IC chip pressing device

Abstract

The utility model relates to the technical field of chip storage, and discloses an IC chip pressing device which comprises a shell, a plurality of storage grooves are formed in the shell, a box cover is hinged to the top of the shell, a limiting protrusion is arranged on the side edge of the box cover, and a buckle groove is formed in the top of the right side edge of the shell. Two sets of clamping mechanisms are arranged on the inner side edge of each storage groove, each clamping mechanism comprises a button, the lower portion of each button is connected with a linkage plate, the two ends of each linkage plate are connected with a first spring and a second spring, a pressing plate is arranged in the middle of each linkage plate, a third spring is arranged in each pressing plate, and a base plate is connected to the bottom of each pressing plate. According to the IC chip pressing device, through the mode that the shell is connected with the box cover, the whole IC chip pressing device becomes a storage device which is portable, small in size and convenient to move, a plurality of storage grooves are formed in the shell and used for storing chips, and each clamping mechanism is provided with a label buckle used for distinguishing the types of the chips.

Description

Technical Field

[0001] The utility model relates to the technical field of chip preservation, in particular to an IC chip pressing device. Background Art

[0002] An IC chip (Integrated Circuit Chip) is an integrated circuit formed by placing a large number of microelectronic components (transistors, resistors, capacitors, etc.) on a plastic substrate. IC chips consist of wafer chips and packaged chips. IC chip production lines are composed of two parts: the wafer production line and the packaging production line. After production, IC chips need to be placed in a storage facility for storage, transportation, or transport. Currently, IC chips lack a clamping device during transportation, causing vibrations during transportation and friction between the chips, which can damage the chip surface. Utility Model Content

[0003] The purpose of the present invention is to provide an IC chip pressing device to solve the problems raised in the above background technology.

[0004] In order to solve the above technical problems, the present invention provides the following technical solutions: an IC chip pressing device, comprising a shell, a storage groove is opened inside the shell, a box cover is hinged on the top, and a clamping mechanism is provided in the storage groove.

[0005] The clamping mechanism includes a button, the bottom of the button is connected to a linkage plate, the two ends of the linkage plate are connected to a No. 1 spring and a No. 2 spring, and the middle of the linkage plate is provided with a pressure plate, the inside of the pressure plate is provided with a No. 3 spring, and the bottom of the pressure plate is connected to a pad.

[0006] Preferably, a limiting protrusion is provided on the side of the box cover, and a snap groove is also provided on the top of the right side of the shell, the snap groove matches the limiting protrusion, and a rotating shaft is provided at the connection between the shell and the box cover, and the box cover is rotatably connected to the shell through the rotating shaft.

[0007] Preferably, a plurality of storage slots are provided inside the shell, and two sets of clamping mechanisms are provided on the inner side of each storage slot.

[0008] Preferably, the linkage plate is arranged in the middle position, the bottom left end of the linkage plate is connected to the No. 1 spring, the top left end is connected to the button, and the top right end of the linkage plate is connected to the No. 2 spring.

[0009] Preferably, the top of the pressure plate is connected to the middle position of the linkage plate, and the No. 3 spring provided at the top of the pressure plate is connected to the pressure plate to form a spring-type chuck, and a label buckle is provided in the middle position of the pressure plate.

[0010] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0011] The utility model connects the shell and the box cover to form a portable, compact and easy-to-move storage device. The shell is provided with a plurality of storage slots for storing chips, and each clamping mechanism is provided with a label buckle for distinguishing chip types. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the overall appearance of the utility model;

[0013] Figure 2 This is a schematic diagram of the internal structure of the shell of the utility model;

[0014] Figure 3 This is a schematic diagram of the clamping mechanism of the present invention.

[0015] Among them: 1. Shell; 11. Buckle slot; 2. Storage slot; 3. Clamping mechanism; 31. Button; 32. Linkage plate; 33. Spring No. 1; 34. Spring No. 2; 35. Spring No. 3; 36. Pressing plate; 37. Pad; 38. Label buckle; 4. Box cover; 41. Limiting protrusion. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0017] See also Figure 1-3 The utility model provides a technical solution: an IC chip pressing device, including a shell 1, a storage slot 2 is opened inside the shell 1, a box cover 4 is hinged on the top, and a clamping mechanism 3 is arranged in the storage slot 2, the clamping mechanism 3 includes a button 31, the bottom of the button 31 is connected to a linkage plate 32, the two ends of the linkage plate 32 are connected to a No. 1 spring 33 and a No. 2 spring 34, and the middle of the linkage plate 32 is arranged on a pressing plate 36, a No. 3 spring 35 is arranged inside the pressing plate 36, and the bottom of the pressing plate 36 is connected to a pad 37.

[0018] Through the above technical solution, the pressure plate 36 and the No. 3 spring 35 in the clamping mechanism 3 drive the pad 37 to pressure clamp the chip type in the storage slot 2, and the No. 3 spring 35 links the pressure plate 36, which is an existing technology and will not be repeated here.

[0019] When a specific operation plan is needed, the box cover 4 on the shell 1 is opened, and then the button 31 on the clamping mechanism 3 is pressed, so that the button 31 applies downward pressure to the No. 1 spring 33, driving the No. 1 spring 33 to contract. When the No. 1 spring 33 contracts, the left end of the linkage plate 32 moves downward, and the top of the right end is connected to the No. 2 spring 34, which also applies downward pressure to the linkage plate 32, and the middle of the linkage plate 32 is connected to the pressure plate 36, providing lever pressure to the pressure plate 36 and the No. 3 spring 35, so that the pressure plate 36 and the pad 37 rise, and then the chip type is placed in the storage slot 2, and then the button 31 is released, so that the No. 1 spring 33 rebounds and maintains balance with the No. 2 spring 34, driving the pressure plate 36 and the pad 37 to return to their original position to stably clamp the chip type. After completing the clamping of the chip type, a chip type label can be affixed to the label buckle 38 for classification and subsequent identification and division.

[0020] Specifically, a limiting protrusion 41 is provided on the side of the box cover 4, and a snap groove 11 is also provided on the top of the right side of the shell 1. The snap groove 11 matches the limiting protrusion 41, and a rotating shaft is provided at the connection between the shell 1 and the box cover 4, and the box cover 4 is rotatably connected to the shell 1 through the rotating shaft.

[0021] Specifically, a plurality of storage slots 2 are provided inside the housing 1 , and two sets of clamping mechanisms 3 are provided on the inner side of each storage slot 2 .

[0022] Specifically, the linkage plate 32 is set in the middle position, the bottom of the left end of the linkage plate 32 is connected to the No. 1 spring 33, the top of the left end is connected to the button 31, and the top of the right end of the linkage plate 32 is connected to the No. 2 spring 34.

[0023] Specifically, the top of the pressure plate 36 is connected to the middle position of the linkage plate 32, and the No. 3 spring 35 set at the top of the pressure plate 36 is connected to the pressure plate to form a spring clamp, and a label buckle 38 is set in the middle position of the pressure plate 36.

[0024] When a specific operation plan is needed, the box cover 4 on the shell 1 is opened, and then the button 31 on the clamping mechanism 3 is pressed, so that the button 31 applies downward pressure to the No. 1 spring 33, driving the No. 1 spring 33 to contract. When the No. 1 spring 33 contracts, the left end of the linkage plate 32 moves downward, and the top of the right end is connected to the No. 2 spring 34, which also applies downward pressure to the linkage plate 32, and the middle of the linkage plate 32 is connected to the pressure plate 36, providing lever pressure to the pressure plate 36 and the No. 3 spring 35, so that the pressure plate 36 and the pad 37 rise, and then the chip type is placed in the storage slot 2, and then the button 31 is released, so that the No. 1 spring 33 rebounds and maintains balance with the No. 2 spring 34, driving the pressure plate 36 and the pad 37 to return to their original position to stably clamp the chip type. After completing the clamping of the chip type, a chip type label can be affixed to the label buckle 38 for classification and subsequent identification and division.

[0025] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IC chip pressing device, comprising a housing (1), characterized in that: The shell (1) is provided with a storage slot (2) inside, a box cover (4) is hinged on the top, and a clamping mechanism (3) is provided in the storage slot (2), the clamping mechanism (3) includes a button (31), the bottom of the button (31) is connected to a linkage plate (32), the two ends of the linkage plate (32) are connected to a No. 1 spring (33) and a No. 2 spring (34), and the middle of the linkage plate (32) is provided with a pressure plate (36), the interior of the pressure plate (36) is provided with a No. 3 spring (35), the bottom of the pressure plate (36) is connected to a pad (37), a side of the box cover (4) is provided with a limiting protrusion (41), and a buckle groove (11) is also provided on the top of the right side of the shell (1), the buckle groove (11) matches the limiting protrusion (41), and a rotating shaft is provided at the connection between the shell (1) and the box cover (4), and the box cover (4) is rotatably connected to the shell (1) through the rotating shaft.

2. The IC chip pressing device according to claim 1, characterized in that: A plurality of storage slots (2) are provided inside the shell (1), and two sets of clamping mechanisms (3) are provided on the inner side of each storage slot (2).

3. The IC chip pressing device according to claim 1, wherein: The linkage plate (32) is arranged in the middle position, the bottom of the left end of the linkage plate (32) is connected to the first spring (33), the top of the left end is connected to the button (31), and the top of the right end of the linkage plate (32) is connected to the second spring (34).

4. The IC chip pressing device according to claim 1, wherein: The top of the pressing plate (36) is connected to the middle position of the linkage plate (32), and the No. 3 spring (35) arranged at the top of the pressing plate (36) is connected to the pressing plate to form a spring-type clamp, and a label buckle (38) is arranged in the middle position of the pressing plate (36).

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