Book type frequency converter

Abstract

The utility model discloses a book-type frequency converter, which relates to the technical field of frequency converters, and comprises a shell, a first end of which is provided with a plurality of heat dissipation holes in an array; the upper cover plate is mounted at the top of the shell; the first partition plate is arranged below the upper cover plate, and the first partition plate and the upper cover plate are combined to form an upper layer cavity; the second partition plate is arranged below the first partition plate, and the second partition plate and the first partition plate are combined to form a middle-layer cavity; the bottom plate is installed at the bottom of the shell, the bottom plate and the second partition plate are combined to form a lower-layer cavity, and a radiator and a fan are arranged in the lower-layer cavity. According to the book type frequency converter, the technical problems that an existing frequency converter is difficult to be suitable for a high-pollution environment, the frequency converter is prone to being polluted by the environment, faults are caused by the environment, and the reliability of the frequency converter is low are solved, functional layering is conducted on the interior of the frequency converter, independent heat dissipation air channels are arranged, and heat dissipation is conducted on the interior of the frequency converter; external environment pollution to electronic components in the frequency converter is reduced, and the fault rate of the frequency converter is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of frequency converters, in particular to a book-type frequency converter. Background Art

[0002] Frequency converters utilize frequency conversion technology and microelectronics technology. They are primarily composed of rectification, filtering, inversion, braking units, drive units, detection units, and microprocessing units. They adjust the output power voltage and frequency by switching on and off the insulated gate bipolar transistors within the IGBT module (IGBT stands for Insulated Gate Bipolar Transistor, in Chinese for Insulated Gate Bipolar Transistor). This provides the required power voltage and current based on the actual needs of the motor, thereby achieving energy conservation and speed regulation. Frequency converters also have numerous protection features, such as overcurrent, overvoltage, and overload protection. With the continuous improvement of industrial automation, frequency converters have also gained widespread application.

[0003] The actual operating environments of inverters are becoming increasingly complex. Most general-purpose industrial inverters are designed to an IP00 rating, making them difficult to use in highly polluted environments such as dust, lint, high humidity, and oil. Field use can easily lead to environmental contamination of the inverter itself, leading to environmental failures and reduced reliability. While some inverters with higher protection levels exist on the market, these are primarily designed for specific industries and suffer from high costs and large size, making them unsuitable for cabinet installation. Furthermore, existing inverters lack functional stratification, resulting in a chaotic internal structure and poorly designed air ducts, which can exacerbate internal environmental pollution. Therefore, a book-type inverter is proposed to address these issues. Utility Model Content

[0004] The purpose of the utility model is to provide a book-type frequency converter, which solves the technical problems that the existing frequency converters are difficult to use in highly polluted environments such as dust, cotton wool, high humidity, and oil, and are easily polluted by the environment when used on site, causing malfunctions due to the environment, and the reliability of the frequency converter is low.

[0005] To achieve the above object, the present invention provides a book-type inverter, comprising:

[0006] A housing, wherein a plurality of heat dissipation holes are arranged in an array at the second end of the housing;

[0007] An upper cover plate is mounted on the top of the housing, and an operator assembly is mounted on the upper cover plate;

[0008] a first partition plate, disposed below the upper cover plate, the first partition plate and the upper cover plate being combined to form an upper cavity, a control PCB assembly being disposed on a top surface of the first partition plate, the operator assembly and the control PCB assembly being both located within the upper cavity;

[0009] A second partition is provided below the first partition, the second partition and the first partition are combined to form a middle cavity, and the power main circuit PCB assembly is provided in the middle cavity;

[0010] A base plate is installed at the bottom of the shell. The base plate and the second partition are combined to form a lower cavity. A radiator and a fan are arranged in the lower cavity. The radiator is located in the middle part of the lower cavity, and the fan is located at the second end of the shell.

[0011] Preferably, a fixing plate is provided on the top surface of one end of the bottom plate, a through hole is provided in the middle portion of the fixing plate, the fan is installed on the side of the fixing plate away from the radiator, and the fan is located at the through hole.

[0012] Preferably, a module IGBT is mounted on the bottom surface of the power main circuit PCB board assembly, and the bottom surface of the module IGBT is in contact with the top surface of the radiator.

[0013] Preferably, a main circuit terminal block is provided on the top surface of the power main circuit PCB board assembly, and the main circuit terminal block is provided at one end of the first partition, and the main circuit terminal block is used to connect various circuits.

[0014] Preferably, an electrolytic capacitor PCB board assembly is mounted on the top surface of the second partition, and an electrolytic capacitor is mounted on the bottom surface of the electrolytic capacitor PCB board assembly, and the electrolytic capacitor is located in the lower cavity.

[0015] Preferably, a plurality of vertical poles are provided on the bottom surface of the power main circuit PCB board assembly, and the top ends of the vertical poles are connected to the top surface of the second partition.

[0016] Preferably, a protective cover is provided on the outer peripheral side surface of the electrolytic capacitor, and an annular protrusion is provided on the outer peripheral side surface of the top end portion of the protective cover.

[0017] Preferably, a section of the housing is provided with a plurality of threading holes, and sealing plugs are clamped and provided at the positions of the plurality of threading holes.

[0018] Preferably, an annular groove is provided on the outer peripheral side surface of the sealing plug, and the annular groove is connected to the threading hole by snapping.

[0019] Preferably, a sink is provided at one end of the first partition, and the sink is used for installing the control PCB assembly.

[0020] Compared with the above background technology, the present invention provides a book-type inverter with the following beneficial effects:

[0021] (1) The utility model forms an upper cavity, a middle cavity and a lower cavity through the shell, the upper cover, the first partition and the bottom plate respectively, so as to functionally layer the interior of the inverter, make the internal structure of the inverter more organized, make full use of the internal space of the inverter, reduce the overall volume of the inverter, and the overall inverter structure is book-shaped, which is more conducive to cabinet installation. It does not need to be designed for a specific industry, effectively improving the application range of the inverter, thereby reducing production costs.

[0022] (2) The utility model forms an independent heat dissipation duct by combining a radiator, a fan and heat dissipation holes arranged in the lower cavity. The circulating air in the independent heat dissipation duct will not affect the electronic components in the upper cavity and the middle cavity. While dissipating the heat inside the inverter, it reduces the pollution of the electronic components inside the inverter by the external environment, improves the protection of the inverter, and reduces the failure rate of the inverter. At the same time, by improving the heat dissipation efficiency, it can provide the basic conditions for reducing the overall external dimensions of the inverter, save the use of materials, and further reduce the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0024] Figure 1 This is a schematic diagram of the shaft side of the frequency converter provided by an embodiment of the utility model;

[0025] Figure 2 A schematic plan view of a frequency converter provided by an embodiment of the present utility model;

[0026] Figure 3 An exploded schematic diagram of the frequency converter provided by an embodiment of the present utility model;

[0027] Figure 4 A transparent schematic diagram of a housing provided by an embodiment of the present utility model;

[0028] Figure 5 A schematic structural diagram of the upper cover provided by an embodiment of the present utility model;

[0029] Figure 6 A schematic plan view of a control PCB assembly provided by an embodiment of the present invention;

[0030] Figure 7 A three-dimensional structural diagram of the operator assembly provided in an embodiment of the present utility model;

[0031] Figure 8 A three-dimensional structural diagram of the main circuit PCB assembly of the power supply provided by an embodiment of the present utility model;

[0032] Figure 9 A three-dimensional structural diagram of a fan provided by an embodiment of the present utility model;

[0033] Figure 10 A three-dimensional structural diagram of a radiator provided by an embodiment of the utility model;

[0034] Figure 11 A three-dimensional structural diagram of the IGBT module provided by an embodiment of the present utility model;

[0035] Figure 12 An exploded schematic diagram of an electrolytic capacitor PCB board assembly provided by an embodiment of the present utility model;

[0036] Figure 13 A three-dimensional structural diagram of the main circuit terminal block provided by an embodiment of the utility model;

[0037] Figure 14 A three-dimensional structural diagram of a sealing plug provided in an embodiment of the present utility model;

[0038] Specifically, 1-housing; 2-upper cover; 3-control PCB board assembly; 301-first mounting hole; 4-operator assembly; 401-second mounting hole; 5-power main circuit PCB board assembly; 501-third mounting hole; 6-fan; 601-fifth mounting hole; 7-radiator; 701-fourth mounting hole; 702-sixth screw hole; 703-heat sink; 8-module IGBT; 801-sixth mounting hole; 9-protective cover; 10-electrolytic capacitor PCB board assembly; 1001-electrolytic capacitor; 11-main circuit terminal block; 1101-pin; 12-sealing plug; 1201-annular card slot; 13-heat dissipation hole; 14-upper cavity; 15-middle cavity; 16-lower cavity; 17-fixing plate; 18-first partition; 19-second partition; 20-bottom plate. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0040] In order to enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0041] like Figure 1 、 Figure 2 and Figure 3 As shown, in order to achieve the above-mentioned purpose, the utility model provides a book-type inverter, comprising: a housing 1 and an upper cover 2 and a bottom plate 20 arranged on the housing 1, wherein the housing 1 is made by a sheet metal processing technology, the upper cover 2 is installed on the top of the housing 1, and the operator assembly 4 is installed on the upper cover 2, and the operator assembly 4 is mainly used to input instructions to the inverter.

[0042] like Figure 3 and Figure 4 As shown, a first partition 18 and a second partition 19 are provided inside the housing 1. Preferably, the first partition 18 and the second partition 19 are integrally formed on the inner wall of the housing 1. It should be noted that the first partition 18 is located below the upper cover 2. The first partition 18 and the upper cover 2 are combined to form an upper cavity 14. The control PCB assembly 3 is provided on the top surface of the first partition 18. The operator assembly 4 and the control PCB assembly 3 are both located in the upper cavity 14. The upper cavity 14 is mainly used for wiring arrangement. Specifically, a first mounting hole 301 is provided on the control PCB assembly 3, and a first screw hole is provided on the housing 1. The first screw is passed through the first mounting hole 301 to connect to the first screw hole, thereby locking the control PCB assembly 3 on the housing 1.

[0043] like Figure 5 As shown, bending portions are provided on three sides of the upper cover plate 2, which are snap-connected to the upper portion of the shell 1 to strengthen the connection strength between the upper cover plate 2 and the shell 1. Correspondingly, a step groove is provided at the left end portion of the shell 1, and the bending portion located on the left side of the upper cover plate 2 is snap-connected to the step groove to further strengthen the connection strength between the upper cover plate 2 and the shell 1, so that the upper cover plate 2 and the shell 1 are stably connected.

[0044] like Figure 6 and Figure 7 As shown, a second screw hole is provided on the control PCB assembly 3, and a second mounting hole 401 is provided on the operator assembly 4. A second screw is passed through the second mounting hole 401 to connect the second screw hole, thereby fastening the operator assembly 4 to the control PCB assembly 3. At the same time, a through-hole is provided on the top surface of the upper cover 2 for further clamping and connecting the operator assembly 4. The operating end of the operator assembly 4 is located on the outer side of the housing 1, making it easy for operators to operate.

[0045] like Figure 1 and Figure 8As shown, the second partition 19 is arranged below the first partition 18. The second partition 19 and the first partition 18 are combined to form a middle cavity 15. The main circuit PCB board assembly 5 of the power supply is arranged in the middle cavity 15. The main circuit PCB board assembly 5 of the power supply is provided with a third mounting hole 501. The third screw hole is provided at the corner position of the second partition 19. The third screw is passed through the third mounting hole 501 to connect the third screw hole to lock the main circuit PCB board assembly 5 on the second partition 19.

[0046] A base plate 20 is installed at the bottom of the shell 1, and the base plate 20 is combined with the second partition plate 19 to form a lower cavity 16. The shell 1, the upper cover plate 2, the first partition plate 18, the first partition plate 18 and the base plate 20 are respectively used to form an upper cavity 14, a middle cavity 15 and a lower cavity 16, so as to functionally layer the interior of the inverter. Each layer is relatively independent and does not interfere with each other, making the internal structure of the inverter more organized, making full use of the internal space of the inverter, and reducing the overall volume of the inverter. Moreover, the overall inverter structure is book-shaped, which is more conducive to cabinet installation and does not need to be designed for a specific industry, effectively improving the applicability of the inverter and reducing the production cost of the inverter.

[0047] like Figure 3 and Figure 10 As shown, a heat sink 7 and a fan 6 are disposed within the lower cavity 16. The heat sink 7 is located in the middle of the lower cavity 16. Several fourth mounting holes 701 are provided on the side of the heat sink 7. Several fourth screw holes are provided on the side of the second partition 19. Fourth screws are inserted through the fourth mounting holes 701 and connected to the fourth screw holes to secure the heat sink 7 to the second partition 19. The fan 6 is located at the left end of the housing 1. Several heat dissipation holes 13 are arranged in an array on the right end surface of the housing 1. The heat sink 7, fan 6, and heat dissipation holes 13 form an independent cooling duct. The circulating air in this independent cooling duct does not affect the electronic components within the upper and middle cavities 14 and 15. While dissipating heat within the inverter, it also reduces environmental contamination of the electronic components, reduces the inverter's failure rate, and increases the inverter's service life. Furthermore, several heat dissipation holes 13 are arranged in an array on both symmetrical sides of the right end of the housing 1 to increase the amount of cool air entering and further improve the inverter's heat dissipation efficiency. Moreover, by improving the heat dissipation efficiency, it can provide the basic conditions for reducing the overall external size of the inverter, save the use of materials, and further reduce production costs.

[0048] It should be noted that a plurality of heat sinks 703 are arranged in an array at the lower end of the radiator 7. The length direction of the heat sink 703 is consistent with the length direction of the shell 1. At the same time, the length direction of the heat sink 703 is consistent with the direction of air circulation to ensure that the radiator 7 can provide maximum heat dissipation efficiency.

[0049] like Figure 1 and Figure 9As shown, in one embodiment of the present invention, connection holes are provided at the corners of the bottom plate 20, and screws are passed through the connection holes to fix the inverter as a whole to a designated workbench or cabinet. A fixing plate 17 is provided on the top surface of the left end of the bottom plate 20, and a through hole is provided in the middle portion of the fixing plate 17. The fan 6 is installed on the side of the fixing plate 17 facing away from the radiator 7, and the fan 6 is located at the through hole position, and the fan 6 is located on the left side of the fixing plate 17. A plurality of fifth mounting holes 601 are provided on the side of the fan 6, and a plurality of fifth screw holes are provided on the side of the fixing plate 17. The fifth screw is passed through the fifth mounting hole 601 to connect the fifth screw hole and lock the fan 6 on the fixing plate 17. The fan 6 is isolated from the radiator 7 by the fixing plate 17. When the lower cavity 16 is closed, the heat in the independent heat dissipation duct is discharged as much as possible, ensuring that the electronic components inside the inverter are as free from external environmental pollution as possible, while increasing the air circulation speed, thereby improving the heat dissipation efficiency.

[0050] like Figure 10 and Figure 11 As shown, in one embodiment of the present invention, the module IGBT8 is installed on the bottom surface of the main circuit PCB board assembly 5 of the power supply, and the bottom surface of the module IGBT8 is in contact with the top surface of the radiator 7, wherein the top surface of the radiator 7 is provided with a sixth screw hole 702, and the bottom surface of the module IGBT8 is provided with a sixth mounting hole 801, and the sixth screw passes through the sixth mounting hole 801 and connects the sixth screw hole 702 to fix the module IGBT8 to the radiator 7. Since the module IGBT8 is a high-power heat-generating electronic component, by making the bottom surface of the module IGBT8 in contact with the top surface of the radiator 7, the heat generated inside the inverter is transferred to the radiator 7 as soon as possible. The radiator 7 transfers the heat to the lower cavity 16, and the heat is brought to the outside of the inverter by the circulating air in the independent heat dissipation duct.

[0051] In addition, a number of vertical poles are set on the bottom surface of the main circuit PCB board assembly 5 of the power supply, and the top ends of the vertical poles are connected to the top surface of the second partition 19. The main circuit PCB board assembly 5 of the power supply and the second partition 19 are separated by a certain space through the vertical poles. On the one hand, the module IGBT8 can be installed on the bottom surface of the main circuit PCB board assembly 5 of the power supply, and on the other hand, a gap is reserved between the main circuit PCB board assembly 5 of the power supply and the second partition 19, thereby improving the heat dissipation effect of other electronic components on the main circuit PCB board assembly 5.

[0052] In one embodiment of the present invention, a main circuit terminal block 11 is provided on the top surface of the power main circuit PCB board assembly 5. The main circuit terminal block 11 is used to connect various circuits, wherein the pins 1101 of the main circuit terminal block 11 are welded to the power main circuit PCB board assembly 5. The main circuit terminal block 11 is provided at the right end portion of the first partition 18. The main circuit terminal block 11 can form a certain blockage for the upper cavity 14, thereby enhancing the functional layering effect inside the inverter.

[0053] like Figure 2 and Figure 12 As shown, it should be noted that the electrolytic capacitor PCB board assembly 10 is installed on the top surface of the second partition 19, and the electrolytic capacitor 1001 is installed on the bottom surface of the electrolytic capacitor PCB board assembly 10. Since the electrolytic capacitor 1001 is also a heat-generating electronic component, when installing the electrolytic capacitor PCB board assembly 10, the electrolytic capacitor 1001 is passed through the second partition 19 and extended into the lower cavity 16, that is, the electrolytic capacitor 1001 is located in the independent heat dissipation duct and is brought to the outside of the inverter through the circulating air in the independent heat dissipation duct.

[0054] In one embodiment of the present invention, a protective cover 9 is provided on the outer peripheral side of the electrolytic capacitor 1001, wherein the protective cover 9 is made of a rubber material, and the rubber material has the property of good elastic deformation, so as to absorb and reduce the vibration and impact generated by the electrolytic capacitor 1001 during operation, thereby protecting its internal structure and components from damage. In addition, the protective cover 9 can effectively prevent the electrolytic capacitor 1001 from being subjected to external electrical interference, thereby improving its working stability and playing the role of insulation protection. Preferably, an annular protrusion is provided on the outer peripheral side of the top portion of the protective cover 9, and the annular protrusion is integrally provided with the protective cover 9. The provision of the annular protrusion facilitates the installation and removal of the protective cover 9.

[0055] like Figure 3 and Figure 14 As shown, it should be noted that a section of the shell 1 is provided with several wire threading holes, and the wire threading holes are connected to the upper cavity 14. The wire threading holes are used to thread wires. The shape of the wire threading holes can be elliptical or circular. There is no limitation on the specific shape. It is designed according to actual needs. A sealing plug 12 is clamped at the position of each wire threading hole. The sealing plug 12 is designed according to the shape of the wire threading hole. When no wire passes through, the wire threading hole is blocked by the sealing plug 12 to enhance the sealing effect inside the inverter, thereby preventing the electronic components inside the inverter from being affected by external dust, water vapor, etc., thereby improving the service life of the inverter.

[0056] In one embodiment of the present invention, an annular groove 1201 is provided on the outer peripheral side of the sealing plug 12, which is connected to the wire threading hole through the annular groove 1201, so that the sealing plug 12 can be stably connected to the wire threading hole, effectively preventing the sealing plug 12 from detaching from the wire threading hole due to the movement of the wire.

[0057] It should be noted that a sink is provided at the right end of the first partition 18, which is used to install the control PCB board assembly 3. The specific shape of the first partition 18 is designed according to the specific structure of the control PCB board assembly 3, making full use of the space inside the inverter, thereby reducing the overall external dimensions of the inverter and making the overall structural design of the inverter more reasonable.

[0058] When the utility model is in use, during the operation of the inverter, the module IGBT8 and the electrolytic capacitor 1001 are the main heat-generating components. The bottom surface of the module IGBT8 is in contact with the top surface of the radiator 7, and the electrolytic capacitor 1001 is located in the lower cavity 16. The fan 6 draws out the air in the lower cavity 16 from the left end of the outer shell 1. At the same time, the air outside the inverter enters the lower cavity 16 through the heat dissipation holes 13, so that circulating air is formed inside the inverter. The air passes through the lower cavity 16 and takes away the heat from the surface of the electrolytic capacitor 1001 and the surface of the radiator 7, thereby achieving the purpose of heat dissipation.

[0059] In summary, by functionally layering the interior of the inverter and making the internal structure of the inverter more organized, the internal space of the inverter is fully utilized. The overall inverter structure is book-shaped, which is more conducive to cabinet installation and effectively improves the applicability of the inverter. Moreover, through independent heat dissipation ducts, the internal heat of the inverter is dissipated while reducing the pollution of the electronic components inside the inverter by the external environment, reducing the failure rate of the inverter, and improving the heat dissipation efficiency, which can provide the basic conditions for reducing the overall external size of the inverter.

[0060] It should be noted that, in this specification, relational terms such as first and second are merely used to distinguish one entity from other entities, but do not necessarily require or imply any actual relationship or order between these entities.

[0061] This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only intended to help understand the method and core concept of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from the principles of the present invention, and such improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A book-type inverter, characterized in that: include: A housing, wherein a first end of the housing is provided with a plurality of heat dissipation holes in an array; An upper cover plate is mounted on the top of the housing, and an operator assembly is mounted on the upper cover plate; a first partition plate, disposed below the upper cover plate, the first partition plate and the upper cover plate being combined to form an upper cavity, a control PCB assembly being disposed on a top surface of the first partition plate, the operator assembly and the control PCB assembly being both located within the upper cavity; A second partition is provided below the first partition, the second partition and the first partition are combined to form a middle cavity, and the power main circuit PCB assembly is provided in the middle cavity; A base plate is installed at the bottom of the shell. The base plate and the second partition are combined to form a lower cavity. A radiator and a fan are arranged in the lower cavity. The radiator is located in the middle part of the lower cavity, and the fan is located at the second end of the shell.

2. A book-type frequency converter according to claim 1, characterized in that: A fixing plate is provided on the top surface of one end of the bottom plate, a through hole is provided in the middle portion of the fixing plate, the fan is installed on the side of the fixing plate away from the radiator, and the fan is located at the position of the through hole.

3. The book-type inverter according to claim 1, characterized in that: The module IGBT is installed on the bottom surface of the power main circuit PCB board assembly, and the bottom surface of the module IGBT is in contact with the top surface of the radiator.

4. The book-type inverter according to claim 3, characterized in that: A main circuit terminal block is provided on the top surface of the power main circuit PCB board assembly. The main circuit terminal block is provided at one end of the first partition board and is used to connect various circuits.

5. The book-type frequency converter according to claim 4, characterized in that: An electrolytic capacitor PCB assembly is mounted on the top surface of the second partition, and an electrolytic capacitor is mounted on the bottom surface of the electrolytic capacitor PCB assembly. The electrolytic capacitor is located in the lower cavity.

6. The book-type frequency converter according to claim 5, characterized in that: A plurality of vertical poles are provided on the bottom surface of the power main circuit PCB board assembly, and the top ends of the vertical poles are connected to the top surface of the second partition.

7. The book-type frequency converter according to claim 5, characterized in that: A protective cover is sleeved on the outer peripheral side of the electrolytic capacitor, and an annular protrusion is provided on the outer peripheral side of the top end of the protective cover.

8. A book-type frequency converter according to any one of claims 1 to 5, characterized in that: A section of the shell is provided with a plurality of threading holes, and sealing plugs are clamped and provided at the positions of the plurality of threading holes.

9. The book-type frequency converter according to claim 8, characterized in that: An annular groove is provided on the outer peripheral side of the sealing plug, and the annular groove is connected to the threading hole by snapping.

10. A book-type frequency converter according to any one of claims 1 to 5, characterized in that: A sink groove is provided at one end of the first partition, and the sink groove is used for installing the control PCB board assembly.

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