Modularized MOSEFT multi-level inverter device

Abstract

The utility model provides a modularized MOSEFT multi-level inverter device, which comprises a supporting assembly, and the supporting assembly comprises a base, a slot, a chute, a guide rod, a spring, a limiting block and a connecting block. Two inserting grooves are symmetrically formed in the inner side wall of the base, two sliding grooves are symmetrically formed in the inner side wall of the base, and one end of each sliding groove communicates with the corresponding inserting groove; a protection assembly is arranged at the top of the supporting assembly and comprises a top plate, a protection plate, a connecting rod, a limiting groove and a positioning column. According to the MOSEFT multi-level inverter device, the connecting rods are pushed to enter the slots, and the limiting blocks are matched with the limiting grooves, so that the connecting rods are fixed in the slots, the MOSEFT multi-level inverter device is convenient to install, and the production efficiency of the MOSEFT multi-level inverter device is improved. The connecting block is pushed to move, so that the limiting block can be driven to retreat from the limiting groove, the MOSEFT multi-level inverter device can be disassembled conveniently, and the time required for disassembling and maintaining the MOSEFT multi-level inverter device is saved.

Description

Technical Field

[0001] The utility model relates to an inverter device, in particular to a modular MOSFET multi-level inverter device, belonging to the technical field of inverters. Background Art

[0002] The MOSFET multilevel inverter is an advanced power electronic device that combines MOSFETs (metal oxide semiconductor field-effect transistors) with multilevel inverter technology to achieve precise control of output voltage and current. It boasts high efficiency, reliability, and widespread application, playing a vital role in electric vehicle charging, industrial equipment drives, and power transmission and distribution systems. With continued technological advancement, MOSFET multilevel inverters will be widely used and developed in even more fields.

[0003] A MOSFET multilevel inverter device usually consists of two parts: a MOSFET control module and an inverter module. When the MOSFET multilevel inverter device is installed and disassembled, it is inconvenient to install, disassemble and repair due to its complex structure. As a result, the maintenance of the inverter device takes a long time and is inefficient. Therefore, a modular MOSFET multilevel inverter device is proposed. Utility Model Content

[0004] In view of this, the present invention provides a modular MOSFET multi-level inverter device to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is implemented as follows: a modular MOS EFT multi-level inverter device includes a support assembly, the support assembly includes a base, a slot, a slide, a guide rod, a spring, a limit block and a connecting block;

[0006] The inner side wall of the base is symmetrically provided with two slots, the inner side wall of the base is symmetrically provided with two slide grooves, one end of the slide groove is communicated with the slot, the inner side wall of the base is symmetrically slidably connected to two guide rods, the outer side wall of the guide rod is provided with a spring, one end of the guide rod is fixedly connected to a limit block, the bottom of the limit block is fixedly connected to a connecting block, and the limit block is slidably connected to the inner side wall of the slide groove;

[0007] A protective assembly is provided on the top of the support assembly, and the protective assembly includes a top plate, a protective plate, a connecting rod, a limiting groove and a positioning column;

[0008] The bottom of the top plate is symmetrically fixedly connected with a protective plate, the bottom of the protective plate is symmetrically fixedly connected with two positioning columns, one side of the protective plate is fixedly connected with a connecting rod, and one side of the connecting rod is fixedly connected with a limiting groove.

[0009] Further preferably, one end of the spring is fixedly connected to the inner side wall of the slide groove, and the other end of the spring is fixedly connected to the limit block.

[0010] Further preferably, the bottom end of the connecting block passes through the lower surface of the base and extends to the outside, and the connecting block is slidably connected to the inner side wall of the base.

[0011] Further preferably, the connecting rod is inserted into the inside of the slot.

[0012] Further preferably, heat dissipation holes are evenly provided on both sides of the base.

[0013] Further preferably, four feet are symmetrically fixedly connected to the bottom of the base.

[0014] Further preferably, four positioning holes are symmetrically formed on the inner side wall of the base, and the positioning posts are inserted into the positioning holes.

[0015] Further preferably, a MOSFET control module and an inverter module are installed on the inner side wall of the base, and the MOSFET control module and the inverter module are electrically connected.

[0016] The embodiment of the present invention has the following advantages due to the adoption of the above technical solution:

[0017] 1. The utility model pushes the connecting rod into the slot and uses the limiting block and the limiting slot to fix the connecting rod inside the slot, which facilitates the installation of the MOSEFT multi-level inverter device and improves the production efficiency of the MOSEFT multi-level inverter device.

[0018] Second, the present invention can drive the limit block to exit the limit groove by pushing the connecting block to move, so as to facilitate the disassembly of the MOSEFT multi-level inverter device and save the time required for disassembly and maintenance of the MOSEFT multi-level inverter device.

[0019] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present invention will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 It is a structural diagram of the utility model;

[0022] Figure 2 This is a bottom view of the structure of the utility model;

[0023] Figure 3 This is a structural diagram of the utility model after disassembly;

[0024] Figure 4 This is a diagram of the internal structure of the chute of the present utility model.

[0025] Figure numerals: 10, support assembly; 11, base; 12, heat dissipation hole; 13, foot pad; 14, positioning hole; 15, MOSFET control module; 16, inverter module; 17, slot; 18, slide; 19, guide rod; 110, spring; 111, limit block; 112, connecting block; 20, protective assembly; 21, top plate; 22, protective plate; 23, connecting rod; 24, limit groove; 25, positioning column. DETAILED DESCRIPTION

[0026] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0027] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] like Figure 1-4 As shown, the embodiment of the present invention provides a modular MOS EFT multi-level inverter device, including a support assembly 10, the support assembly 10 includes a base 11, a slot 17, a slide 18, a guide rod 19, a spring 110, a limit block 111 and a connecting block 112;

[0029] The inner side wall of the base 11 is symmetrically provided with two slots 17, and the inner side wall of the base 11 is symmetrically provided with two slide grooves 18. One end of the slide groove 18 is connected to the slot 17. The inner side wall of the base 11 is symmetrically slidably connected to two guide rods 19. The outer side wall of the guide rod 19 is provided with a spring 110. One end of the guide rod 19 is fixedly connected to a limit block 111. The bottom of the limit block 111 is fixedly connected to a connecting block 112. The limit block 111 is slidably connected to the inner side wall of the slide groove 18.

[0030] A protective assembly 20 is provided on the top of the support assembly 10. The protective assembly 20 includes a top plate 21, a protective plate 22, a connecting rod 23, a limiting groove 24 and a positioning column 25;

[0031] A protective plate 22 is symmetrically fixedly connected to the bottom of the top plate 21, and two positioning columns 25 are symmetrically fixedly connected to the bottom of the protective plate 22. A connecting rod 23 is fixedly connected to one side of the protective plate 22, and one side of the connecting rod 23 is fixedly connected to the limiting slot 24. By pushing the connecting rod 23 into the slot 17 and using the spring 110 to push the limiting block 111 to move, the limiting block 111 and the limiting slot 24 are driven to cooperate, so that the connecting rod 23 is fixed inside the slot 17, completing the installation of the inverter device. By pushing the connecting block 112 to move, the limiting block 111 can be driven to exit the limiting slot 24, so as to complete the disassembly of the MOSSEFT multi-level inverter device.

[0032] In this embodiment, specifically: one end of the spring 110 is fixedly connected to the inner wall of the sliding groove 18, and the other end of the spring 110 is fixedly connected to the limit block 111, and the limit block 111 is driven to move by the spring 110.

[0033] In this embodiment, specifically: the bottom end of the connecting block 112 passes through the lower surface of the base 11 and extends to the outside, and the connecting block 112 is slidably connected to the inner wall of the base 11. By pushing the connecting block 112 to move, the limiting block 111 can be driven to exit the limiting groove 24.

[0034] In this embodiment, specifically: the connecting rod 23 is inserted into the interior of the slot 17 , and the connecting rod 23 is fixed inside the slot 17 to complete the installation of the inverter device.

[0035] In this embodiment, specifically: heat dissipation holes 12 are evenly opened on both sides of the base 11, and the heat dissipation holes 12 facilitate heat dissipation of the inverter device.

[0036] In this embodiment, specifically: four feet 13 are symmetrically fixedly connected to the bottom of the base 11, and the feet 13 are used to support the inverter device.

[0037] In this embodiment, specifically: four positioning holes 14 are symmetrically opened on the inner side wall of the base 11, and the positioning posts 25 are inserted into the positioning holes 14. The base 11 and the protective plate 22 are aligned by the cooperation between the positioning posts 25 and the positioning holes 14.

[0038] In this embodiment, specifically: a MOSFET control module 15 and an inverter module 16 are installed on the inner side wall of the base 11, the MOSFET control module 15 and the inverter module 16 are electrically connected, and the MOSFET control module 15 serves as a switching device. By controlling the on and off of the MOSFET control module 15, the conversion of electric energy and the regulation of voltage are realized.

[0039] During installation, the present invention utilizes the cooperation between the positioning column 25 and the positioning hole 14 to align the base 11 and the protective plate 22, and pushes the connecting rod 23 into the slot 17, and utilizes the spring 110 to push the limit block 111 to move, thereby driving the limit block 111 to cooperate with the limit groove 24, so that the connecting rod 23 is fixed inside the slot 17, thereby completing the installation of the inverter device, facilitating the installation of the MOSEFT multi-level inverter device, and improving the production efficiency of the MOSEFT multi-level inverter device. During disassembly and maintenance, by pushing the connecting block 112 to move, the limit block 111 can be driven to exit the limit groove 24, so as to complete the disassembly of the MOSEFT multi-level inverter device, thereby saving the time required for disassembly and maintenance of the MOSEFT multi-level inverter device.

[0040] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope of protection of the claims.

Claims

1. A modular MOS EFT multi-level inverter device, comprising a support assembly (10), characterized in that: The support assembly (10) includes a base (11), a slot (17), a slide groove (18), a guide rod (19), a spring (110), a limit block (111) and a connecting block (112); The inner side wall of the base (11) is symmetrically provided with two slots (17), the inner side wall of the base (11) is symmetrically provided with two slide grooves (18), one end of the slide groove (18) is communicated with the slot (17), the inner side wall of the base (11) is symmetrically slidably connected with two guide rods (19), the outer side wall of the guide rod (19) is provided with a spring (110), one end of the guide rod (19) is fixedly connected to a limit block (111), the bottom of the limit block (111) is fixedly connected with a connecting block (112), and the limit block (111) is slidably connected to the inner side wall of the slide groove (18); A protective assembly (20) is provided on the top of the support assembly (10), and the protective assembly (20) includes a top plate (21), a protective plate (22), a connecting rod (23), a limiting groove (24) and a positioning column (25); The bottom of the top plate (21) is symmetrically fixedly connected to a protective plate (22), the bottom of the protective plate (22) is symmetrically fixedly connected to two positioning columns (25), one side of the protective plate (22) is fixedly connected to a connecting rod (23), and one side of the connecting rod (23) is fixedly connected to a limiting groove (24).

2. The modular MOSFET multi-level inverter device according to claim 1, characterized in that: One end of the spring (110) is fixedly connected to the inner wall of the slide groove (18), and the other end of the spring (110) is fixedly connected to the limit block (111).

3. The modular MOSFET multi-level inverter device according to claim 2, characterized in that: The bottom end of the connecting block (112) passes through the lower surface of the base (11) and extends to the outside, and the connecting block (112) is slidably connected to the inner side wall of the base (11).

4. The modular MOSFET multi-level inverter device according to claim 1, characterized in that: The connecting rod (23) is inserted into the interior of the slot (17).

5. The modular MOSFET multi-level inverter device according to claim 1, characterized in that: Heat dissipation holes (12) are evenly formed on both sides of the base (11).

6. The modular MOSFET multi-level inverter device according to claim 5, characterized in that: Four pads (13) are symmetrically fixedly connected to the bottom of the base (11).

7. The modular MOSFET multi-level inverter device according to claim 6, characterized in that: Four positioning holes (14) are symmetrically formed on the inner side wall of the base (11), and the positioning posts (25) are inserted into the interior of the positioning holes (14).

8. The modular MOSFET multi-level inverter device according to claim 7, characterized in that: A MOSFET control module (15) and an inverter module (16) are installed on the inner side wall of the base (11), and the MOSFET control module (15) and the inverter module (16) are electrically connected.

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