Wafer grinding device

Abstract

The utility model discloses a wafer grinding device, and relates to the technical field of wafer grinding, the wafer grinding device comprises a protective sleeve, the upper end of the protective sleeve is provided with a fixing assembly, the upper end of the fixing assembly is provided with a lower gland, a grinding disc is arranged above the fixing assembly, the upper end of the grinding disc is provided with a variable frequency motor, and the variable frequency motor is connected with the lower gland. The variable frequency motor is fixed to a movable top plate, the movable top plate moves up and down through an air cylinder, a center cavity is formed in the center of the upper surface of the protective sleeve, a servo motor is installed in the center cavity, the fixing assembly comprises a center base and multiple fixing bases, and the fixing bases are arranged in the center base. A connecting socket is arranged at one end of the fixing seat, a connecting slot is formed in the outer wall of the center seat, and the connecting socket is inserted into the connecting slot, and the problems that an existing wafer grinding fixing seat is inconvenient to disassemble, the whole fixing seat needs to be replaced after local damage, the replacement cost is high, and replacement is inconvenient are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer grinding, in particular to a wafer grinding device. Background Art

[0002] Wafer grinding is an important step in the semiconductor manufacturing process. Its main purpose is to process the wafer to a thickness suitable for packaging.

[0003] For example, the Chinese authorized patent with publication number CN215588816U (wafer grinding device) includes: a base having a processing area and a thickness detection area; a turntable rotatably mounted on the base, the turntable being provided with a supporting portion for supporting wafers; the processing area and thickness detection area are distributed along the direction of rotation of the turntable; a grinding head mounted on the base and located in the processing area, the grinding head being used to grind wafers rotated to the processing area; a thickness detection device mounted on the base and located in the thickness detection area, the thickness detection device being used to detect the thickness of wafers that have been ground and rotated to the thickness detection area; wherein the supporting portions are multiple, and the multiple supporting portions are arranged at circumferential intervals around the rotation axis of the turntable. This utility model effectively solves the problem of low processing efficiency of wafer grinding equipment in the prior art.

[0004] However, the existing wafer grinding fixed seat is inconvenient to disassemble, and after local damage, it needs to be replaced as a whole, resulting in high replacement costs and inconvenience. Therefore, it does not meet the existing needs. We have proposed a wafer grinding device. Utility Model Content

[0005] The purpose of the present invention is to provide a wafer grinding device to solve the problem in the above background technology that the fixed seat of the existing wafer grinding is inconvenient to disassemble and needs to be replaced as a whole after local damage, resulting in high replacement cost and inconvenience in replacement.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer grinding device, comprising: a protective cover, a fixing component is provided at the upper end of the protective cover, a lower pressure cover is provided at the upper end of the fixing component, a grinding disc is provided above the fixing component, a variable frequency motor is provided at the upper end of the grinding disc, the variable frequency motor is fixed to a movable top plate, the movable top plate moves up and down by a cylinder, a central cavity is provided at the center of the upper surface of the protective cover, and a servo motor is installed inside the central cavity.

[0007] Preferably, the fixing assembly includes a central seat and a fixed seat, and there are multiple fixed seats. A connecting socket is provided at one end of the fixed seat, a connecting slot is provided on the outer wall of the central seat, and the connecting socket is inserted into the connecting slot, and a placement groove is provided on the upper surface of the fixed seat.

[0008] Preferably, a thread groove is provided at the center of the upper surface of the center seat, a thread column is provided at the center of the lower surface of the lower pressure cover, and the lower pressure cover is fixed to the thread groove through the thread column.

[0009] Preferably, a positioning seat is provided on the lower surface of the fixing seat, and the positioning seat is fixed to the fixing seat by hot melting, and a rotating column is rotatably connected between the two positioning seats via a rotating shaft.

[0010] Preferably, a base is provided at the lower end of the protective sleeve, a mounting bracket is welded to the upper surface of one end of the base, a mounting groove is provided inside the mounting bracket, and the cylinder is installed inside the mounting groove.

[0011] Preferably, a movable groove is provided on one side surface of the mounting frame, and the upper end of the movable groove passes through the mounting frame, and the movable groove is communicated with the mounting groove.

[0012] Preferably, the connection socket and the connection slot are both T-shaped.

[0013] Compared with the prior art, the beneficial effects of the present invention are:

[0014] (1) The utility model sets a plurality of fixing seats outside the center seat, inserts the connecting socket of the fixing seat into the connecting slot of the center seat, and connects the plurality of fixing seats to the center seat in the same way. Since the connecting socket and the connecting slot are both T-shaped, they play a limiting role to prevent them from falling. Then, the upper and lower pressure covers are covered. The lower pressure cover is fixed by the threaded column and the threaded groove to press down and fix the plurality of connecting sockets to prevent the connecting sockets from sliding along the center seat, thereby improving the connection stability. After local damage, the lower pressure cover is rotated to remove the lower pressure cover, and then the corresponding fixing seat is moved upward to remove the corresponding fixing seat. It is simple and convenient, and improves the convenience of replacement. When the fixing seat rotates, the rotating column and the upper surface of the protective cover rotate by friction, thereby improving the stability and force of the fixing seat and avoiding bending damage. It solves the problem that the fixing seat of the existing wafer grinding is inconvenient to disassemble and needs to be replaced as a whole after local damage, resulting in high replacement cost and inconvenience.

[0015] (2) By installing a servo motor in the central cavity of the protective sleeve, the output end of the servo motor drives the center seat to rotate, thereby realizing the position adjustment of the fixed seat, rotating the wafer to the bottom of the grinding disc, driving the movable top plate downward by the cylinder, and starting the variable frequency motor, driving the grinding disc to rotate by the output end of the variable frequency motor, and relying on the grinding disc to grind the wafer surface. After grinding one wafer, the center seat is rotated to rotate the next wafer to the bottom of the grinding disc for grinding, without having to remove and then install it, and then grind it, thereby improving the grinding efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the top view of the fixing assembly of the present invention;

[0018] Figure 3 This is a bottom view structural diagram of the fixing assembly of the present invention;

[0019] Figure 4 This is a schematic diagram of the protective cover structure of the utility model;

[0020] In the figure: 1. Protective cover; 2. Fixed assembly; 3. Lower pressure cover; 4. Moving top plate; 5. Frequency conversion motor; 6. Grinding disc; 7. Mounting frame; 8. Mounting slot; 9. Cylinder; 10. Base; 11. Fixed seat; 12. Placement slot; 13. Center seat; 14. Connecting socket; 15. Connecting slot; 16. Threaded groove; 17. Rotating column; 18. Positioning seat; 19. Center cavity; 20. Servo motor; 21. Threaded column; 22. Moving slot. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0022] See also Figure 1-4, the utility model provides an embodiment: a wafer grinding device, comprising: a protective sleeve 1, a fixing component 2 is provided at the upper end of the protective sleeve 1, a lower pressure cover 3 is provided at the upper end of the fixing component 2, a grinding disc 6 is provided above the fixing component 2, a frequency conversion motor 5 is provided at the upper end of the grinding disc 6, the frequency conversion motor 5 is fixed to the movable top plate 4, the movable top plate 4 moves up and down through the cylinder 9, the fixing component 2 includes a center seat 13 and a fixing seat 11, and the fixing seat 11 is provided with multiple, one end of the fixing seat 11 is provided with a connecting socket 14, the outer wall of the center seat 13 is provided with a connecting slot 15, and the connecting socket 14 is inserted into the connecting slot 15, the upper surface of the fixing seat 11 is provided with a placement groove 12, and the center of the upper surface of the center seat 13 is provided with a thread Slot 16, a threaded column 21 is provided at the center of the lower surface of the lower pressure cover 3, and the lower pressure cover 3 is fixed to the threaded groove 16 by the threaded column 21, and the connecting socket 14 of the fixing seat 11 is inserted into the connecting slot 15 of the center seat 13. Multiple fixing seats 11 are connected to the center seat 13 in the same way. Since the connecting socket 14 and the connecting slot 15 are both T-shaped, they have a limiting effect to prevent them from falling. Then the upper and lower pressure covers 3 are covered, and the lower pressure cover 3 is fixed to the threaded groove 16 by the threaded column 21, and multiple connecting sockets 14 are pressed down and fixed to prevent the connecting sockets 14 from sliding along, thereby improving the connection stability. After local damage, rotate to remove the lower pressure cover 3, and then move upward to remove the corresponding fixing seat 11. It is simple and convenient, and improves the convenience of replacement.

[0023] See also Figure 1 、 3 A positioning seat 18 is provided on the lower surface of the fixing seat 11, and the positioning seat 18 is fixed to the fixing seat 11 by hot melt. A rotating column 17 is rotatably connected between the two positioning seats 18 through a rotating shaft. When the fixing seat 11 rotates, the rotating column 17 rotates by friction with the upper surface of the protective sleeve 1, thereby improving the stability and force of the fixing seat 11 and avoiding bending damage.

[0024] See also Figure 1 、 4The lower end of the protective cover 1 is provided with a base 10, and a mounting frame 7 is welded to the upper surface of one end of the base 10. A mounting groove 8 is provided inside the mounting frame 7, and the cylinder 9 is installed inside the mounting groove 8. A movable groove 22 is provided on one side surface of the mounting frame 7, and the upper end of the movable groove 22 passes through the mounting frame 7, and the movable groove 22 is communicated with the mounting groove 8. A central cavity 19 is provided at the center of the upper surface of the protective cover 1, and a servo motor 20 is installed inside the central cavity 19. The wafer to be ground is placed in the placement groove 12 of the fixed seat 11. The output end of the servo motor 20 drives the center seat 13 to rotate, thereby realizing the position adjustment of the fixed seat 11, rotating the wafer to the bottom of the grinding disc 6, driving the movable top plate 4 downward by the cylinder 9, and starting the variable frequency motor 5, driving the grinding disc 6 to rotate by the output end of the variable frequency motor 5, and relying on the grinding disc 6 to grind the wafer surface. After one grinding is completed, the center seat 13 is rotated to rotate the next wafer to the bottom of the grinding disc 6 for grinding, without having to remove and then install it, and then grind it, thereby improving the grinding efficiency.

[0025] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A wafer grinding device, comprising a protective cover (1), characterized in that: The upper end of the protective sleeve (1) is provided with a fixing component (2), the upper end of the fixing component (2) is provided with a lower pressure cover (3), a grinding disc (6) is provided above the fixing component (2), a variable frequency motor (5) is provided at the upper end of the grinding disc (6), the variable frequency motor (5) is fixed to the movable top plate (4), the movable top plate (4) moves up and down through the cylinder (9), a central cavity (19) is provided at the center of the upper surface of the protective sleeve (1), and a servo motor (20) is installed inside the central cavity (19).

2. The wafer grinding device according to claim 1, wherein: The fixing assembly (2) includes a central seat (13) and a fixing seat (11), and a plurality of fixing seats (11) are provided. A connecting socket (14) is provided at one end of the fixing seat (11), a connecting slot (15) is provided on the outer wall of the central seat (13), and the connecting socket (14) is inserted into the connecting slot (15), and a placement groove (12) is provided on the upper surface of the fixing seat (11).

3. The wafer grinding device according to claim 2, wherein: A threaded groove (16) is provided at the center of the upper surface of the center seat (13), a threaded column (21) is provided at the center of the lower surface of the lower pressure cover (3), and the lower pressure cover (3) is fixed to the threaded groove (16) via the threaded column (21).

4. The wafer grinding device according to claim 2, wherein: A positioning seat (18) is provided on the lower surface of the fixing seat (11), and the positioning seat (18) and the fixing seat (11) are fixed by hot melting, and a rotating column (17) is rotatably connected between the two positioning seats (18) via a rotating shaft.

5. The wafer grinding device according to claim 1, wherein: A base (10) is provided at the lower end of the protective sleeve (1), a mounting frame (7) is welded to the upper surface of one end of the base (10), a mounting groove (8) is provided inside the mounting frame (7), and the cylinder (9) is installed inside the mounting groove (8).

6. The wafer grinding device according to claim 5, wherein: A movable groove (22) is provided on one side surface of the mounting frame (7), and the upper end of the movable groove (22) passes through the mounting frame (7), and the movable groove (22) is communicated with the mounting groove (8).

7. The wafer grinding device according to claim 2, wherein: The connection socket (14) and the connection slot (15) are both T-shaped.

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