Membrane electrode batch heat treatment device

Abstract

The utility model provides a film electrode batch heat treatment device which comprises a limiting clamp and a pressing plate, a vacant frame is arranged at the inner end of the limiting clamp, a limiting block is arranged at the rear end of the vacant frame, a circuit board is arranged at the upper end of the vacant frame, a to-be-treated complete substrate is arranged at the upper end of the circuit board, and a plurality of sets of film electrodes are arranged on the to-be-treated complete substrate. A voltage source is arranged at the front ends of the limiting clamp and the pressing plate, a power line is arranged in the voltage source, a welding hole is formed in the circuit board, a penetrating groove hole is formed in the pressing plate, the limiting clamp and the pressing plate are connected in a clamped and embedded mode, a positioning hole is formed between the limiting clamp and the pressing plate, and a threaded piece used for connection is arranged in the positioning hole. A limiting plate is arranged at the other end of the pressing plate, the limiting groove and the limiting block are attached to each other, and the limiting plate and the front end of the to-be-processed complete substrate are attached to each other. The problems that in the thin film electrode heat treatment process, heat treatment of a single thin film electrode is long in time and low in efficiency, and a lead is prone to falling off are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of sensor chip production, in particular to a thin film electrode batch heat treatment device. Background Art

[0002] When manufacturing thin-film electrodes involved in sensor chips, heat treatment is a key step, which has a significant impact on the microstructure and macroscopic properties of the film. Heat treatment can improve the crystallinity of the film, reduce defects, adjust the resistivity of the film, and improve its stability and reliability. These properties are crucial to the sensitivity, accuracy and durability of the sensor chip. Thin-film electrodes are usually prepared by physical vapor deposition techniques such as ion beam sputtering or magnetron sputtering. During these processes, the film may contain various types of crystal defects, including dislocations, grain boundaries and holes, which affect the electrical and mechanical properties of the film. Heat treatment can be used as a post-treatment technology to promote the repair and rearrangement of crystal defects by heating the film to a certain temperature and maintaining it for a period of time, thereby optimizing the performance of the film.

[0003] In the prior art, during the production process of the sensor, the thin film electrodes of the chip must be heat treated to reduce film defects, improve crystallinity, and enhance the conductivity and stability of the film.

[0004] The existing electrode heat treatment method is to cut the substrate covered with electrodes into individual electrodes, then install them on the circuit board, connect them to the sensor working circuit through leads, and perform heat treatment. This process is time-consuming and inefficient, and the lead connections are prone to falling off, resulting in a low yield rate. This makes the heat treatment of thin-film electrodes a major bottleneck affecting production efficiency. Therefore, we have made improvements to this and proposed a thin-film electrode batch heat treatment device. Utility Model Content

[0005] The purpose of the utility model is to solve the problems that in the current thin film electrode heat treatment process, the heat treatment of a single thin film electrode takes a long time, has low efficiency, and the lead wire is easy to fall off.

[0006] In order to achieve the above-mentioned purpose of the utility model, the utility model provides the following technical solutions:

[0007] A thin film electrode batch heat treatment device is provided to improve the above problems.

[0008] The specific application is as follows:

[0009] A device for batch heat treatment of thin film electrodes includes a limiting fixture and a pressing plate. An empty rack is provided at the inner end of the limiting fixture, a limiting block is provided at the rear end of the empty rack, a circuit board is provided at the upper end of the empty rack, a complete substrate to be processed is provided at the upper end of the circuit board, and several groups of thin film electrodes are provided on the complete substrate to be processed. A voltage source is provided at the front end of the limiting fixture and the pressing plate, a power line is provided inside the voltage source, a welding hole is provided on the circuit board, and a through slot is provided in the pressing plate.

[0010] As a preferred technical solution of the present application, the limiting clamp and the pressure plate are snap-fitted together, a positioning hole is provided between the limiting clamp and the pressure plate, and a threaded member for connection is provided in the positioning hole.

[0011] As a preferred technical solution of the present application, a limiting groove is provided at one end of the pressure plate, and a limiting plate is provided at the other end of the pressure plate, and the limiting groove and the limiting block are fitted together.

[0012] As a preferred technical solution of the present application, the limiting plate is in contact with the front end of the complete substrate to be processed.

[0013] As a preferred technical solution of the present application, several groups of thin film electrodes are conductively connected to the circuit board.

[0014] As a preferred technical solution of the present application, a heating circuit is arranged inside the circuit board, and several groups of thin film electrodes are connected in parallel.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] In the scheme of this application:

[0017] The complete substrates to be processed, which are covered with thin film electrodes, are directly subjected to batch heat treatment without cutting, which has high production efficiency; the thin film electrodes in the heating circuit are connected in parallel, which can ensure that each thin film electrode has the same heating voltage, and thus has a similar heat treatment temperature, and the heat treatment effect is good; the substrates and thin film electrodes are easy and quick to disassemble and install in the heat treatment system, and the operation is simple. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the overall structure of the thin film electrode batch heat treatment device provided in this application;

[0019] Figure 2 Schematic diagram of the pressure plate structure of the thin film electrode batch heat treatment device provided in this application;

[0020] Figure 3 Schematic diagram of the limiting fixture structure of the thin film electrode batch heat treatment device provided by this application;

[0021] Figure 4 A schematic diagram of the internal structure of the thin film electrode batch heat treatment device provided in this application without the pressing plate;

[0022] Figure 5 This is a schematic diagram of the circuit board circuit connection structure of the thin film electrode batch heat treatment device provided in this application.

[0023] Indicated in the figure:

[0024] 1. Limiting fixture; 2. Pressing plate; 3. Empty rack; 4. Limiting block; 5. Circuit board; 6. Complete substrate to be processed; 7. Thin film electrode; 8. Voltage source; 9. Welding hole; 10. Through slot; 11. Limiting slot; 12. Limiting plate; 13. Positioning hole. DETAILED DESCRIPTION

[0025] To make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of them.

[0026] Therefore, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the claimed invention, but merely represents some embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative effort are within the scope of protection of the present invention. It should be noted that the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other unless there is a conflict.

[0027] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0028] like Figure 1-5 As shown, this embodiment proposes a thin film electrode batch heat treatment device, including a limiting clamp 1 and a pressing plate 2, an inner end of the limiting clamp 1 is provided with an empty rack 3, the rear end of the empty rack 3 is provided with a limiting block 4, the upper end of the empty rack 3 is provided with a circuit board 5, the upper end of the circuit board 5 is provided with a complete substrate to be processed 6, and several groups of thin film electrodes 7 are provided on the complete substrate to be processed 6, a voltage source 8 is provided at the front end of the limiting clamp 1 and the pressing plate 2, a power line is provided inside the voltage source 8, a welding hole 9 is provided on the circuit board 5, and a through slot 10 is provided in the pressing plate 2.

[0029] The through slots 10 in the pressing plate 2 correspond to the thin film electrodes 7 in a one-to-one manner. The through slots 10 can dissipate heat, thereby preventing the back of the intact substrate 6 to be processed from overheating. Only the thin film electrodes 7 are heated, thereby preventing internal overheating from causing circuit burnout.

[0030] The welding hole 9 and the power line of the voltage source 8 are welded to each other, and the corresponding heating voltage is injected into the circuit board 5 through the voltage source 8 .

[0031] The limiting clamp 1 and the pressing plate 2 are connected by snapping, and a positioning hole 13 is provided between the limiting clamp 1 and the pressing plate 2. A screw member for connection is provided in the positioning hole 13.

[0032] The locking connection between the limiting fixture 1 and the pressing plate 2 can facilitate the positioning and heating of the complete substrate 6 to be processed;

[0033] The connecting piece in the positioning hole 13 can be a screw thread or other structure that can be quickly positioned.

[0034] A limiting groove 11 is provided at one end of the pressing plate 2 , and a limiting plate 12 is provided at the other end of the pressing plate 2 . The limiting groove 11 and the limiting block 4 are fitted together.

[0035] The limiting grooves 11 and the limiting plates 12 at both ends of the pressing plate 2 can position the front and rear ends of the complete substrate 6 to be processed, thereby preventing displacement during the process of connecting the circuit board 5 to the circuit.

[0036] The limiting plate 12 is in contact with the front end of the complete substrate 6 to be processed.

[0037] Several groups of thin film electrodes 7 are conductively connected to the circuit board 5 .

[0038] A heating circuit is arranged inside the circuit board 5 , and a plurality of groups of thin film electrodes 7 are connected in parallel.

[0039] The positive and negative poles of the circuit board 5 are connected to the power line: Before connecting the power line, it is necessary to ensure the cleanliness of the circuit board 5 to avoid any possible contamination. The power line should be selected based on its conductivity and high temperature resistance. Copper or gold is usually used as the material. During the connection process, precision welding technology is used to ensure the stability and reliability of the connection point.

[0040] Use of the limiting fixture 1: The limiting fixture 1 must have a high-precision positioning function to ensure accurate alignment of the circuit board 5 and the substrate to be processed. The limiting fixture 1 should have good thermal conductivity and corrosion resistance to facilitate uniform heat transfer and prevent corrosion by chemical substances.

[0041] Placement of the thin film electrode 7: When placing the substrate to be processed, which is covered with thin film electrodes 7, on the circuit board 5, the operator must wear dust-free gloves to prevent fingerprints or other contaminants from affecting the film surface. The thin film electrode 7 must be facing downward in the correct direction to ensure the subsequent heat treatment effect.

[0042] Selection and fixation of the pressing plate 2: The function of the pressing plate 2 is to ensure close contact between the substrate and the circuit board 5 to promote efficient heat transfer. The pressing plate 2 is usually made of hard materials such as stainless steel or ceramics. The fixing structure such as screws must be firm and avoid damaging the substrate.

[0043] Power on and voltage control: Before turning on the power, the circuit needs to be thoroughly checked to ensure that there are no short circuits or open circuits. The input voltage must be precisely controlled to match the characteristics of the film material and the required heat treatment temperature curve. Too high a voltage may cause the film to burn, while too low a voltage may not achieve the desired heat treatment effect.

[0044] Monitoring of the heat treatment process: During the entire heat treatment process, temperature changes need to be monitored in real time to ensure that the temperature distribution is uniform and meets the preset parameters. The production line is often equipped with a temperature control system and a high-resolution infrared camera to achieve refined temperature management.

[0045] In one embodiment:

[0046] Zinc oxide thin film electrodes for pressure sensor chips are being produced.

[0047] First, we use precision welding technology to connect the copper power wires to the positive and negative electrodes of the circuit board 5, and place the circuit board 5 in the limiting fixture 1 made of aluminum alloy;

[0048] Next, we gently place the silicon substrate covered with the ZnO thin film electrode 7 on the circuit board 5, ensuring that the thin film electrode 7 faces completely downwards;

[0049] Then, we place a stainless steel pressing plate 2 on top of the substrate and fix it to the limiting fixture 1 with four precision screws to ensure close contact between the substrate and the circuit board 5;

[0050] After confirming that all connections were correct, we turned on the power and set a gradually increasing voltage program through the programmable logic controller (PLC) to simulate a constant temperature heating process;

[0051] During the heat treatment process, we use an infrared thermal imager installed on the production line to monitor the temperature distribution on the substrate surface in real time through the through-slot 10 on the upper end of the pressure plate 2. A closed-loop control system adjusts the voltage output to maintain a uniform and stable temperature field. After approximately 30 minutes of treatment, we gradually reduce the voltage until the power supply is completely disconnected, completing the heat treatment process.

[0052] Finally, we examined the morphology and quality of the ZnO thin film electrode 7 using a microscope to ensure that its crystallinity and electrical properties met the requirements of the pressure sensor chip.

[0053] When the present application is used, the positive and negative electrodes of the circuit board 5 are connected to the power lines respectively and then placed in the limiting fixture 1; then the complete substrate 6 to be processed, which is covered with thin film electrodes 7, is stacked on the circuit board 5 with the thin film electrodes 7 facing downward; finally, the pressing plate 2 is placed on the complete substrate 6 to be processed and fixed with connecting parts such as screws, the power is turned on, a certain voltage is input, and the entire thin film is heat-treated;

[0054] The complete substrates 6 to be processed, which are covered with thin film electrodes 7, are directly subjected to batch heat treatment without cutting, which has high production efficiency; the thin film electrodes 7 in the heating circuit are connected in parallel, which can ensure that each thin film electrode 7 has the same heating voltage, and thus has a similar heat treatment temperature, and the heat treatment effect is good; the substrates and thin film electrodes 7 are easy and quick to disassemble and install in the heat treatment system, and the operation is simple.

[0055] The above embodiments are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. Although this specification has described the present invention in detail with reference to the above embodiments, the present invention is not limited to the above specific implementation methods. Therefore, any modification or equivalent replacement of the present invention; and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention are included in the scope of the claims of the present invention.

Claims

1. A thin film electrode batch heat treatment device, comprising a limiting fixture (1) and a pressing plate (2), characterized in that: The inner end of the limiting clamp (1) is provided with an empty frame (3), the rear end of the empty frame (3) is provided with a limiting block (4), the upper end of the empty frame (3) is provided with a circuit board (5), the upper end of the circuit board (5) is provided with a complete substrate to be processed (6), and the complete substrate to be processed (6) is provided with a plurality of groups of thin film electrodes (7), the front end of the limiting clamp (1) and the pressure plate (2) are provided with a voltage source (8), the interior of the voltage source (8) is provided with a power line, the circuit board (5) is provided with a welding hole (9), and the pressure plate (2) is provided with a through slot (10).

2. The thin film electrode batch heat treatment device according to claim 1, characterized in that: The limiting clamp (1) and the pressing plate (2) are connected by snapping, a positioning hole (13) is provided between the limiting clamp (1) and the pressing plate (2), and a threaded part for connection is provided in the positioning hole (13).

3. The thin film electrode batch heat treatment device according to claim 2, characterized in that: One end of the pressing plate (2) is provided with a limiting groove (11), and the other end of the pressing plate (2) is provided with a limiting plate (12), and the limiting groove (11) and the limiting block (4) are in contact with each other.

4. The thin film electrode batch heat treatment device according to claim 3, characterized in that: The limiting plate (12) is in contact with the front end of the complete substrate (6) to be processed.

5. The thin film electrode batch heat treatment device according to claim 4, characterized in that: Several groups of thin film electrodes (7) are conductively connected to the circuit board (5).

6. The thin film electrode batch heat treatment device according to claim 5, characterized in that: A heating circuit is provided inside the circuit board (5), and a plurality of groups of thin film electrodes (7) are connected in parallel.

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