Laser dew point management system and portable handheld welding equipment
By setting two flow channels at the compressor outlet and regulating the opening time and flow rate of the hot valve and the cold valve, the problem that the compressor refrigeration solution cannot control the cold plate temperature is solved, and flexible control of the cold plate temperature and lightweighting of the portable handheld welding equipment are achieved.
Patent Information
- Application Number
- CN202422581833.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-10
- Estimated Expiration
- 2034-10-24
AI Technical Summary
In existing laser dew point management systems, the compressor cooling solution cannot control the cold plate temperature within the target temperature range, which easily causes condensation. At the same time, the compressor cooling solution is heavy, bulky, and not easy to carry.
A compressor refrigeration solution is adopted. Two flow channels are set at the outlet of the compressor. One flow channel is used for high-temperature and high-pressure refrigerant, and the other flow channel is equipped with a cooling component. The controller adjusts the opening time and flow rate of the hot valve and the cold valve, and mixes the refrigerant to control the temperature of the cold plate within the target range. The compressor runs continuously, eliminating the need for a large water tank to store refrigerant.
It achieves flexible control of the cold plate temperature, avoids condensation, reduces system weight and volume, improves portability, and supports full-load operation in high-temperature environments.
Smart Images

Figure CN223418589U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of laser dew point management systems, and in particular to a laser dew point management system and a portable handheld welding device. Background Art
[0002] The heat dissipation performance of the laser directly determines the laser output power.
[0003] Maintaining strong heat dissipation performance in a high-temperature operating environment is a design challenge, because conventional air-cooled radiators cannot reduce the temperature of the cold plate to below the ambient temperature, and continuous cooling with compressor cooling solutions cannot control the temperature of the cold plate within the target temperature range, which can easily cause condensation. At the same time, compressor cooling solutions are often heavy and bulky, making them difficult to carry. Utility Model Content
[0004] This application mainly provides a laser dew point management system to solve the problems in existing laser dew point management systems where the compressor refrigeration solution cannot continuously cool the cold plate to within the target temperature range, which easily causes condensation. At the same time, the compressor refrigeration solution is often heavy, bulky, and difficult to carry.
[0005] In order to solve the above technical problems, a technical solution adopted in this application is to provide a laser dew point management system. The laser dew point management system includes: a pump source assembly including a cold plate, a pump source disposed on the cold plate, and a temperature sensor disposed on the cold plate, wherein a heat dissipation channel is provided in the cold plate, the heat dissipation channel including a first channel inlet, a second channel inlet, and a channel outlet; a compressor, wherein the compressor inlet is connected to the channel outlet of the heat dissipation channel via a first pipe, the compressor outlet is connected to the first channel inlet via a second pipe, and the compressor outlet is further connected to the second channel inlet via a third pipe; a refrigerant, wherein the refrigerant circulates in a refrigeration circuit formed by the heat dissipation channel, the compressor, the first pipe, the second pipe, and the third pipe; a thermal valve mounted on the second pipe for regulating a flow rate in the second pipe; a cooling assembly mounted on the third pipe for reducing a temperature of the refrigerant passing through the third pipe; and a controller communicatively connected to the thermal valve and the temperature sensor and regulating an opening time and / or a flow rate of the thermal valve based on the temperature of the cold plate monitored by the temperature sensor to control the temperature of the cold plate within a target temperature range.
[0006] In some embodiments, the laser dew point management system further includes a cold valve, which is installed on the third pipeline and located downstream of the cooling component, and is used to regulate the flow of the third pipeline; the cold valve is communicatively connected to the controller, and adjusts the opening time and / or flow of the cold valve based on the monitored temperature of the cold plate and the opening time and / or flow of the hot valve.
[0007] In some embodiments, the cooling component includes a pressure-reducing device installed on the third pipe, and the pressure-reducing device is a capillary tube or an expansion valve.
[0008] In some embodiments, the cooling assembly further includes a heat dissipation device installed on the third pipe and located upstream of the pressure reducing device, and the heat dissipation device includes heat dissipation fins and / or heat pipes.
[0009] In some embodiments, the cooling component further includes a fan, and the fan is used to blow air to the heat dissipation device to accelerate the heat dissipation of the heat dissipation device.
[0010] In some embodiments, a temperature sensor is installed on the cold plate, the controller is in communication with the temperature sensor, and the temperature sensor is used to collect the temperature of the cold plate.
[0011] In some embodiments, the target temperature range is within plus or minus 1 degree of the dew point of the environment in which the cold plate is located.
[0012] In some embodiments, the laser dew point management system also includes a temperature and humidity sensor, which is arranged on the cold plate. The controller is communicatively connected to the temperature and humidity sensor. The temperature and humidity sensor is used to collect ambient temperature and ambient humidity. The controller calculates the dew condensation temperature point based on the ambient temperature and ambient humidity collected in real time.
[0013] In some embodiments, the cold plate component includes a cold plate and a tee, the cold plate is provided with a cold plate channel, the cold plate channel includes the channel outlet and the channel inlet, one end of the tee is connected to the channel inlet of the cold plate, and the other two ends of the tee constitute the first channel inlet and the second channel inlet, and the heat dissipation channel includes the cold plate channel and the channel of the tee that are connected.
[0014] The present application also provides a portable handheld welding device, comprising the above-mentioned laser dew point management system.
[0015] In some embodiments, the compressor is kept running during the operation of the portable handheld welding device.
[0016] The beneficial effects of the present application are as follows: Different from the prior art, the present application discloses a laser dew point management system and a portable handheld welding device. By setting two flow channels at the outlet of the compressor, one of which is used to circulate high-temperature and high-pressure refrigerant and is provided with a thermal valve, and the other flow channel is provided with a cooling component, the high-temperature and high-pressure refrigerant can be converted into a low-temperature and low-pressure refrigerant. The controller adjusts the opening time and / or flow rate of the thermal valve to adjust the mixing ratio of the high-temperature and high-pressure refrigerant and the low-temperature and low-pressure refrigerant leading to the heat dissipation flow channel of the cold plate, so as to flexibly control the temperature of the cold plate within the target temperature range and avoid condensation. In addition, the compressor can maintain continuous operation during this process to avoid repeated start-stop. At the same time, there is no need to set up a large water tank to store the refrigerant. Therefore, the present application solution can eliminate the need for a water tank, greatly reducing the weight and volume of the laser dew point management system and improving its portability. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive work, among which:
[0018] Figure 1 It is a structural diagram of an embodiment of a laser dew point management system provided by this application. DETAILED DESCRIPTION
[0019] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.
[0020] The terms "first", "second" and "third" in the embodiments of the present application are only used for descriptive purposes and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second" and "third" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally also include steps or units that are not listed, or may optionally also include other steps or units inherent to these processes, methods, products or devices.
[0021] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.
[0022] This application provides a laser dew point management system 100, see Figure 1 , Figure 1 It is a structural diagram of an embodiment of a laser dew point management system provided by this application.
[0023] The laser dew point management system 100 includes: a pump source assembly 10 including a cold plate (not shown), a pump source 14 disposed on the cold plate, and a temperature sensor (not shown) disposed on the cold plate; a heat dissipation channel (not shown) is provided in the cold plate, and the heat dissipation channel includes a first channel inlet 11, a second channel inlet 12, and a channel outlet 13; a compressor 20, wherein the inlet of the compressor 20 is connected to the channel outlet 13 of the heat dissipation channel through a first pipe 101, the outlet of the compressor 20 is connected to the first channel inlet 11 through a second pipe 102, and the outlet of the compressor 20 is further connected to the second channel inlet 12 through a third pipe 103; a refrigeration The refrigerant circulates in a refrigeration circuit formed by the heat dissipation channel, the compressor 20, the first pipe 101, the second pipe 102 and the third pipe 103; the thermal valve 30 is installed on the second pipe 102, and is used to regulate the flow of the second pipe 102; the cooling component 40 is installed on the third pipe 103, and is used to reduce the temperature of the refrigerant passing through the third pipe 103; the controller 60 is connected to the thermal valve 30 and the temperature sensor for communication, and adjusts the opening time and / or flow of the thermal valve 30 based on the temperature of the cold plate monitored by the temperature sensor, so as to control the temperature of the cold plate within the target temperature range.
[0024] The pump source 14 generally includes a housing and a plurality of laser chips disposed in the housing, wherein the housing is connected to a cold plate to transfer heat generated by the laser chips to the cold plate.
[0025] The laser chip generates a large amount of heat during operation, especially when it often operates in a high-temperature environment. Furthermore, the superposition of the two temperatures causes the pump source 14 to suffer performance damage due to the high temperature and cannot operate at full load.
[0026] The currently commonly used air cooling solution cannot reduce the temperature of the cold plate to below the ambient temperature, and therefore cannot support the full load operation of the pump source 14 in a high temperature environment.
[0027] In this embodiment, a compressor refrigeration solution is adopted to replace the traditional air-cooling heat dissipation solution, so that the pump source 14 can operate at the rated temperature under high power and full load conditions.
[0028] In this embodiment, a temperature sensor is installed on the cold plate, and the controller 60 is in communication with the temperature sensor. The temperature sensor is used to collect the temperature of the cold plate and timely adjust the mixing ratio of the hot refrigerant and the cold refrigerant to control the temperature of the cold plate within the target temperature range.
[0029] The temperature sensor may be a negative temperature coefficient thermistor (NTC thermistor) or a positive temperature coefficient thermistor (PTC thermistor), etc., and may be mounted on the cold plate.
[0030] In this embodiment, the compressor can be a scroll compressor, the rotating shaft of the scroll compressor is powered by a motor that is driven by the electricity provided to the motor. The scroll compressor has a simple structure, small size and light weight, which greatly reduces the weight and volume of the laser dew point management system and improves its portability.
[0031] In this embodiment, the refrigerant may be Freon, specifically R22, R32, R134a, R410A, etc.
[0032] Refrigerant is running in the above-mentioned heat dissipation flow channel, first pipe 101, compressor 20, second pipe 102 and third pipe 103. The compressor 20 is used to compress the refrigerant, and can compress the refrigerant at normal temperature and pressure into a high-temperature and high-pressure refrigerant. Then, part of the high-temperature and high-pressure refrigerant enters the second pipe 102, and the other part enters the third pipe 103. The refrigerant entering the third pipe 103 is cooled by the cooling component 40 to form a low-temperature and low-pressure refrigerant. The controller 60 controls the opening time and / or flow rate of the thermal valve 30 to control the mixing ratio of the high-temperature refrigerant in the second pipe 103 and the low-temperature refrigerant in the third pipe 103. The mixed refrigerant can evaporate and absorb heat in the heat dissipation flow channel, thereby dynamically controlling the temperature of the cold plate within the target temperature range.
[0033] For example, if it is detected that the temperature of the cold plate is too high, the opening time of the thermal valve 30 can be shortened and / or the flow rate of the thermal valve 30 can be reduced to cool the cold plate; if it is detected that the temperature of the cold plate is too low, the opening time of the thermal valve 30 can be extended and / or the flow rate of the thermal valve 30 can be increased to heat the cold plate, that is, the temperature of the cold plate can be dynamically controlled within the target temperature range.
[0034] Of course, when the monitored temperature of the cold plate is closer to the target temperature range, the opening time and / or flow rate of the thermal valve 30 can be adjusted more finely, so that the temperature of the cold plate can be maintained within the target temperature range.
[0035] It should be noted that the target temperature range can support the pump source 14 to operate under full power and full load conditions.
[0036] In some embodiments, the laser dew point management system 100 further includes a cold valve 50, which is installed on the third pipeline 103 and located downstream of the cooling component 40, and is used to regulate the flow of the third pipeline 103; the cold valve 50 is communicated with the controller 60, and adjusts the opening time and / or flow of the cold valve 50 based on the monitored temperature of the cold plate and the opening time and / or flow of the hot valve 30.
[0037] For example, if it is detected that the temperature of the cold plate is too high, the opening time of the hot valve 30 and / or the flow of the hot valve 30 can be relatively shortened and / or the flow of the hot valve 30 can be reduced, and the opening time of the cold valve 50 can be extended and / or the flow of the cold valve 50 can be increased to cool the cold plate; if it is detected that the temperature of the cold plate is too low, the opening time of the hot valve 30 can be relatively extended and / or the flow of the hot valve 30 can be increased, and the opening time of the cold valve 50 can be shortened and / or the flow of the cold valve 50 can be reduced to heat the cold plate, that is, the temperature of the cold plate can be dynamically controlled within the target temperature range.
[0038] Of course, when the monitored temperature of the cold plate is closer to the target temperature range, the opening time and / or flow rate of the hot valve 30 and the cold valve 50 can be adjusted more finely, so that the temperature of the cold plate can be maintained within the target temperature range.
[0039] It should be noted that the target temperature range can support the pump source 14 to operate under full power and full load conditions.
[0040] In some embodiments, a three-way pipe or a three-way valve may be connected to the outlet of the compressor 20 , and the second pipe 102 and the third pipe 103 are respectively connected to the other two pipe openings of the three-way pipe or the three-way valve.
[0041] In other embodiments, a common pipe is connected to the outlet of the compressor 20, and a three-way pipe or a three-way valve is connected to the end of the common pipe away from the compressor 20. The second pipe 102 and the third pipe 103 are respectively connected to the other two pipe openings in the three-way pipe or the three-way valve to distribute the high-temperature refrigerant to the second pipe 102 and the third pipe 103 through the common pipe.
[0042] The cooling component 40 may be a semiconductor refrigerator or an ice bag installed on the third pipe 103 , which can directly cool the high-temperature refrigerant passing through.
[0043] In this embodiment, the cooling component 40 includes a pressure reducing device 42 installed on the third pipe 103. The pressure reducing device 42 is used to reduce the pressure of the high-pressure refrigerant to a low pressure to promote the evaporation and heat absorption process of the refrigerant, thereby achieving the purpose of quickly reducing the refrigerant temperature.
[0044] The pressure-reducing device 42 can be a capillary tube or an expansion valve. A capillary tube is a long, thin tube that uses its narrow cross-section to limit the refrigerant flow rate, thereby reducing pressure. Capillary tubes have a simple structure and are relatively low cost. An expansion valve can adjust the refrigerant flow rate to reduce pressure based on system requirements, thereby controlling the amount of refrigerant entering the cold plate.
[0045] Furthermore, the cooling component 40 also includes a heat dissipation device 44 installed on the third pipe 103 and located upstream of the pressure reducing device 42. The heat dissipation device 44 can first convert the high-temperature and high-pressure refrigerant entering the third pipe 103 into a refrigerant at normal temperature and pressure, and then convert it into a low-temperature and low-pressure refrigerant through the pressure reducing device 42, which can reduce the temperature of the refrigerant to a greater extent, so as to achieve better temperature control and a larger temperature adjustable range.
[0046] The heat dissipation device 44 can be a heat dissipation fin installed on the third pipe 103. After the high-temperature and high-pressure refrigerant passes through the third pipe 103, the heat can be transferred to the heat dissipation fin to accelerate the heat dissipation through the larger surface area of the heat dissipation fin.
[0047] The heat sink 44 can also be a heat pipe, which is a highly efficient heat conduction device with a small amount of liquid (usually water) inside. When one end is heated, the liquid evaporates and moves along the pipe to the cooler end, where it condenses and releases heat. This process is almost resistance-free, so the heat pipe can transfer heat very efficiently.
[0048] Furthermore, the cooling assembly 40 includes a fan 46 for blowing air toward the heat sink 44 to accelerate heat dissipation from the heat sink 44. The fan 46 accelerates the heat dissipation process by forcing air to flow. The fan 46 can be installed near the heat sink 44 to directly blow or extract air to help remove heat from the heat sink 44, allowing the high-temperature, high-pressure refrigerant passing through the heat sink 44 to be more efficiently converted to refrigerant at room temperature and pressure.
[0049] In this embodiment, heat sink 44 includes fins and / or heat pipes, and fan 46 is used to blow air over the fins and / or heat pipes. The fins and heat pipes are both simple in structure, highly efficient in heat conduction, and occupy a small space. Combined with the forced air cooling provided by small fan 46, efficient heat dissipation can be achieved.
[0050] In this embodiment, the compressor can keep running continuously during this process, avoiding repeated starts and stops, and there is no need to set up a large water tank to store the refrigerant. Therefore, this solution can eliminate the need for a water tank, greatly reducing the weight and volume of the laser dew point management system and improving its portability.
[0051] In this embodiment, the target temperature range is within plus or minus 1 degree of the dew point temperature in the environment where the laser dew point management system 100 is located.
[0052] It is understandable that the minimum temperature of the cold plate cannot be set too low. If the target temperature range of the cold plate is set too low, condensation will easily form on the cold plate, thereby causing a greater risk of damage to the pump source 14.
[0053] It can be seen that the target temperature range should not be set too low. Condensation on the cold plate needs to be avoided. The condensation temperature is strongly related to the temperature and humidity of the current environment. The condensation temperature will be different under different temperature and humidity conditions.
[0054] The controller 60 can obtain the real-time ambient temperature and humidity of the environment in which the laser dew point management system 100 is located, and then set the target temperature range to within plus or minus 1 degree of the dew temperature point in the environment in which the laser dew point management system 100 is located. The dew temperature point is adjusted in real time based on the ambient temperature and humidity, which can maximize the limit of the heat dissipation performance of the cold plate and prevent the compressor 20 from lowering the temperature of the cold plate too low and causing condensation on its surface.
[0055] In this embodiment, the laser dew point management system 100 also includes a temperature and humidity sensor (not shown in the figure). The temperature and humidity sensor can be set on the cold plate. The controller 60 is communicated with the temperature and humidity sensor. The temperature and humidity sensor is used to collect ambient temperature and ambient humidity. The controller 60 calculates the dew condensation temperature point based on the real-time collected ambient temperature and ambient humidity.
[0056] By setting up temperature and humidity sensors to monitor the ambient temperature and humidity in real time, the real-time dew condensation temperature point can be obtained, so that the temperature of the cold plate during operation can be maintained within the target temperature range. The target temperature range is within plus or minus 1 degree of the dew condensation temperature point in the environment where the cold plate is located, so as to maximize the limit of the heat dissipation performance of the cold plate and avoid the compressor 20 lowering the temperature of the cold plate too low to cause condensation on its surface.
[0057] In this embodiment, the dew point temperature can be calculated using a dew point calculation formula, which is Td=Ta-((100-RH) / 5), where Td is the dew point temperature, Ta is the air temperature, and RH is the relative humidity.
[0058] In some embodiments, the laser dew point management system 100 further includes a dew point sensor (not shown). The dew point sensor can be arranged on the main board or the shell of the laser dew point management system 100. The controller 60 is communicatively connected with the dew point sensor. The dew point sensor is used to collect the dew temperature point in the current environment of the cold plate.
[0059] Optionally, the cold plate may have a heat dissipation channel and a first channel inlet 11 , a second channel inlet 12 and a channel outlet.
[0060] Furthermore, the cold plate usually has a flow channel inlet and a flow channel outlet. Changing the flow channel structure of the cold plate to have the first flow channel inlet 11 and the second flow channel inlet 12 is not suitable for the existing cold plate structure, resulting in huge modification costs.
[0061] In this embodiment, the cold plate may include a cold plate and a tee (not shown in the figure), the cold plate is provided with a cold plate channel, the cold plate channel includes a channel outlet 13 and a channel inlet, one end of the tee is connected to the channel inlet of the cold plate, and the other two ends of the tee constitute the first channel inlet 11 and the second channel inlet 12, the heat dissipation channel includes the connected cold plate channel and the channel of the tee, that is, the second channel 102 and the third channel 103 are respectively connected to the other two ends of the tee, thereby avoiding the need to modify the channel structure of the original cold plate, saving huge modification costs, and the heat dissipation scheme can also be adapted to various types of cold plates.
[0062] The technical solution provided in this application has been verified. Through compressor cooling, the surface temperature of the cold plate can be maintained below 40 degrees under high power conditions to support full load use of the laser chip.
[0063] The compressor 20 in the present application can remain open and adjust the surface temperature of the cold plate by controlling the opening time and / or flow management of the cold valve 30 and the hot valve 50, thereby avoiding repeated start and stop of the compressor 20, and solving the problem in the prior art that the compressor 20 is easily damaged due to repeated start and stop.
[0064] The control logic of the controller 60 is further used to regulate the opening time and / or flow of the cold valve 30 and the hot valve 50 to control the temperature of the cold plate. The temperature of the cold plate can be controlled within plus or minus 1 degree of the dew point. The dew point temperature is also monitored in real time to dynamically adjust the lower limit of the cold plate temperature to prevent the compressor 20 from lowering the temperature too low and causing condensation on the surface of the cold plate, thereby maximizing the heat dissipation performance limit.
[0065] The controller 60 may be a PID controller for performing PID logic control; alternatively, the controller 60 may be a microcontroller unit (MCU) or a central processing unit (CPU), etc., which controls the temperature of the cold plate by running a set program.
[0066] Through the above settings, the present application solution can support high-power operation of the handheld laser after use, and the heat dissipation problem will no longer be a shortcoming in releasing the performance of the handheld laser.
[0067] Based on this, the laser dew point management system of the present application can be used in a portable handheld welding device (not shown), which includes the laser dew point management system as described above, and can be used for laser welding.
[0068] Furthermore, the compressor 20 remains in continuous operation during operation of the portable handheld welding device.
[0069] Different from the prior art, the present application discloses a laser dew point management system and a portable handheld welding device. By setting two flow channels at the outlet of the compressor, one of which is used to circulate high-temperature and high-pressure refrigerant and is provided with a thermal valve, and the other flow channel is provided with a cooling component, the high-temperature and high-pressure refrigerant can be converted into a low-temperature and low-pressure refrigerant. The controller adjusts the opening time and / or flow rate of the thermal valve to adjust the mixing ratio of the high-temperature and high-pressure refrigerant and the low-temperature and low-pressure refrigerant leading to the heat dissipation flow channel of the cold plate, so as to flexibly control the temperature of the cold plate within the target temperature range and avoid condensation. The refrigerant circulates in the circulating flow channel, and the compressor can maintain continuous operation during this process, avoiding repeated start-stop and no need to set up a large water tank to store the refrigerant. Therefore, the present application solution can eliminate the need for a water tank, greatly reducing the weight and volume of the laser dew point management system and improving its portability.
[0070] By combining the accompanying drawings and text descriptions, it can be seen that the laser dew point management system 100 provided in this application has a simple structure and a simple control implementation scheme. The overall equipment is small in size and light in weight. It can provide extremely strong heat dissipation capabilities in high-temperature environments and can adjust the temperature of the cold plate to near the dew point in a short time to support short-term overclocking output of the laser chip.
[0071] The above description is merely an embodiment of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. A laser dew point management system, characterized in that: include: A pump source assembly includes a cold plate, a pump source disposed on the cold plate, and a temperature sensor disposed on the cold plate, wherein a heat dissipation channel is provided in the cold plate, and the heat dissipation channel includes a first channel inlet, a second channel inlet, and a channel outlet; a compressor, wherein the inlet of the compressor is connected to the outlet of the heat dissipation channel via a first pipe, the outlet of the compressor is connected to the inlet of the first channel via a second pipe, and the outlet of the compressor is further connected to the inlet of the second channel via a third pipe; a refrigerant, the refrigerant circulating in a refrigeration circuit formed by the heat dissipation channel, the compressor, the first pipe, the second pipe, and the third pipe; a thermal valve, installed on the second pipeline, for regulating the flow of the second pipeline; a cooling component, installed on the third pipe, for reducing the temperature of the refrigerant passing through the third pipe; A controller is in communication with the thermal valve and the temperature sensor, and adjusts the opening time and / or flow rate of the thermal valve based on the temperature of the cold plate monitored by the temperature sensor to control the temperature of the cold plate within a target temperature range.
2. The laser dew point management according to claim 1, characterized in that: It also includes a cold valve, which is installed on the third pipeline and located downstream of the cooling component, and is used to regulate the flow of the third pipeline; the cold valve is communicatively connected to the controller, and adjusts the opening time and / or flow of the cold valve based on the monitored temperature of the cold plate and the opening time and / or flow of the hot valve.
3. The laser dew point management system according to claim 1, characterized in that: The cooling component includes a pressure reducing device installed on the third pipeline, and the pressure reducing device is a capillary tube or an expansion valve.
4. The laser dew point management system according to claim 3, characterized in that: The cooling component further includes a heat dissipation device installed on the third pipe and located upstream of the pressure reducing device. The heat dissipation device includes heat dissipation fins and / or heat pipes.
5. The laser dew point management system according to claim 4, characterized in that: The cooling component further includes a fan, which is used to blow air to the heat dissipation device to accelerate the heat dissipation of the heat dissipation device.
6. The laser dew point management system according to claim 1, characterized in that: The target temperature range is within plus or minus 1 degree of the dew point in the environment where the cold plate is located.
7. The laser dew point management system according to claim 1, characterized in that: The laser dew point management system also includes a temperature and humidity sensor, which is arranged on the cold plate. The controller is communicatively connected to the temperature and humidity sensor. The temperature and humidity sensor is used to collect ambient temperature and ambient humidity. The controller calculates the dew condensation temperature point based on the ambient temperature and ambient humidity collected in real time.
8. The laser dew point management system according to claim 1, characterized in that: The cold plate component includes a cold plate and a tee pipe. The cold plate is provided with a cold plate channel. The cold plate channel includes the flow channel outlet and the channel inlet. One end of the tee pipe is connected to the channel inlet of the cold plate, and the other two ends of the tee pipe constitute the first flow channel inlet and the second flow channel inlet. The heat dissipation flow channel includes the cold plate channel and the channel of the tee pipe that are connected.
9. A portable handheld welding device, characterized in that: The laser dew point management system comprises the laser dew point management system according to any one of claims 1 to 8.
10. The portable handheld welding device according to claim 9, characterized in that: The compressor remains in continuous operation during operation of the portable handheld welding device.