Battery device and electric device

Abstract

The utility model belongs to the technical field of batteries and electronic equipment, and provides a battery device and a power utilization device, the battery device comprises a battery monomer assembly, a circuit board, a bonding pad, a sampling wire harness and a signal acquisition part; the battery monomer assembly comprises a plurality of battery monomers, and the plurality of battery monomers are stacked along a preset direction; the circuit board is provided with groove structures, and the groove structures are distributed at the side parts of the bonding pads, so that weak parts and limiting parts are formed on the circuit board at the side parts of the bonding pads; the signal acquisition part is in communication connection with the battery monomer assembly so as to acquire electrical data of the battery monomer assembly; the bonding pad is connected to the circuit board, the weak part is distributed at the side part of the bonding pad along the preset direction, and the limiting part is distributed at the side part of the bonding pad along the direction vertical to the preset direction; one end of the sampling wire harness is connected with the bonding pad, and the other end of the sampling wire harness is connected with the signal acquisition component. The utility model aims to reduce the risk that the connection position of the sampling wire harness and the bonding pad is easy to break and reduce the phenomenon that the bonding pad and the plate body at the side part of the bonding pad are easy to warp.

Description

Technical Field

[0001] The present application relates to the technical field of batteries and electronic equipment, and in particular to a battery device and an electrical device. Background Art

[0002] To facilitate battery management, it is necessary to collect electrical data from the battery cell assemblies. For example, this data includes voltage, current, and temperature. Typically, a circuit board is connected to the battery cell assembly via a sampling harness and signal acquisition components to collect this electrical data.

[0003] However, after the battery device has been used for a period of time, a problem of a false connection or a broken circuit may occur between the circuit board and the battery cell assembly, resulting in interruption of signal acquisition. Utility Model Content

[0004] The purpose of the present application is to provide a battery device and an electrical device, aiming to solve the technical problem that the welding pad and the sampling harness in the battery device are prone to false connection or circuit breakage.

[0005] In a first aspect, the present application provides a battery device, comprising:

[0006] A battery cell assembly includes a plurality of battery cells, wherein the plurality of battery cells are stacked along a preset direction;

[0007] pads;

[0008] A circuit board having a slot structure, a solder pad connected to the circuit board, the slot structure being distributed on the side of the solder pad so that a weak portion and a limiting portion are formed on the circuit board on the side of the solder pad, the limiting portion being used to limit warping of the solder pad and the circuit board on the side of the solder pad; the weak portion is distributed on the side of the solder pad in a preset direction, and the limiting portion is distributed on the side of the solder pad in a direction perpendicular to the preset direction;

[0009] A signal acquisition component is communicatively connected to the battery cell assembly to collect electrical data of the battery cell assembly;

[0010] One end of the sampling harness is connected to the pad, and the other end of the sampling harness is connected to the signal acquisition component.

[0011] In this embodiment, a groove structure is formed on the circuit board. The groove structure itself can make the pad and the surrounding board have a certain deformation ability, and has the function of releasing and transmitting stress, so as to reduce the problem of stress concentration; and the groove structure forms a weak part and a limiting part on the circuit board. The weak part can increase the deformation of the pad and the surrounding board by breaking, thereby allowing the pad and the board part around the pad to have a certain displacement or activity relative to other parts of the board, so that the stress at the connection position between the sampling harness and the pad is relatively reduced, thereby absorbing the energy of the external force through deformation, playing a role of buffering stress, and reducing the risk of damage to the pad due to instantaneous strong external force; in addition, the limiting part can make the deformation amount within a controllable range and can reduce the problem of warping of the pad and the surrounding board.

[0012] In one embodiment, the weak portion includes a first sub-weak portion and a second sub-weak portion, and in a preset direction, the first sub-weak portion and the second sub-weak portion are distributed on both sides of the pad; one or more first sub-weak portions are provided; and / or one or more second sub-weak portions are provided.

[0013] In this embodiment, the provision of the first sub-weak portion and the second sub-weak portion can increase the fracture position of the plate body on the side or surrounding the pad, thereby facilitating the increase in deformation of the pad and the plate body on the side or surrounding the pad, and is more conducive to reducing the stress at the connection position between the sampling harness and the pad, thereby enhancing the effect of buffering stress.

[0014] In one embodiment, a plurality of limiting portions are provided.

[0015] In this embodiment, by disposing a plurality of limiting portions, the probability of warping of the pad and the side or surrounding board due to accidental breakage of some of the limiting portions is reduced.

[0016] In one embodiment, the groove structure forms a connecting portion on the circuit board on the side of the pad, and the connecting portion is connected between the main body of the circuit board and the circuit board on the side of the pad. In a direction perpendicular to the preset direction, the connecting portion and the limiting portion are respectively arranged on both sides of the pad.

[0017] In this embodiment, the connecting portion can limit the side of the pad or the surrounding plate, so as to maintain a good transition and connection between the side of the pad or the surrounding plate and the main body of the plate.

[0018] In one embodiment, the circuit board has a board edge, and a preset spacing distance is provided between the limiting portion and the board edge in a direction perpendicular to a preset direction.

[0019] In this embodiment, a preset spacing distance is formed between the limiting portion and the edge of the circuit board, so that the groove structure as a whole is away from the edge of the circuit board to be located in the solid part of the board body, thereby helping to reduce the strength damage of the groove structure to the edge position of the circuit board and helping to improve the overall structural stability of the circuit board.

[0020] In one embodiment, the groove structure includes a first groove section, a second groove section and a third groove section arranged in sequence, and the first groove section, the second groove section and the third groove section are arranged around the circumference of the pad, a limiting portion is formed between the first groove section and the second groove section, and a weak portion is formed between the second groove section and the third groove section.

[0021] In this embodiment, the first slot segment, the second slot segment, and the third slot segment are arranged in sequence to form a weak portion and a limiting portion on the circuit board. The first slot segment, the second slot segment, and the third slot segment surround the circumference of the pad, which is beneficial to dispersing the stress concentration problem at the pad position, and is beneficial to increasing the deformation of the pad and the plate body around the pad, thereby improving the effect of buffering stress.

[0022] In one embodiment, the first slot segment has a first distal end away from the second slot segment along the extension direction, the third slot segment has a second distal end away from the second slot segment along the extension direction, and a connecting portion is formed between the first distal end and the second distal end.

[0023] In this embodiment, the connecting portion is formed between the first distal end of the first groove segment and the second distal end of the third groove segment. The area of ​​the connecting portion can be adjusted by adjusting the spacing distance between the first distal end and the second distal end, so as to achieve the purpose of flexibly adjusting the structural strength and rigidity of the connecting portion.

[0024] In one embodiment, a first expansion slot is formed on the first distal end to expand the slot width of the first distal end; and / or

[0025] A second expansion slot is formed on the second distal end to expand the slot width of the second distal end.

[0026] In this embodiment, the arrangement of the first expansion groove and the second expansion groove enables the stress to be released more smoothly at the first distal end during the transmission process, thereby reducing stress concentration.

[0027] In one embodiment, the opening of the first expansion groove and / or the second expansion groove is circular or elliptical.

[0028] In this embodiment, the circular or elliptical first expansion groove and the second expansion groove can effectively reduce stress concentration at the groove edge and further optimize the stress dispersion effect of the groove structure.

[0029] In one embodiment, arc-shaped chamfers are respectively formed on the extending ends of the second slot segment and the third slot segment that are close to each other along the extending direction.

[0030] In this embodiment, the arc-shaped chamfer design forms a concave portion on the weak portion, which is more conducive to breaking the weak portion.

[0031] In one embodiment, the first slot segment includes a first sub-slot segment and a second sub-slot segment arranged at intervals, a weak portion is formed between the first sub-slot segment and the second sub-slot segment; and a limiting portion is formed between the second sub-slot segment and the second slot segment.

[0032] In this embodiment, the first groove section is divided into a first sub-groove section and a second sub-groove section arranged at intervals, so that the number of weak parts can be increased, so that the plate body around the pad can be broken at both sides of the preset direction of the pad, thereby increasing the deformation of the pad and the side or periphery of the pad, thereby improving the effect of buffering stress.

[0033] In one embodiment, arc-shaped chamfers are respectively formed on the mutually adjacent extending ends of the first sub-groove segment and the second sub-groove segment.

[0034] In this embodiment, the arc-shaped chamfer design forms a concave portion on the weak portion, which is more conducive to breaking the weak portion.

[0035] In one embodiment, the sampling wire has a bent portion.

[0036] In this embodiment, a bending portion is formed on the sampling harness, thereby increasing the length of the sampling harness and forming a redundant expansion and contraction amount. The redundant expansion and contraction amount enables the sampling harness to have a certain expansion and contraction amount or deformation amount when subjected to a smaller pulling force, so that the sampling harness is not easily broken when subjected to a smaller pulling force, thereby reducing the risk probability of the sampling harness breaking.

[0037] In one embodiment, the battery device further includes a busbar component, the busbar component is electrically connected to the battery cell assembly, and the signal acquisition component is connected to the busbar component.

[0038] In this embodiment, the converging component can collect the current output by multiple battery cell assemblies, manage and distribute them in a unified manner, and ensure that the electrical energy can be stably and efficiently transmitted to the circuit board and other electrical components.

[0039] In a second aspect, the present application provides an electrical device, comprising a battery device as described above, wherein the battery device is used to store or provide electrical energy.

[0040] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments of the present application or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0042] Figure 1 A schematic structural diagram of a vehicle provided in some embodiments of the present application;

[0043] Figure 2 A schematic diagram of the exploded structure of a battery device provided in some embodiments of the present application;

[0044] Figure 3 A schematic diagram of the structure of a circuit board provided in some embodiments of the present application;

[0045] Figure 4 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 1 ;

[0046] Figure 5 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 2 ;

[0047] Figure 6 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 3 ;

[0048] Figure 7 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 4 ;

[0049] Figure 8 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 5 ;

[0050] Figure 9 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 6 ;

[0051] Figure 10 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 7 ;

[0052] Figure 11 Schematic diagram of the arrangement relationship between the slot structure and the pad on the circuit board provided in some embodiments of the present application Figure 8 ;

[0053] Figure 12 Schematic diagram of the local structure of the connection between the circuit board, conductive wire and signal acquisition components provided in some embodiments of the present application Figure 1 ;

[0054] Figure 13 Schematic diagram of the local structure of the connection between the circuit board, conductive wire and signal acquisition components provided in some embodiments of the present application Figure 2 ;

[0055] Figure 14 A schematic diagram of the structure of the connection between the circuit board, conductive wires, busbar components and signal acquisition components provided in some embodiments of the present application.

[0056] Description of reference numerals:

[0057] 1000, vehicle; 1100, battery device; 1110, housing assembly; 1111, housing cover; 1112, housing frame; 1113, accommodating cavity; 1120, battery cell assembly; 1130, circuit board; 1131, board edge; 1140, solder pad; 1150, slot structure; 1151, weak portion; 11511, first sub-weak portion; 11512, second sub-weak portion; 1152, limiting portion; 1153, connecting portion; 1154, first slot section; 11541, first distal end; 11542, first sub-slot section; 11543, second sub-slot section; 11544, third sub-slot section; 11545, First part; 11546, second part; 11547, third part; 1155, second slot section; 11551, fourth part; 11552, fifth part; 1156, third slot section; 11561, second distal end; 11562, sixth part; 11563, seventh part; 1157, first expansion slot; 1158, second expansion slot; 1159, arc chamfer; 1160, sampling harness; 1161, bending portion; 1170, signal acquisition component; 1180, confluence component; 1200, controller; 1300, motor; X, preset direction; Y, perpendicular to the preset direction; D, preset spacing distance. DETAILED DESCRIPTION

[0058] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0059] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0060] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0061] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0062] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0063] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0064] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0065] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0066] In the field of batteries and electronic equipment, circuit boards, as key components for achieving electrical connections, are widely used in various electronic products.

[0067] To facilitate battery management, it's necessary to collect electrical data from the battery cell assemblies. For example, this data includes voltage, current, and temperature. This data is typically collected by connecting a circuit board (such as a flexible circuit board) to the battery cell assembly via a sampling harness and signal acquisition components. However, after a battery device has been used for a period of time, a loose connection or open circuit between the circuit board and the battery cell assembly may occur, resulting in interrupted signal acquisition.

[0068] Research has revealed that within battery devices, the battery cell assemblies are soldered to pads on the circuit board via sampling harnesses. Chemical reactions occur during the charge and discharge process, causing the cell assemblies to change in volume, leading to relative stress and stress concentration at the connection between the pads and the sampling harness. As the battery ages, the cell assemblies experience significant expansion. When this expansion reaches a certain level, the connection between the pads and the sampling harness can tear or detach, resulting in the circuit board being unable to capture electrical data such as the battery cell voltage, current, and temperature.

[0069] For example, in some application scenarios, for battery devices, the circuit board needs to work in conjunction with multiple components such as signal acquisition components (such as sensors, etc.), sampling harnesses, and battery cell assemblies. The signal acquisition components can collect signals from the battery cell assemblies (such as current, voltage, temperature, etc.). The signal acquisition components need to be connected to the circuit board through the sampling harness to realize functions such as energy storage, transmission, and device status monitoring. However, due to the structural design limitations of the welding positions (i.e., pad positions) on traditional circuit boards that are connected to the sampling harness, the welding positions are prone to stress concentration and tearing and falling off from the sampling harness, resulting in poor connection reliability and unstable signal transmission. These problems affect the overall performance and reliability of the battery device and make it difficult to meet the needs of modern electronic devices for efficient and stable energy supply. Therefore, there is an urgent need to develop a new circuit board structure that can effectively disperse stress, improve structural strength, enhance the reliability of connections with other components, and improve the overall performance of the device.

[0070] Therefore, the present application provides a circuit board, which arranges a groove structure on the side of the soldering pad of the circuit board. The groove structure has the function of dispersing stress, and the groove structure forms a weak part and a limiting part on the board body on the side of the soldering pad. The position of the weak part can be broken when the soldering pad is subjected to external force, so that the soldering pad and the board body part around the soldering pad can be deformed, thereby allowing the soldering pad and the side or surrounding board body part to have a certain amount of displacement or activity relative to other parts of the board body, so that the stress at the connection position between the sampling wire harness and the soldering pad is relatively reduced, thereby absorbing the energy of the external force through deformation, playing a role of buffering stress, and reducing the risk of damage to the soldering pad due to instantaneous strong external force; the limiting part can make the deformation amount within a controllable range and can reduce the problem of warping of the soldering pad and the board body around it.

[0071] The circuit board 1130 is an indispensable key component in the electronic device and the battery device 1100, and plays a core role in the operation of the electronic system and the battery system.

[0072] For example, a printed circuit board (PCB) is a plate-like assembly made of an insulating material substrate, with conductive traces printed on its surface through a specific process, and then assembled with electronic components to achieve circuit connections. The circuit board 1130 can be considered the "nervous system" of the electronic device and battery device 1100, providing mechanical support for the various electronic components, allowing them to be neatly secured to the board. Furthermore, printed conductive traces (such as copper foil traces) enable electrical connections between components, transmitting electrical signals and power, and ensuring the proper operation of the electronic device.

[0073] Structurally, for example, circuit board 1130 typically consists of a substrate, a conductive layer, an insulating layer, and a protective layer. The substrate is typically made of materials such as fiberglass epoxy resin, which provides excellent mechanical strength and insulation properties. The conductive layer is typically copper foil, which is etched to form the desired circuit pattern. The insulating layer prevents short circuits between circuits. The protective layer protects the circuits from oxidation, corrosion, and external physical damage.

[0074] From the functional principle point of view, the circuit board 1130 can modularly design and layout complex electronic circuits, connect numerous electronic components (such as chips, resistors, capacitors, etc.) according to specific logical relationships, and realize functions such as signal processing, data calculation, and power transmission.

[0075] The application of circuit board 1130 is extremely wide, covering consumer electronics (such as mobile phones, televisions), communication equipment, aerospace, automotive electronics, medical equipment and other fields.

[0076] In this application, the circuit board 1130 is applied to the battery device 1100, referring to Figure 2 As shown, an embodiment of the present application provides a battery device 1100. The battery device 1100 disclosed in the embodiment of the present application can be used in an electrical device that uses the battery device 1100 as a power source or various energy storage devices and energy storage systems that use the battery device 1100 as an energy storage element. The electrical device can be, but is not limited to, a mobile phone, a portable device, a laptop computer, an electric toy, an electric tool, an electric car, a vehicle 1000, a ship, a spacecraft, and the like. Among them, the electric toy can include a fixed or mobile electric toy, such as a game console, an electric car toy, an electric ship toy, and an electric airplane toy, and the like, and the spacecraft can include an airplane, a rocket, a space shuttle, and a spacecraft, and the like.

[0077] For the convenience of description, the following embodiments take a vehicle 1000 as an example of an electrical device according to an embodiment of the present application.

[0078] Please refer to Figure 1 , Figure 1A schematic structural diagram of a vehicle 1000 provided for some embodiments of the present application. The vehicle 1000 may be a fuel vehicle, a gas vehicle or a new energy vehicle. The new energy vehicle may be a pure electric vehicle, a hybrid vehicle or an extended-range vehicle, etc. A battery device 1100 is provided inside the vehicle 1000. The battery device 1100 may be provided at the bottom, head or tail of the vehicle 1000. The battery device 1100 may be used to power the vehicle 1000. For example, the battery device 1100 may serve as an operating power source for the vehicle 1000. The vehicle 1000 may further include a controller 1200 and a motor 1300. The controller 1200 is used to control the battery device 1100 to power the motor 1300, for example, to meet the power requirements for starting, navigating and driving the vehicle 1000.

[0079] In some embodiments of the present application, the battery device 1100 can not only serve as the operating power source of the vehicle 1000, but also serve as the driving power source of the vehicle 1000, replacing or partially replacing fuel or natural gas to provide driving power for the vehicle 1000.

[0080] According to some embodiments of the present application, referring to Figure 2 As shown, an embodiment of the present application provides a battery device 1100, which includes a battery cell assembly 1120, a circuit board 1130, a solder pad 1140, a sampling harness 1160, and a signal acquisition component 1170; wherein the battery cell assembly 1120 includes a plurality of battery cells, and the plurality of battery cells are stacked along a preset direction X; the circuit board 1130 has a groove structure 1150, and the solder pad 1140 is connected to the circuit board 1130, and the groove structure 1150 is distributed on the side of the solder pad 1140, so that a weak portion 1150 is formed on the circuit board 1130 on the side of the solder pad 1140. 1 and a limiting portion 1152, the limiting portion 1152 is used to limit the warping of the pad 1140 and the circuit board 1130 on the side of the pad 1140; in the preset direction X, the weak portion 1151 is distributed on the side of the pad 1140, and in the direction perpendicular to the preset direction Y, the limiting portion 1152 is distributed on the side of the pad 1140; the signal acquisition component 1170 is communicatively connected to the battery cell assembly 1120 to collect electrical data of the battery cell assembly 1120; one end of the sampling harness 1160 is connected to the pad 1140, and the other end of the sampling harness 1160 is connected to the signal acquisition component 1170.

[0081] The battery cell assembly 1120 is typically formed by arranging multiple battery cells, which are stacked and arranged in a predetermined direction X. Alternatively, the battery cell assembly 1120 may also include multiple battery modules, each of which is formed by stacking and arranging multiple battery cells in a predetermined direction X and fixing them together to form an independent module. The multiple battery modules are arranged in sequence perpendicular to the predetermined direction Y. For example, a battery module may be formed by bundling multiple battery cells using cable ties.

[0082] The predetermined direction X should be understood as the direction perpendicular to the major surface of the battery cell. The major surface of the battery cell should be understood as the surface with the largest surface area. For example, if the battery cell is in the shape of a cube, the major surface of the battery cell should be understood as the surface with the largest surface area among the four sides of the battery cell. The battery cell primarily expands in a direction perpendicular to the major surface. Therefore, the predetermined direction can also be understood as the direction of the expansion force.

[0083] A battery cell is the smallest unit that makes up the battery device 1100. Each battery cell can be a secondary battery cell or a primary battery cell; it can also be a lithium-sulfur battery cell, a sodium-ion battery cell, or a magnesium-ion battery cell, but is not limited to these. A battery cell can be cylindrical, flat, rectangular, or have other shapes.

[0084] During the use of the battery cell assembly 1120, as the use time increases, the battery cells therein will produce a large expansion displacement due to the action of the expansion force, thereby causing the sampling harness 1160 connected to the circuit board 1130 to be pulled and moved, and then causing the connection position between the soldering pad 1140 and the sampling harness 1160 to be affected by an external force; since the external force applied to the connection position between the soldering pad 1140 and the sampling harness 1160 is caused by the expansion of the battery cell assembly 1120, based on the fact that the expansion displacement (or expansion force) of the battery cell has a certain directionality, it can be seen that the external force applied to the connection position between the soldering pad 1140 and the sampling harness 1160 has the same directionality, therefore, the direction of the external force applied to the connection position between the soldering pad 1140 and the sampling harness 1160 is defined as the direction of the expansion force, and this expansion force direction is the preset direction X.

[0085] Combine Figure 3 As shown, the circuit board 1130 is the basic supporting component of the solder pad 1140. The circuit board 1130 is a plate body in a plate shape. The circuit board 1130 has two opposite surfaces. Generally, a conductive circuit is printed on one side of the board through a specific process, and electronic components are assembled to achieve circuit connection, provide mechanical support for various electronic components, and enable the components to be fixed on the circuit board 1130 in an orderly manner.

[0086] Because the circuit board 1130 needs to be connected to various electronic components, a connection area is required on one side of the circuit board 1130. The connection area can be connected to a soldering pad 1140, which is then soldered to one end of the sampling harness 1160 to achieve electrical connection. The above-mentioned connection area should be considered as an area for achieving electrical connection. Since the connection area needs to be electrically connected to one end of the sampling harness 1160, one end of the sampling harness 1160 can be electrically connected to the connection area by welding, thereby enabling the circuit board 1130 to achieve signal transmission and electrical energy conduction. Typically, the soldering pad 1140 is connected or arranged on the connection area, so that the sampling harness 1160 can be electrically connected to the circuit board 1130 by welding to the soldering pad 1140.

[0087] The other end of sampling harness 1160 is electrically connected to signal acquisition component 1170. Sampling harness 1160 acts as a bridge for signal and power transmission within battery device 1100. The other end of sampling harness 1160 and signal acquisition component 1170 can be stably connected via welding. Within battery device 1100, sampling harness 1160, circuit board 1130, and signal acquisition component 1170 work together to form a complete signal and power transmission system.

[0088] The signal acquisition component 1170 is communicatively connected to the battery cell assembly 1120. For example, the signal acquisition component 1170 is directly connected to the battery cell assembly 1120, or the signal acquisition component 1170 can be indirectly connected to the battery cell assembly 1120 via the busbar assembly 1180. The signal acquisition component 1170 can be used to collect signals such as voltage, current, and temperature. For example, the signal acquisition component 1170 can use an NTC (Negative Temperature Coefficient) temperature sensor, such as a water dropper temperature sensor.

[0089] Reference Figure 4-7 As shown, a groove structure 1150 is provided on the circuit board 1130. The groove structure 1150 should be understood as a groove opened on the above-mentioned side board surface, and the groove opening is located on the side board surface. The groove structure 1150 can adopt a through groove that passes through the two board surfaces of the circuit board 1130. Of course, the groove structure 1150 can also adopt a blind groove opened on the side board surface. Both the through groove and the blind groove can disperse and release stress on the side or outer periphery of the pad 1140.

[0090] Regarding the arrangement of the slot structure 1150, for example, the slot structure 1150 is extended in sequence along the trajectory surrounding the solder pad 1140. It should be understood that the slot opening of the slot structure 1150 has a certain extension trajectory (or extension length) on the board surface of the circuit board 1130; the slot structure 1150 will form multiple slot segments on the extension trajectory, and a discontinuous part will be formed between two adjacent slot segments. On the circuit board 1130, the discontinuous part can be understood as the entity part connecting the two slot segments. Since the area of ​​the entity part is small, it is easy to break when subjected to external force. Therefore, the entity part that is easy to break is defined as the weak part 1151.

[0091] It should be emphasized that one purpose of designing weak portion 1151 in circuit board 1130 is to enable the sides of or surrounding pad 1140 to deform when subjected to external forces. Weak portion 1151 should be understood as a weak, solid portion of circuit board 1130 that is susceptible to breaking under force. When pad 1140 is pulled by sampling harness 1160, weak portion 1151 breaks, allowing pad 1140 and the surrounding board portion to deform. This allows pad 1140 and the surrounding board portion to move relative to the rest of the board (i.e., circuit board 1130), reducing stress at the connection between sampling harness 1160 and pad 1140. This deformation absorbs external force energy, acting as a stress buffer and reducing the risk of damage to pad 1140 caused by sudden, intense external forces.

[0092] In the preset direction X, the weak portion 1151 is distributed on the side of the pad 1140. It should be understood that, as is known, the side of the pad 1140 should be understood as one or more sides of the pad 1140 in the circumferential direction. The direction of the external force applied to the connection point between the pad 1140 and the sampling harness 1160 is the preset direction X. Therefore, it can be known that the side of the pad 1140 should be one or both sides of the pad 1140 in the preset direction X. For example, if the pad 1140 has four sides in the circumferential direction, and the four sides are opposite to each other, then two opposite sides are distributed in the preset direction X, and the other two sides are distributed perpendicular to the preset direction Y. Then, the weak portion 1151 can be distributed on one or two sides along the preset direction X.

[0093] In practical applications, the length (or spacing distance) of the weak portion 1151 between the two adjacent extension ends of the adjacent slot segments should not be too long. The weak portion 1151 is a weak structure relative to other solid parts of the circuit board 1130 (or board body). The weak portion 1151 can be formed when the spacing distance between the two extension ends is greater than 0 mm. The spacing distance between the two adjacent extension ends of the weak portion 1151 between the adjacent slot segments should not be greater than twice the width of the slot structure 1150. For example, referring to Figure 4As shown, the slot structure 1150 has a slot width L1 at adjacent extended ends. The slot width should be understood as the slot's width perpendicular to the extension direction (or length). Therefore, the length L2 of the weak portion 1151 should generally not exceed 2L1. For example, if the slot structure 1150 has a width L1 of 2 mm, there will be a certain spacing between the extended end walls of two adjacent slot segments (i.e., the length L2 of the weak portion 1151). This spacing should generally not exceed 4 mm. Of course, this spacing can be simulated and set based on the thickness of the circuit board 1130 using a simulator to ensure that the weak portion 1151 is easily broken when subjected to external forces.

[0094] After the weak portion 1151 breaks, the pad 1140 and the plate on the side or periphery of the pad 1140 will be deformed and displaced. When the deformation or displacement is too large, the pad 1140 and the plate on the side or periphery of the pad 1140 will warp on the extension path of the groove structure 1150. The warping can easily cause the pad 1140 and the plate on the side or periphery of the pad 1140 to contact other components (such as the busbar component 1180, etc.), thereby causing the risk of short circuit.

[0095] Therefore, one of the design purposes of the limiting portion 1152 is to maintain the structural strength of the plate body on the side or periphery of the pad 1140, so that after the weak portion 1151 breaks, the pad 1140 and the plate body on the side or periphery (or surrounding) of the pad 1140 are not prone to warping, and it plays a limiting role on the pad 1140 and the plate body on the side or periphery of the pad 1140, so that the deformation or displacement of the pad 1140 and the plate body on the side or periphery of the pad 1140 is within a controllable range.

[0096] The limiting portion 1152 should be arranged at intervals from the weak portion 1151, and the limiting portion 1152 is distributed on the side of the pad 1140 perpendicular to the preset direction Y. For example, the pad 1140 has four sides in the circumference, and the four sides are opposite to each other. Two of the opposite sides are defined as first sides, and the other two opposite sides are defined as second sides. The two first sides are distributed in the preset direction X, and the two second sides are distributed perpendicular to the preset direction Y. Then, in this example, the weak portion 1151 is distributed on one of the first sides, or the weak portion 1151 is distributed on both first sides; the limiting portion 1152 is distributed on one of the second sides, or the limiting portion 1152 is distributed on both second sides.

[0097] In this embodiment, a groove structure 1150 is formed on the circuit board 1130. The groove structure 1150 itself can enable the pad 1140 and the surrounding board to have a certain degree of deformation ability, and has the function of releasing and transmitting stress, thereby reducing the problem of stress concentration. The groove structure 1150 also forms a weak portion 1151 and a stop portion 1152 on the circuit board 1130. The weak portion 1151 can increase the deformation of the pad 1140 and the surrounding board by breaking, thereby allowing the pad 1140 and the surrounding board portion to have a certain amount of displacement or movement relative to other parts of the board, thereby reducing the stress at the connection point between the sampling harness 1160 and the pad 1140. The deformation absorbs the energy of the external force, acts as a stress buffer, and reduces the risk of damage to the pad 1140 due to instantaneous strong external force. In addition, the stop portion 1152 can keep the deformation within a controllable range and reduce the problem of warping of the pad 1140 and the surrounding board.

[0098] In some embodiments, reference Figure 7 As shown, the weak portion 1151 includes a first sub-weak portion 11511 and a second sub-weak portion 11512 . In the preset direction X, the first sub-weak portion 11511 and the second sub-weak portion 11512 are distributed on both sides of the pad 1140 .

[0099] It is known that the more weak portions 1151 are provided, the greater the deformation of the pad 1140 and the side or surrounding plate of the pad 1140, and thus the more significant the stress concentration problem at the connection position between the buffer pad 1140 and the sampling harness 1160. Therefore, multiple weak portions 1151 can be provided.

[0100] In addition, considering that the stress on the connection position between the pad 1140 and the sampling harness 1160 is along the preset direction X, weak portions 1151 are arranged on both sides of the pad 1140 in the preset direction X, which makes it easier for the weak portions 1151 to break, thereby causing the pad 1140 and the side or surrounding plate of the pad 1140 to have a larger deformation. Of course, the limiting portion 1152 can keep the above-mentioned deformation within a controllable range to reduce the occurrence of warping problems.

[0101] Therefore, multiple weak portions 1151 are provided, with a portion of weak portions 1151 being defined as first sub-weak portions 11511, and another portion of weak portions 1151 being defined as second sub-weak portions 11512. In a predetermined direction X, the first sub-weak portions 11511 and the second sub-weak portions 11512 are respectively arranged on either side of the pad 1140. When a relatively small force is applied to the connection between the pad 1140 and the sampling harness 1160, either the first sub-weak portion 11511 or the second sub-weak portion 11512 may break. When a relatively large force is applied to the connection between the pad 1140 and the sampling harness 1160, both the first sub-weak portion 11511 and the second sub-weak portion 11512 may break.

[0102] In this embodiment, the provision of the first sub-weak portion 11511 and the second sub-weak portion 11512 can increase the fracture position of the plate body on the side or around the pad 1140, thereby facilitating the increase in deformation of the pad 1140 and the plate body on the side or around the pad 1140, and is more conducive to reducing the stress at the connection position between the sampling harness 1160 and the pad 1140, thereby enhancing the effect of buffering stress.

[0103] In some embodiments, reference Figure 8-10 As shown, there are one or more first sub-weak portions 11511 .

[0104] Specifically, it is known that at least one first sub-weak portion 11511 should be provided, and when a force is applied to the connection position between the solder pad 1140 and the sampling harness 1160 , the first sub-weak portion 11511 will break.

[0105] However, in some cases, because the area of ​​the first sub-weak portion 11511 is too small, or the battery device 1100 has been used for too long, the first sub-weak portion 11511 may accidentally break when no force is applied to the connection position between the pad 1140 and the sampling harness 1160, thereby affecting the structural strength of the pad 1140 and the side or surrounding plate of the pad 1140.

[0106] In some embodiments, reference Figure 8-10 As shown, there are one or more second sub-weak portions 11512 .

[0107] Likewise, it is known that at least one second sub-weak portion 11512 should be provided, and when a force is applied to the connection position between the solder pad 1140 and the sampling harness 1160 , the second sub-weak portion 11512 will break.

[0108] However, in some cases, because the area of ​​the second sub-weak portion 11512 is too small, or the battery device 1100 has been used for too long, the second sub-weak portion 11512 may accidentally break when no force is applied to the connection position between the pad 1140 and the sampling harness 1160, thereby affecting the structural strength of the pad 1140 and the side or surrounding plate of the pad 1140.

[0109] In this embodiment, by arranging multiple first sub-weak portions 11511 or multiple second sub-weak portions 11512, the risk of sudden movement of the pad 1140 and the side or surrounding board of the pad 1140 caused by accidental breakage of one of the first sub-weak portions 11511 or one of the second sub-weak portions 11512 is reduced.

[0110] In some embodiments, reference Figure 11 As shown, there are multiple limiting portions 1152.

[0111] Specifically, there should be at least one limiting portion 1152, which is used to limit the pad 1140 and the side or surrounding plate of the pad 1140 from warping after the weak portion 1151 breaks. However, the limiting portion 1152 also has a certain strength. When the connection position between the pad 1140 and the sampling harness 1160 is subjected to a large force, the limiting portion 1152 also has the risk of breaking. When only one limiting portion 1152 is provided, the limiting portion 1152 will cause the pad 1140 and the side or surrounding plate of the pad 1140 to warp after it breaks.

[0112] Therefore, in order to enhance the limiting effect of the limiting portion 1152 on the pad 1140 and the side or surrounding board of the pad 1140, and reduce the risk of warping of the pad 1140 and the side or surrounding board of the pad 1140, a plurality of limiting portions 1152 can be provided, and the plurality of limiting portions 1152 are arranged at intervals. When one of the limiting portions 1152 breaks, the other limiting portions 1152 may not be pulled apart and can continue to play a limiting role.

[0113] In this embodiment, by disposing a plurality of limiting portions 1152 , the probability of some of the limiting portions 1152 accidentally breaking and causing the pad 1140 and the side or surrounding board to warp is reduced.

[0114] In some embodiments, reference Figure 4-11As shown, the groove structure 1150 forms a connecting portion 1153 on the circuit board 1130 (or board body) on the side of the solder pad 1140. The connecting portion 1153 is connected between the main body of the circuit board 1130 and the circuit board 1130 on the side of the solder pad 1140. In a direction perpendicular to the preset direction Y, the connecting portion 1153 and the limiting portion 1152 are respectively arranged on both sides of the solder pad 1140.

[0115] Specifically, the connecting portion 1153 should be understood as the part that connects the board body on the side or around the solder pad 1140 and the main body of the circuit board 1130. When the board body on the side or around the solder pad 1140 is deformed or displaced, the connecting portion 1153 connects and limits the board body on the side or around the solder pad 1140.

[0116] It should be noted that when the board body on or around the pad 1140 deforms or shifts, the connecting portion 1153 will also deform to some extent. In some examples, the connecting portion 1153 can serve as a transitional connection between the board body on or around the pad 1140 and the main body (or main body portion) of the board body, significantly limiting the board body on or around the pad 1140. Regardless of whether the weak portion 1151 is broken or not, the connecting portion 1153 always serves as a connection and limiting function. The limiting portion 1152, in turn, limits warping of the board body on or around the pad 1140 after the weak portion 1151 breaks.

[0117] Since the connecting portion 1153 and the limiting portion 1152 both have a limiting function, in order to improve the limiting stability of the side or surrounding board of the pad 1140, the connecting portion 1153 and the limiting portion 1152 are respectively distributed on the opposite sides of the pad 1140. Since the limiting portion 1152 is located on the side of the pad 1140 perpendicular to the preset direction Y, it can be seen that the connecting portion 1153 is located on the other side of the pad 1140 perpendicular to the preset direction Y.

[0118] In this embodiment, the connecting portion 1153 can limit the side of the pad 1140 or the surrounding plate, so as to maintain a good transition and connection between the side of the pad 1140 or the surrounding plate and the main body of the plate.

[0119] In some embodiments, reference Figure 3 As shown, the circuit board 1130 has a board edge 1131 , and in a direction perpendicular to a preset direction Y, a preset spacing distance D is present between the limiting portion 1152 and the board edge 1131 .

[0120] Specifically, the circuit board 1130 has a board edge 1131, which should be understood as the board edge 1131 on the side of the circuit board 1130 that is close to the solder pad 1140. For example, the circuit board 1130 has two board edges 1131 in the width direction, and the width direction can be considered to be perpendicular to the preset direction Y. The solder pad 1140 is located in an area close to one of the board edges 1131. Multiple solder pads 1140 can be provided, and the multiple solder pads 1140 are arranged at intervals along the length direction of the circuit board 1130.

[0121] The limiting portion 1152 is positioned adjacent to the aforementioned board edge 1131, and a predetermined distance D is provided between the limiting portion 1152 and the board edge 1131. The predetermined distance D can range from 0.5 mm to 5 mm. For example, if the groove structures 1150 on both sides of the limiting portion 1152 extend parallel to the board edge 1131 of the circuit board 1130, the predetermined distance D can be considered to be the distance between the groove structures 1150 on both sides of the limiting portion 1152 and the board edge 1131 of the circuit board 1130. Therefore, it can be seen that the groove structures 1150 are entirely located on the board body of the circuit board 1130 and have a predetermined distance D between the board edge 1131 of the circuit board 1130.

[0122] In this embodiment, by forming a preset spacing distance D between the limiting portion 1152 and the board edge 1131 of the circuit board 1130, the groove structure 1150 as a whole is moved away from the board edge 1131 of the circuit board 1130 to be located in the solid part of the board body, thereby helping to reduce the strength damage of the groove structure 1150 to the board edge 1131 of the circuit board 1130, and helping to improve the overall structural stability of the circuit board 1130.

[0123] In some embodiments, reference Figure 4-6 As shown, the groove structure 1150 includes a first groove section 1154, a second groove section 1155 and a third groove section 1156 arranged in sequence. The first groove section 1154, the second groove section 1155 and the third groove section 1156 are arranged around the circumference of the pad 1140. A limiting portion 1152 is formed between the first groove section 1154 and the second groove section 1155, and a weak portion 1151 is formed between the second groove section 1155 and the third groove section 1156.

[0124] The layout trajectory of the groove structure 1150 can be understood as being in a ring shape around the pad 1140 in the circumferential direction of the pad 1140 , so that the groove structure 1150 can release stress in the circumferential direction of the pad 1140 .

[0125] Specifically, since the groove structure 1150 is formed on the circuit board 1130 and a weak portion 1151 and a limiting portion 1152 are formed on the circuit board 1130, it can be seen that the groove structure 1150 should include at least three sections, specifically the first groove section 1154, the second groove section 1155 and the third groove section 1156 arranged in sequence. The first groove section 1154, the second groove section 1155 and the third groove section 1156 are arranged in sequence according to the layout trajectory (or extension trajectory) of the groove structure 1150.

[0126] The second slot section 1155 is located between the first slot section 1154 and the third slot section 1156. One extending end of the second slot section 1155 is opposite to and spaced apart from an extending end of the first slot section 1154. The spaced apart portion forms a limiting portion 1152. The other extending end of the second slot section 1155 is opposite to and spaced apart from an extending end of the third slot section 1156. The spaced apart portion forms a weak portion 1151.

[0127] The first slot section 1154, the second slot section 1155 and the third slot section 1156 may be in a straight line or a curved line. Figure 5 As shown, the first slot section 1154 includes a first part 11545, a second part 11546 and a third part 11547 connected in sequence, wherein the first part 11545 and the third part 11547 are both extended along a preset direction X (i.e., the edge extension direction of the circuit board 1130), and the second part 11546 is extended perpendicular to the preset direction Y. A rounded transition can be formed at the position where the first part 11545 and the second part 11546 are connected, and a rounded transition can be formed at the position where the second part 11546 and the third part 11547 are connected.

[0128] For example, refer to Figure 5 As shown, the second slot section 1155 may include a fourth part 11551 and a fifth part 11552 connected in sequence, wherein the fourth part 11551 is extended along the preset direction X, a limiting portion 1152 is formed between the fourth part 11551 and the third part 11547, and the fifth part 11552 is extended perpendicular to the preset direction Y, and a rounded transition may be formed at the position where the fourth part 11551 and the fifth part 11552 are connected.

[0129] For example, refer to Figure 5As shown, the third slot section 1156 includes a sixth portion 11562 and a seventh portion 11563 connected in sequence. The sixth portion 11562 extends perpendicular to the preset direction Y, and a weak portion 1151 is formed between the sixth portion 11562 and the fifth portion 11552. The seventh portion 11563 extends along the preset direction X. The seventh portion 11563 and the first portion 11545 are spaced apart and arranged parallel to each other. The spaced portion between the seventh portion 11563 and the first portion 11545 forms the connecting portion 1153.

[0130] In this embodiment, the first slot section 1154, the second slot section 1155 and the third slot section 1156 are arranged in sequence at intervals so that a weak portion 1151 and a limiting portion 1152 are formed on the circuit board 1130. The first slot section 1154, the second slot section 1155 and the third slot section 1156 surround the circumference of the solder pad 1140, which is beneficial to dispersing the stress concentration problem at the position of the solder pad 1140, and is beneficial to increasing the deformation of the solder pad 1140 and the circumferential plate body of the solder pad 1140, thereby improving the effect of buffering stress.

[0131] In some embodiments, reference Figure 4 and Figure 7 As shown, the first slot segment 1154 has a first distal end 11541 away from the second slot segment 1155 along the extension direction, and the third slot segment 1156 has a second distal end 11561 away from the second slot segment 1155 along the extension direction, and a connecting portion 1153 is formed between the first distal end 11541 and the second distal end 11561.

[0132] Specifically, since the second slot segment 1155 is located between the first slot segment 1154 and the third slot segment 1156, the first slot segment 1154 has an end away from the second slot segment 1155 along the extension direction. This end of the first slot segment 1154 is the first distal end 11541. The first distal end 11541 should be understood as a part of the first slot segment 1154, that is, the first distal end 11541 is the slot segment part of the first slot segment 1154 away from the second slot segment 1155. For example, the first distal end 11541 can be understood as the above-mentioned first part 11545.

[0133] Similarly, the third slot segment 1156 has an end away from the second slot segment 1155 along the extension direction. The end of the third slot segment 1156 is the second distal end 11561. The second distal end 11561 should be understood as a part of the third slot segment 1156, that is, the second distal end 11561 is the slot segment part of the third slot segment 1156 away from the second slot segment 1155. For example, the second distal end 11561 can be understood as the above-mentioned seventh part 11563.

[0134] It is known that a connecting portion 1153 can be formed between the first part 11545 and the seventh part 11563. Therefore, it can be known that a connecting portion 1153 will be formed between the first distal end 11541 and the second distal end 11561. The greater the spacing distance between the first distal end 11541 and the second distal end 11561, the larger the area of ​​the connecting portion 1153.

[0135] In this embodiment, the connecting portion 1153 is formed between the first distal end 11541 of the first slot segment 1154 and the second distal end 11561 of the third slot segment 1156. The area of ​​the connecting portion 1153 can be adjusted by adjusting the spacing distance between the first distal end 11541 and the second distal end 11561, so as to achieve the purpose of flexibly adjusting the structural strength and rigidity of the connecting portion 1153.

[0136] In some embodiments, reference Figure 4-11 As shown, a first expansion slot 1157 is formed on the first distal end 11541 to expand the slot width of the first distal end 11541 .

[0137] Specifically, the slot width of the first distal end 11541 refers to the distance between two opposing sides of the slot, perpendicular to the slot extension length of the first slot segment 1154. A first expansion slot 1157 is formed on the surface of the circuit board 1130 and located at the extended edge (or tail) of the first distal end 11541. The provision of the first expansion slot 1157 increases the slot width of the first slot segment 1154 at the tail of the first distal end 11541, thereby changing the geometry and mechanical properties of the first slot segment 1154 at the extended end.

[0138] The setting of the first expansion groove 1157 expands the slot width of the first distal end 11541, increases the stress release space of the first distal end 11541, and enables the stress to be more effectively dispersed through the first expansion groove 1157, so as to effectively reduce the stress concentration of the first slot section 1154 at the extended end, improve the fatigue resistance and structural strength of the circuit board 1130, extend the service life of the circuit board 1130, and enhance the stability of the pad 1140 and the side or periphery of the pad 1140 under complex stress environments.

[0139] In this embodiment, the presence of the first expansion groove 1157 allows the stress to be released more smoothly at the first distal end 11541 during the stress transmission process, thereby reducing stress concentration.

[0140] In some embodiments, reference Figure 4-11 As shown, a second expansion slot 1158 is formed on the second distal end 11561 to expand the slot width of the second distal end 11561.

[0141] Specifically, the slot width of the second distal end 11561 refers to the distance between two opposing sides of the slot, perpendicular to the extended length of the third slot segment 1156. A second expansion slot 1158 is formed on the surface of the circuit board 1130 at the extended edge (or tail) of the second distal end 11561. The provision of the second expansion slot 1158 increases the slot width of the third slot segment 1156 at the tail of the second distal end 11561, thereby changing the geometry and mechanical properties of the extended end of the third slot segment 1156.

[0142] The provision of the second expansion slot 1158 expands the slot width of the second distal end 11561, increases the stress release space of the second distal end 11561, and enables the stress to be more effectively dispersed through the second expansion slot 1158, thereby effectively reducing the stress concentration of the third slot section 1156 at the extended end, improving the fatigue resistance and structural strength of the circuit board 1130, extending the service life of the circuit board 1130, and improving the stability of the pad 1140 and the side or periphery of the pad 1140 under complex stress environments.

[0143] In this embodiment, the presence of the second expansion groove 1158 allows the stress to be released more smoothly at the second distal end 11561 during the transmission process, thereby reducing stress concentration.

[0144] In some embodiments, reference Figure 4-11 As shown, the openings of the first expansion slot 1157 and / or the second expansion slot 1158 are circular or elliptical.

[0145] Specifically, a circular or elliptical notch shape has good stress dispersion characteristics, and the stress concentration at its edge is lower than that of a sharp shape. The circular or elliptical first expansion groove 1157 and the second expansion groove 1158 can be in a "tear drop" shape.

[0146] It is understood that first expansion slot 1157 and second expansion slot 1158 are respectively formed at the two extended ends of slot structure 1150. The circular or elliptical notches described above can more evenly distribute stress around the slots during the stress transfer process. First expansion slot 1157 and second expansion slot 1158, slot structure 1150, stop 1152, and weakened portion 1151 cooperate with each other to jointly influence the mechanical properties of pad 1140 and the side or periphery of pad 1140. When circuit board 1130 is subjected to external forces, the stress can be more smoothly transferred and dispersed through first expansion slot 1157 and second expansion slot 1158, reducing the risk of damage to circuit board 1130 due to stress concentration and improving the structural stability and reliability of circuit board 1130.

[0147] In addition, the circular or elliptical first expansion groove 1157 and the second expansion groove 1158 can reduce the probability of cracks forming at the extended end of the pad 1140 and the side or outer periphery of the pad 1140 when subjected to force. The diameter of the circular first expansion groove 1157 and the second expansion groove 1158 can be 3mm-10mm, and can be designed to match the size of the groove structure 1150.

[0148] In this embodiment, the circular or elliptical first expansion groove 1157 and the second expansion groove 1158 can effectively reduce stress concentration at the groove edge and further optimize the stress dispersion effect of the groove structure 1150 .

[0149] In some embodiments, reference Figure 7 As shown, arc-shaped chamfers 1159 are respectively formed on the extending ends of the second slot segment 1155 and the third slot segment 1156 that are close to each other along the extending direction.

[0150] Since the second slot section 1155 is located between the first slot section 1154 and the third slot section 1156, a weak portion 1151 is formed between the extending ends of the second slot section 1155 and the third slot section 1156 that are close to each other along the extension direction. The weak portion 1151 needs to be broken to allow the pad 1140 and the side or surrounding plate of the pad 1140 to move. Therefore, when a concave portion is formed on the weak portion 1151, the weak portion 1151 is more likely to break.

[0151] Therefore, arc-shaped chamfers 1159 are respectively formed on the extended ends of the second groove segment 1155 and the third groove segment 1156 that are close to each other along the extension direction, so that the groove wall of the extended end of the second groove segment 1155 and the groove wall of the extended end of the third groove segment 1156 are designed to be arc-shaped protruding parts. It can also be understood that the extended end of the second groove segment 1155 and the extended end of the third groove segment 1156 are gradually set, so that a corresponding concave part is formed on the weak part 1151, which makes the weak part 1151 more prone to fracture. The arc-shaped chamfer is also conducive to alleviating the stress concentration phenomenon at this location.

[0152] The arc radius of the arc chamfer 1159 may be greater than or equal to 0.2 mm.

[0153] In this embodiment, the design of the arc-shaped chamfer 1159 forms a concave portion on the weak portion 1151, which is more conducive to breaking the weak portion 1151.

[0154] In some embodiments, reference Figure 7As shown, the first slot segment 1154 includes a first sub-slot segment 11542 and a second sub-slot segment 11543 arranged at intervals, and a weak portion 1151 is formed between the first sub-slot segment 11542 and the second sub-slot segment 11543; a limiting portion 1152 is formed between the second sub-slot segment 11543 and the second slot segment 1155.

[0155] A single weak portion 1151 can be provided, for example, formed between the second slot segment 1155 and the third slot segment 1156. Of course, multiple weak portions 1151 can also be provided, with spacing between them. Multiple weak portions 1151 can be arranged on different sides of the pad 1140. For example, if the pad 1140 has two opposing sides along the predetermined direction X, the weak portions 1151 can be arranged on these two sides. Furthermore, the weak portions 1151 on both sides of the pad 1140 can be arranged symmetrically.

[0156] Specifically, a weak portion 1151 is formed between the second slot segment 1155 and the third slot segment 1156, dividing the first slot segment 1154 into a first sub-slot segment 11542 and a second sub-slot segment 11543. The space between the first sub-slot segment 11542 and the second sub-slot segment 11543 forms a weak portion 1151. It can be seen that in this case, two weak portions 1151 are provided, one on each side of the solder pad 1140 in the predetermined direction X. The two weak portions 1151 can be symmetrically arranged about the solder pad 1140. It is understood that a stopper 1152 is formed between the end of the second sub-slot segment 11543 away from the first sub-slot segment 11542 and the second slot segment 1155. It can be understood that the weak portion 1151 includes a first sub-weak portion 11511 and a second sub-weak portion 11512, the second sub-weak portion 11512 is formed between the second slot segment 1155 and the third slot segment 1156, and the first sub-weak portion 11511 is formed between the first sub-slot segment 11542 and the second sub-slot segment 11543. In the preset direction X, the first sub-weak portion 11511 and the second sub-weak portion 11512 are distributed on both sides of the solder pad 1140.

[0157] In this embodiment, the first slot section 1154 is divided into a first sub-slot section 11542 and a second sub-slot section 11543 arranged at intervals, thereby increasing the number of weak portions 1151, and allowing the plate body around the pad 1140 to break at both sides of the preset direction X of the pad 1140, thereby increasing the deformation of the pad 1140 and the side or periphery of the pad 1140, thereby improving the stress buffering effect.

[0158] In some embodiments, reference Figure 8As shown, the first slot segment 1154 may further include a third sub-slot segment 11544, a fourth sub-slot segment, and so on. That is, the first slot segment 1154 may include multiple sub-slot segments, and a weak portion 1151 may be formed between two adjacent sub-slot segments, thereby increasing the number of weak portions 1151. For example, the weak portion 1151 may be understood as a first sub-weak portion 11511. Figure 8 As shown, taking the first slot segment 1154 including the first sub-slot segment 11542, the second sub-slot segment 11543 and the third sub-slot segment 11544 as an example, a first sub-weak portion 11511 is formed between the first sub-slot segment 11542 and the second sub-slot segment 11543, a first sub-weak portion 11511 is formed between the second sub-slot segment 11543 and the third sub-slot segment 11544, and a limiting portion 1152 is formed between the third sub-slot segment 11544 and the second slot segment 1155.

[0159] Similarly, the second slot segment 1155 and the third slot segment 1156 may also include multiple sub-slot segments, and a weak portion 1151 may be formed between two adjacent sub-slot segments, thereby increasing the number of weak portions 1151. For example, the weak portion 1151 may be understood as a second sub-weak portion 11512. It is sufficient that each weak portion 1151 is distributed on both sides of the pad 1140 along the predetermined direction X, and the weak portions 1151 on both sides of the pad 1140 may be symmetrically distributed.

[0160] The above design can be understood as that the weak portion 1151 includes a first sub-weak portion 11511 and a second sub-weak portion 11512. In the preset direction X, the first sub-weak portion 11511 and the second sub-weak portion 11512 are distributed on both sides of the pad 1140. There are one or more first sub-weak portions 11511 and one or more second sub-weak portions 11512.

[0161] In this embodiment, by providing a plurality of weak portions 1151 , the risk of accidental movement of the pad 1140 and the side or surrounding board of the pad 1140 caused by accidental breakage of one of the weak portions 1151 can be reduced.

[0162] In some embodiments, reference Figure 7 As shown, arc-shaped chamfers 1159 are respectively formed on the extending ends of the first sub-groove segment 11542 and the second sub-groove segment 11543 that are close to each other.

[0163] Specifically, the second sub-groove segment 11543 is located between the first sub-groove segment 11542 and the second groove segment 1155, and a weak portion 1151 is formed between the mutually close extended ends of the first sub-groove segment 11542 and the second sub-groove segment 11543. The weak portion 1151 needs to be broken to enable the pad 1140 and the side or surrounding plate of the pad 1140 to move. Therefore, when an inward concave portion is formed on the weak portion 1151, the weak portion 1151 is more likely to break.

[0164] Therefore, arc-shaped chamfers 1159 are respectively formed on the mutually adjacent extended ends of the first sub-groove segment 11542 and the second sub-groove segment 11543, so that the groove wall of the extended end of the first sub-groove segment 11542 and the groove wall of the extended end of the second sub-groove segment 11543 are designed as arc-shaped protruding parts. It can also be understood that the extended end of the first sub-groove segment 11542 and the extended end of the second sub-groove segment 11543 are gradually set, so that a corresponding concave part is formed on the weak part 1151, which makes the weak part 1151 more prone to fracture. The arc-shaped chamfer is also conducive to alleviating the stress concentration phenomenon at this location.

[0165] The arc radius of the arc chamfer 1159 may be greater than or equal to 0.2 mm.

[0166] In this embodiment, the design of the arc-shaped chamfer 1159 forms a concave portion on the weak portion 1151, which is more conducive to breaking the weak portion 1151.

[0167] In some embodiments, reference Figure 12 and Figure 13 As shown, the sampling harness 1160 has a bent portion 1161 .

[0168] Specifically, the sampling harness 1160 may have at least one bending portion 1161. It can be understood that the sampling harness 1160 is a non-linear structure. The sampling harness 1160 may be a curved structure. For example, the sampling harness 1160 may be in an arc shape or a serpentine shape that bends back and forth, etc. The arc shape may have one bending portion 1161, and the serpentine shape may have multiple bending portions 1161.

[0169] The bending portion 1161 may be in the shape of a smooth arc, or may be in the shape of a broken line formed by a plurality of straight line segments intersecting and bending. For example, the sampling bundle 1160 may be in an S-shape.

[0170] During the manufacturing process of the sampling harness 1160, finite element simulations were used to achieve balanced three-dimensional flexibility (with an error of ≤10%), thereby dissipating thermal expansion stress. Simultaneously, gradient matching of the thermal expansion coefficients suppressed deformation, maintaining a deformation of ≤0.15mm during cycling from -40°C to 125°C. The sampling harness 1160 is manufactured using a pre-molding process. The sampling harness 1160 is pre-bent into a bend 1161 using a 180°C hot press mold. Precise temperature control aligns the material's molecular chains, forming an S-shaped or wavy structure, for example. This molding process allows the sampling harness 1160 to bend and reduce residual stress. It also allows the outer shell of the sampling harness 1160 to maintain elastic deformation during dynamic bending, dissipating dynamic stress and extending the bending life of the sampling harness 1160.

[0171] In this embodiment, by forming a bend 1161 on the sampling harness 1160, the length of the sampling harness 1160 is increased, thereby creating redundant expansion and contraction. This redundant expansion and contraction allows the sampling harness 1160 to have a certain amount of expansion or deformation when subjected to a relatively small pulling force, making the sampling harness 1160 less likely to be broken under such a small pulling force, thereby reducing the risk of breaking the sampling harness 1160. In addition, the buffering effect of the bend 1161 can effectively reduce the impact of external forces on the connection between the sampling harness 1160 and the pad 1140, reducing the risk of loose connection or breakage, improving the stability of signal and power transmission, and increasing the reliability and service life of the battery device 1100.

[0172] In some embodiments, reference Figure 14 As shown, the battery device 1100 further includes a busbar component 1180 , which is electrically connected to the battery cell assembly 1120 , and the signal acquisition component 1170 is connected to the busbar component 1180 .

[0173] In battery device 1100, busbar 1180 supports and supports the temperature sensor. Busbar 1180 directly connects to battery cell assembly 1120, forming a complex electrical connection and information transmission network between these components. Circuit board 1130 is connected to signal acquisition component 1170 via sampling harness 1160. Signal acquisition component 1170 is in turn connected to busbar 1180, which is in turn electrically connected to battery cell assembly 1120. These components work together to implement battery device 1100's energy storage, transmission, and monitoring functions.

[0174] In this embodiment, the confluence component 1180 can collect the current output by multiple battery cell assemblies 1120, and uniformly manage and distribute them, ensuring that the electrical energy can be stably and efficiently transmitted to the circuit board 1130 and other electrical components.

[0175] In some embodiments, reference Figure 2 As shown, the battery device 1100 also includes a housing assembly 1110, which has a housing cavity 1113 formed therein. A battery cell assembly 1120 is housed within the housing cavity 1113. The battery cell assembly 1120 is often formed by arranging multiple battery cells. Alternatively, the battery cell assembly 1120 may be a battery module, which is formed by arranging and fixing multiple battery cells to form an independent module. As an example, a battery module may be formed by bundling multiple battery cells using cable ties. The housing assembly 1110 is used to provide the housing cavity 1113 for the battery cell assembly 1120, and the housing assembly 1110 may adopt a variety of structures.

[0176] The box assembly 1110 includes a box cover portion 1111 and a box frame portion 1112. The box cover portion 1111 and the box frame portion 1112 cover each other and jointly define a receiving chamber 1113 for accommodating the battery cell assembly 1120. The box frame portion 1112 can be a hollow structure with one end open, and the box cover portion 1111 can be a plate-like structure. In this case, the box cover portion 1111 can be understood as an end cap on the box assembly 1110. The box cover portion 1111 covers the open side of the box frame portion 1112, so that the box cover portion 1111 and the box frame portion 1112 jointly define the receiving chamber 1113. The box cover portion 1111 and the box frame portion 1112 can also be hollow structures with one end open, with the open side of the box cover portion 1111 covering the open side of the box frame portion 1112. Of course, the box assembly 1110 formed by the box cover portion 1111 and the box frame portion 1112 can be in various shapes, such as a cylinder, a cuboid, etc. In this application, the box assembly 1110 is rectangular as an example for description.

[0177] According to some embodiments of the present application, referring to Figure 1 As shown, the present application further provides an electrical device, which includes the battery device 1100 in the above embodiment, and the battery device 1100 is used to store or provide electrical energy.

[0178] The technical solutions described in the embodiments of the present application are applicable to various electrical devices that use battery cells, such as mobile phones, portable devices, laptop computers, electric vehicles, electric toys, electric tools, vehicles 1000, ships and spacecraft, etc. For example, spacecraft include airplanes, rockets, space shuttles and spacecraft, etc.

[0179] The example of the electric device in this application is based on the example of the battery device 1100 described above. The example of the electric device includes all the technical effects of the example of the battery device 1100 described above, which will not be repeated here.

[0180] According to some embodiments of the present application, the present application further provides an energy storage device, which includes a power conversion device and the battery device 1100 in the above embodiment, and the power conversion device is used to electrically connect the power generation device and the energy storage device.

[0181] Specifically, the energy storage device may include one or more battery clusters to increase the device's voltage and capacity. A battery cluster may include multiple battery devices 1100 connected in series via a busbar 1180 to increase the device's voltage. When the energy storage device includes multiple battery clusters, the battery clusters are connected in parallel to increase the device's capacity.

[0182] Energy storage devices can be used in energy storage power stations, wind power generation systems, solar power generation systems, mobile power systems, or temporary power supply systems. Energy storage devices can store electrical energy as needed and output it at the appropriate time. For example, an energy storage device can store electrical energy during periods of low electricity consumption and provide it to relevant users or electrical equipment during periods of peak electricity consumption. The energy storage system provided in the embodiments of the present application can be any power system that requires an energy storage device.

[0183] In some embodiments, the energy storage device is an energy storage container or an energy storage cabinet.

[0184] In some embodiments, the energy storage device may include a cabinet and one or more battery clusters housed in the cabinet.

[0185] In some embodiments, the energy storage device may include modules such as a thermal management module, a main control module, a master control module, a power distribution module, and a fire protection module.

[0186] As an example, the thermal management module may include a liquid cooling unit that provides cooling liquid for regulating the temperature of the battery cells to each battery device 1100 through a pipeline.

[0187] For example, the master control module can serve as the battery management unit (BMU) of a battery cluster, monitoring and managing the battery cluster. The master control module can monitor information such as the battery cluster's current, voltage, power, and temperature. For example, it can control the battery cluster's charge and discharge current and voltage. The master control module includes modules such as the slave battery management unit (SBMU) and the fusion switch.

[0188] As an example, the master control module can serve as the battery management unit (BMU) of an energy storage device, monitoring and managing the device. The master control module can monitor information such as the device's current, voltage, power, state of charge, or temperature. For example, it can control the device's charge and discharge current and voltage. For example, the master control module includes modules such as an insulation monitoring module (IMM), a master battery management unit (MBMU), an Ethernet (ETH), and a fiber optic conversion module.

[0189] As an example, the fire protection module includes a control panel, detectors, alarm devices, etc., which are used to detect, alarm or extinguish fires in the energy storage system.

[0190] As an example, the power distribution module can be used to distribute power to modules in the energy storage device that require power.

[0191] According to some embodiments of the present application, the present application also provides an energy storage system, which includes a power conversion device and the energy storage device in the above embodiment, and the power conversion device is used to electrically connect the power generation device and the energy storage device.

[0192] In some embodiments, the energy storage system may include one or more energy storage devices and a power converter system (PCS). The power converter system is connected between the power generation equipment and the energy storage device. The power generation equipment is used to generate electricity, which can be stored in the energy storage device via the power converter. For example, the power generation equipment may include solar panels, hydroelectric power generation equipment, thermal power generation equipment, wind power generation equipment, etc. The specific type of power generation equipment is not limited in this application.

[0193] According to some embodiments of the present application, the present application further provides a charging network, which includes charging piles and the energy storage device in the above embodiment or the energy storage system in the above embodiment, and the energy storage device is used to provide electrical energy for the charging piles.

[0194] For example, a charging network includes a charging station and an energy storage device. The charging station is electrically connected to the energy storage device, which is used to provide electrical energy to the charging station. The charging station and the battery device 1100 in the energy storage device are electrically connected via a cable. The battery device 1100 can provide its stored energy to the charging station. The charging station has one or more connectors for connecting to an electrical device (such as a vehicle 1000) to replenish the electrical device.

[0195] The energy storage device can be located inside the charging pile (such as an integrated storage and charging machine) or outside the charging pile.

[0196] The above are merely preferred embodiments of the present application and only specifically describe the technical principles of the present application. These descriptions are intended only to explain the principles of the present application and should not be construed in any way as limiting the scope of protection of the present application. Based on the explanations herein, any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present application, as well as other specific implementations of the present application that can be conceived by those skilled in the art without inventive effort, shall be included within the scope of protection of the present application.

Claims

1. A battery device (1100), characterized in that: include: A battery cell assembly (1120) comprising a plurality of battery cells, wherein the plurality of battery cells are stacked along a preset direction; pad(1140); A circuit board (1130) having a groove structure (1150), wherein the soldering pad (1140) is connected to the circuit board (1130), and the groove structure (1150) is distributed on the side of the soldering pad (1140), so that a weak portion (1151) and a limiting portion (1152) are formed on the circuit board (1130) on the side of the soldering pad (1140), and the limiting portion (1152) is used to limit the soldering pad (1140) and the circuit board (1130) on the side of the soldering pad (1140) from warping; in the preset direction (X), the weak portion (1151) is distributed on the side of the soldering pad (1140), and in a direction perpendicular to the preset direction (Y), the limiting portion (1152) is distributed on the side of the soldering pad (1140); a signal acquisition component (1170) communicatively connected to the battery cell assembly (1120) for collecting electrical data of the battery cell assembly (1120); A sampling harness (1160) has one end connected to the pad (1140), and the other end of the sampling harness (1160) is connected to the signal acquisition component (1170).

2. The battery device (1100) according to claim 1, characterized in that The weak portion (1151) comprises a first sub-weak portion (11511) and a second sub-weak portion (11512); in the preset direction (X), the first sub-weak portion (11511) and the second sub-weak portion (11512) are distributed on both sides of the pad (1140); one or more first sub-weak portions (11511) are provided; and / or one or more second sub-weak portions (11512) are provided.

3. The battery device (1100) according to claim 1, characterized in that There are multiple limiting portions (1152).

4. The battery device (1100) according to claim 1, characterized in that The groove structure (1150) enables a connecting portion (1153) to be formed on the circuit board (1130) on the side of the soldering pad (1140). The connecting portion (1153) is connected between the main body of the circuit board (1130) and the circuit board (1130) on the side of the soldering pad (1140). In a direction perpendicular to the preset direction (Y), the connecting portion (1153) and the limiting portion (1152) are respectively arranged on both sides of the soldering pad (1140).

5. The battery device (1100) according to claim 1, characterized in that The circuit board (1130) has a board edge (1131), and in a direction perpendicular to the preset direction (Y), there is a preset spacing distance between the limiting portion (1152) and the board edge (1131).

6. The battery device (1100) according to any one of claims 1 to 5, characterized in that: The slot structure (1150) comprises a first slot section (1154), a second slot section (1155) and a third slot section (1156) which are arranged in sequence and spaced apart from each other; the first slot section (1154), the second slot section (1155) and the third slot section (1156) are arranged around the circumference of the pad (1140); the limiting portion (1152) is formed between the first slot section (1154) and the second slot section (1155); and the weak portion (1151) is formed between the second slot section (1155) and the third slot section (1156).

7. The battery device (1100) according to claim 6, characterized in that The first slot segment (1154) has a first distal end (11541) away from the second slot segment (1155) along the extension direction, and the third slot segment (1156) has a second distal end (11561) away from the second slot segment (1155) along the extension direction, and a connecting portion (1153) is formed between the first distal end (11541) and the second distal end (11561).

8. The battery device (1100) according to claim 7, characterized in that A first expansion slot (1157) is formed on the first distal end (11541) to expand the slot width of the first distal end (11541); and / or A second expansion slot (1158) is formed on the second distal end (11561) so as to expand the slot width of the second distal end (11561).

9. The battery device (1100) according to claim 8, characterized in that The notches of the first expansion groove (1157) and / or the second expansion groove (1158) are circular or elliptical.

10. The battery device (1100) according to claim 6, characterized in that Arc chamfers (1159) are respectively formed on the mutually approaching extension ends of the second slot section (1155) and the third slot section (1156) along the extension direction.

11. The battery device (1100) according to claim 6, characterized in that The first slot section (1154) comprises a first sub-slot section (11542) and a second sub-slot section (11543) arranged at intervals, the weak portion (1151) being formed between the first sub-slot section (11542) and the second sub-slot section (11543); and the limiting portion (1152) being formed between the second sub-slot section (11543) and the second slot section (1155).

12. The battery device (1100) according to claim 11, characterized in that Arc-shaped chamfers (1159) are respectively formed on the mutually adjacent extended ends of the first sub-groove section (11542) and the second sub-groove section (11543).

13. The battery device (1100) according to any one of claims 1 to 5, characterized in that: The sampling harness (1160) has a bending portion (1161).

14. The battery device (1100) according to any one of claims 1 to 5, characterized in that: The battery device (1100) further comprises a busbar component (1180), wherein the busbar component (1180) is electrically connected to the battery cell assembly (1120), and the signal acquisition component (1170) is connected to the busbar component (1180).

15. An electrical device, characterized in that: The electrical device comprises the battery device (1100) according to any one of claims 1 to 14, and the battery device (1100) is used to store or provide electrical energy.

Images