Cold plate mounting and dismounting tool structure

Abstract

The utility model discloses a tool structure for assembling and disassembling a cold plate. The cold plate mounting and dismounting tool structure comprises a base and a main body, the main body is placed on the base, the main body is provided with a positioning block, a grabbing assembly and a spring pressing buckle, the main body is provided with a containing cavity used for containing an SDI card cold plate and a mounting cavity of a liquid cooling connector, the spring pressing buckle is used for fixing the SDI card cold plate and the liquid cooling connector, and the grabbing assembly is used for fixing a CPU cold plate. According to the utility model, the main body is fixed on the case of the liquid cooling server, the grabbing assembly grabs the CPU cold plate, the spring pressing buckle fixes the SDI card cold plate and the liquid cooling joint, after the whole set of cold plate is fixed on the main body, the main body is taken up, the whole set of cold plate is dismounted from the case, and the main body is overturned and placed on the base so as to coat the radiator silicone grease; and then the main body is fixed on the case, and the cold plates are loaded into the case one by one, so that the whole set of cold plates can be assembled and disassembled by one person, and the operation and maintenance efficiency of the server is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cold plate installation and disassembly, in particular to a cold plate installation and disassembly tooling structure. Background Art

[0002] With the continuous growth of data center computing needs and increasingly stringent energy efficiency requirements, the demand for liquid cooling radiators as an efficient heat dissipation solution has increased significantly. Traditional air cooling methods can no longer meet the high requirements of high-performance servers for heat dissipation performance and noise control. Therefore, cold plate liquid cooling servers have gradually become the mainstream of the market. This type of server achieves efficient and quiet heat dissipation by directly circulating coolant to key heat-generating components inside the server, such as the CPU.

[0003] However, with the evolution of technology and the deepening of application requirements, the design of cold plate liquid cooling servers has also faced new challenges. Currently, not only do CPUs require cold plates for heat dissipation, but other high-performance components such as SDI (Serial Digital Interface) network cards, GPUs (graphics processing units), and memory modules are also beginning to adopt cold plate cooling technology to further optimize the overall system's thermal management efficiency. This trend has led to the need to integrate three or more cold plates within the server, significantly increasing system complexity and maintenance difficulties. It is impossible for a single person to complete the installation of a complete set of cold plates, affecting the efficiency of product repair and maintenance. Furthermore, if the cold plate falls into the chassis during installation, it can damage the product and pose a quality risk. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a cold plate installation and disassembly tooling structure.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] An embodiment of the present utility model provides a cold plate installation and disassembly tooling structure, comprising: a base and a main body, the main body being placed on the base, the main body being provided with a positioning block, a grabbing assembly and a spring buckle, the main body being provided with a placement cavity for placing an SDI card cold plate and an installation cavity for a liquid cooling joint, the spring buckle being used to fix the SDI card cold plate and the liquid cooling joint, and the grabbing assembly being used to fix the CPU cold plate.

[0007] In a specific embodiment, the grabbing assembly includes a movable handle, a mounting end and a grabbing block, the mounting end is fixed to the main body, the movable handle is hinged to the mounting end, the grabbing block is transmission-connected to the movable handle, and the grabbing block is used to fix the CPU cold plate.

[0008] In a specific embodiment, the grab block is provided with a captive screw, and the captive screw is engaged with the CPU cold plate.

[0009] In a specific embodiment, there are two positioning blocks, which are respectively arranged on two sides of the bottom of the main body.

[0010] In a specific embodiment, a snap-fit ​​groove is provided at the bottom of the positioning block.

[0011] In a specific embodiment, the engaging groove is further provided with a limiting protrusion.

[0012] In a specific embodiment, the positioning block is further provided with a pull pin.

[0013] In a specific embodiment, the liquid cooling joint is connected to the SDI card cold plate and the CPU cold plate through a liquid pipe.

[0014] In a specific embodiment, the base is provided with a support column, and the main body is provided with a support hole corresponding to the support column.

[0015] The cold plate installation and disassembly tooling structure of the present invention has the following beneficial effects compared with the prior art: the main body is fixed on the liquid-cooled server chassis, the grabbing assembly grabs the CPU cold plate, the spring buckle fixes the SDI card cold plate and the liquid-cooling joint, and when the whole set of cold plates are fixed on the main body, the main body is picked up and the whole set of cold plates are removed from the liquid-cooled server chassis, and then the main body is turned over and placed on the base, and operations such as applying radiator silicone grease can be performed. When the product is returned for repair, the main body can be fixed on the chassis again, and the cold plates can be installed into the chassis one by one, so that a single person can complete the installation and disassembly of the whole set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plates.

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0018] Figure 1 A three-dimensional schematic diagram of the cold plate installation and disassembly tooling structure provided by the utility model;

[0019] Figure 2 This is an exploded schematic diagram of the cold plate installation and disassembly tooling structure provided by the present invention;

[0020] Figure 3 This is a schematic structural diagram of the back side of the main body provided by the present invention;

[0021] Figure 4 This is a schematic diagram of an application scenario in which the cold plate installation and removal tooling structure provided by the present invention cooperates with a chassis;

[0022] Figure 5 The present invention provides a flow chart of a method for using the cold plate installation and removal tooling structure. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0027] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0028] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0029] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0030] See also Figures 1 to 4 In the specific embodiment shown, the utility model discloses a cold plate installation and disassembly tooling structure, including: a base 10 and a main body 20, the main body 20 is placed on the base 10, the main body 20 is provided with a positioning block 30, a grabbing assembly 40 and a spring buckle 50, the main body 20 is provided with a placement cavity for placing an SDI card cold plate 70 and an installation cavity for a liquid cooling joint 80, the spring buckle 50 is used to fix the SD I card cold plate 70 and the liquid cooling joint 80, and the grabbing assembly 40 is used to fix the CPU cold plate (not shown in the figure).

[0031] Specifically, the main body 20 is fixed on the liquid-cooled server chassis, the grabbing component 40 grabs the CPU cold plate, and the spring buckle 50 fixes the SDI card cold plate 70 and the liquid-cooled connector 80. When the entire set of cold plates are fixed on the main body 20, pick up the main body 20 and remove the entire set of cold plates from the liquid-cooled server chassis. Then, the main body 20 is turned over and placed on the base 10, and operations such as applying radiator silicone grease can be performed. When the product is returned for repair, the main body 20 can be fixed on the chassis (i.e., the liquid-cooled server chassis) and the cold plates can be installed into the chassis one by one, so that a single person can complete the installation and disassembly of the entire set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plates. Furthermore, the main body 20 of the tooling structure, particularly its positioning block 30, gripping assembly 40, and spring buckle 50, achieves secure fixation and convenient operation of the CPU cold plate, SDI card cold plate 70, and liquid cooling connector 80. This design allows a single operator to complete the installation and removal of the entire cold plate set, significantly simplifying the operational process and reducing manpower requirements. Furthermore, the spring buckle 50 is used to secure the SDI card cold plate 70 and liquid cooling connector 80, and when the main body 20 is flipped, the spring buckle 50 prevents the SDI card cold plate 70 and liquid cooling connector 80 from falling. In other words, the sophisticated design of the spring buckle 50 and gripping assembly 40 ensures that the cold plate remains secure during installation and removal, preventing the cold plate from falling into the chassis due to improper operation, thereby effectively reducing the risk of product damage.

[0032] In one embodiment, the grabbing assembly 40 includes a movable handle 41, a mounting end 42 and a grabbing block 43. The mounting end 42 is fixed to the main body 20, the movable handle 41 is hinged to the mounting end 42, and the grabbing block 43 is transmission-connected to the movable handle 41. The grabbing block 43 is used to fix the CPU cold plate.

[0033] Specifically, the mounting end 42 and the movable handle 41 are provided on the upper surface of the main body 20, and the grab block 43 is provided on the lower surface of the main body 20. The movable handle 41 is lifted to make the grab block 43 move downward and fit against the CPU cold plate to fix the CPU cold plate; conversely, when the movable handle 41 is pressed down, the grab block 43 moves upward and separates from the CPU cold plate.

[0034] More specifically, the movable handle 41 is used to move the grab block 43 up or down, and the position of the grab block 43 can be adjusted on the X-axis and Y-axis so that the grab block 43 is aligned with the screw holes of different CPU cold plates (AMD or Inter). The grab block 43 is fixed to the CPU cold plate by captive screws, and a silicone block is provided to absorb the height error between the grab block 43 and the CPU cold plate.

[0035] In one embodiment, the grab block 43 is provided with a captive screw, and the captive screw is engaged with the CPU cold plate.

[0036] Specifically, when the operator lifts the movable handle 41, the grab block 43 moves downward and fits tightly against the CPU cold plate. At this point, by tightening the captive screws, the grab block 43 can be locked to the CPU cold plate, ensuring the stability of the CPU cold plate. This design effectively prevents the CPU cold plate from loosening and falling. When the CPU cold plate needs to be removed, the operator only needs to loosen the captive screws first, then press the movable handle 41, and the grab block 43 will move upward and disengage from the CPU cold plate. This design makes the installation and removal of the CPU cold plate simple and quick, eliminating the need for complex tools or tedious operations, thereby improving work efficiency. In addition, through the precise design and transmission connection of the grab block 43, as well as the locking effect of the captive screws, this technology can avoid unnecessary physical damage to the CPU cold plate or motherboard during the installation and removal of the CPU cold plate. This design reduces the risk of hardware damage caused by improper operation and extends the service life of the server.

[0037] In one embodiment, there are two positioning blocks 30 , which are respectively disposed on two sides of the bottom of the main body 20 .

[0038] Specifically, when the main body 20 is placed on the side wall of the liquid-cooled server chassis, it is fixed by two positioning blocks 30, and the positioning blocks 30 are used to limit the X-axis degree of freedom. That is, the two positioning blocks 30 are respectively arranged on both sides of the bottom of the main body 20. When the main body 20 is placed on the side wall of the liquid-cooled server chassis, the two positioning blocks 30 can effectively fix the main body 20. This design ensures the stability of the main body 20 in the chassis and prevents the main body 20 from loosening or shifting. In addition, the main function of the positioning blocks 30 is to limit the degree of freedom of the main body 20 in the X-axis direction. In physics, the degree of freedom refers to the number of directions in which an object can move freely in space. By limiting the X-axis degree of freedom, it is ensured that the main body 20 can only move or adjust along a specific direction (such as the Y-axis or Z-axis) in the chassis, thereby avoiding unnecessary shaking or dislocation. In addition, since the positioning block 30 can accurately limit the position of the main body 20 in the X-axis direction, the operation and maintenance personnel can more accurately place the main body 20 in the predetermined position when installing it. This design improves the accuracy and efficiency of the installation and reduces the risk of failure or performance degradation due to improper installation.

[0039] In one embodiment, a snap-fit ​​groove 31 is provided at the bottom of the positioning block 30 .

[0040] Specifically, the snap-fitting connection between the snap-fitting slots 31 and the sidewalls of the liquid-cooled server chassis forms a secure mechanical connection. This connection effectively prevents the main body 20 from shaking or shifting within the chassis, ensuring its stability and reliability during operation. Furthermore, the snap-fitting connection between the snap-fitting slots 31 and the chassis sidewalls helps ensure precise alignment of the main body 20 during installation. Because the shape and dimensions of the snap-fitting slots 31 are precisely designed, they fit tightly with corresponding features on the chassis sidewalls, enabling highly precise installation.

[0041] In one embodiment, the engaging groove 31 is further provided with a limiting protrusion 32 .

[0042] Specifically, the limiting protrusion 32 cooperates with the limiting portion provided on the liquid-cooled server chassis to restrict the Y-axis degree of freedom. This means that the cooperation between the limiting protrusion 32 and the limiting portion effectively prevents the main body 20 from shaking or shifting in the Y-axis direction. This restriction ensures the stability of the main body 20 within the chassis. Furthermore, the cooperation between the limiting protrusion 32 and the limiting portion not only provides a secure connection but also ensures precise alignment of the main body 20 during installation, which helps avoid errors during installation.

[0043] In one embodiment, the positioning block 30 is further provided with a pull pin 60 .

[0044] Specifically, the liquid-cooled server chassis is provided with a pin hole corresponding to the pull pin 60, and the pull pin 60 cooperates with the pin hole to limit the Z-axis degree of freedom. That is to say, by cooperating with the pull pin 60 on the positioning block 30 and the pin hole on the chassis, the main body 20 can be fixed in the Z-axis direction, thereby combining with the restrictions of the X-axis and Y-axis to achieve comprehensive fixation in three-dimensional space. In addition, the close fit between the pull pin 60 and the pin hole helps prevent the main body 20 from shaking or shifting in the Z-axis direction, thereby improving stability. In addition, the design of the pull pin 60 generally makes the installation and disassembly process easier. The operation and maintenance personnel can complete the installation or disassembly of the main body 20 by simply inserting or pulling out the pull pin 60, without the need to use complex tools or perform tedious operations.

[0045] In one embodiment, the liquid cooling connector 80 is connected to the SDI card cold plate 70 and the CPU cold plate through a liquid pipe.

[0046] Specifically, the liquid cooling connector 80 serves as a key component connecting the SDI card cold plate 70 and the CPU cold plate, and circulates the cooling liquid to the two cold plates through the liquid pipe. The cooling liquid flows in the cold plate and absorbs heat, and then carries it away, thereby achieving efficient heat dissipation. This heat dissipation method is more efficient than the traditional air cooling heat dissipation, and can significantly reduce the working temperature of the SDI card and the CPU, and improve their stability and service life. In addition, through the connection of the liquid cooling connector 80, the SDI card cold plate 70 and the CPU cold plate can form a unified heat dissipation system, and the cooling liquid circulates in the system, which helps to conduct heat from high-temperature areas (such as the CPU and the SDI card) to low-temperature areas (such as the heat sink or external cooling equipment), thereby achieving temperature balance of the entire system, which helps to prevent local overheating and improve the overall performance and stability of the server. In addition, the liquid cooling heat dissipation system has higher energy efficiency than the traditional air cooling system. Since the heat conduction efficiency of the cooling liquid is higher, the liquid cooling system can achieve the same heat dissipation effect with lower energy consumption, which helps to reduce the operating cost of the server and reduce the impact on the environment.

[0047] In an embodiment, the base 10 is provided with support columns 11, and the main body 20 is provided with support holes 21 corresponding to the support columns 11.

[0048] Specifically, the main body 20 can be placed on the base 10 in a normal or reversed manner. When placed in a reversed manner, the CPU cold plate faces upwards, and the bottom of the CPU cold plate can be coated with thermal conductive silicone grease. That is, the cooperation of the support columns 11 and the support holes 21 provides stable support for the main body 20. Whether placed in a normal or reversed manner, the main body 20 can be accurately positioned on the base 10 through the support columns 11, avoiding hardware damage or performance degradation caused by shaking or displacement. In addition, this design allows the main body 20 to be placed on the base 10 in two different ways (normal or reversed), which provides flexibility for assembly and maintenance. For example, when placed in a reversed manner, the CPU cold plate faces upwards, which makes it easier for maintenance personnel to access the bottom of the CPU cold plate, thereby facilitating the coating of thermal conductive silicone grease or other maintenance work.

[0049] In the embodiment, two CPU cold plates and one SDI card cold plate 70 are included. The CPU cold plates are located on the lower surface of the main body 20, and the SDI card cold plate 70 is located on the upper surface of the main body 20. When the main body 20 is placed on the base 10 in a normal manner, the SDI card cold plate 70 faces upwards, and when the main body 20 is placed on the base 10 in a reversed manner, the CPU cold plate faces upwards.

[0050] Specifically, the spring press buckle 50 adopts existing public technology, which will not be described in detail here.

[0051] Referring to Figure 5 The utility model embodiment provides a cold storage refrigeration heat recovery control method, it includes the following steps:

[0052] S1, placing the main body 20 on the chassis and pulling the pin 60 to fix the main body 20 to the chassis;

[0053] Specifically, by pulling the pin 60, the main body 20 can be quickly fixed to the chassis; similarly, by pulling the pin 60 again, the main body 20 can be easily detached from the chassis. This design greatly simplifies the installation and disassembly operations and improves work efficiency.

[0054] S2, lift the movable handle 41 to move the grab block 43 downward and into contact with the CPU cold plate, and then tighten the captive screws to lock the grab block 43 to the CPU cold plate;

[0055] Specifically, lifting the movable handle 41 causes the gripping block 43 to move downward and engage with the CPU cold plate. By tightening the captive screws, the gripping block 43 and the CPU cold plate are locked. Similarly, lifting the movable handle 41 causes the gripping block 43 to move downward and engage with the motherboard. The screws securing the CPU cold plate to the motherboard are then tightened. The captive screws are then loosened, and the movable handle 41 is then pressed down to release the gripping block 43 from the CPU cold plate.

[0056] S3, loosen the screws between the CPU cold plate and the motherboard, and then press down the movable handle 41 to separate the CPU cold plate from the motherboard;

[0057] Specifically, after tightening the captive screws to lock the grab block 43 to the CPU cold plate, the screws between the CPU cold plate and the motherboard are loosened, and the movable handle 41 is pressed down to move the grab block 43 upward to drive the CPU cold plate away from the motherboard, that is, the CPU cold plate is lifted away from the motherboard.

[0058] S4, take out the SD I card cold plate 70 and place it in the placement cavity, and rotate the spring buckle 50 to fix the SD I card cold plate 70;

[0059] Specifically, loosen the screws securing the SD I card cold plate 70 to the chassis, remove the SDI card cold plate 70, and place it in the placement cavity. Then, rotate the spring buckle 50 to secure the SDI card cold plate 70. Similarly, rotate the spring buckle 50, remove the SDI card cold plate 70, place it in the chassis, and then tighten the screws to secure the SD I card cold plate 70 to the chassis.

[0060] S5, take out the liquid cooling connector 80 and place it in the installation cavity, and rotate the spring buckle 50 to fix the liquid cooling connector 80;

[0061] Specifically, loosen the screws securing the liquid cooling connector 80 to the chassis, remove the liquid cooling connector 80, and place it in the mounting cavity. Then, rotate the spring buckle 50 to secure the liquid cooling connector 80. Similarly, rotate the spring buckle 50, remove the liquid cooling connector 80, place it in the chassis, and then tighten the screws to secure the liquid cooling connector 80 to the chassis.

[0062] S6, pulling the pin 60 to separate the main body 20 from the chassis, then taking out the main body 20 and placing it on the base 10, to complete the disassembly of the SDI card cold plate 70 and the CPU cold plate.

[0063] Specifically, once the complete set of cold plates is secured to the main body 20, pull the pin 60 to detach the main body 20 from the chassis. The main body 20 is then removed and placed on the base 10, completing the removal of the SDI card cold plate 70 and the CPU cold plate. Once the product repair is complete, the main body 20 is secured to the chassis, and the complete set of cold plates is installed in order.

[0064] More specifically, the main body 20 is fixed to the liquid-cooled server chassis by pulling the pin 60, and then the movable handle 41 is lifted to make the grab block 43 move downward and fit into the CPU cold plate, and then the captive screws are tightened to lock the grab block 43 and the CPU cold plate, and then the screws between the CPU cold plate and the motherboard are loosened, and then the movable handle 41 is pressed down to separate the CPU cold plate from the motherboard, and the SDI card cold plate 70 is taken out and placed in the placement cavity, and the spring buckle 50 is rotated to fix the SDI card cold plate 70, and then the liquid-cooled connector is The head 80 is taken out and placed in the installation cavity, the spring buckle 50 is rotated to fix the liquid cooling connector 80, and then the pin 60 is pulled to separate the main body 20 from the chassis. The main body 20 is then taken out and placed on the base 10 to complete the disassembly of the SDI card cold plate 70 and the CPU cold plate. Conversely, the installation of the SDI card cold plate 70 and the CPU cold plate can also be achieved, so that a single person can complete the installation and disassembly of the entire set of cold plates, thereby improving the operation and maintenance efficiency of the server and reducing the risk of collision or damage to the product during the disassembly and assembly of the cold plate.

[0065] The above embodiments are preferred implementation schemes of the present invention. In addition, the present invention can also be implemented in other ways. Any obvious replacement without departing from the concept of the present technical solution is within the scope of protection of the present invention.

Claims

1. A cold plate installation and disassembly tooling structure, characterized in that: include: The base and the main body are placed on the base. The main body is provided with a positioning block, a grabbing assembly and a spring buckle. The main body is provided with a placement cavity for placing the SDI card cold plate and an installation cavity for the liquid cooling joint. The spring buckle is used to fix the SDI card cold plate and the liquid cooling joint. The grabbing assembly is used to fix the CPU cold plate.

2. The cold plate installation and disassembly tooling structure according to claim 1, characterized in that: The grabbing assembly includes a movable handle, a mounting end and a grabbing block, the mounting end is fixed to the main body, the movable handle is hinged to the mounting end, the grabbing block is transmission-connected to the movable handle, and the grabbing block is used to fix the CPU cold plate.

3. The cold plate installation and disassembly tooling structure according to claim 2, characterized in that: The grab block is provided with a captive screw, and the captive screw is matched with the CPU cold plate.

4. The cold plate installation and disassembly tooling structure according to claim 1, characterized in that: There are two positioning blocks, which are respectively arranged on both sides of the bottom of the main body.

5. The cold plate installation and disassembly tooling structure according to claim 4, characterized in that: A clamping groove is provided at the bottom of the positioning block.

6. The cold plate installation and disassembly tooling structure according to claim 5, characterized in that: The clamping groove is further provided with a limiting protrusion.

7. The cold plate installation and removal tooling structure according to claim 5, characterized in that: The positioning block is also provided with a pull pin.

8. The cold plate installation and disassembly tooling structure according to claim 1, characterized in that: The liquid cooling joint is connected to the SDI card cold plate and the CPU cold plate through a liquid pipe.

9. The cold plate installation and disassembly tooling structure according to claim 1, characterized in that: The base is provided with a supporting column, and the main body is provided with a supporting hole corresponding to the supporting column.

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