Packaging substrate three-dimensional measuring device

Abstract

A packaging substrate three-dimensional measuring device comprises a rack, and the rack is provided with a light-emitting module, a microscopic imaging module, an image acquisition module and an image analysis and system control module. Light of the light emitting module irradiates a to-be-detected sample, light reflected from the to-be-detected sample enters the image acquisition module after passing through the microscopic imaging module, and image information acquired by the image acquisition module enters the image analysis and system control module. During application, the device can realize high-precision, large-range and high-efficiency measurement of three-dimensional shapes of samples with different surface heights.

Description

Technical Field

[0001] The utility model relates to the technical field of optical microscopic imaging, in particular to a three-dimensional measuring device for a packaging substrate. Background Art

[0002] Currently, the detection of packaging substrates on the market is mainly divided into two categories: contact and non-contact.

[0003] Contact testing mainly uses manual testing and electrical testing to perform functional testing on the packaging substrate. This type of testing method is simple to operate, but it is highly subjective, inefficient, and contact testing can easily damage the packaging substrate.

[0004] Non-contact measurement can accurately measure complex topography without touching the sample surface and without damaging the sample surface. Common methods include optical interferometry, laser scanning detection, and traditional confocal detection. Although the detection accuracy and speed are improved compared to contact measurement, optical interferometry detection requires a high-precision optical anti-vibration platform to reduce measurement errors caused by environmental vibration, making it difficult to use in non-laboratory environments. Laser scanning detection requires point-by-point scanning of the sample being measured, resulting in low detection efficiency and difficulty meeting modern production needs. Traditional confocal detection requires imaging in a point-by-point and layer-by-layer scanning direction, which makes imaging time-consuming and slow.

[0005] In summary, contact-based inspection methods are difficult to use for inspecting complex three-dimensional surface topography, dimensions, and defects within a 3D range. Furthermore, the aforementioned non-contact inspection methods are subject to varying degrees of limitations due to factors such as the inspection environment and efficiency, making them difficult to apply to in-line production. Furthermore, the associated equipment is relatively expensive. Utility Model Content

[0006] In view of the shortcomings of the background technology, the purpose of the present invention is to provide a three-dimensional measurement device for a packaging substrate.

[0007] To achieve the above objectives, the present invention provides the following technical solutions:

[0008] A three-dimensional measurement device for a package substrate includes a frame, on which are mounted a light-emitting module, a microscopic imaging module, an image acquisition module, and an image analysis and system control module. Light from the light-emitting module is irradiated onto a sample to be measured, and light reflected from the sample to be measured passes through the microscopic imaging module and enters the image acquisition module. Image information acquired by the image acquisition module enters the image analysis and system control module.

[0009] Furthermore, the light emitting module includes a light source, an optical path intermediate, a spatial light modulator, a dispersion tube lens, an objective lens and a sample in sequence along the direction of the optical signal.

[0010] Furthermore, the light emitting module includes a light source, an optical path intermediate, a spatial light modulator, a polarizer LP, a collimating lens group, a polarization beam splitter PBS, a dispersion tube lens, a microscope objective lens and a sample in sequence along the light traveling direction.

[0011] Furthermore, the microscopic imaging module and the light emitting module share the following components: according to the direction of the light signal, they include a sample, a microscope objective lens, and a dispersion tube lens.

[0012] Furthermore, the microscopic imaging module and the light emitting module share the following components: according to the direction of light travel, they include a sample, a microscope objective lens, a dispersion tube lens, and a polarization beam splitter PBS.

[0013] Furthermore, the image acquisition module includes at least two groups of image acquisition sub-modules, each of which includes a dichroic mirror, a narrow-band filter, and a camera; so that the reflected light passing through the dichroic mirror is incident on the camera in the same group, and the projected light passing through the dichroic mirror is incident on the dichroic mirror or the camera in the next group.

[0014] Furthermore, the cameras are all on the focal plane of the tube lenses of the same group.

[0015] Furthermore, it also includes a stage, the sample is placed on the stage, the stage is driven and connected to an XYZ three-axis motion mechanism, and the XYZ three-axis motion mechanism is installed on the frame.

[0016] Furthermore, the XYZ three-axis motion mechanism includes an X-axis drive device, a Y-axis drive device and a Z-axis drive device; the X-axis drive device drives the worktable to move along the X-axis direction; the Y-axis drive device drives the worktable to move along the Y-axis direction; and the Z-axis drive device drives the worktable to move along the Z-axis direction.

[0017] Furthermore, the image analysis and system control module is electrically connected to the camera, the light emitting module, the spatial light modulator, and the stage; and the camera is electrically connected to the spatial light modulator.

[0018] The beneficial effects of the utility model are:

[0019] 1. The present invention proposes a three-dimensional measurement device for package substrates. By configuring a light-emitting module, a microscopic imaging module, an image acquisition module, and an image analysis and system control module, the manufacturing cost is controllable, the device can be applied to different inspection environments, and has good inspection efficiency, enabling it to be used for online production inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is a schematic diagram of a three-dimensional measurement device for a package substrate according to the present invention;

[0022] Figure 2 This is a front view of a three-dimensional measurement device for a packaging substrate according to the present invention;

[0023] Figure 3 This is a side view of a three-dimensional measurement device for a package substrate according to the present invention;

[0024] Figure 4 This is a detection optical path diagram of a three-dimensional measurement device for a package substrate of the utility model

[0025] Figure 5 This is a flow chart of the measurement steps of a three-dimensional measurement device for a package substrate according to the present invention;

[0026] In the figure, 101 is the light source; 102 is the spatial light modulator; 103 is the polarizer LP; 104 is the collimating lens group; 201 is the objective lens; 202 is the dispersion tube lens; 203 is the polarization beam splitter PBS; 301 is the dichroic mirror; 302 is the narrow-band filter; 303 is the camera; 401 is the stage; 402 is the sample; 50 is the rack; 60 is the optical path intermediate. DETAILED DESCRIPTION

[0027] The following combination Figure 1-5 The utility model is described in detail.

[0028] A three-dimensional measurement device for a package substrate, such as Figure 1-3 As shown, the apparatus includes a frame 50 on which a light-emitting module, a microscopic imaging module, an image acquisition module, and an image analysis and system control module are provided. Light from the light-emitting module is irradiated onto the sample 402 to be tested, and light reflected from the sample 402 to be tested enters the image acquisition module after passing through the microscopic imaging module. Image information acquired by the image acquisition module enters the image analysis and system control module.

[0029] In this embodiment, Figure 4 As shown, the light emitting module includes a light source 101, an optical path intermediate body 60, a spatial light modulator 102, a dispersion tube lens 202, an objective lens 201 and a sample 402 in sequence along the direction of the light signal. The light source 101 is an LED polychromatic light source 101.

[0030] In this embodiment, Figure 4 As shown, the light emitting module includes a light source 101, an optical path intermediate body 60, a spatial light modulator 102, a polarizer LP103, a collimating lens group 104, a polarization beam splitter PBS203, a dispersion tube lens 202, a microscope objective lens 201 and a sample 402 in sequence along the direction of light travel.

[0031] In this embodiment, the microscopic imaging module and the light emitting module share the following components: according to the direction of the light signal, they include a sample 402 , a microscope objective lens 201 , and a dispersion tube lens 202 .

[0032] In this embodiment, the microscopic imaging module and the light emitting module share the following components: in terms of the light traveling direction, they include a sample 402 , a microscope objective lens 201 , a dispersion tube lens 202 , and a polarization beam splitter PBS 203 .

[0033] In this embodiment, the image acquisition module includes at least two groups of image acquisition submodules, each of which includes a dichroic mirror 301, a narrowband filter 302, and a camera 303, wherein the camera 303 is an sCMOS camera 303. Light reflected from the dichroic mirror 301 is incident on the camera 303 in the same group, while projected light from the dichroic mirror 301 is incident on the dichroic mirror 301 or camera 303 in the next group. Furthermore, the cameras 303 are all located on the focal plane of the tube lens in the same group.

[0034] In this embodiment, a stage 401 is further included, and a sample 402 is placed on the stage 401 . The stage 401 is driven and connected to an XYZ three-axis motion mechanism, and the XYZ three-axis motion mechanism is installed on the frame 50 .

[0035] In this embodiment, the XYZ triaxial motion mechanism includes an X-axis drive shaft, a Y-axis drive shaft, and a Z-axis drive shaft. The X-axis drive shaft drives the stage 401 along the X-axis; the Y-axis drive shaft drives the stage 401 along the Y-axis; and the Z-axis drive shaft drives the stage 401 along the Z-axis. In this embodiment, the image analysis and system control module is electrically connected to the camera 303, the light emitting module, the spatial light modulator 102, and the stage 401; and the camera 303 is electrically connected to the spatial light modulator 102.

[0036] In this embodiment, the optical path intermediate body 60 is provided with a through hole, and the polychromatic LED light source 101 and the camera 303 are connected to the optical path intermediate body 60 through the through hole. The through hole below the camera 303 is provided with a card slot for placing the filter. The optical path intermediate body 60 is connected to the dispersion tube lens 202 and the objective lens 201 through the through hole. The optical path intermediate body 60 is fixed to the frame 50 by fasteners such as bolts. The stage 401 is provided below the objective lens 201, and the DMD spatial light modulator 102 is placed at the tail of the optical path intermediate body 60.

[0037] In this embodiment, Figure 4 As shown, LED polychromatic light source 101 is placed vertically. Polychromatic light λ emitted by LED polychromatic light source 101 enters optical path intermediate body 60. Optical path intermediate body 60 reflects the light to DMD spatial light modulator 102. At this time, the DMD's dot matrix confocal illumination mode is turned on. The light from the DMD is collimated by collimating lens group 104 in optical path intermediate body 60, adjusted into parallel light. The light passes through dispersion tube lens 202 and objective lens 201 and illuminates sample 402. The light signal reflected by sample 402 is returned to dual camera 303, and then processed by image analysis and system control module. The image analysis and system control module is a data processing device such as a computer. Optical path intermediate body 60 also includes a total reflection prism and tube lens. Sample 402 is placed on stage 401, which is axially moved under computer control.

[0038] A three-dimensional measurement method for a package substrate, applicable to a three-dimensional measurement device for a package substrate, includes the following measurement steps:

[0039] Step 101: Place the sample 402 to be tested on the stage 401, and turn on the camera 303, the spatial light modulator 102 and the light emitting module;

[0040] Step 102: The polychromatic light emitted by the light source 101 is modulated into a dot matrix confocal illumination mode by the spatial light modulator 102. The light intensity of the light emitting module is adjusted by adjusting the exposure value on the image analysis and system control module to achieve a critical state of being about to be overexposed but not yet overexposed.

[0041] Step 103: Place the sample 402 to be measured at the center of the field of view of the dot matrix light, and adjust the position of the stage 401 so that the confocal image of the sample 402 is in a focused state in the camera 303;

[0042] Step 104: The light source 101 emits polychromatic light, which passes through the microscopic imaging module and illuminates the sample 402. Under the combined effects of the axial dispersion tube lens 202, the axial chromatic aberration, and the residual chromatic aberration of the objective lens 201, the polychromatic light is dispersed along the axial direction, so that light of different wavelength bands of the polychromatic light produces a series of focal points along the optical axis, among which some wavelength bands are focused on the surface of the sample 402.

[0043] Step 105: The circularly polarized light in the focused wavelength band reflected by the sample 402 passes through the objective lens 201, the dispersion tube lens 202, and then the dichroic mirror 301. The two light bands of different wavelengths enter the two image acquisition submodules to complete image acquisition. The two image acquisition submodules transmit the two light bands λ1 corresponding to each position on the package substrate surface, λ, and the light intensity values ​​N1 and N2 to the image analysis and system control module, and calculate the light intensity difference N1-N2.

[0044] In this embodiment, in step 105, light below the specific wavelength λ1 is reflected and passes through the total reflection prism and the narrow-band filter 302 to enter the first camera 303 and complete image acquisition. Light above the specific wavelength λ1 passes through the dichroic mirror 301, then passes through the narrow-band filter 302 to enter the second camera 303 and complete image acquisition.

[0045] The method for calibrating the axial response curve of the sample 402 under the polychromatic light source 101 is as follows:

[0046] Step 201: Place a plane reflector on stage 401. The light emitting module emits polychromatic light. Select narrowband filters 302 with wavelengths λn and λm to obtain a narrowband light source 101. Focus the narrowband light source 101 on the plane reflector to obtain a reference zero plane. Then control the spatial light modulator 102 to a central single-point illumination mode.

[0047] Step 202: Drive the objective lens 201 to perform axial scanning on the plane reflector, and take the maximum grayscale value of the point light source 101 as the light intensity value at the corresponding axial position, and draw an axial position curve corresponding to the light intensity, i.e., a spectral confocal axial light intensity response curve;

[0048] Step 203: Modulate the spatial light modulator 102 to a dot matrix confocal illumination mode, perform subtraction processing on the two axial light intensity response curves of the package substrate generated by the narrowband light source 101 with wavelengths λ1 and λ2, obtain the dispersion differential axial response curve I, and perform linear fitting on the central linear region of the curve to obtain the slope k and intercept b of the linear segment of the differential axial response curve.

[0049] Step 204: The relationship between the height H of the package substrate surface and the light intensity difference (N1-N2) is: H = (N1-N2)*k+b, thereby restoring the three-dimensional topography of the package substrate surface for inspection. The functional relationship between the light intensity difference and the height of the sample 402 surface is used to determine the height of the package substrate surface, and thus restore the three-dimensional topography of the package substrate surface for inspection.

[0050] The present invention provides a three-dimensional measurement device for package substrates, comprising a frame 50 equipped with a light-emitting module, a microscopic imaging module, an image acquisition module, and an image analysis and system control module. Light from a light source 101 illuminates a sample 402 to be measured. Light reflected from the sample 402 passes through the microscopic imaging module and enters the image acquisition module. Image information captured by the image acquisition module enters the image analysis and system control module. The method provided by the present invention enables high-precision, large-scale, and efficient microscopic three-dimensional topography detection.

[0051] The above embodiments are intended only to illustrate the technical concepts and features of the present invention. Their purpose is to enable those skilled in the art to understand and implement the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent changes or modifications based on the spirit of the present invention are intended to be included in the scope of protection of the present invention.

Claims

1. A three-dimensional measurement device for a package substrate, comprising a frame, characterized in that: The frame is equipped with a light-emitting module, a microscopic imaging module, an image acquisition module and an image analysis and system control module; the light from the light-emitting module is irradiated onto the sample to be tested, and the light reflected from the sample to be tested passes through the microscopic imaging module and enters the image acquisition module. The image information acquired by the image acquisition module enters the image analysis and system control module.

2. The three-dimensional measurement device for a package substrate according to claim 1, wherein: The light emitting module includes a light source, an optical path intermediate, a spatial light modulator, a dispersion tube lens, an objective lens and a sample in sequence along the direction of the optical signal.

3. The three-dimensional measurement device for a package substrate according to claim 2, wherein: The light emitting module includes a light source, an optical path intermediate, a spatial light modulator, a polarizer LP, a collimating lens group, a polarization beam splitter PBS, a dispersion tube lens, a microscope objective lens and a sample in sequence along the light advancing direction.

4. The three-dimensional measurement device for a package substrate according to claim 1, wherein: The microscopic imaging module and the light emitting module share the following components: according to the direction of the light signal, they include a sample, a microscope objective lens, and a dispersion tube lens.

5. The three-dimensional measurement device for a package substrate according to claim 1, wherein: The microscopic imaging module and the light emitting module share the following components: according to the direction of light travel, they include a sample, a microscope objective lens, a dispersion tube lens, and a polarization beam splitter PBS.

6. The three-dimensional measurement device for a package substrate according to claim 2, wherein: The image acquisition module includes at least two groups of image acquisition submodules, each of which includes a dichroic mirror, a narrow-band filter, and a camera; so that the reflected light passing through the dichroic mirror is incident on the camera in the same group, and the projected light passing through the dichroic mirror is incident on the dichroic mirror or the camera in the next group.

7. The three-dimensional measurement device for a package substrate according to claim 6, wherein: The cameras are all on the focal plane of the tube lenses of the same group.

8. The three-dimensional measurement device for a package substrate according to claim 6, wherein: It also includes a stage, the sample is placed on the stage, the stage is driven and connected to an XYZ three-axis motion mechanism, and the XYZ three-axis motion mechanism is installed on the frame.

9. The three-dimensional measurement device for a package substrate according to claim 8, wherein: The XYZ three-axis motion mechanism includes an X-axis drive device, a Y-axis drive device and a Z-axis drive device; the X-axis drive device drives the stage to move along the X-axis direction; the Y-axis drive device drives the stage to move along the Y-axis direction; and the Z-axis drive device drives the stage to move along the Z-axis direction.

10. The three-dimensional measurement device for a package substrate according to claim 8, wherein: The image analysis and system control module is electrically connected to the camera, the light emitting module, the spatial light modulator, and the stage; and the camera is electrically connected to the spatial light modulator.

Images