Cooling system of converter

Abstract

The utility model relates to the technical field of small-power converter cooling, in particular to a cooling system of a converter. A cooling system of a converter comprises a radiator body and a cavity channel. The cavity channel is in a closed circular ring shape which is communicated end to end, the cavity channel is connected with the radiator body, a plurality of inner wall tooth pieces are obliquely arranged on the inner wall of one side of the cavity channel, the inner wall tooth pieces and the semiconductor device are located on the two sides of the cavity channel respectively, the inner wall, located on the lower side, of the top end of the cavity channel is obliquely arranged, and cooling liquid is poured into the cavity channel. Through the liquid level difference design of the left cold area and the right cold area in the cavity channel and the multi-layer arrangement of the inner wall tooth pieces, in the phase change process or the overflow process of cooling liquid caused by temperature rise of a hot area, heat exchange is effectively conducted between heat and the inner wall tooth pieces through hierarchical contact between the cooling liquid and the multi-layer inner wall tooth pieces, and the cooling liquid is cooled. Therefore, the purpose of effective cooling is achieved, the service life is long, the failure rate is low, and after-sales maintenance or replacement is not needed.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling of small power converters, in particular to a cooling system of a converter. Background Art

[0002] Converters use a large number of semiconductor devices, including IGBTs, diodes, MOSFETs and other power devices. The switching losses and conduction losses during operation will generate a lot of heat. If the temperature rises to exceed the junction temperature of the device, there will be a risk of damage.

[0003] In traditional cooling methods, the heat-generating device is typically placed on a heat sink, and a fan blows air through the heat sink's fins, rapidly dissipating the heat through air heat exchange. As a moving component, the fan has an inherent mechanical lifespan. Depending on the operating environment, it can be affected by dust and moisture, further impacting field applications and significantly increasing failure rates. This requires after-sales maintenance or replacement, significantly impacting application costs and user experience. Utility Model Content

[0004] In order to solve the deficiencies in the prior art, the utility model provides a cooling system for a converter to solve the technical problem of high failure rate in the prior art.

[0005] The utility model adopts the following technical solutions.

[0006] A cooling system for a converter,

[0007] The heat sink comprises a heat sink body and a cavity; the cavity is in the shape of a closed circular ring connected end to end, the cavity is connected to the heat sink body, a plurality of inner wall teeth are provided on the inner wall of one side of the cavity according to a set inclination angle, the inner wall teeth and the semiconductor device are respectively located on both sides of the cavity, the inner wall of the cavity top is inclined at the lower side, and the cavity is filled with coolant.

[0008] As an improvement, a groove is dug on the surface of the heat sink body, the cavity is pre-buried in the groove, and the semiconductor device is against one side of the cavity and the heat sink body.

[0009] As an improvement, the cavity is pre-buried inside the heat sink body, the semiconductor device is against the heat sink body, and the semiconductor device is located on one side of the cavity.

[0010] As an improvement, the inner wall teeth are arranged obliquely from top to bottom on the inner wall of one side of the cavity.

[0011] As an improvement, the inner wall at the lower side of the top end of the cavity is tilted from the top to the bottom from the side close to the semiconductor device to the side close to the inner wall teeth.

[0012] As an improvement, the angle between the inner wall teeth and the vertical direction is greater than 0° and less than 90°, and the angle between the inner wall at the lower side of the top of the cavity and the horizontal direction is greater than 0° and less than 90°.

[0013] As an improvement, a plurality of external teeth are provided on the surface of the radiator body.

[0014] As an improvement, the inner wall teeth are located at both ends of the inner wall on one side of the cavity.

[0015] As an improvement, the inner wall teeth at both ends are arranged in a staggered manner.

[0016] As an improvement, the inner wall teeth are located below the inner wall at the lower side of the top end of the cavity.

[0017] The beneficial effect of the present invention is that, compared with the prior art, the present invention, through the liquid level difference design of the left and right cold and hot areas in the cavity and the multi-level arrangement of the inner wall teeth, in the phase change process or overflow process of the coolant due to the temperature rise of the hotter area, the heat is effectively exchanged with the inner wall teeth through the hierarchical contact with the multi-level inner wall teeth, thereby achieving the purpose of effective cooling. It is suitable for the heat dissipation system of small power converters, has a long service life, low failure rate, and does not require after-sales maintenance or replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural diagram of the utility model;

[0019] Figure 2 This is a structural diagram of the outer tooth piece of the utility model.

[0020] 1. Radiator body; 2. Cavity; 3. Semiconductor device; 4. Inner wall teeth; 5. Coolant; 6. Outer teeth. DETAILED DESCRIPTION

[0021] To make the purpose, technical solution, and advantages of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. The embodiments described in this application are only part of the embodiments of the present invention, not all of them. Based on the spirit of the present invention, other embodiments obtained by ordinary technicians in this field without making any creative efforts are all within the scope of protection of the present invention.

[0022] Example 1

[0023] A cooling system for a converter,

[0024] The heat sink comprises a heat sink body 1 and a cavity 2; the cavity 2 is in the shape of a closed circular ring connected end to end, the cavity 2 is connected to the heat sink body 1, and a plurality of inner wall teeth 4 are obliquely arranged on the inner wall of one side of the cavity 2. The inner wall teeth 4 and the semiconductor device 3 are respectively located on both sides of the cavity 2. The inner wall of the cavity 2 at the top end is inclined, and the cavity 2 is filled with a coolant 5.

[0025] In a preferred but non-limiting embodiment of the present invention, a groove is dug on the surface of the heat sink body 1, and the cavity 2 is pre-buried in the groove to facilitate heat exchange between the cavity 2 and the heat sink body 1. The semiconductor device 3 is against one side of the cavity 2 and the heat sink body 1, which facilitates heat exchange between the semiconductor device 3 and the cavity 2 and the heat sink body 1.

[0026] In a preferred but non-limiting embodiment of the present invention, the inner wall fins 4 are arranged on the inner wall of one side of the cavity 2 at an angle from top to bottom to facilitate contact with the coolant 5 for heat exchange.

[0027] In a preferred but non-limiting embodiment of the present invention, the inner wall at the lower side of the top end of the cavity 2 is tilted from the side close to the semiconductor device 3 to the side close to the inner wall teeth 4 from top to bottom.

[0028] In a preferred but non-limiting embodiment of the present invention, the cavity 2 is made of copper.

[0029] In a preferred but non-limiting embodiment of the present invention, a plurality of external teeth fins 6 are provided on the surface of the radiator body 1 .

[0030] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth are located at both ends of the inner wall on one side of the cavity.

[0031] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth at both ends are staggered.

[0032] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth are located below the inner wall at the lower side of the top end of the cavity.

[0033] Example 2

[0034] A cooling system for a converter,

[0035] The heat sink comprises a heat sink body 1 and a cavity 2; the cavity 2 is in the shape of a closed circular ring connected end to end, the cavity 2 is connected to the heat sink body 1, and a plurality of inner wall teeth 4 are obliquely arranged on the inner wall of one side of the cavity 2. The inner wall teeth 4 and the semiconductor device 3 are respectively located on both sides of the cavity 2. The inner wall of the cavity 2 at the top end is inclined, and the cavity 2 is filled with a coolant 5.

[0036] Compared with Example 1, in a preferred but non-restrictive embodiment of the present invention, the cavity 2 is pre-buried inside the radiator body 1, which facilitates heat exchange between the cavity 2 and the radiator body 1. The semiconductor device 3 is against the radiator body 1, which facilitates heat exchange between the semiconductor device 3 and the radiator body 1. The semiconductor device 3 is located on one side of the cavity 2, which facilitates heating of the coolant on one side of the cavity 2.

[0037] In a preferred but non-limiting embodiment of the present invention, the inner wall fins 4 are arranged on the inner wall of one side of the cavity 2 at an angle from top to bottom to facilitate contact with the coolant 5 for heat exchange.

[0038] In a preferred but non-limiting embodiment of the present invention, the inner wall at the lower side of the top end of the cavity 2 is tilted from the side close to the semiconductor device 3 to the side close to the inner wall teeth 4 from top to bottom.

[0039] In a preferred but non-limiting embodiment of the present invention, the cavity 2 is made of copper.

[0040] Compared with Example 1, in a preferred but non-restrictive embodiment of the present invention, the angle between the inner wall tooth plate 4 and the vertical direction is greater than 0° and less than 90°, the number of the inner wall tooth plates 4 is determined according to the upper and lower depths of the radiator and the specific effect, and the angle between the inner wall at the lower side of the top of the cavity 2 and the horizontal direction is greater than 0° and less than 90°.

[0041] In a preferred but non-limiting embodiment of the present invention, a plurality of external teeth fins 6 are provided on the surface of the radiator body 1 .

[0042] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth are located at both ends of the inner wall on one side of the cavity.

[0043] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth at both ends are staggered.

[0044] In a preferred but non-limiting embodiment of the present invention, the inner wall teeth are located below the inner wall at the lower side of the top end of the cavity.

[0045] Working principle:

[0046] The copper cavity 2 is a closed cavity, and inner wall teeth 4 are set from top to bottom in the relevant internal area. The cavity 2 is pre-buried in the groove on the surface of the radiator body 1 or inside the radiator body 1; the inner wall at the lower side of the top of the cavity 2 is inclined from top to bottom from the side close to the semiconductor device 3 to the side close to the inner wall teeth 4, which is convenient for gas condensation, lateral flow of condensed water, and lateral flow of overflow water.

[0047] The heat generated during operation of the semiconductor device 3 in the heating area on the right causes the water level in the cavity 2 to rise. When the temperature continues to rise, the water vaporizes, condenses at the upper part of the cavity 2, and falls step by step from the left side, contacting the inner wall tooth pieces 4. During the contact process, heat exchange is formed with the inner wall tooth pieces 4, and the water continues to fall and exchange heat with the inner wall tooth pieces 4 on the lower layer, thereby gradually reducing the temperature of the coolant 5.

[0048] When the temperature continues to rise, causing the level of the coolant 5 on the right side to rise, or even overflow from the right side of the cavity 2, the coolant 5 flows to the left side of the cavity 2 and exchanges heat with the inner wall fins 4 step by step, thereby achieving the purpose of lowering the temperature.

[0049] The beneficial effect of the present invention is that, compared with the prior art, the present invention, through the liquid level difference design of the left and right hot and cold areas in the cavity 2 and the multi-level arrangement of the inner wall teeth 4, in the phase change process or overflow process of the coolant 5 due to the temperature rise of the hotter area, the heat is effectively exchanged with the inner wall teeth 4 through the hierarchical contact with the multi-level inner wall teeth 4, thereby achieving the purpose of effective cooling. It is suitable for the heat dissipation system of small power converters, has a long service life, low failure rate, and does not require after-sales maintenance or replacement.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the present invention can still be modified or replaced by equivalents, and any modifications or equivalent replacements that do not depart from the spirit and scope of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A cooling system for a converter, characterized in that: include: A heat sink body (1) and a cavity (2); the cavity (2) is in the shape of a closed circular ring connected end to end, the cavity (2) is connected to the heat sink body (1), a plurality of inner wall teeth (4) are provided on the inner wall of one side of the cavity (2) at a set inclination angle, the inner wall teeth (4) and the semiconductor device (3) are respectively located on both sides of the cavity (2), the inner wall of the cavity (2) at the top end is inclined, and the cavity (2) is filled with a cooling liquid (5).

2. The cooling system for a converter according to claim 1, characterized in that: A groove is dug on the surface of the heat sink body (1), the cavity (2) is pre-buried in the groove, and the semiconductor device (3) abuts against one side of the cavity (2) and the heat sink body (1).

3. The cooling system for a converter according to claim 1, characterized in that: The cavity (2) is pre-buried inside the heat sink body (1), the semiconductor device (3) is in contact with the heat sink body (1), and the semiconductor device (3) is located on one side of the cavity (2).

4. The cooling system for a converter according to claim 1, characterized in that: The inner wall tooth pieces (4) are arranged obliquely from top to bottom on the inner wall of one side of the cavity (2).

5. The cooling system for a converter according to claim 1, characterized in that: The inner wall at the lower side of the top end of the cavity (2) is tilted from the top to the bottom from the side close to the semiconductor device (3) to the side close to the inner wall tooth plate (4).

6. The cooling system for a converter according to claim 1, characterized in that: The included angle between the inner wall tooth piece (4) and the vertical direction is greater than 0° and less than 90°, and the included angle between the inner wall at the lower side of the top end of the cavity (2) and the horizontal direction is greater than 0° and less than 90°.

7. The cooling system for a converter according to claim 1, characterized in that: A plurality of external teeth (6) are provided on the surface of the radiator body (1).

8. The cooling system for a converter according to claim 1, characterized in that: The inner wall teeth (4) are located at both ends of the inner wall of one side of the cavity (2).

9. The cooling system for a converter according to claim 8, characterized in that: The inner wall teeth (4) at both ends are arranged in a staggered manner.

10. The cooling system for a converter according to claim 1, characterized in that: The inner wall tooth piece (4) is located below the inner wall at the lower side of the top end of the cavity (2).

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