 connected to one end of the fixing plate 32, and the fixing plate 32 and the solder pin mounting portion 31 are parallel to each other. The end of the fixing plate 32, which is away from the solder pin mounting portion 31, is attached to the second slider 9. The solder pin mounting portion 31 has at least one solder pin fixing hole 311 formed therein and extending vertically through the solder pin mounting portion 31. Since the fixing plate 32 is attached to the second slider 9, the solder pin fixing hole 311 is formed vertically in the solder pin mounting portion 31 parallel to the fixing plate 32, allowing the solder pin 4 to be attached perpendicularly to the sandpaper 2 below.

[0032] More specifically, the vertical distance between the solder pin mounting portion 31 and the first mounting area 11 is smaller than the vertical distance between the fixing plate 32 and the first mounting area 11. Due to the double-layer sliding structure, the fixing plate 32 has a certain height. Therefore, by making the solder pin mounting portion 31 have a smaller vertical distance from the first mounting area 11, the solder pin 4 mounted on the solder pin mounting portion 31 can more reliably slide vertically on the sandpaper 2.

[0033] Furthermore, the solder pin mounting portion 31 and the fixing plate 32 are connected via a connecting plate 33 , and the connecting plate 33 is perpendicular to the solder pin mounting portion 31 and the fixing plate 32 .

[0034] In some embodiments, the solder pin mounting portion 31 is provided with a penetrating solder pin fixing hole 311 , and an extending direction of the solder pin fixing hole 311 is perpendicular to the first mounting area 11 .

[0035] Specifically, the welding needle mounting portion 31 is provided with a plurality of welding needle fixing holes 311, and at least some of the welding needle fixing holes 311 have different diameters, so that welding needles 4 of different diameters can be adapted. There is no need to replace the welding needle fixing part 3 according to the different diameters of the welding needles 4, which is conducive to improving efficiency.

[0036] In order to better understand the present invention, Figures 1 to 5 The following specific examples briefly describe the optional use of the soldering needle grinding device:

[0037] First, the sandpaper 2 is laid flat and fixed on the first installation area 11 of the supporting base plate 1 .

[0038] Next, an appropriate welding needle fixing hole 311 is selected according to the diameter of the welding needle 4 to be ground and inserted therein, and the bottom of the welding needle 4 passes through the welding needle fixing hole 311 and contacts the sandpaper 2 vertically.

[0039] Next, hold the upper part of the soldering needle 4 with your hand and press it down slightly so that the bottom of the soldering needle 4 fits well with the sandpaper 2.

[0040] Next, the upper portion of the welding needle 4 is pressed down in real time, and driven by the sliding of the first slider 6 and the second slider 9, the bottom of the welding needle 4 is slid and ground on the sandpaper 2 until a flat bottom surface is formed on the bottom of the welding needle 4.

[0041] Example 2

[0042] Please combine Figure 6 The main difference between this embodiment and the first embodiment lies in the difference in the sliding module. The following mainly describes the differences between this embodiment and the first embodiment. For the similarities, please refer to the description of the first embodiment.

[0043] In some embodiments, the sliding module includes a first slide rail 5 fixedly mounted in the second mounting area 12. The first slide rail 5 is arranged along a first direction. A first slider 6 is mounted on the first slide rail 5 and is slidable in the first direction. The solder pin holder 3 is mounted on the first slider 6. The sliding of the first slider 6 drives the solder pin holder 3 to move in a plane parallel to the second mounting area 12. Through the above-described technical means, the sliding of the first slider 6 in the first direction enables the solder pin holder 3 to move in a plane parallel to the second mounting area 12 and the first mounting area 11, driving the solder pin 4 to slide and grind perpendicularly on the sandpaper 2. Furthermore, the sliding cooperation between the slide rail and the slider ensures sliding reliability, thereby ensuring the grinding effect of the solder pin 4.

[0044] Specifically, the solder pin holder 3 includes a fixing plate 32. A plate-shaped solder pin mounting portion 31 is connected to one end of the fixing plate 32. The fixing plate 32 and the solder pin mounting portion 31 are parallel to each other. The end of the fixing plate 32, distal from the solder pin mounting portion 31, is affixed to the first slider 6. The solder pin mounting portion 31 has at least one solder pin fixing hole 311 formed therein and extending perpendicularly therethrough. Because the fixing plate 32 is affixed to the first slider 6, the solder pin 4 can be mounted perpendicularly to the sandpaper 2 below by forming the solder pin fixing hole 311 perpendicularly therethrough in the solder pin mounting portion 31, which is parallel to the fixing plate 32. The foregoing disclosure is merely a preferred embodiment of the present invention, intended to facilitate understanding and implementation by those skilled in the art. It is not intended to limit the scope of the present invention. Therefore, equivalent variations made within the scope of the present invention are still within the scope of the present invention.

Claims

1. A welding needle grinding device, characterized in that: It includes a bearing base plate, and a first mounting area and a second mounting area are formed on the upper side of the bearing base plate. The first mounting area is planar and is used for laying sandpaper flat. The second mounting area is planar. The second mounting area is parallel to or located on the same plane as the first mounting area. The second mounting area is provided with a sliding module, and the sliding module is fixedly connected to a welding pin fixing part. The sliding module is used to drive the welding pin fixing part to slide on a plane parallel to the second mounting area. The welding pin fixing part includes a welding pin mounting portion, and the welding pin mounting portion is used to install the welding pin and make the welding pin perpendicular to the first mounting area and the second mounting area. When the sliding module drives the welding pin fixing part to slide, the welding pin installed on the welding pin mounting portion can slide perpendicular to the sandpaper on the sandpaper.

2. The welding needle grinding device according to claim 1, characterized in that: The supporting base plate has a flat upper surface, and the first mounting area and the second mounting area are respectively a portion of the upper surface.

3. The welding needle grinding device according to claim 1, characterized in that: The sliding module includes a first slide rail fixedly installed in the second installation area, the first slide rail is arranged along the first direction, a first slider is installed on the first slide rail, the first slider can slide along the first direction, the solder pin fixing part is installed on the first slider, and the solder pin fixing part is driven to move in a plane parallel to the second installation area by sliding of the first slider.

4. The welding needle grinding device according to claim 1, characterized in that: The sliding module includes a first slide rail fixedly installed in the second mounting area, the first slide rail is arranged along a first direction, a first slider is installed on the first slide rail, the first slider can slide along the first direction, a slide rail fixing plate is installed on the first slider, the upper side of the slide rail fixing plate has a slide rail mounting surface parallel to the second mounting area, a second slide rail is fixedly installed on the slide rail mounting surface, the second slide rail is arranged along a second direction different from the first direction, a second slider is installed on the second slide rail, the second slider can slide along the second direction, and the welding pin fixing part is installed on the second slider, and the welding pin fixing part is driven to move in a plane parallel to the second mounting area by the sliding of the first slider and the second slider.

5. The welding needle grinding device according to claim 4, characterized in that: The first direction and the second direction are perpendicular.

6. The welding needle grinding device according to claim 4, characterized in that: The solder pin fixing member includes a fixing plate, the solder pin mounting portion is plate-shaped and connected to one end of the fixing plate, the fixing plate and the solder pin mounting portion are parallel to each other, and the end of the fixing plate away from the solder pin mounting portion is attached to and fixed on the second slider, and at least one solder pin fixing hole is formed on the solder pin mounting portion and vertically passes through the solder pin mounting portion.

7. The welding needle grinding device according to claim 6, characterized in that: A vertical distance between the solder pin mounting portion and the first mounting area is smaller than a vertical distance between the fixing plate and the first mounting area.

8. The welding needle grinding device according to claim 7, characterized in that: The soldering pin mounting portion and the fixing plate are connected via a connecting plate, and the connecting plate is perpendicular to the soldering pin mounting portion and the fixing plate.

9. The welding needle grinding device according to claim 1, characterized in that: The solder pin mounting portion is provided with a solder pin fixing hole, and an extending direction of the solder pin fixing hole is perpendicular to the first mounting area.

10. The welding needle grinding device according to claim 9, characterized in that: The solder pin mounting portion is provided with a plurality of solder pin fixing holes, and at least some of the solder pin fixing holes have different diameters.

Images