Novel car lamp module heat dissipation device
The heat dissipation device for the headlight module, which integrates a micro-metal film through MEMS technology, uses the reciprocating motion of the vibration membrane to form an airflow for heat dissipation, solving the problems of heat dissipation noise and high energy consumption of existing headlight modules, achieving efficient heat dissipation with low noise and low power consumption, and extending the service life of the LED light source.
Patent Information
- Application Number
- CN202423078575.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-13
- Publication Date
- 2025-10-03
- Estimated Expiration
- 2034-12-13
AI Technical Summary
Existing headlight modules have problems with noise and high energy consumption during the heat dissipation process, and the life and reliability of the fan are challenged. A more efficient and low-noise heat dissipation solution is needed.
MEMS technology is used to integrate micro-metal films, and the reciprocating vibration of the film forms an airflow for heat dissipation, avoiding the use of fans. The heating element heats the vibration membrane to generate suction to inhale and expel air, thereby achieving effective heat dissipation.
It achieves high-efficiency heat dissipation effect with low noise, low power consumption, small size and dustproofness, prolongs the service life of LED light source and reduces costs.
Smart Images

Figure CN223411901U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of vehicle lamps, in particular to a novel heat dissipation device for a vehicle lamp module. Background Art
[0002] Automotive lighting modules, particularly those using LEDs as light sources, generate significant heat during operation. While LEDs offer high luminous efficiency, some electrical energy is still converted into heat. Furthermore, headlights are typically installed in the engine compartment or at the front of the vehicle, where ambient temperatures are high and space is limited, making heat dissipation a significant challenge. Effective heat dissipation ensures the stability of the LED light source and extends its lifespan, thereby guaranteeing driving safety. A common industry solution is to address this issue using aluminum metal bodies or fans and heat sinks. However, fan heat dissipation increases noise and energy consumption, and fan lifespan and reliability are also issues that need to be considered.
[0003] MEMS cooling technology is applied to the heat dissipation of automotive lighting modules. It mainly uses miniaturized and high-efficiency heat dissipation components manufactured using MEMS technology to effectively dissipate the heat generated by the automotive lighting module during operation through physical or thermal principles, thereby ensuring the stability of the LED light source and extending its service life.
[0004] Therefore, a new type of headlight module heat dissipation device is needed. MEMS technology can be used to integrate micro metal films, and the reciprocating vibration of the film can form airflow to solve the heat dissipation of the headlight module. This method can avoid the use of fans. Utility Model Content
[0005] The purpose of the utility model is to provide a cooling device for a vehicle lamp module without using a fan.
[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:
[0007] A novel heat dissipation device for a vehicle lamp module includes a driving module and a heat dissipation module disposed in a lamp housing;
[0008] The heat dissipation module includes a housing, a heat sink, a heating element and a vibration membrane;
[0009] The bottom surface of the housing is replaced by the heat sink, and the housing is used to accommodate the heating element and the vibration membrane;
[0010] The top surface of the shell is provided with at least one air inlet, and one side surface of the shell is provided with an air outlet;
[0011] The heat sink is attached to the top surface of the lamp board to absorb the heat of the lamp board;
[0012] The vibration membrane is arranged above the light board;
[0013] The driving module drives the heating element to heat;
[0014] The heating element is used to heat the vibration membrane;
[0015] The vibration membrane is deformed by heat and vibrates to generate suction, so that the air drawn into the air inlet absorbs the heat emitted by the heat sink and is then discharged from the air outlet.
[0016] Furthermore, the vibration membrane includes an aluminum membrane and a silicon membrane, the aluminum membrane is far away from the air inlet, and the silicon membrane is close to the air inlet.
[0017] Furthermore, the heating element is a polysilicon diaphragm.
[0018] Furthermore, the heating element is located between the aluminum film and the silicon film.
[0019] Furthermore, the thickness of the aluminum film is greater than the thickness of the silicon film.
[0020] Furthermore, the heat sink is a copper sheet.
[0021] Furthermore, it also includes a sensor receiving module, which is used to collect the temperature of the heat dissipation module and send it to the driving module.
[0022] Furthermore, it also includes a filter cover, which is used to filter the air at the air inlet.
[0023] In the above technical solution, a new type of headlight module heat dissipation device of the utility model adopts MEMS technology to integrate a micro metal film, and forms an airflow through the reciprocating vibration of the film to solve the heat dissipation of the headlight module. This method has low power consumption, low noise, small size, dustproof and good heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.
[0025] Figure 1 This is a schematic structural diagram of the heat dissipation device for a vehicle lamp module disclosed in the present utility model;
[0026] Figure 2 It is a structural schematic diagram of the vehicle light module disclosed in the utility model.
[0027] Reference numerals:
[0028] Housing 1, lamp board 2, heat sink 3, heating element 4, air inlet 11, air outlet 12, aluminum film 51, silicon film 52. DETAILED DESCRIPTION
[0029] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.
[0030] like Figure 1-2 A novel heat dissipation device for a vehicle lamp module is shown, comprising a driving module and a heat dissipation module placed in a lamp housing.
[0031] The heat dissipation module includes a housing 1, a heat sink 3, a heating element 4 and a vibration membrane.
[0032] The housing 1 is a cavity with an opening on one side, and serves as a mounting base for the heat sink 3, the heating element 4, and the diaphragm. The housing 1 is preferably made of epoxy resin. The housing 1 is fixed in the lamp housing during use.
[0033] The bottom surface of the housing 1 is replaced by the heat sink 3, that is, the bottom surface of the housing 1 is set as the heat sink 3. The housing 1 is used to accommodate the heating element 4 and the vibration membrane; the heat sink 3 is fixedly connected to other parts of the housing 1.
[0034] The top surface of the housing 1 , ie, the surface opposite to the lamp panel, is provided with at least one air inlet 11 , and an air outlet 12 is provided on one side surface of the housing 1 .
[0035] The heat sink 3 is attached to the top surface of the lamp board 2 to absorb the heat of the lamp board 2. The heat sink 3 is preferably a copper sheet with good heat dissipation effect.
[0036] The vibration membrane is arranged above the lamp board 2; there is a distance between the vibration membrane and the heat sink.
[0037] The driving module drives the heating element to heat, and the heating element 4 is used to heat the vibration membrane.
[0038] The vibration membrane deforms due to heat, and the vibration generates suction, so that the air drawn into the air inlet 11 absorbs the heat emitted by the heat sink 3 and is discharged from the air outlet 12 .
[0039] The diaphragm preferably comprises an aluminum film 51 and a silicon film 52, with the aluminum film 51 positioned away from the air inlet 11 and the silicon film 52 positioned closer to the air inlet 11. The difference in expansion coefficients between aluminum and silicon causes the diaphragm to deform and vibrate, generating suction. The aluminum film 51 and silicon film 52 provide airflow and disperse the air.
[0040] The heating element 4 is a polysilicon membrane. It is located between the aluminum membrane 51 and the silicon membrane 52. The heating element 4, the aluminum membrane 51, and the silicon membrane 52 do not need to be fixedly connected to each other. Their edges can be supported by the housing itself or by multiple spaced support posts fixed to the housing.
[0041] Preferably, the area of the polysilicon is smaller than that of the aluminum film 51 and the silicon film 52, and is located between the two. The thickness of the aluminum film 51 is greater than that of the silicon film 52. This allows the overall deformation of the vibrating membrane to be greater, which is conducive to the intake of more air.
[0042] Preferably, a sensor receiving module is further included, which is used to collect the temperature of the heat dissipation module and send it to the driving module, so that the driving module can control the temperature of the heating element.
[0043] Preferably, a filter cover is further included, and the filter cover is used to filter the air at the air inlet 11.
[0044] The sensor receiving module senses the temperature of the heat dissipation module, specifically the light panel and heating element, and transmits this information to the driver module. The driver module, in response to the temperature, releases an electrical signal to heat the polysilicon, heating the diaphragm in the heat dissipation module. The difference in expansion coefficients between aluminum and silicon causes the diaphragm to deform and vibrate, generating suction that pulls air through the dust cover to the air inlet. This suction is then pushed downward at very high speed, passing through the gap between the aluminum diaphragm and the outer shell before impacting the heat sink. The air reaches saturation by extracting heat from the heat sink and is then discharged through the side outlet.
[0045] The sensor receiving module can be composed of a temperature detection unit and a signal transmission unit. The temperature detection unit can detect the temperature of the headlight and transmit the signal to the driver module controller via analog or digital signals through the signal transmission unit. The transmission communication interface can be UART, LIN, or CAN. The driver module can send an electrical signal to the heat sink module to heat the polysilicon. The heat sink is miniature and can be directly mounted on the light board. The copper sheet is attached to the bottom of the light board.
[0046] The utility model has the advantages of efficient heat dissipation, low noise, ultra-thin design, low power consumption, long life and low cost. Compared with the graphite heat sink of the prior art, it can reduce the cost. Compared with fan heat dissipation, it is quieter and less likely to cause dust accumulation.
[0047] The above description is merely illustrative of certain exemplary embodiments of the present invention. It goes without saying that those skilled in the art will be able to modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A new type of heat dissipation device for a vehicle lamp module, characterized in that: It includes a driving module and a heat dissipation module placed in the lamp housing; The vehicle lamp module comprises a housing (1), a heat sink (3), a heating element (4) and a vibration membrane; The bottom surface of the housing (1) is replaced by the heat sink (3), and the housing (1) is used to accommodate the heating element (4) and the vibration membrane; The top surface of the housing (1) is provided with at least one air inlet (11), and a side surface of the housing (1) is provided with an air outlet (12); The heat sink (3) is attached to the top surface of the light board (2) to absorb heat from the light board (2); The vibration membrane is arranged above the light board (2); The driving module drives the heating element (4) to heat; The heating element (4) is used to heat the vibrating membrane (5); The vibration membrane deforms due to heat, and vibrates to generate suction, so that the air drawn into the air inlet (11) absorbs the heat emitted by the heat sink (3) and is discharged from the air outlet (12).
2. A novel heat dissipation device for a vehicle lamp module according to claim 1, characterized in that: The vibration membrane comprises an aluminum membrane (51) and a silicon membrane (52), wherein the aluminum membrane (51) is far away from the air inlet (11), and the silicon membrane (52) is close to the air inlet (11).
3. The novel heat dissipation device for a vehicle lamp module according to claim 2, characterized in that: The heating element (4) is a polysilicon diaphragm.
4. The novel heat dissipation device for a vehicle lamp module according to claim 3, characterized in that: The heating element (4) is located between the aluminum film (51) and the silicon film (52).
5. The novel heat dissipation device for a vehicle lamp module according to claim 2, characterized in that: The thickness of the aluminum film (51) is greater than the thickness of the silicon film (52).
6. The novel heat dissipation device for a vehicle lamp module according to claim 1, characterized in that: The heat sink (3) is a copper sheet.
7. The novel heat dissipation device for a vehicle lamp module according to claim 1, characterized in that: It also includes a sensor receiving module, which is used to collect the temperature of the heat dissipation module and send it to the driving module.
8. The novel heat dissipation device for a vehicle lamp module according to claim 1, characterized in that: It also includes a filter cover, which is used to filter the air at the air inlet (11).