Automatic packaging machine for electronic components

Abstract

The utility model discloses an automatic packaging machine for electronic components. The automatic packaging machine comprises a packaging machine body and a buffering mechanism. The packaging machine body is connected with a discharging hopper. The buffering mechanism is installed on the packaging machine body and corresponds to the discharging hopper, the buffering mechanism comprises a support, a pair of connecting rods are fixedly connected between the support and the packaging machine body, the support is rotationally connected with a collecting hopper, the collecting hopper is arranged on the lower side of the discharging hopper, the support is arranged on the outer side of the discharging hopper, and the length of the support is larger than the width of the discharging hopper so that the collecting hopper can be conveniently installed. The collecting hopper can be used for collecting the packaged electronic elements falling from the discharging hopper, so that the packaged electronic elements are not prone to falling, the safety of the electronic elements can be guaranteed, and the packaging quality of the electronic elements is guaranteed. According to the electronic component packaging device, gravity buffering can be carried out on packaged and gliding electronic components, the falling phenomenon of the electronic components is effectively reduced, the safety of the electronic components can be guaranteed, and the packaging quality of the electronic components is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic component packaging, in particular to an automatic packaging machine for electronic components. Background Art

[0002] Electronic components are components used in electronic devices to connect and control electrical current. They can convert electronic signals into outputs such as electromagnetic waves or sound signals, or convert other signals such as light or mechanical motion into electronic signals. Common electronic components include resistors, capacitors, inductors, diodes, transistors, field-effect transistors, and integrated circuits.

[0003] Since some electronic components are small in size, they need to be packaged in plastic bags when they are shipped or sold, so as to ensure that the electronic components are dry and clean during transportation. At present, there are two main types of packaging for electronic components: manual packaging and automated packaging. Among them, automated packaging is suitable for large-scale packaging of electronic components. For example, the Chinese utility model patent with publication number: CN221163690U discloses a packaging device for electronic components. After the packaging is completed, the electronic components can automatically maintain an inclined state, so that the electronic components can automatically slide down without accumulation, which is conducive to directly entering the next batch of electronic component packaging work. There is no need to frequently pick up electronic components, which improves the efficiency of the device and can meet the use requirements to a certain extent.

[0004] However, when the packaged electronic components slide down the inclined plate, the bottom of the inclined plate lacks a gravity buffer mechanism, causing the packaged electronic components to fall when sliding down, thereby easily increasing the probability of damage to the electronic components and reducing the packaging quality of the electronic components. Utility Model Content

[0005] In view of the above situation, in order to remedy the above existing defects, the utility model provides an automatic packaging machine for electronic components.

[0006] The utility model provides the following technical solutions: The utility model proposes an automatic packaging machine for electronic components, comprising a packaging machine body and a buffer mechanism;

[0007] The packaging machine body is connected to a lower hopper;

[0008] The buffer mechanism is installed on the packaging machine body and corresponds to the lower hopper. The buffer mechanism includes a bracket. A pair of connecting rods are fixedly connected between the bracket and the packaging machine body. A collecting hopper is rotatably connected to the bracket. The collecting hopper is arranged on the lower side of the lower hopper.

[0009] Furthermore, the bracket is arranged on the outside of the lower hopper, and the length of the bracket is greater than the width of the lower hopper, which is convenient for installing a collecting hopper. The collecting hopper can be used to collect the packaged electronic components falling from the lower hopper, so that the packaged electronic components are not prone to falling, thereby ensuring the safety of the electronic components and the packaging quality of the electronic components.

[0010] Furthermore, the collecting hopper is made of elastic material, which can cushion the falling packaged electronic components, thereby reducing the probability of damage to the electronic components;

[0011] The collecting bucket is connected to the bracket at an angle so that the collecting bucket can better collect the fallen electronic components.

[0012] Furthermore, the inclination angle of the collecting bucket ranges from 15° to 30°.

[0013] Furthermore, a pair of side walls of the bracket are each provided with a first slide groove, a slider is slidably connected in the first slide groove, and the collecting bucket is rotatably connected to the slider through a rotating shaft. When the packaged electronic components fall into the collecting bucket, the collecting bucket is impacted and drives the slider to slide in the first slide groove, thereby performing gravity buffering on the collecting bucket, effectively reducing the falling phenomenon of the electronic components, thereby ensuring the safety of the electronic components and the packaging quality of the electronic components.

[0014] Furthermore, a pair of side walls of the first chute are each formed with a second chute, and a guide rod is provided in the second chute.

[0015] Furthermore, a pair of connecting ears are fixedly connected to the side wall of the slider, and the pair of connecting ears are slidably provided on the pair of guide rods respectively. The sliding of the slider can be guided by sliding the connecting ears on the guide rods.

[0016] Furthermore, a spring is provided in the second slide groove, and the spring is provided on the outside of the guide rod and on the lower side of the connecting ear. The spring can increase the resistance of the slider to move downward, thereby buffering the impact force on the collection bucket, effectively reducing the falling phenomenon of electronic components, thereby ensuring the safety of electronic components and the packaging quality of electronic components.

[0017] Furthermore, a mounting block is fixedly connected to one of the sliders, a motor is mounted on the mounting block, and the motor output shaft is connected to the rotating shaft. When the motor is running, the motor can drive the collection bucket to rotate through the rotating shaft to discharge the packaged electronic components collected in the collection bucket.

[0018] Furthermore, the side wall of the bracket is provided with a avoidance groove, and the mounting block is slidably arranged in the avoidance groove, so that the motor and the mounting block can move up and down following the slider.

[0019] The automatic electronic component packaging machine proposed by the utility model adopting the above structure can perform gravity buffering on the packaged electronic components that slide down, effectively reducing the falling phenomenon of the electronic components, thereby ensuring the safety of the electronic components and the packaging quality of the electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 This is a three-dimensional diagram of an automatic packaging machine for electronic components proposed in the present utility model;

[0022] Figure 2 for Figure 1 Schematic diagram of the structure at A in the middle;

[0023] Figure 3 This is a front view of an automatic packaging machine for electronic components proposed by the present invention;

[0024] Figure 4 This is a partial structural cross-sectional view of an automatic packaging machine for electronic components proposed in the present invention;

[0025] Figure 5 for Figure 4 Schematic diagram of the structure at point B in the middle.

[0026] Among them, 1. packaging machine body, 101. lower hopper, 2. buffer mechanism, 201. bracket, 202. connecting rod, 203. collecting bucket, 204. first slide groove, 205. slider, 206. second slide groove, 207. guide rod, 208. spring, 209. mounting block, 210. motor, 211. avoidance groove. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the accompanying drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0029] like Figures 1 to 5 As shown, this embodiment provides an automatic packaging machine for electronic components, including a packaging machine body 1 and a buffer mechanism 2.

[0030] The packaging machine body 1 is connected to a lower hopper 101 , through which the electronic components packaged by the packaging machine body 1 are discharged.

[0031] In addition, the specific structure of the packaging machine body 1 can refer to the structure disclosed in the Chinese utility model patent publication number: CN221163690U, and this application will not go into details here.

[0032] like Figures 1 to 5 As shown, the buffer mechanism 2 is installed on the packaging machine body 1 and corresponds to the lower hopper 101. The buffer mechanism 2 is used to gravity buffer the packaged electronic components discharged from the lower hopper 101, so that the electronic components are not prone to falling, thereby ensuring the safety of the electronic components.

[0033] The buffer mechanism 2 includes a bracket 201, which is located outside the lower hopper 101. The bracket 201 is longer than the width of the lower hopper 101. The bracket 201 is used to mount a collection hopper 203, which collects packaged electronic components that fall from the lower hopper 101, preventing them from falling, thereby ensuring the safety and packaging quality of the electronic components.

[0034] In addition, a pair of connecting rods 202 are fixedly connected between the bracket 201 and the packaging machine body 1 to ensure that the bracket 201 and the collecting bucket 203 are firmly fixed.

[0035] Specifically, the bracket 201 is rotatably connected to a collecting hopper 203, which is located at the lower side of the lower hopper 101. The specific shape of the collecting hopper 203 is as follows: Figure 1 As shown, the collecting hopper 203 is used to collect the packaged electronic components dropped from the lower hopper 101 . The electronic components collected in the collecting hopper 203 can be discharged by rotating so that the packaged electronic components can enter the next process.

[0036] Preferably, the collecting hopper 203 is made of an elastic material, such as rubber, which can cushion the falling packaged electronic components, thereby reducing the probability of damage to the electronic components.

[0037] like Figures 1 to 5 As shown, the collecting bucket 203 is connected to the bracket 201 at an angle, so that the collecting bucket 203 can better collect the fallen electronic components and prevent the electronic components from slipping out of the collecting bucket 203 easily.

[0038] When the collecting bucket 203 collects the fallen electronic components, the tilt angle of the collecting bucket 203 is in the range of 15-30°.

[0039] like Figures 1 to 5 As shown, a pair of sidewalls of the bracket 201 are each formed with a first chute 204, within which a slider 205 is slidably connected. The collection hopper 203 is rotatably connected to the slider 205 via a rotating shaft. When packaged electronic components fall into the collection hopper 203, the impact on the collection hopper 203 drives the slider 205 to slide within the first chute 204, thereby providing gravity cushioning for the collection hopper 203, effectively reducing the risk of the electronic components falling, thereby ensuring the safety of the electronic components and ensuring the packaging quality of the electronic components.

[0040] A second chute 206 is formed on each of the pair of sidewalls of the first chute 204, and a guide rod 207 is disposed within the second chute 206. A pair of connecting ears are fixedly connected to the sidewalls of the slider 205, and each of the connecting ears slides on the pair of guide rods 207. The connecting ears slide on the guide rods 207 to guide the sliding of the slider 205.

[0041] Furthermore, a spring 208 is disposed within the second chute 206, located outside the guide rod 207 and below the connecting lug. This spring 208 increases the resistance to the downward movement of the slider 205, thereby cushioning the impact force on the collection hopper 203 and effectively reducing the risk of electronic components falling, thereby ensuring the safety and packaging quality of the electronic components.

[0042] Specifically, a mounting block 209 is fixedly connected to one of the sliders 205. A motor 210 is mounted on the mounting block 209. The output shaft of the motor 210 is connected to the rotating shaft. When the motor 210 is running, the motor 210 drives the collection hopper 203 to rotate via the rotating shaft, thereby discharging the packaged electronic components collected in the collection hopper 203.

[0043] In addition, a side wall of the bracket 201 is provided with a avoiding groove 211 , and the mounting block 209 is slidably arranged in the avoiding groove 211 , so that the motor 210 and the mounting block 209 can move up and down following the slider 205 .

[0044] During specific use, the packaging machine body 1 is used to package electronic components, and the packaged electronic components can be discharged through the lower hopper 101 .

[0045] As electronic components are discharged through the discharge hopper 101, they first fall into the collection hopper 203. At this point, the falling electronic components impact the collection hopper 203. Because the collection hopper 203 is made of an elastic material, it cushions the falling packaged electronic components, thereby reducing the probability of damage. Simultaneously, the collection hopper 203 drives the slider 205 downward within the first chute 204. The spring 208 increases the resistance to the slider 205's downward movement, thereby cushioning the impact force on the collection hopper 203. This effectively reduces the risk of electronic components falling, thereby ensuring the safety and packaging quality of the electronic components.

[0046] When the electronic components in the collecting hopper 203 need to be discharged, the motor 210 is operated. The motor 210 can drive the collecting hopper 203 to rotate through the rotating shaft, so that the electronic components are discharged from the gap on the collecting hopper 203, so that the packaged electronic components can enter the next process.

[0047] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, material, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, material, or apparatus.

[0048] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An automatic packaging machine for electronic components, characterized by: include A packaging machine body (1), wherein a lower hopper (101) is connected to the packaging machine body (1); The buffer mechanism (2) is installed on the packaging machine body (1) and corresponds to the lower hopper (101). The buffer mechanism (2) includes a bracket (201). A pair of connecting rods (202) are fixedly connected between the bracket (201) and the packaging machine body (1). A collecting hopper (203) is rotatably connected to the bracket (201). The collecting hopper (203) is arranged on the lower side of the lower hopper (101). The collecting hopper (203) is made of elastic material. The collecting hopper (203) is obliquely connected to the bracket (201). A pair of side walls of the bracket (201) are each provided with a first slide groove (204). ), a slider (205) is slidably connected in the first chute (204), the collecting bucket (203) is rotatably connected to the slider (205) through a rotating shaft, a pair of side walls of the first chute (204) are each provided with a second chute (206), a guide rod (207) is provided in the second chute (206), a pair of connecting ears are fixedly connected to the side wall of the slider (205), a pair of the connecting ears are respectively slidably provided on a pair of the guide rods (207), a spring (208) is provided in the second chute (206), the spring (208) is provided on the outside of the guide rod (207), and is provided on the lower side of the connecting ear.

2. The automatic packaging machine for electronic components according to claim 1, characterized in that: The bracket (201) is arranged outside the lower hopper (101), and the length of the bracket (201) is greater than the width of the lower hopper (101).

3. The automatic packaging machine for electronic components according to claim 1, characterized in that: The inclination angle of the collecting bucket (203) ranges from 15 to 30 degrees.

4. The automatic packaging machine for electronic components according to claim 1, characterized in that: A mounting block (209) is fixedly connected to one of the sliders (205), a motor (210) is mounted on the mounting block (209), and an output shaft of the motor (210) is connected to the rotating shaft.

5. The automatic packaging machine for electronic components according to claim 4, characterized in that: The side wall of the bracket (201) is provided with a avoiding groove (211), and the mounting block (209) is slidably arranged in the avoiding groove (211).

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