Antenna module

Abstract

The utility model discloses an antenna module. The antenna module comprises a plurality of antenna patterns; and a plurality of dielectric coatings, the plurality of dielectric coatings are separated from each other and respectively cover the corresponding antenna patterns, the plurality of dielectric coatings expose the conductive circuit, and the conductive circuit is electrically connected with a chip and the antenna patterns. According to the technical scheme, at least the antenna characteristics of the antenna module can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and more specifically, to an antenna module. Background Art

[0002] With the rapid development of wearable devices in recent years, along with the Internet of Things and mobile communications, we've noticed a gradual shift from low-frequency to high-frequency antenna applications toward integrated designs. As antenna frequency band requirements vary, more flexible integration models are required in design, and antenna patches will have the amplification capability to adapt to various antenna substrates.

[0003] With the rise of high-frequency signal applications, in addition to the increasing demand for single-band and dual-band antennas, it is also necessary to adapt to other substrates to meet market demand. Therefore, the antenna RF end is integrated onto different substrates to meet this demand. In the past, a dielectric coating (thickness of, for example, about 475 microns to 620 microns) was formed on the already designed and simulated antenna soft board, and the thickness and shape were adjusted according to the selected frequency band to achieve the purpose of matching. For example, a dielectric coating was added to an antenna design with originally weak transmission efficiency to enhance the antenna efficiency. Figure 1A and Figure 1B As shown, an antenna substrate 20 having an antenna pattern 22 is designed on a radio frequency substrate 10 in the early stage, and then a dielectric coating 40 is adhered and bonded to the antenna substrate 20 .

[0004] However, in the past, when designing this type of system-level antenna board, the substrate and antenna were designed together first. Although dielectric coatings can be added during the manufacturing process to enhance the antenna's capabilities, it is necessary to design a corresponding dielectric coating for the antenna pattern. Therefore, in the early stages of design, it is necessary to select the appropriate machine and mold to achieve the required thickness and performance of the antenna. This will increase the cost of fixtures and verification in the early stages of development. In addition, in order to comply with the mold and mold flow design, there will be thinner connecting parts between the dielectric coatings covering the antenna (such as Figure 1B This connection portion will cause electromagnetic waves between adjacent antennas to interfere with each other, thereby affecting the antenna characteristics. Utility Model Content

[0005] In response to the above problems, the present application proposes an antenna module that can at least improve the antenna characteristics of the antenna module.

[0006] The technical solution of this application is achieved as follows:

[0007] According to one aspect of the present application, an antenna module is provided, which may include: multiple antenna patterns; and multiple dielectric coatings, the multiple dielectric coatings are separated from each other and each covers the corresponding antenna pattern, wherein the multiple dielectric coatings expose conductive circuits, and the conductive circuits electrically connect a chip and the antenna pattern.

[0008] In some embodiments, the conductive traces are disposed between the plurality of dielectric coatings when viewed from a top-down perspective.

[0009] In some embodiments, the antenna module further includes: an antenna substrate, with multiple antenna patterns located on a first surface of the antenna substrate; an RF substrate located on a second surface side of the antenna substrate opposite to the first surface, and the RF substrate is connected to the antenna substrate via an adhesive layer.

[0010] In some embodiments, the conductive trace passes through the antenna substrate.

[0011] In some embodiments, the conductive traces pass through the adhesive layer.

[0012] In some embodiments, the antenna substrate has a through hole, the through hole exposing a circuit layer at a side surface of the antenna substrate, and the circuit layer is connected to the conductive circuit.

[0013] In some embodiments, the conductive traces provide feed lines for single-polarized or dual-polarized antenna patterns.

[0014] In some embodiments, the material of the dielectric coating is a high dielectric constant epoxy molding compound.

[0015] In some embodiments, the circuit layer on the side surface of the antenna substrate extends laterally to below the antenna pattern and serves as a feeding circuit for the antenna pattern.

[0016] In some embodiments, the dielectric coating has inclined side surfaces and a planar top surface connected to the side surfaces, wherein the inclined side surfaces are inclined inwardly in a bottom-to-top direction.

[0017] In this technical solution, since multiple, separate dielectric coatings each cover a corresponding antenna pattern, electromagnetic interference between adjacent antenna patterns is reduced, mitigating the impact on antenna characteristics. By connecting the antenna substrate, which already has enhanced antenna efficiency, to the RF substrate via an adhesive layer, this improves early development flexibility and antenna matching, reducing substrate development and manufacturing costs, increasing product applications across different antenna frequencies, and enabling the development of selective, specific frequency bands for communication between different products. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1A to Figure 1B It is a cross-sectional schematic diagram of multiple stages of forming an antenna module in the prior art.

[0020] Figures 2A to 2D It is a cross-sectional schematic diagram at multiple stages of forming the antenna module of an embodiment of the present application.

[0021] Figures 3A to 3E 1 is a cross-sectional schematic diagram of multiple stages of forming an antenna module according to another embodiment of the present application.

[0022] Figure 3F A schematic top view of an antenna module according to another embodiment of the present application is shown.

[0023] Figures 4A to 4D Schematic diagrams of dielectric coating structures according to various optional embodiments. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0025] The following disclosure provides many different embodiments or examples for implementing the different features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. Of course, these are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include an embodiment in which the first component and the second component are in direct contact, and may also include an embodiment in which an additional component is formed between the first component and the second component so that the first component and the second component may not be in direct contact. Moreover, the present invention may repeatedly refer to numbers and / or letters in various examples. This repetition is merely for simplicity and clarity and does not in itself represent a relationship between the various embodiments and / or configurations discussed.

[0026] In addition, the embodiments and features of the embodiments in this application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] Figures 2A to 2D It is a cross-sectional schematic diagram of multiple stages of forming the antenna module 100 of the embodiment of the present application. Figure 2A As shown, an antenna substrate 120 is formed, and the antenna substrate 120 may include a soft board 129 and a plurality of antenna patterns 122 disposed on the soft board 129. The plurality of antenna patterns 122 may be spaced apart from each other in a lateral direction.

[0028] refer to Figure 2BAs shown, multiple dielectric coatings 150 are formed, each separated from another in the transverse direction and each covering a corresponding antenna pattern 122. In some embodiments, the material of the dielectric coatings 150 can be an epoxy molding compound with a high dielectric constant. The dielectric coatings 150 can be shaped according to design requirements to achieve amplification of the signal transmitted by the antenna pattern 122. After forming the dielectric coatings 150 into the desired shape, each antenna pattern 122 can be verified to confirm that the antenna pattern 122 is operational.

[0029] refer to Figure 2C As shown, a radio frequency substrate 140 is provided. One side of the radio frequency substrate 140 ( Figure 2C Multiple electronic components are provided on the lower side of the RF substrate 140. The multiple electronic components may include a chip 145 and passive components 148. The chip 145 and passive components 148 may be covered by a mold layer 260. A connector 263, not covered by the mold layer 260, may also be provided on one side of the RF substrate 140. The connector 263 may be used to electrically connect to other external devices.

[0030] refer to Figure 2D As shown, the other side of the RF substrate 140 ( Figure 2D The upper side of the antenna pattern 120 is attached to the antenna substrate 120 via an adhesive layer 303 to form the antenna module 100. An antenna substrate 120 that matches the RF substrate 140 can be selected and combined with the RF substrate 140, and then baked and cured to enable the antenna pattern 122 to receive and transmit effectively.

[0031] In the above technical solution, since the multiple, separate dielectric coatings 150 each cover the corresponding antenna pattern 122, electromagnetic interference between adjacent antenna patterns 122 is reduced, thereby alleviating the impact on antenna characteristics. Furthermore, by utilizing the initial antenna design and adding the dielectric coating 150, antenna performance is enhanced through performance simulation of the antenna substrate 120 and the dielectric coating 150. The antenna substrate 120, with enhanced antenna efficiency, is then connected to the originally designed RF substrate 140 via the adhesive layer 303. Antennas of different frequency bands can be matched to the application requirements. After the antenna band is matched to the antenna module, transmission and reception via the antenna pattern 122 will exhibit the desired antenna frequency band. This improves early development flexibility and antenna matching, reduces substrate development and manufacturing costs (thus, this application does not require the purchase of expensive molds in the early stages and can utilize existing molds for development), and increases product applications across different antenna frequencies. Furthermore, because the antenna pattern 122 and the RF substrate are not packaged simultaneously, the thickness, shape, and composition of the dielectric coating 150 can be adjusted according to different requirements to select a band that can meet the needs of the receiving and transmitting ends. There are also more selectable frequency bands, and selective specific frequency bands can be developed for communication applications of different products.

[0032] In some embodiments, at least two antenna patterns 122 among the plurality of antenna patterns 122 may have different frequency bands. In some embodiments, the frequency band of each antenna pattern 122 may be any one of n257 (26.5-29.5 GHz), n258 (24.25-27.5 GHz), n260 (37-40 GHz), n261 (27.5-28.35 GHz), and n259 (39.5-43.5 GHz).

[0033] Figures 3A to 3E 1 is a cross-sectional schematic diagram at multiple stages of forming an antenna module 200 according to another embodiment of the present application. Figures 3A to 3E Many aspects of the antenna module 200 may be similar to those of the antenna module 100 described above and may have the benefits described above with respect to the antenna module 100 . The following mainly describes the differences of the antenna module 200 .

[0034] refer to Figure 3A As shown, an antenna substrate 120 having a plurality of antenna patterns 122 is provided. The plurality of antenna patterns 122 are located on a first surface 120a of the antenna substrate 120. The antenna patterns 122 can be connected to a circuit layer 190 in the antenna substrate 120. An initial dielectric coating 150' covers the first surface 120a of the antenna substrate 120. In some embodiments, the antenna substrate 120 can be a flexible circuit board. In addition, an RF substrate 140 is provided. The antenna substrate 120 is attached to the RF substrate 140 via an adhesive layer 303, as shown in FIG. Figure 3BAs shown. After attachment, the substrate can be left to rest for a period of time until the surface is flat, and then baked and cured. The RF substrate 140 is attached to the second surface 120b of the antenna substrate 120, which is opposite the first surface 120a. At least one chip 145 is provided on the side of the RF substrate 140 facing away from the antenna substrate 120. In this embodiment, two chips 145 are shown as an example.

[0035] Then refer to Figure 3C , thinning the initial dielectric coating 150' to a desired thickness. Figure 3D As shown, a laser engraving process can be performed to shape the initial dielectric coating 150' into a shape that meets the design requirements so that the signal transmitted by the antenna pattern 122 can be amplified. And the initial dielectric coating 150' is formed into a plurality of dielectric coatings 150, each covering a corresponding antenna pattern 122. In this embodiment, the dielectric coating 150 has an inclined side surface and a planar top surface connected to the inclined side surface, and the inclined side surface is inclined inward in the direction from bottom to top. The bottom of the dielectric coating 150 can protrude laterally from the inclined side surface of the dielectric coating 150. In this embodiment, the antenna pattern 122 can be dual-polarized. In other embodiments, the antenna pattern 122 can be single-polarized. In some embodiments, at least two of the multiple antenna patterns 122 have different frequency bands.

[0036] The dielectric coating 150 may have any suitable shape according to design requirements. Figures 4A to 4D Some optional shapes of the dielectric coating 150 are shown, such as a rectangular parallelepiped shape (see FIG. Figure 4A ), pyramid (see Figure 4B ), truncated pyramid shape (see Figure 4C ) or truncated cone shape (see Figure 4D ).

[0037] Continue to refer Figure 3D As shown, a plurality of through holes 308 are formed, which pass through the antenna substrate 120, the adhesive layer 303, and extend into the RF substrate 140. The through holes 308 can expose the pads in the RF substrate 140. The through holes 308 can also expose the circuit layer 190 at the side of the antenna substrate 120.

[0038] refer to Figure 3E , in through hole 308 (see Figure 3D ) is filled with a conductive material to form a conductive circuit 310, thereby forming the antenna module 200. In this embodiment, the conductive circuit 310 is formed as a conductive through-hole passing through the antenna substrate 120.

[0039] Conductive trace 310 may pass through antenna substrate 120. Conductive trace 310 also passes through adhesive layer 303. Conductive trace 310 connects trace layer 190 in antenna substrate 120 and pad 144 in RF substrate 140. Tracing layer 190 extends laterally below antenna pattern 122 and, together with conductive trace 310, serves as a feed line for antenna pattern 122.

[0040] In the above-mentioned antenna module 200, since the multiple dielectric coatings 150 separated from each other each cover the corresponding antenna pattern 122, the mutual interference of electromagnetic waves between adjacent antenna patterns 122 can be reduced, thereby alleviating the impact on the antenna characteristics. The conductive circuit 310 exposed by the multiple dielectric coatings 150 can be used to electrically connect a chip 145 and the antenna pattern 122 to provide an antenna feeding circuit. The chip 145 can be used to provide a feeding signal to the antenna pattern 122, and the feeding signal reaches the antenna pattern 122 through the feeding circuit provided by the conductive circuit 310. Specifically, the feeding signal can be from the chip 145, through the pad 144 in the RF substrate 140, the conductive circuit 310, the circuit layer 190, and reach the antenna pattern 122.

[0041] Figure 3F FIG shows a schematic top view of the antenna module 200. Figure 3F As shown, the plurality of dielectric coatings 150 also expose a portion of the first surface 120a of the antenna substrate 120. Conductive traces 310 are disposed between the plurality of dielectric coatings 150. The conductive traces 310 corresponding to each antenna pattern 122 may include two conductive through-vias 310a and 310b, and the trace layer 190 may include two conductive lines 190a and 190b connected to the antenna pattern 122. The two conductive through-vias 310a and 310b are connected to the two conductive lines 190a and 190b, respectively.

[0042] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. An antenna module, characterized in that: include: multiple antenna patterns; as well as A plurality of dielectric coatings are separated from each other and each covers the corresponding antenna pattern, wherein the plurality of dielectric coatings expose conductive circuits, and the conductive circuits electrically connect a chip and the antenna pattern.

2. The antenna module according to claim 1, wherein: In a top-down perspective, the conductive circuit is disposed between the plurality of dielectric coating layers.

3. The antenna module according to claim 1, wherein: Also includes: an antenna substrate, wherein the plurality of antenna patterns are located on a first surface of the antenna substrate; The radio frequency substrate is located on a side of the second surface of the antenna substrate opposite to the first surface, and the radio frequency substrate is connected to the antenna substrate through an adhesive layer.

4. The antenna module according to claim 3, wherein: The conductive line passes through the antenna substrate.

5. The antenna module according to claim 4, wherein: The conductive trace passes through the adhesive layer.

6. The antenna module according to claim 3, wherein: The antenna substrate has a through hole, wherein the through hole exposes a circuit layer at a side surface of the antenna substrate, and the circuit layer is connected to the conductive circuit.

7. The antenna module according to claim 1, wherein: The conductive line provides a feeding line for the single-polarized or dual-polarized antenna pattern.

8. The antenna module according to claim 1, wherein: The material of the dielectric coating is a high dielectric constant epoxy molding compound.

9. The antenna module according to claim 6, wherein: The circuit layer on the side surface of the antenna substrate extends laterally to below the antenna pattern and serves as a feeding circuit for the antenna pattern.

10. The antenna module according to claim 1, wherein: The dielectric coating has inclined side surfaces and a planar top surface connected to the side surfaces, wherein The side surfaces inclined in the direction from bottom to top are inclined inwardly.

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