Molded pulp packaging part with good damping effect for electronic product

Abstract

The utility model discloses a molded pulp package for electronic products with good damping effect, which comprises a molded box cover, a molded box body and a splint layer arranged between the molded box cover and the molded box body, the molded box cover comprises a cover body and a partition plate which are integrally formed, the splint layer comprises a splint, a convex part, a bending part and a convex block which are integrally formed, and the convex block is arranged on the cover body. The molded box body comprises a box body part and a cavity formed in the box body part. Due to the arrangement of the cover body, the partition plate, the groove, the clamping plate, the protruding part, the bending part and the protruding block, the electronic product can be taken out of the paper pulp molding packaging piece easily.

Description

Technical Field

[0001] The utility model belongs to the technical field of paper pulp molding, and in particular relates to a paper pulp molding packaging piece for electronic products with good shock absorption effect. Background Art

[0002] Pulp molding is a three-dimensional papermaking technology that uses waste paper as raw material and forms paper products of a certain shape using special molds on a molding machine. It is commonly used to package electronic products. Existing pulp molded packaging is usually an integrated box body and box lid. The electronic products are usually wrapped and fixed in the empty slots in the box body and box lid. However, after opening this pulp molded packaging, the electronic products need to be picked out from the empty slots, which makes it inconvenient to remove the electronic products. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a pulp molded packaging for electronic products with good shock absorption effect, which facilitates taking the electronic products out of the pulp molded packaging.

[0004] The present invention is realized by the following technical solutions:

[0005] A pulp molded packaging piece for electronic products with good shock absorption effect comprises a molded box cover, a molded box body and a plywood layer arranged between the molded box cover and the molded box body, the molded box cover comprises an integrally formed cover body and a partition, the plywood layer comprises an integrally formed plywood, a raised portion, a bent portion and a protrusion, the molded box body comprises a box body portion and a cavity opened in the box body portion, the partitions are arranged equidistantly at the lower part of the cover body, the front and rear sides of the cover body are provided with grooves, the upper and lower sides of the plywood are equidistantly and integrally provided with raised portions, and the bent portion is integrated between every two adjacent raised portions.

[0006] Preferably, the groove is provided at a portion of the cover body between two adjacent partitions.

[0007] Preferably, the number of the partitions is set to at least two.

[0008] Compared with the prior art, the beneficial effects of the present invention are:

[0009] In the utility model, the arrangement of the cover, partition, groove, clamping plate, raised portion, bent portion and protrusion is conducive to taking out the electronic product from the pulp molded package.

[0010] In the present invention, the arrangement of the arc-surface protrusion is conducive to contact with electronic products and plays a shock-absorbing role for the electronic products. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a structural diagram of the present utility model.

[0012] Figure 2 It is a structural schematic diagram of the molded box cover and the molded box body of the present invention.

[0013] Figure 3 It is a structural schematic diagram of the plywood layer of the present utility model.

[0014] Figures 1 to 3 middle:

[0015] 1. Molded box cover; 11. Cover body; 12. Partition; 13. Groove; 2. Plywood layer; 21. Plywood; 22. Raised portion; 23. Bend portion; 24. Bump; 3. Molded box body; 31. Box body; 32. Cavity; 33. Arc-surface protrusion. DETAILED DESCRIPTION

[0016] The present invention will be described in detail below with reference to the accompanying drawings:

[0017] As shown in Figures 1 and 2, the pulp molded packaging for electronic products with good shock absorption effect described in the present invention includes a molded box cover 1, a molded box body 3 and a plywood layer 2 arranged between the molded box cover 1 and the molded box body 3. The molded box cover 1 includes an integrally formed cover body 11 and a partition 12. The plywood layer 2 includes an integrally formed plywood 21, a raised portion 22, a bent portion 23 and a protrusion 24. The molded box body 3 includes a box body portion 31 and a cavity 32 opened in the box body portion 31. The partitions 12 are equidistantly arranged in sequence at the lower part of the cover body 11. Grooves 13 are opened on the front and back sides of the cover body 11. The grooves 13 are arranged at a position of the cover body 11 between two adjacent partitions 12.

[0018] In this embodiment, combined with the Figure 3 As shown, the upper and lower sides of the splint 21 are equidistantly integrated with raised portions 22, the bent portion 23 is integrated between every two adjacent raised portions 22, and the protrusions 24 are integrated on the front and back sides of each of the splints 21, the protrusions 24 are adapted to the grooves 13, and the splint 21 is arranged between every two adjacent partitions 12. When taking out the electronic products, the user presses the protrusions 24 and pulls the cover 11 and the partition 12 upwards. Since the splint layer 2 blocks the electronic products, the electronic products are left in the box body 31. The user then removes the splint layer 2 to facilitate the removal of the electronic products inside the box body 31. The raised portions 22 and the bent portions 23 improve the bending resistance of the splint 21, and the arc protrusions 33 improve the shock absorption effect of the electronic products.

[0019] In this embodiment, specifically, the inner wall of the box body 31 is integrally provided with a curved protrusion 33 .

[0020] In this embodiment, specifically, the number of the partitions 12 is at least two.

[0021] In the present invention, when in use, the plywood layer 2 is placed in the cover body 11, and then the electronic product is placed at the lower part of the plywood layer 2, and the electronic product is clamped and fixed by the partition 12, and the partition 12 of the molded box cover 1 is inserted into the molded box body 3 to realize the packaging of the electronic product.

[0022] Utilizing the technical solution described in the present invention, or those skilled in the art designing similar technical solutions inspired by the technical solution of the present invention to achieve the above-mentioned technical effects, all fall within the scope of protection of the present invention.

Claims

1. A pulp molded packaging for electronic products with good shock absorption effect, characterized in that: The pulp molded packaging for electronic products with good shock absorption effect comprises a molded box cover (1), a molded box body (3), and a plywood layer (2) arranged between the molded box cover (1) and the molded box body (3); the molded box cover (1) comprises an integrally formed cover body (11) and a partition (12); the plywood layer (2) comprises an integrally formed plywood (21), a raised portion (22), a bent portion (23), and a convex block (24); the molded box body (3) comprises a box body (31) and a cavity (32) provided in the box body (31); the partitions (12) are equidistantly arranged at the lower part of the cover body (11); grooves (13) are provided on both the front and rear sides of the cover body (11); raised portions (22) are equidistantly provided on both the upper and lower sides of the plywood (21); and the bent portion (23) is provided between every two adjacent raised portions (22).

2. The pulp molded packaging for electronic products with good shock absorption effect according to claim 1, characterized in that: The groove (13) is provided at a portion of the cover body (11) between two adjacent partitions (12).

3. The pulp molded package for electronic products with good shock absorption effect according to claim 1, characterized in that: The number of the partitions (12) is set to at least two.

4. The pulp molded package for electronic products with good shock absorption effect according to claim 1, characterized in that: The protrusions (24) are integrally arranged on the front and rear sides of each of the clamping plates (21), and the protrusions (24) are adapted to the grooves (13).

5. The pulp molded packaging for electronic products with good shock absorption effect according to claim 1, characterized in that: The clamping plate (21) is arranged between every two adjacent partition plates (12).

6. The pulp molded package for electronic products with good shock absorption effect according to claim 1, characterized in that: The inner wall of the box body (31) is integrally provided with a curved surface protrusion (33).

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