Full-function high-power laser chip aging mechanism

Abstract

The utility model discloses a full-function high-power laser chip aging mechanism, which comprises an aging base, a reflection seat body, a light splitting seat body, a plurality of optical fiber heads and a plurality of PD sensors, the aging seat body is used for placing a laser chip; the reflecting seat body is provided with a light absorbing hole and a light emitting hole, the light splitting seat body is provided with a penetrating hole penetrating through the light splitting seat body front and back and a light splitting hole extending out of the light splitting seat body downwards from the penetrating hole, the penetrating hole is aligned with the light emitting hole front and back, and the optical fiber head is installed at the front end of the light splitting seat body. The PD sensor is arranged in the light splitting hole and is aligned with the front and back of the through hole, the optical fiber head is independently connected to the spectrograph through an optical fiber line, an efficient and accurate optical detection system is constructed, the system can capture and analyze the optical property of laser emitted from the through hole in real time, and the PD sensor extends into the light splitting hole and is used for accurately measuring the laser power.

Description

Technical Field

[0001] The utility model relates to the technical field of laser chip testing, in particular to a full-function high-power laser chip aging mechanism. Background Art

[0002] Current laser chip aging mechanisms have matured in terms of design and functionality, but they still face several key potential deficiencies that directly or indirectly affect the efficiency, accuracy, and cost-effectiveness of testing. Specifically, the main challenges include: temperature control accuracy and stability are easily affected by external factors such as environmental fluctuations, equipment aging, and changes in water quality, making it difficult to maintain an absolutely constant test environment; manual clamping, chip positioning, photoelectric signal detection, and data analysis involved in the test process are not only time-consuming and lengthy, but also have limited automation, which restricts the improvement of overall test efficiency; in addition, for high-power laser chips, their high heat generation characteristics are particularly significant during aging tests. If the heat dissipation system is not well designed or efficient, it is easy to cause chip overheating, which in turn damages the accuracy of test results and threatens the long-term reliability of the chip.

[0003] Therefore, in response to the above problems, it is necessary to further optimize the design, improve the level of automation, and enhance the heat dissipation efficiency to comprehensively improve the overall performance of laser chip aging testing. Utility Model Content

[0004] The purpose of the utility model is to provide a full-function high-power laser chip aging mechanism with compact structure and high automation level.

[0005] To achieve the aforementioned objectives, the present invention adopts the following technical solutions: a full-function high-power laser chip aging mechanism, which includes an aging base, a reflective base, a spectrometer base, a plurality of optical fiber heads and a plurality of PD sensors; the aging base is provided with a plurality of grooves arranged at intervals on the left and right for placing the laser chip; the reflective base is located between the aging base and the spectrometer base, the reflective base is provided with a light absorption hole and a light output hole, the light absorption hole extends upward and forward from the rear end surface of the reflective base to the light output hole, and the light output hole extends forward to the front end surface of the reflective base; the spectrometer base is provided with a through hole that penetrates the spectrometer base front and back and a spectrometer hole extending downward from the through hole out of the spectrometer base, the through hole is aligned front and back with the light output hole, the optical fiber head is installed at the front end of the spectrometer base, aligned front and back with the through hole, and the PD sensor extends into the spectrometer hole.

[0006] A further improvement also includes pressing down the laser chip and an electrode mounting plate for powering the laser chip.

[0007] As a further improvement, the PD sensors are arranged on a circuit board with intervals on the left and right sides, and the circuit board is installed on the bottom of the spectrometer body.

[0008] As a further improvement, the optical fiber heads are installed on a mounting plate at intervals on the left and right, and the mounting plate is installed on the front end of the beam splitter body.

[0009] A further improvement further includes a temperature sensor installed in the mounting groove of the aging base, wherein the mounting groove is recessed in the front end surface of the aging base and is close to the groove.

[0010] As a further improvement, the aging base is provided with a water flow channel running through the aging base on the left and right sides and a plurality of partition walls arranged in the water flow channel at intervals in front and back, the upper and lower ends of the partition walls are connected to the inner side walls of the water flow channel, and the partition walls are provided with a plurality of through holes running through the partition walls in front and back.

[0011] As a further improvement, the through holes are arranged in a matrix on the middle partition wall, and the through holes on two adjacent middle partition walls are aligned front to back.

[0012] The optical fiber head of this new full-function high-power laser chip aging mechanism is independently connected to a spectrometer via an optical fiber line, constructing an efficient and precise optical detection system that can capture and analyze in real time the optical properties of the laser emitted from the through-hole, including but not limited to core parameters such as wavelength, intensity, and spectral distribution; the PD sensor absorbs the laser beam and instantly outputs an electrical signal that is strictly proportional to the beam power, thereby achieving accurate measurement of the laser power. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a three-dimensional diagram of the full-function high-power laser chip aging mechanism of the utility model.

[0014] Figure 2 This is a three-dimensional diagram from another angle of the full-function high-power laser chip aging mechanism of the utility model.

[0015] Figure 3 This is a three-dimensional exploded view of the full-function high-power laser chip aging mechanism of the utility model.

[0016] Figure 4 This is a three-dimensional exploded view from another angle of the full-function high-power laser chip aging mechanism of the utility model.

[0017] Figure 5 This is a three-dimensional schematic diagram of the cooperation between the aging base and the electrode mounting plate and the laser chip of the full-function high-power laser chip aging mechanism of the utility model.

[0018] Figure 6 for Figure 5 Enlarged view within the circle.

[0019] Figure 7 This is a cross-sectional view of the aging base of the full-function high-power laser chip aging mechanism of the utility model.

[0020] Figure 8 This is a cross-sectional view of the light-absorbing block of the full-function high-power laser chip aging mechanism of the utility model.

[0021] Figure 9 This is a cross-sectional view of the spectrometer body of the full-function high-power laser chip aging mechanism of the utility model. DETAILED DESCRIPTION

[0022] See also Figures 1 to 4 As shown, the embodiment of the present invention discloses a full-function high-power laser chip aging mechanism 100, which includes an aging base 10, an electrode mounting plate 20, a plurality of temperature sensors 30, a reflective base body 40, a spectrometer base body 50, a plurality of optical fiber heads 60 and a plurality of PD sensors 70.

[0023] Please combine Figures 5 to 7 As shown, the aging base 10 is made of a metal material with high thermal conductivity. The top surface is provided with a row of grooves 11 spaced apart on the left and right and mounting grooves 12 extending downward from each groove 11. The grooves 11 are close to the front end of the aging base 10 and are used to place the laser chip 200. The mounting grooves 12 are recessed in the front end surface of the aging base 10. Each temperature sensor 30 is installed one by one in the corresponding mounting groove 12 and is close to the groove 11 for testing the operating temperature of the laser chip 200.

[0024] The aging base 10 also features a water channel 15 that runs through the aging base 10 horizontally and a number of intermediate partitions 16 spaced apart in the water channel 15. The upper and lower ends of the intermediate partitions 16 are connected to the inner sidewalls of the water channel 15. The intermediate partitions 16 are provided with a number of through holes 18 that run through the intermediate partitions 16 front to back. The through holes 18 are arranged in a matrix, with the through holes 18 on adjacent intermediate partitions 16 aligned one after the other. Because the intermediate partitions 16 have through holes 18, the water flowing through the water channel 15 of the aging base 10 is guided into a turbulent state. This turbulent effect significantly improves the heat exchange process and greatly enhances heat dissipation performance.

[0025] The electrode mounting plate 20 presses downwardly on the laser chip 200 , and simultaneously realizes the functions of powering and heat conducting the laser chip 200 .

[0026] Please combine Figure 8As shown, the reflector body 40 is arranged on the front side of the aging base 10. The reflector body 40 is a long strip extending horizontally and includes a plurality of light absorption holes 41, a plurality of light output holes 42, and a water channel 43. The light absorption holes 41 are spaced apart on the reflector body 40, corresponding one-to-one with the grooves 11. The light absorption holes 41 extend upward and forward from the rear end of the reflector body 40 to the light output holes 42. Each light output hole 42 is arranged horizontally, extending forward from the upper portion of the light absorption hole 41 to the front end of the reflector body 40. The water channel 43 runs through the reflector body 40 from side to side, providing efficient water cooling for the reflector body 40. When the laser light emitted by the laser chip 200 enters the light absorption hole 41, it is reflected multiple times by the inner wall of the light absorption hole 41 before being emitted from the light output hole 32 to the spectrometer body 50.

[0027] Please combine Figure 9 As shown, the beam splitter body 50 is provided with a plurality of through holes 51 extending through the beam splitter body 50 front to back and spaced apart from each other left to right, and a beam splitting hole 52 extending downward from each through hole 51 out of the beam splitter body 50. The through holes 51 are arranged horizontally, and the beam splitting holes 52 are arranged vertically. The inner diameter of the beam splitting hole 52 is smaller than the inner diameter of the through holes 51. The through holes 51 are aligned front to back with the light exit hole 42.

[0028] Several fiber optic heads 60 are spaced apart and mounted on a mounting plate 62, which is attached to the front end of the spectrometer body 50. The fiber optic heads 60 are aligned with the through-holes 51 and receive the laser light emitted from the through-holes 51. Each fiber optic head 60 is independently connected to a spectrometer via an optical fiber line, forming an efficient and precise optical detection system capable of capturing and analyzing the optical properties of the laser light emitted from the through-holes 51 in real time, including but not limited to key parameters such as wavelength, intensity, and spectral distribution.

[0029] Several PD sensors 70 are spaced apart on a circuit board 72 and extend into corresponding spectroscopic apertures 52 to measure laser power. These sensors absorb the laser beam and instantly output an electrical signal proportional to the beam power, enabling precise measurement of laser power. Circuit board 72 is mounted on the bottom of the spectroscopic base 50, ensuring the stability and reliability of the entire measurement system.

[0030] During operation of the fully functional high-power laser chip aging mechanism 100 of the present invention, first, a temperature sensor approaches the laser chip 200 placed on the aging base 10 to perform real-time and accurate testing of the operating temperature of the laser chip 200. Second, the laser light is emitted into the reflective base 40. Thanks to the inclined arrangement of the light absorption hole 41 and the horizontal layout of the light output hole 42, as the laser light passes through these two empty passages, its energy undergoes multiple reflections and scattering caused by the inner walls, thereby achieving an effective attenuation process. The attenuated laser light is then guided and tilted into the beam splitter base 50, where it again triggers multiple reflections and scattering caused by the inner walls. One beam is precisely emitted to the optical fiber head 60 and ultimately transmitted to the spectrometer for detailed detection and analysis. The other beam enters the beam splitter hole 52 and is captured by the PD sensor 70 for power information collection.

[0031] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.

Claims

1. A full-function high-power laser chip aging mechanism, characterized by: The optical fiber head is installed at the front end of the optical fiber head and aligned with the through hole, and the optical fiber head is installed at the front end of the optical fiber head and aligned with the through hole, and the optical fiber head is installed at the front end of the optical fiber head and aligned with the through hole, and the optical fiber head extends into the optical fiber head.

2. The full-function high-power laser chip aging mechanism according to claim 1, characterized in that: The device also includes an electrode mounting plate for pressing the laser chip downward and supplying power to the laser chip.

3. The full-function high-power laser chip aging mechanism according to claim 1, characterized in that: The PD sensors are arranged on a circuit board with intervals on the left and right sides, and the circuit board is installed on the bottom of the spectrometer body.

4. The full-function high-power laser chip aging mechanism according to claim 1, characterized in that: The optical fiber heads are installed on a mounting plate at intervals on the left and right sides, and the mounting plate is installed on the front end of the beam splitter body.

5. The full-function high-power laser chip aging mechanism according to claim 1, characterized in that: It also includes a temperature sensor installed in the installation groove of the aging base, and the installation groove is recessed on the front end surface of the aging base and close to the groove.

6. The full-function high-power laser chip aging mechanism according to claim 1, characterized in that: The aging base is provided with a water flow channel running through the aging base on the left and right sides and a plurality of middle partition walls arranged in the water flow channel at intervals in front and back. The upper and lower ends of the middle partition walls are connected to the inner side walls of the water flow channel. The middle partition walls are provided with a plurality of through holes running through the middle partition walls in front and back.

7. The full-function high-power laser chip aging mechanism according to claim 6, characterized in that: The through holes are arranged in a matrix on the middle partition wall, and the through holes on two middle partition walls adjacent to each other are aligned front to back.

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